[go: up one dir, main page]

TW200620526A - Substrate processing apparatus and substrate transferring method adopted in substrate processing apparatus - Google Patents

Substrate processing apparatus and substrate transferring method adopted in substrate processing apparatus

Info

Publication number
TW200620526A
TW200620526A TW094134704A TW94134704A TW200620526A TW 200620526 A TW200620526 A TW 200620526A TW 094134704 A TW094134704 A TW 094134704A TW 94134704 A TW94134704 A TW 94134704A TW 200620526 A TW200620526 A TW 200620526A
Authority
TW
Taiwan
Prior art keywords
processing
transferring
wafers
processing apparatus
unit
Prior art date
Application number
TW094134704A
Other languages
Chinese (zh)
Other versions
TWI408767B (en
Inventor
Tatsuya Ogi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200620526A publication Critical patent/TW200620526A/en
Application granted granted Critical
Publication of TWI408767B publication Critical patent/TWI408767B/en

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

To enhance operation efficiency at each processing chamber and thereby enhance throughput of an entire processing apparatus by matching the timing of transferring wafers from cassette containers with the processing time at each processing chamber. The substrate processing apparatus 100 comprises: a processing unit 110 having a plurality of processing chambers 140A, 140B for applying specific processing to wafers; a transferring unit 120 connected to the processing unit 110; a transferring unit side transfer mechanism 170 for transferring the wafers contained in cassette containers 134A, 134B to the processing unit; and a processing unit side transfer mechanism 180 for transferring the wafers transferred from the transferring unit to the processing chambers. A control unit 190 is provided to obtain wafer transferring timing for each processing chamber for transferring the wafers from the cassette containers to each processing chamber, based on processing times TP1, TP2 of the wafers WP1, WP2 in each processing chamber P1, P2, and to transfer the wafers from the cassette containers according to the transferring timing.
TW94134704A 2004-12-06 2005-10-04 A substrate processing apparatus, and a substrate processing apparatus TWI408767B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004352796A JP4610317B2 (en) 2004-12-06 2004-12-06 Substrate processing apparatus and substrate transfer method for substrate processing apparatus

Publications (2)

Publication Number Publication Date
TW200620526A true TW200620526A (en) 2006-06-16
TWI408767B TWI408767B (en) 2013-09-11

Family

ID=36666855

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94134704A TWI408767B (en) 2004-12-06 2005-10-04 A substrate processing apparatus, and a substrate processing apparatus

Country Status (4)

Country Link
JP (1) JP4610317B2 (en)
KR (1) KR100742409B1 (en)
CN (1) CN100411130C (en)
TW (1) TWI408767B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100978857B1 (en) * 2008-07-16 2010-08-31 세메스 주식회사 Substrate Processing Equipment and Method
JP5392190B2 (en) * 2010-06-01 2014-01-22 東京エレクトロン株式会社 Substrate processing system and substrate processing method
JP6568335B2 (en) * 2013-03-29 2019-08-28 芝浦メカトロニクス株式会社 Processing system and processing method
JP6298318B2 (en) * 2014-02-25 2018-03-20 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus
CN105336652B (en) * 2014-06-26 2019-05-31 北京北方华创微电子装备有限公司 Chip transmission control method and system
JP6256388B2 (en) * 2015-03-10 2018-01-10 トヨタ自動車株式会社 Work processing system and processing method
US12046499B2 (en) * 2020-02-05 2024-07-23 Brooks Automation Us, Llc Substrate processing apparatus
JP7311553B2 (en) * 2021-03-29 2023-07-19 株式会社Kokusai Electric SUBSTRATE PROCESSING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND PROGRAM
JP7324811B2 (en) * 2021-09-22 2023-08-10 株式会社Kokusai Electric SUBSTRATE PROCESSING APPARATUS, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROGRAM

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3105544B2 (en) * 1996-03-18 2000-11-06 株式会社小松製作所 Control device for work transfer system
US5928389A (en) * 1996-10-21 1999-07-27 Applied Materials, Inc. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
US6224312B1 (en) * 1996-11-18 2001-05-01 Applied Materials, Inc. Optimal trajectory robot motion
JP3193904B2 (en) * 1997-08-01 2001-07-30 株式会社日立国際電気 Substrate transfer control method and substrate product manufacturing method
JP2000021948A (en) * 1998-06-30 2000-01-21 Toshiba Corp Semiconductor manufacturing apparatus and semiconductor manufacturing system
US6418356B1 (en) * 1998-12-31 2002-07-09 Silicon Valley Group, Inc. Method and apparatus for resolving conflicts in a substrate processing system
JP3748193B2 (en) * 1999-03-17 2006-02-22 株式会社日立製作所 Vacuum processing apparatus and operation method thereof
US6291252B1 (en) * 1999-06-30 2001-09-18 Advanced Micro Devices, Inc. Automatic method to eliminate first-wafer effect
US6417014B1 (en) * 1999-10-19 2002-07-09 Advanced Micro Devices, Inc. Method and apparatus for reducing wafer to wafer deposition variation
JP2001351848A (en) * 2000-06-07 2001-12-21 Tokyo Electron Ltd Substrate processing system and substrate processing method
JP2002151568A (en) * 2000-11-07 2002-05-24 Tokyo Electron Ltd Processing system and transfer method for object to be processed
JP2002237507A (en) * 2000-12-08 2002-08-23 Tokyo Electron Ltd Processing system and method of transporting object to be processed in processing system
WO2002047153A1 (en) * 2000-12-08 2002-06-13 Tokyo Electron Limited Semiconductor processing system and method for transferring workpiece
JP2001319959A (en) * 2001-03-30 2001-11-16 Tokyo Electron Ltd Decompression / normal pressure processing equipment
US6650964B2 (en) * 2002-04-16 2003-11-18 Mckesson Automation Inc. Medication dispensing apparatus override check and communication system
JP3936948B2 (en) * 2004-08-19 2007-06-27 カネソウ株式会社 Chain stop device of car stopper strut
JP4557986B2 (en) * 2004-11-24 2010-10-06 株式会社日立国際電気 Substrate processing apparatus and semiconductor device manufacturing method

Also Published As

Publication number Publication date
KR100742409B1 (en) 2007-07-24
TWI408767B (en) 2013-09-11
JP4610317B2 (en) 2011-01-12
JP2006165174A (en) 2006-06-22
CN1787197A (en) 2006-06-14
KR20060063728A (en) 2006-06-12
CN100411130C (en) 2008-08-13

Similar Documents

Publication Publication Date Title
TW200620526A (en) Substrate processing apparatus and substrate transferring method adopted in substrate processing apparatus
WO2006031956A3 (en) Multi-single wafer processing apparatus
KR101412302B1 (en) Scheduling method and recording medium having scheduling program recorded thereon for substrate treating apparatus
WO2009099721A9 (en) Processing system for fabricating compound nitride semiconductor devices
MY160715A (en) System for batch processing of magnetic media
TW200707113A (en) Substrate processing apparatus
DE502006004199D1 (en) A method of forming a back-to-back wafer batch to be positioned in a process boat and handling system for forming the back-to-back wafer batch
EP1361600A3 (en) Substrate treating apparatus
MY142778A (en) Device and method for the separation and the transport of substrates
TW200801371A (en) Drive apparatus for substrate transfer robot having coolant circulating passage
WO2008039702A3 (en) Substrate handling system and method
WO2003010800A1 (en) Processing apparatus and processing method
TW200508140A (en) Method and apparatus for vertical transfer of semiconductor substrates between cleaning modules
PT1571234E (en) Method for using an in line coating apparatus
MXPA02010669A (en) IMPROVEMENT OF PRODUCTION FOR A REACTOR OF A SINGLE CONTACT PLATE.
US6990747B2 (en) Vacuum processing apparatus and substrate transfer method
TWI436934B (en) Component feeding apparatus and method thereof
CN103811292B (en) Silicon chip process and treat system and processing method
KR101225312B1 (en) Process apparatus
WO2009037754A1 (en) Substrate transfer system
TW201110264A (en) Bernoulli gripper
WO2006069341A3 (en) Cluster tool architecture for processing a substrate
TW200511368A (en) Apparatus for semiconductor device and method using the same
TW200602728A (en) Distribution system and method of operating the same
WO2007002856A3 (en) Software sequencer to dynamically adjust wafer transfer decision

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees