TW200616712A - Polymer protected palladium nanoparticles - Google Patents
Polymer protected palladium nanoparticlesInfo
- Publication number
- TW200616712A TW200616712A TW093135326A TW93135326A TW200616712A TW 200616712 A TW200616712 A TW 200616712A TW 093135326 A TW093135326 A TW 093135326A TW 93135326 A TW93135326 A TW 93135326A TW 200616712 A TW200616712 A TW 200616712A
- Authority
- TW
- Taiwan
- Prior art keywords
- nanoparticles
- palladium nanoparticles
- synthesized
- activators
- polymer protected
- Prior art date
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title abstract 5
- 239000002105 nanoparticle Substances 0.000 title abstract 3
- 229910052763 palladium Inorganic materials 0.000 title abstract 2
- 229920000642 polymer Polymers 0.000 title abstract 2
- 238000000034 method Methods 0.000 abstract 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- 239000012190 activator Substances 0.000 abstract 3
- 230000004913 activation Effects 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 230000003750 conditioning effect Effects 0.000 abstract 1
- 238000007772 electroless plating Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Chemically Coating (AREA)
Abstract
The polymer protected palladium nanoparticles were synthesized in pure ethylene glycol system by adding sodium hydroxide as accelerator. This newly developed method improves previous methods which need to add extra reducing agent or react at high temperature. Those Pd nanoparticles can be diluted by water and successfully applied to the activation step in electroless plating process. These well-dispersed activators show not only superior stability in low concentration (10ppm) but also improve performance compared with existing commercial activators. Suitable conditioning procedures for the newly synthesized activator were also developed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93135326A TWI259105B (en) | 2004-11-17 | 2004-11-17 | Polymer protected palladium nanoparticles |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93135326A TWI259105B (en) | 2004-11-17 | 2004-11-17 | Polymer protected palladium nanoparticles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200616712A true TW200616712A (en) | 2006-06-01 |
| TWI259105B TWI259105B (en) | 2006-08-01 |
Family
ID=37873297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW93135326A TWI259105B (en) | 2004-11-17 | 2004-11-17 | Polymer protected palladium nanoparticles |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI259105B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109692707A (en) * | 2017-10-23 | 2019-04-30 | 卫子健 | From absorption catalyst composition and its manufacturing method of manufacturing method and electroless plating substrate |
| US11865518B2 (en) | 2017-10-20 | 2024-01-09 | National Tsing Hua University | Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate |
-
2004
- 2004-11-17 TW TW93135326A patent/TWI259105B/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11865518B2 (en) | 2017-10-20 | 2024-01-09 | National Tsing Hua University | Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate |
| CN109692707A (en) * | 2017-10-23 | 2019-04-30 | 卫子健 | From absorption catalyst composition and its manufacturing method of manufacturing method and electroless plating substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI259105B (en) | 2006-08-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |