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TW200629488A - Semiconductor device and electronic circuit - Google Patents

Semiconductor device and electronic circuit

Info

Publication number
TW200629488A
TW200629488A TW094134824A TW94134824A TW200629488A TW 200629488 A TW200629488 A TW 200629488A TW 094134824 A TW094134824 A TW 094134824A TW 94134824 A TW94134824 A TW 94134824A TW 200629488 A TW200629488 A TW 200629488A
Authority
TW
Taiwan
Prior art keywords
semiconductor device
inductor
frame portion
support substrate
lead frame
Prior art date
Application number
TW094134824A
Other languages
Chinese (zh)
Inventor
Fujio Ito
Hiromichi Suzuki
Motoo Suwa
Mitsuru Hiraki
Masashi Horiguchi
Original Assignee
Renesas Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Tech Corp filed Critical Renesas Tech Corp
Publication of TW200629488A publication Critical patent/TW200629488A/en

Links

Classifications

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

A semiconductor apparatus comprises a support substrate, a lead frame portion fixed to the support substrate, and a semiconductor device connected to the lead frame portion. The lead frame portion has an inductor having a predetermined pattern at its center and lead components. The inductor has a spiral shape with an opening at its central part. The semiconductor device is fixed to the support substrate in the opening. Since the inductor is not obstructed by the semiconductor device, the position of the connection between the semiconductor device and the inductor is not restricted at all. On this point, the degree of freedom of bonding is attained.
TW094134824A 2005-02-09 2005-10-05 Semiconductor device and electronic circuit TW200629488A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/001935 WO2006085363A1 (en) 2005-02-09 2005-02-09 Semiconductor apparatus and electronic circuit

Publications (1)

Publication Number Publication Date
TW200629488A true TW200629488A (en) 2006-08-16

Family

ID=36792938

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134824A TW200629488A (en) 2005-02-09 2005-10-05 Semiconductor device and electronic circuit

Country Status (3)

Country Link
JP (1) JPWO2006085363A1 (en)
TW (1) TW200629488A (en)
WO (1) WO2006085363A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI574359B (en) * 2015-01-14 2017-03-11 聯發科技股份有限公司 Semiconductor package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8818296B2 (en) * 2012-11-14 2014-08-26 Power Integrations, Inc. Noise cancellation for a magnetically coupled communication link utilizing a lead frame

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181046A (en) * 1983-03-31 1984-10-15 Toshiba Corp Semiconductor integrated circuit
JPS59190717A (en) * 1983-04-13 1984-10-29 Omron Tateisi Electronics Co Proximity switch
JPH06104372A (en) * 1992-09-22 1994-04-15 Matsushita Electric Ind Co Ltd Semiconductor device
JPH0888313A (en) * 1994-09-14 1996-04-02 Oki Electric Ind Co Ltd Resin-sealed semiconductor device
JP2970626B2 (en) * 1997-11-11 1999-11-02 日本電気株式会社 Lead frame for semiconductor integrated circuit device and semiconductor integrated circuit device
US6351033B1 (en) * 1999-10-06 2002-02-26 Agere Systems Guardian Corp. Multifunction lead frame and integrated circuit package incorporating the same
JP3847242B2 (en) * 2002-10-11 2006-11-22 松下電器産業株式会社 Semiconductor device and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI574359B (en) * 2015-01-14 2017-03-11 聯發科技股份有限公司 Semiconductor package
US9704785B2 (en) 2015-01-14 2017-07-11 Mediatek Inc. Semiconductor package with die paddle

Also Published As

Publication number Publication date
WO2006085363A1 (en) 2006-08-17
JPWO2006085363A1 (en) 2008-06-26

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