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TW200603695A - Method for fabricating conductive bumps of circuit board - Google Patents

Method for fabricating conductive bumps of circuit board

Info

Publication number
TW200603695A
TW200603695A TW093120569A TW93120569A TW200603695A TW 200603695 A TW200603695 A TW 200603695A TW 093120569 A TW093120569 A TW 093120569A TW 93120569 A TW93120569 A TW 93120569A TW 200603695 A TW200603695 A TW 200603695A
Authority
TW
Taiwan
Prior art keywords
circuit board
layer
conductive bumps
conductive polymer
pads
Prior art date
Application number
TW093120569A
Other languages
Chinese (zh)
Other versions
TWI296490B (en
Inventor
Shih-Ping Hsu
Sao-Hsia Tang
Ying-Tung Wang
Wen-Hung Hu
Chao-Wen Shih
Meng Da Chu
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW93120569A priority Critical patent/TWI296490B/en
Publication of TW200603695A publication Critical patent/TW200603695A/en
Application granted granted Critical
Publication of TWI296490B publication Critical patent/TWI296490B/en

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A method for fabricating conductive bumps of a circuit board is proposed, wherein a circuit board formed with a plurality of pads on a surface thereof is provided, and an insulating layer is formed thereon with a plurality of openings to expose the pads. After a conductive polymer layer is formed on the surface of the insulating layer, a resist layer is formed thereon with a plurality of openings to expose the conductive polymer layer corresponding to the pads. A conductive bump is formed in the opening of the resist layer via the conductive polymer layer by an electroplating process, and then the resist layer and the conductive polymer layer beneath the resist layer can be removed.
TW93120569A 2004-07-09 2004-07-09 Method for fabricating conductive bumps of circuit board TWI296490B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93120569A TWI296490B (en) 2004-07-09 2004-07-09 Method for fabricating conductive bumps of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93120569A TWI296490B (en) 2004-07-09 2004-07-09 Method for fabricating conductive bumps of circuit board

Publications (2)

Publication Number Publication Date
TW200603695A true TW200603695A (en) 2006-01-16
TWI296490B TWI296490B (en) 2008-05-01

Family

ID=45068786

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93120569A TWI296490B (en) 2004-07-09 2004-07-09 Method for fabricating conductive bumps of circuit board

Country Status (1)

Country Link
TW (1) TWI296490B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI421001B (en) * 2007-02-12 2013-12-21 Unimicron Technology Corp Circuit board structure and fabrication method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI421001B (en) * 2007-02-12 2013-12-21 Unimicron Technology Corp Circuit board structure and fabrication method thereof

Also Published As

Publication number Publication date
TWI296490B (en) 2008-05-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees