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TW200632267A - Heat dissipation device and its manufacturing method - Google Patents

Heat dissipation device and its manufacturing method

Info

Publication number
TW200632267A
TW200632267A TW094106532A TW94106532A TW200632267A TW 200632267 A TW200632267 A TW 200632267A TW 094106532 A TW094106532 A TW 094106532A TW 94106532 A TW94106532 A TW 94106532A TW 200632267 A TW200632267 A TW 200632267A
Authority
TW
Taiwan
Prior art keywords
heat dissipation
chamber
wick structure
wall
manufacturing
Prior art date
Application number
TW094106532A
Other languages
Chinese (zh)
Inventor
Ming-Te Chuang
Chi-Feng Lin
Chin-Ming Chen
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW094106532A priority Critical patent/TW200632267A/en
Publication of TW200632267A publication Critical patent/TW200632267A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation apparatus, applied to an electric device for dissipating the heat generated therefrom, includes a chamber and a wick structure formed on the inner wall of the chamber. The wick structure includes a plurality of grooves formed on the inner wall of the chamber, and porouspowders sintered on the inner wall of the chamber. Thus, the heat dissipation apparatus has the best capillarity resulting from the sintered wick structure and the best permeability due to the grooved wick structure.
TW094106532A 2005-03-04 2005-03-04 Heat dissipation device and its manufacturing method TW200632267A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094106532A TW200632267A (en) 2005-03-04 2005-03-04 Heat dissipation device and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094106532A TW200632267A (en) 2005-03-04 2005-03-04 Heat dissipation device and its manufacturing method

Publications (1)

Publication Number Publication Date
TW200632267A true TW200632267A (en) 2006-09-16

Family

ID=57809212

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106532A TW200632267A (en) 2005-03-04 2005-03-04 Heat dissipation device and its manufacturing method

Country Status (1)

Country Link
TW (1) TW200632267A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398616B (en) * 2011-01-26 2013-06-11 奇鋐科技股份有限公司 Micro - temperature plate structure improvement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398616B (en) * 2011-01-26 2013-06-11 奇鋐科技股份有限公司 Micro - temperature plate structure improvement

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