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TW200626054A - Heat conducting structure of heat radiator - Google Patents

Heat conducting structure of heat radiator

Info

Publication number
TW200626054A
TW200626054A TW094100769A TW94100769A TW200626054A TW 200626054 A TW200626054 A TW 200626054A TW 094100769 A TW094100769 A TW 094100769A TW 94100769 A TW94100769 A TW 94100769A TW 200626054 A TW200626054 A TW 200626054A
Authority
TW
Taiwan
Prior art keywords
heat conducting
heat
cylinder
retaining ring
heating element
Prior art date
Application number
TW094100769A
Other languages
Chinese (zh)
Other versions
TWI289040B (en
Inventor
Jr-Kai Yang
Feng-Gu Wang
Yi-Luen Jeng
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to TW94100769A priority Critical patent/TWI289040B/en
Publication of TW200626054A publication Critical patent/TW200626054A/en
Application granted granted Critical
Publication of TWI289040B publication Critical patent/TWI289040B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

This invention relates to a heat conducting structure of heat radiator. It is applied for a heat dissipation module of an electronic apparatus to combine with a heating element. The structure comprises a heat conducting board, and a buckling spring. A plane of the heat conducting board combines with the heating element has at least one retaining ring cylinder and at least one keyhole cylinder. A pair of plates and a pair of structural plates combines the buckling spring. The plate has an aperture corresponding to the retaining ring cylinder. Furthermore, it has a locking aperture corresponding to the keyhole cylinder. Through the retaining ring and the keyhole cylinder, the heat conducting board supports a buckling spring. Moreover, the heating element is clipped through the buckling spring fastened and locked to the retaining ring cylinders and the keyhole cylinders. Eventually, the heating surface of the heating element is combined with the heat conducting board.
TW94100769A 2005-01-11 2005-01-11 Heat conducting structure of heat radiator TWI289040B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94100769A TWI289040B (en) 2005-01-11 2005-01-11 Heat conducting structure of heat radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94100769A TWI289040B (en) 2005-01-11 2005-01-11 Heat conducting structure of heat radiator

Publications (2)

Publication Number Publication Date
TW200626054A true TW200626054A (en) 2006-07-16
TWI289040B TWI289040B (en) 2007-10-21

Family

ID=39228533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94100769A TWI289040B (en) 2005-01-11 2005-01-11 Heat conducting structure of heat radiator

Country Status (1)

Country Link
TW (1) TWI289040B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381206B (en) * 2008-10-31 2013-01-01 Chimei Innolux Corp Liquid crystal display device

Also Published As

Publication number Publication date
TWI289040B (en) 2007-10-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees