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TW200620821A - Surface acoustic wave filter implementing diamond and microwave micro-strip line - Google Patents

Surface acoustic wave filter implementing diamond and microwave micro-strip line

Info

Publication number
TW200620821A
TW200620821A TW093137709A TW93137709A TW200620821A TW 200620821 A TW200620821 A TW 200620821A TW 093137709 A TW093137709 A TW 093137709A TW 93137709 A TW93137709 A TW 93137709A TW 200620821 A TW200620821 A TW 200620821A
Authority
TW
Taiwan
Prior art keywords
diamond
wave filter
acoustic wave
surface acoustic
layer
Prior art date
Application number
TW093137709A
Other languages
Chinese (zh)
Other versions
TWI241065B (en
Inventor
Mau-Phong Houng
Yeong-Her Wang
Wen-Chi Hwang
Chun-Hsien Huang
I-Tseng Tang
Original Assignee
Nat Applied Res Laboratories
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Applied Res Laboratories filed Critical Nat Applied Res Laboratories
Priority to TW93137709A priority Critical patent/TWI241065B/en
Application granted granted Critical
Publication of TWI241065B publication Critical patent/TWI241065B/en
Publication of TW200620821A publication Critical patent/TW200620821A/en

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  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

The present invention discloses a Surface Acoustic Wave filter Implementing Diamond and Microwave Micro-strip Line. The surface acoustic wave filter is formed by implementing the high acoustic speed and excellent vibratility of diamond or diamond like carbon, together with microwave microstrip line. A layer of diamond is formed on a silicon or GaAs substrate, a layer of ZnO or AlN is formed on the diamond to form a piezoelectric film, then a layer of Aluminum is formed on the piezoelectric film by plating. Lithography and etching or lift-off method is used to form a group of coupled microstrip square open-loop resonators and interdigital transducer (IDTs). Finally, a layer of Al is plating on the back side of the substrate, a microwave microstrip and IDTs cross coupled surface acoustic wave filter is formed.
TW93137709A 2004-12-07 2004-12-07 Surface acoustic wave filter implementing diamond and microwave micro-strip line TWI241065B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93137709A TWI241065B (en) 2004-12-07 2004-12-07 Surface acoustic wave filter implementing diamond and microwave micro-strip line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93137709A TWI241065B (en) 2004-12-07 2004-12-07 Surface acoustic wave filter implementing diamond and microwave micro-strip line

Publications (2)

Publication Number Publication Date
TWI241065B TWI241065B (en) 2005-10-01
TW200620821A true TW200620821A (en) 2006-06-16

Family

ID=37013040

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93137709A TWI241065B (en) 2004-12-07 2004-12-07 Surface acoustic wave filter implementing diamond and microwave micro-strip line

Country Status (1)

Country Link
TW (1) TWI241065B (en)

Also Published As

Publication number Publication date
TWI241065B (en) 2005-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees