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TW200614273A - Conductive fine particle, method for producing conductive fine particle and electroless silver plating liquid - Google Patents

Conductive fine particle, method for producing conductive fine particle and electroless silver plating liquid

Info

Publication number
TW200614273A
TW200614273A TW094126697A TW94126697A TW200614273A TW 200614273 A TW200614273 A TW 200614273A TW 094126697 A TW094126697 A TW 094126697A TW 94126697 A TW94126697 A TW 94126697A TW 200614273 A TW200614273 A TW 200614273A
Authority
TW
Taiwan
Prior art keywords
fine particle
conductive fine
silver plating
producing
plating liquid
Prior art date
Application number
TW094126697A
Other languages
English (en)
Inventor
Takashi Kubota
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200614273A publication Critical patent/TW200614273A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Powder Metallurgy (AREA)
  • Non-Insulated Conductors (AREA)
TW094126697A 2004-08-05 2005-08-08 Conductive fine particle, method for producing conductive fine particle and electroless silver plating liquid TW200614273A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004229651 2004-08-05

Publications (1)

Publication Number Publication Date
TW200614273A true TW200614273A (en) 2006-05-01

Family

ID=35907385

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094126697A TW200614273A (en) 2004-08-05 2005-08-08 Conductive fine particle, method for producing conductive fine particle and electroless silver plating liquid

Country Status (7)

Country Link
US (1) US20070269603A1 (zh)
EP (1) EP1783783A1 (zh)
JP (1) JPWO2006018995A1 (zh)
KR (1) KR20070039882A (zh)
CN (1) CN1989573A (zh)
TW (1) TW200614273A (zh)
WO (1) WO2006018995A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI709635B (zh) * 2017-12-22 2020-11-11 德商愛卡有限公司 導電粒子、組合物、物件及製備導電粒子的方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4235227B2 (ja) * 2004-09-02 2009-03-11 積水化学工業株式会社 導電性微粒子及び異方性導電材料
US20120061698A1 (en) * 2010-09-10 2012-03-15 Toscano Lenora M Method for Treating Metal Surfaces
US20120061710A1 (en) * 2010-09-10 2012-03-15 Toscano Lenora M Method for Treating Metal Surfaces
CN103827981A (zh) * 2011-09-22 2014-05-28 株式会社日本触媒 导电性微粒及含有导电性微粒的各向异性导电材料
JP5667541B2 (ja) * 2011-09-26 2015-02-12 株式会社日本触媒 導電性微粒子及びそれを含む異方性導電材料
JP5916334B2 (ja) * 2011-10-07 2016-05-11 デクセリアルズ株式会社 異方性導電接着剤及びその製造方法、発光装置及びその製造方法
US9758702B2 (en) 2012-05-29 2017-09-12 Conpart As Isotropic conductive adhesive
US9434875B1 (en) * 2014-12-16 2016-09-06 Carbo Ceramics Inc. Electrically-conductive proppant and methods for making and using same
CN104342643B (zh) * 2013-07-23 2017-06-06 比亚迪股份有限公司 一种化学镀银液和镀银方法
CN104342644B (zh) * 2013-07-23 2017-05-31 比亚迪股份有限公司 一种化学镀银液和镀银方法
CN104342645B (zh) * 2013-07-23 2017-05-31 比亚迪股份有限公司 一种化学镀银液和镀银方法
WO2016121558A1 (ja) * 2015-01-28 2016-08-04 三菱マテリアル株式会社 銀被覆粒子及びその製造方法
JP6665514B2 (ja) 2015-01-28 2020-03-13 三菱マテリアル株式会社 銀被覆粒子の製造方法
JP6186019B2 (ja) * 2016-01-13 2017-08-23 株式会社山王 導電性微粒子及び導電性微粒子の製造方法
JP7093639B2 (ja) * 2018-02-06 2022-06-30 三菱マテリアル株式会社 銀被覆樹脂粒子
CN115279949A (zh) * 2020-02-25 2022-11-01 同和金属技术有限公司 镀银材料及其制造方法
CN117123791B (zh) * 2023-07-20 2025-10-17 云南省贵金属新材料控股集团股份有限公司 一种用于匹配低温共烧陶瓷的金粉的制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001155540A (ja) * 1999-11-29 2001-06-08 Sekisui Chem Co Ltd 導電性微粒子、異方性導電接着剤及び導電接続構造体
US20010055685A1 (en) * 2000-05-15 2001-12-27 Masami Kaneyoshi Conductive filler and making method
US20020160193A1 (en) * 2001-02-21 2002-10-31 Karel Hajmrle Noble metal clad Ni/C conductive fillers and conductive polymers made therefrom
JP2002266079A (ja) * 2001-03-09 2002-09-18 Shin Etsu Chem Co Ltd 銀被覆導電性粉末の製造方法、銀被覆導電性粉末および導電性粉末被覆用無電解銀メッキ浴
JP4022750B2 (ja) * 2002-10-31 2007-12-19 信越化学工業株式会社 導電性粉体及びその製造方法並びに導電性シリコーンゴム組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI709635B (zh) * 2017-12-22 2020-11-11 德商愛卡有限公司 導電粒子、組合物、物件及製備導電粒子的方法

Also Published As

Publication number Publication date
CN1989573A (zh) 2007-06-27
JPWO2006018995A1 (ja) 2008-05-08
US20070269603A1 (en) 2007-11-22
WO2006018995A1 (ja) 2006-02-23
EP1783783A1 (en) 2007-05-09
KR20070039882A (ko) 2007-04-13

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