TW200632267A - Heat dissipation device and its manufacturing method - Google Patents
Heat dissipation device and its manufacturing methodInfo
- Publication number
- TW200632267A TW200632267A TW094106532A TW94106532A TW200632267A TW 200632267 A TW200632267 A TW 200632267A TW 094106532 A TW094106532 A TW 094106532A TW 94106532 A TW94106532 A TW 94106532A TW 200632267 A TW200632267 A TW 200632267A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- chamber
- wick structure
- wall
- manufacturing
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000035699 permeability Effects 0.000 abstract 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat dissipation apparatus, applied to an electric device for dissipating the heat generated therefrom, includes a chamber and a wick structure formed on the inner wall of the chamber. The wick structure includes a plurality of grooves formed on the inner wall of the chamber, and porouspowders sintered on the inner wall of the chamber. Thus, the heat dissipation apparatus has the best capillarity resulting from the sintered wick structure and the best permeability due to the grooved wick structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094106532A TW200632267A (en) | 2005-03-04 | 2005-03-04 | Heat dissipation device and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094106532A TW200632267A (en) | 2005-03-04 | 2005-03-04 | Heat dissipation device and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200632267A true TW200632267A (en) | 2006-09-16 |
Family
ID=57809212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094106532A TW200632267A (en) | 2005-03-04 | 2005-03-04 | Heat dissipation device and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200632267A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI398616B (en) * | 2011-01-26 | 2013-06-11 | 奇鋐科技股份有限公司 | Micro - temperature plate structure improvement |
-
2005
- 2005-03-04 TW TW094106532A patent/TW200632267A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI398616B (en) * | 2011-01-26 | 2013-06-11 | 奇鋐科技股份有限公司 | Micro - temperature plate structure improvement |
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