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TW200617400A - Circuit device inspecting electrode apparatus, method for manufacturing the same and circuit device inspecting apparatus - Google Patents

Circuit device inspecting electrode apparatus, method for manufacturing the same and circuit device inspecting apparatus

Info

Publication number
TW200617400A
TW200617400A TW094134332A TW94134332A TW200617400A TW 200617400 A TW200617400 A TW 200617400A TW 094134332 A TW094134332 A TW 094134332A TW 94134332 A TW94134332 A TW 94134332A TW 200617400 A TW200617400 A TW 200617400A
Authority
TW
Taiwan
Prior art keywords
circuit device
electrodes
device inspecting
electrode
inspecting
Prior art date
Application number
TW094134332A
Other languages
Chinese (zh)
Inventor
Kiyoshi Kimura
Sugiro Shimoda
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200617400A publication Critical patent/TW200617400A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A circuit device inspecting electrode apparatus is provided, in which connecting electrodes are formed at a small arrangement pitch, while permitting the electrodes to have sufficient insulation, and further, a contact resistance is small. A method for manufacturing such apparatus is also provided. A circuit device inspecting apparatus is provided, wherein prescribed high precision electrical inspection can be performed for all the electrodes to be inspected in a circuit device having a small arrangement pitch of the electrodes to be inspected or in a circuit device having a large number of electrodes. The electrode apparatus is provided with an insulating board; a plurality of connecting electrodes which are arranged at prescribed positions on a front plane side of the insulating board and have flat rear planes; and a plurality of cables integrally connected at one end plane with the rear plane of the connecting electrode, in a status where one end part of each of the cable is fixed to extend by penetrating the insulating board in a thickness direction. The inspecting apparatus is provided with the circuit device inspecting electrode apparatus.
TW094134332A 2004-09-30 2005-09-30 Circuit device inspecting electrode apparatus, method for manufacturing the same and circuit device inspecting apparatus TW200617400A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004285678 2004-09-30

Publications (1)

Publication Number Publication Date
TW200617400A true TW200617400A (en) 2006-06-01

Family

ID=36119001

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134332A TW200617400A (en) 2004-09-30 2005-09-30 Circuit device inspecting electrode apparatus, method for manufacturing the same and circuit device inspecting apparatus

Country Status (2)

Country Link
TW (1) TW200617400A (en)
WO (1) WO2006035856A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI585426B (en) * 2013-05-06 2017-06-01 三星顯示器有限公司 Substrate of electronic device and electronic device including the same
TWI658277B (en) * 2014-04-24 2019-05-01 日商日本電產理德股份有限公司 Electrode structure, inspection jig, and method of manufacturing electrode structure
CN111948567A (en) * 2019-04-30 2020-11-17 烽火通信科技股份有限公司 Method and system for detecting short circuit before mainboard is powered on
TWI874599B (en) * 2020-03-13 2025-03-01 日商日本電產理德股份有限公司 Inspection jig, substrate inspection device, and inspection device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20120453A1 (en) * 2012-03-22 2013-09-23 Technoprobe Spa HYBRID TYPE CONNECTION STRUCTURE

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63208237A (en) * 1987-02-25 1988-08-29 Hitachi Ltd Semiconductor device measurement equipment
JPH11204177A (en) * 1998-01-07 1999-07-30 Jsr Corp Sheet connector
JP2000241485A (en) * 1999-02-24 2000-09-08 Jsr Corp Apparatus and method for measuring electric resistance of circuit board
JP4083350B2 (en) * 1999-06-30 2008-04-30 Ｈｏｙａ株式会社 Manufacturing method of membrane ring with bumps
JP2002062313A (en) * 2000-08-22 2002-02-28 Toppan Printing Co Ltd Electrical inspection jig and method of manufacturing the same
JP3690796B2 (en) * 2002-01-31 2005-08-31 株式会社コーヨーテクノス Inspection jig, manufacturing method thereof, and circuit board manufacturing method
JP3700721B2 (en) * 2003-01-17 2005-09-28 Ｊｓｒ株式会社 Circuit board inspection apparatus and circuit board inspection method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI585426B (en) * 2013-05-06 2017-06-01 三星顯示器有限公司 Substrate of electronic device and electronic device including the same
TWI658277B (en) * 2014-04-24 2019-05-01 日商日本電產理德股份有限公司 Electrode structure, inspection jig, and method of manufacturing electrode structure
CN111948567A (en) * 2019-04-30 2020-11-17 烽火通信科技股份有限公司 Method and system for detecting short circuit before mainboard is powered on
CN111948567B (en) * 2019-04-30 2023-04-25 烽火通信科技股份有限公司 Method and system for detecting short circuit before powering on motherboard
TWI874599B (en) * 2020-03-13 2025-03-01 日商日本電產理德股份有限公司 Inspection jig, substrate inspection device, and inspection device

Also Published As

Publication number Publication date
WO2006035856A1 (en) 2006-04-06

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