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TW200638016A - Flat plate-type heat pipe - Google Patents

Flat plate-type heat pipe

Info

Publication number
TW200638016A
TW200638016A TW094145188A TW94145188A TW200638016A TW 200638016 A TW200638016 A TW 200638016A TW 094145188 A TW094145188 A TW 094145188A TW 94145188 A TW94145188 A TW 94145188A TW 200638016 A TW200638016 A TW 200638016A
Authority
TW
Taiwan
Prior art keywords
heat pipe
flat plate
type heat
working fluid
capillary force
Prior art date
Application number
TW094145188A
Other languages
Chinese (zh)
Other versions
TWI297766B (en
Inventor
Seok-Hwan Moon
Gunn Hwang
Sang-Choon Ko
Sung-Weon Kang
Chang-Auck Choi
Original Assignee
Korea Electronics Telecomm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Electronics Telecomm filed Critical Korea Electronics Telecomm
Publication of TW200638016A publication Critical patent/TW200638016A/en
Application granted granted Critical
Publication of TWI297766B publication Critical patent/TWI297766B/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/02—Tubular elements of cross-section which is non-circular
    • F28F1/022—Tubular elements of cross-section which is non-circular with multiple channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Provided is a flat plate-type heat pipe formed of a flat pipe having a predetermined through-hole formed therein and a plurality of grooves extending from an inner surface of the through-hole in a longitudinal direction so that, while the interior of the heat pipe is in a vacuum state, heat in the heat pipe is discharged to the exterior due to a phase change of between liquid and gaseous states of working fluid and the working fluid flows by a capillary force produced from the plurality of grooves, whereby it is possible to obtain a strong capillary force and an excellent cooling effect while it is manufactured through a simple process.
TW094145188A 2005-04-19 2005-12-20 Flat plate-type heat pipe TWI297766B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050032212A KR100631050B1 (en) 2005-04-19 2005-04-19 Flat heat pipe

Publications (2)

Publication Number Publication Date
TW200638016A true TW200638016A (en) 2006-11-01
TWI297766B TWI297766B (en) 2008-06-11

Family

ID=37115274

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094145188A TWI297766B (en) 2005-04-19 2005-12-20 Flat plate-type heat pipe

Country Status (5)

Country Link
US (1) US20080185128A1 (en)
JP (1) JP2008531966A (en)
KR (1) KR100631050B1 (en)
TW (1) TWI297766B (en)
WO (1) WO2006112586A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105793660A (en) * 2013-12-05 2016-07-20 Ttm株式会社 Thin heat pipe having wicks of crisscross structure

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* Cited by examiner, † Cited by third party
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JP2008185283A (en) * 2007-01-31 2008-08-14 Toshiba Home Technology Corp Heat pipe
KR20080076423A (en) * 2007-02-16 2008-08-20 엘에스엠트론 주식회사 Plate Heat Pipe and Manufacturing Method Thereof
DE602008002507D1 (en) * 2007-08-27 2010-10-28 Abb Research Ltd Heat exchanger for power electronics components
TWI413887B (en) * 2008-01-07 2013-11-01 Compal Electronics Inc Heat pipe structure
KR100942063B1 (en) 2008-03-03 2010-02-11 한국생산기술연구원 Square Channel Heat Pipe
TW201100736A (en) * 2009-06-17 2011-01-01 Yeh Chiang Technology Corp Superthin heat pipe
JP5455503B2 (en) * 2009-08-11 2014-03-26 モレックス インコーポレイテド Heat transport unit, electronic equipment
US10107560B2 (en) 2010-01-14 2018-10-23 University Of Virginia Patent Foundation Multifunctional thermal management system and related method
US8311708B2 (en) * 2010-02-16 2012-11-13 Ford Global Technologies, Llc Adjustable grill shutter system
US20110214841A1 (en) * 2010-03-04 2011-09-08 Kunshan Jue-Chung Electronics Co. Flat heat pipe structure
CN102012181A (en) * 2010-06-21 2011-04-13 邹飞龙 Thermal superconducting pipe of plate multi-channel special-shape cavity
US20120080170A1 (en) * 2010-10-04 2012-04-05 Hsiu-Wei Yang Plate-type heat pipe sealing structure and manufacturing method thereof
KR20120065569A (en) * 2010-12-13 2012-06-21 한국전자통신연구원 Thin plate heat pipe
KR20120065575A (en) * 2010-12-13 2012-06-21 한국전자통신연구원 Thinned flat plate heat pipe fabricated by extrusion
KR101158682B1 (en) 2010-12-30 2012-06-25 주식회사 케이에스비 Evacuated tube solar collector with multi channel plate type heat pipe
KR20130050790A (en) 2011-11-08 2013-05-16 한국전자통신연구원 Flat heat pipe and fabrication method thereof
CN102661670B (en) * 2012-05-17 2014-09-03 程宝华 Superconducting nano heat transfer plate type heat exchanger and manufacturing method thereof
KR20140029633A (en) * 2012-08-29 2014-03-11 한국전자통신연구원 Flat heat pipe and fabrication method thereof
KR101465628B1 (en) 2012-09-28 2014-11-28 전자부품연구원 Solar cell module
FR2998657B1 (en) * 2012-11-28 2015-01-30 Renault Sa REVERSIBLE FLAT CALENDUL
TW201437591A (en) * 2013-03-26 2014-10-01 華碩電腦股份有限公司 Heat pipe structure
US20140352926A1 (en) * 2013-05-31 2014-12-04 Cooler Master Co., Ltd. Shell structure for handheld device
US9421648B2 (en) * 2013-10-31 2016-08-23 Asia Vital Components Co., Ltd. Manufacturing method of heat pipe structure
US10698458B2 (en) * 2014-06-02 2020-06-30 Microsoft Technology Licensing, Llc Integrated vapor chamber for thermal management of computing devices
WO2016121115A1 (en) * 2015-01-30 2016-08-04 三菱電機株式会社 Heat exchanger and refrigeration cycle device
KR102219482B1 (en) 2015-03-03 2021-02-25 한국전자통신연구원 Semiconductor device
WO2016204328A1 (en) * 2015-06-19 2016-12-22 티티엠주식회사 Thin heat pipe and method for manufacturing same
CN105352351B (en) * 2015-11-03 2018-07-06 刘树宇 Improved structure of temperature-uniforming plate
US10694641B2 (en) 2016-04-29 2020-06-23 Intel Corporation Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms
CN108253827B (en) * 2016-12-28 2020-06-23 神讯电脑(昆山)有限公司 Aluminum extrusion type hot plate and manufacturing method thereof
WO2018198354A1 (en) * 2017-04-28 2018-11-01 株式会社村田製作所 Vapor chamber
JP7243135B2 (en) * 2018-01-22 2023-03-22 大日本印刷株式会社 Vapor chambers, electronics, and sheets for vapor chambers

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5179043A (en) * 1989-07-14 1993-01-12 The Texas A&M University System Vapor deposited micro heat pipes
US5219021A (en) * 1991-10-17 1993-06-15 Grumman Aerospace Corporation Large capacity re-entrant groove heat pipe
US5309986A (en) * 1992-11-30 1994-05-10 Satomi Itoh Heat pipe
JPH11101585A (en) * 1997-09-29 1999-04-13 Furukawa Electric Co Ltd:The Plate type heat pipe and its mounting structure
JP2000193385A (en) * 1998-12-24 2000-07-14 Furukawa Electric Co Ltd:The Flat heat pipe
US6216343B1 (en) * 1999-09-02 2001-04-17 The United States Of America As Represented By The Secretary Of The Air Force Method of making micro channel heat pipe having corrugated fin elements
KR200259040Y1 (en) * 2001-09-04 2001-12-31 주식회사 한국에치피티 Flat type heat pipe
KR200297491Y1 (en) * 2002-08-26 2002-12-11 (주) 대홍기업 flat type heat pipe and heat sink
US20040112572A1 (en) * 2002-12-17 2004-06-17 Moon Seok Hwan Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105793660A (en) * 2013-12-05 2016-07-20 Ttm株式会社 Thin heat pipe having wicks of crisscross structure

Also Published As

Publication number Publication date
US20080185128A1 (en) 2008-08-07
WO2006112586A1 (en) 2006-10-26
TWI297766B (en) 2008-06-11
JP2008531966A (en) 2008-08-14
KR100631050B1 (en) 2006-10-04

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Legal Events

Date Code Title Description
MC4A Revocation of granted patent