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TW200704507A - Method for making high anti-flexion flexible copper clad laminate board - Google Patents

Method for making high anti-flexion flexible copper clad laminate board

Info

Publication number
TW200704507A
TW200704507A TW095126480A TW95126480A TW200704507A TW 200704507 A TW200704507 A TW 200704507A TW 095126480 A TW095126480 A TW 095126480A TW 95126480 A TW95126480 A TW 95126480A TW 200704507 A TW200704507 A TW 200704507A
Authority
TW
Taiwan
Prior art keywords
copper foil
copper
laminate board
clad laminate
copper clad
Prior art date
Application number
TW095126480A
Other languages
Chinese (zh)
Other versions
TWI394659B (en
Inventor
Natsuki Fukuda
Koichi Hattori
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200704507A publication Critical patent/TW200704507A/en
Application granted granted Critical
Publication of TWI394659B publication Critical patent/TWI394659B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0038—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides

Landscapes

  • Laminated Bodies (AREA)

Abstract

This invention provides a method for stably making a flexible copperclad laminate board which exhibits excellent anti-flexion property, the flexible copper clad laminate board being made from a copper foil and a polyimide resin layer. The method for making a copper cladlaminate board composed of a copper foil and a polyimide resin layer comprises the steps of coating a surface of the copper foil with a solution of polyimide precursor resin, performing a drying and hardening process in a subsequent heat treatment process, wherein an electrolytic copper foil is used for the copper foil, and the coated copper foil is held under the temperature of 300 ~ 450 DEG C for 5 to 40 minutes, to grow the copper crystalline particles up to an average crystalline particle diameter of the copper foil two(2)to eight(8) times of that before the heat treatment process.
TW095126480A 2005-07-27 2006-07-20 Method for making high anti-flexion flexible copper clad laminate board TWI394659B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005217064 2005-07-27

Publications (2)

Publication Number Publication Date
TW200704507A true TW200704507A (en) 2007-02-01
TWI394659B TWI394659B (en) 2013-05-01

Family

ID=37674862

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126480A TWI394659B (en) 2005-07-27 2006-07-20 Method for making high anti-flexion flexible copper clad laminate board

Country Status (3)

Country Link
KR (1) KR101241265B1 (en)
CN (1) CN100594760C (en)
TW (1) TWI394659B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4477665B2 (en) * 2007-12-10 2010-06-09 古河電気工業株式会社 Electrolytic copper foil and wiring board
CN102124148B (en) * 2008-07-07 2013-11-06 古河电气工业株式会社 Electrolytic copper foil and copper-clad laminate
KR101126969B1 (en) * 2009-08-18 2012-03-23 엘에스엠트론 주식회사 High flexuous copper foil and method for producing the same
JP2011093229A (en) * 2009-10-30 2011-05-12 Jx Nippon Mining & Metals Corp Method for manufacturing double-sided copper-clad laminated plate, and one set of copper or copper alloy foil used for the same
CN102078853A (en) * 2009-11-30 2011-06-01 比亚迪股份有限公司 Method for preparing flexible copper clad laminate
KR101304846B1 (en) * 2011-06-10 2013-09-05 주식회사 포스코 Substrate for flexible display having excellent heat emission property
MY187285A (en) * 2013-11-27 2021-09-19 Mitsui Mining & Smelting Co Ltd Copper foil provided with carrier foil, copper clad laminate and printed wiring board
JP6344914B2 (en) * 2013-12-27 2018-06-20 新日鉄住金化学株式会社 Flexible copper clad laminate and flexible circuit board
CN115179638B (en) * 2022-06-29 2024-02-27 厦门爱谱生电子科技有限公司 Manufacturing method of flexible copper-clad plate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3768104B2 (en) * 2001-01-22 2006-04-19 ソニーケミカル株式会社 Flexible printed circuit board
JP4789398B2 (en) * 2003-03-28 2011-10-12 三井化学株式会社 Polyimide composition and polyimide metal laminate

Also Published As

Publication number Publication date
KR20070014067A (en) 2007-01-31
CN1905781A (en) 2007-01-31
KR101241265B1 (en) 2013-03-14
CN100594760C (en) 2010-03-17
TWI394659B (en) 2013-05-01

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