TW200619240A - Star polymer, acid-decomposable resin composition, resist composition, and di(meth) acrylate compound - Google Patents
Star polymer, acid-decomposable resin composition, resist composition, and di(meth) acrylate compoundInfo
- Publication number
- TW200619240A TW200619240A TW094127407A TW94127407A TW200619240A TW 200619240 A TW200619240 A TW 200619240A TW 094127407 A TW094127407 A TW 094127407A TW 94127407 A TW94127407 A TW 94127407A TW 200619240 A TW200619240 A TW 200619240A
- Authority
- TW
- Taiwan
- Prior art keywords
- star polymer
- meth
- acid
- acrylate compound
- decomposable resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
- C07C69/54—Acrylic acid esters; Methacrylic acid esters
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004235905 | 2004-08-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200619240A true TW200619240A (en) | 2006-06-16 |
Family
ID=35839408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094127407A TW200619240A (en) | 2004-08-13 | 2005-08-12 | Star polymer, acid-decomposable resin composition, resist composition, and di(meth) acrylate compound |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4421614B2 (zh) |
| TW (1) | TW200619240A (zh) |
| WO (1) | WO2006016648A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106893053A (zh) * | 2015-12-18 | 2017-06-27 | 陶氏环球技术有限责任公司 | 酸不稳定超支化共聚物和相关联的光致抗蚀剂组合物以及形成电子器件的方法 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4851140B2 (ja) * | 2005-08-09 | 2012-01-11 | 三菱レイヨン株式会社 | (メタ)アクリル酸エステル、重合体、レジスト組成物、およびパターンが形成された基板の製造方法 |
| JP2007316508A (ja) | 2006-05-29 | 2007-12-06 | Tokyo Ohka Kogyo Co Ltd | 分解性組成物およびその使用方法 |
| JP5340158B2 (ja) * | 2007-08-31 | 2013-11-13 | 日本曹達株式会社 | スターポリマーの製造方法 |
| JP5553488B2 (ja) * | 2008-06-06 | 2014-07-16 | 株式会社ダイセル | リソグラフィー用重合体並びにその製造方法 |
| JP5663153B2 (ja) * | 2008-08-27 | 2015-02-04 | 東京応化工業株式会社 | ポジ型レジスト組成物及びレジストパターン形成方法 |
| JP2010250278A (ja) * | 2009-03-26 | 2010-11-04 | Tokyo Ohka Kogyo Co Ltd | ポジ型レジスト組成物、レジストパターン形成方法 |
| JP5645495B2 (ja) * | 2010-06-17 | 2014-12-24 | 東京応化工業株式会社 | ポジ型レジスト組成物、レジストパターン形成方法 |
| CN112125998A (zh) * | 2020-09-30 | 2020-12-25 | 中国科学院宁波材料技术与工程研究所 | 一种缩醛型动态共价网络材料及其制备方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4746714A (en) * | 1986-06-17 | 1988-05-24 | E. I. Du Pont De Nemours And Company | Stabilized acrylic resin |
| JPS63132914A (ja) * | 1986-08-29 | 1988-06-04 | イ−・アイ・デユポン・ド・ネモア−ス・アンド・コンパニ− | ハイブリツドアクリル系星形ポリマ−およびその製法 |
| EP0636156B1 (en) * | 1992-04-14 | 1997-07-30 | Cornell Research Foundation, Inc. | Dendritic based macromolecules and method of production |
| JP4183293B2 (ja) * | 1997-07-09 | 2008-11-19 | 日本曹達株式会社 | (メタ)アクリル酸エステル系重合体及びその製造方法 |
| JP2000063327A (ja) * | 1998-08-17 | 2000-02-29 | Toyo Ink Mfg Co Ltd | 反応性ヘミアセタールエステルの製造方法、該方法で製造された反応性ヘミアセタールエステル、およびその硬化物 |
| JP2002338535A (ja) * | 2001-05-17 | 2002-11-27 | Nitto Denko Corp | ポリヒドロキシルデンドリマーおよびその製造法 |
| JP4052904B2 (ja) * | 2002-09-04 | 2008-02-27 | 株式会社日本触媒 | (メタ)アクリレート化合物を含む水系組成物 |
| US7736834B2 (en) * | 2003-08-28 | 2010-06-15 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, process for manufacturing printed circuit board and method for removing photocured product |
-
2005
- 2005-08-11 WO PCT/JP2005/014740 patent/WO2006016648A1/ja not_active Ceased
- 2005-08-11 JP JP2006531726A patent/JP4421614B2/ja not_active Expired - Fee Related
- 2005-08-12 TW TW094127407A patent/TW200619240A/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106893053A (zh) * | 2015-12-18 | 2017-06-27 | 陶氏环球技术有限责任公司 | 酸不稳定超支化共聚物和相关联的光致抗蚀剂组合物以及形成电子器件的方法 |
| CN106893053B (zh) * | 2015-12-18 | 2019-02-22 | 陶氏环球技术有限责任公司 | 酸不稳定超支化共聚物和相关联的光致抗蚀剂组合物以及形成电子器件的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4421614B2 (ja) | 2010-02-24 |
| WO2006016648A1 (ja) | 2006-02-16 |
| JPWO2006016648A1 (ja) | 2008-05-01 |
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