TW200621137A - Substrate with high heat-conductivity and its manufacturing process - Google Patents
Substrate with high heat-conductivity and its manufacturing processInfo
- Publication number
- TW200621137A TW200621137A TW093138528A TW93138528A TW200621137A TW 200621137 A TW200621137 A TW 200621137A TW 093138528 A TW093138528 A TW 093138528A TW 93138528 A TW93138528 A TW 93138528A TW 200621137 A TW200621137 A TW 200621137A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal material
- conductivity
- heat
- high heat
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000007769 metal material Substances 0.000 abstract 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 4
- 239000000853 adhesive Substances 0.000 abstract 4
- 230000001070 adhesive effect Effects 0.000 abstract 4
- 239000011889 copper foil Substances 0.000 abstract 4
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000000155 melt Substances 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Landscapes
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Abstract
A substrate with high heat-conductivity and its manufacturing process are disclosed. A metal material with high heat-conductivity, such as aluminum, is premeditatedly bored with holes having proper diameters. The metal material is placed between two copper foils. An adhesive with high heat-conductivity is filled between the metal material and the copper foil for use as electric insulating and binding medium. When high temperature is introduced during the compression applied on the sheet materials, the adhesive having high heat-conductivity melts so the metal material and the copper foil are bound. During the melting of the high heat-conductive adhesive, the adhesive fills the holes premeditatedly manufactured on the metal material to form an electric insulating layer. After the substrate is bored, an electroplating process is performed and there is no shortcut formed between the metal material and the copper foil. The heat generated by an electronic device can be immediately transmitted to the metal material because of the increased area of the heat-dissipating surface of the metal material. This design makes the heat-conductive substrate dissipate the heat more efficiently.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93138528A TWI246881B (en) | 2004-12-13 | 2004-12-13 | Substrate with high heat-conductivity and its manufacturing process |
| JP2005358113A JP2006173612A (en) | 2004-12-13 | 2005-12-12 | Substrate having high thermal conductivity and process for manufacturing it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93138528A TWI246881B (en) | 2004-12-13 | 2004-12-13 | Substrate with high heat-conductivity and its manufacturing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI246881B TWI246881B (en) | 2006-01-01 |
| TW200621137A true TW200621137A (en) | 2006-06-16 |
Family
ID=36673960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW93138528A TWI246881B (en) | 2004-12-13 | 2004-12-13 | Substrate with high heat-conductivity and its manufacturing process |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006173612A (en) |
| TW (1) | TWI246881B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI755985B (en) * | 2020-12-22 | 2022-02-21 | 聚鼎科技股份有限公司 | Thermally conductive board |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108697004A (en) * | 2017-04-12 | 2018-10-23 | 健鼎（无锡）电子有限公司 | Circuit board with high heat dissipation efficiency and manufacturing method thereof |
| CN109729359A (en) * | 2017-10-31 | 2019-05-07 | 苏州新海宜电子技术有限公司 | High-definition digital video encoder |
| CN116408453B (en) * | 2021-12-31 | 2026-01-16 | 天之棋(上海)材料科技有限公司 | Composite heat conduction material of copper foil substrate |
-
2004
- 2004-12-13 TW TW93138528A patent/TWI246881B/en not_active IP Right Cessation
-
2005
- 2005-12-12 JP JP2005358113A patent/JP2006173612A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI755985B (en) * | 2020-12-22 | 2022-02-21 | 聚鼎科技股份有限公司 | Thermally conductive board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006173612A (en) | 2006-06-29 |
| TWI246881B (en) | 2006-01-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |