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Application filed by Advanced Semiconductor EngfiledCriticalAdvanced Semiconductor Eng
Priority to TW093133649ApriorityCriticalpatent/TWI253731B/en
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Publication of TWI253731BpublicationCriticalpatent/TWI253731B/en
Publication of TW200616187ApublicationCriticalpatent/TW200616187A/en
Cooling Or The Like Of Semiconductors Or Solid State Devices
(AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices
(AREA)
Abstract
A semiconductor package includes a substrate, a die mounted on the substrate, a heat slug, and an encapsulation. The heat slug has a top cover portion having a cavity, and a structure-fixing device positioned in the cavity for fixing the structure of the heat slug, wherein the structure-fixing device is formed with pluralities of crossed grooves.