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TW200603177A - Composition of conductive paste - Google Patents

Composition of conductive paste

Info

Publication number
TW200603177A
TW200603177A TW094105710A TW94105710A TW200603177A TW 200603177 A TW200603177 A TW 200603177A TW 094105710 A TW094105710 A TW 094105710A TW 94105710 A TW94105710 A TW 94105710A TW 200603177 A TW200603177 A TW 200603177A
Authority
TW
Taiwan
Prior art keywords
composition
units
conductive paste
resin
unit
Prior art date
Application number
TW094105710A
Other languages
English (en)
Other versions
TWI364042B (en
Inventor
Toshiaki Ogiwara
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200603177A publication Critical patent/TW200603177A/zh
Application granted granted Critical
Publication of TWI364042B publication Critical patent/TWI364042B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124—Intrinsically conductive polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Paints Or Removers (AREA)
TW094105710A 2004-02-25 2005-02-25 Composition of conductive paste TWI364042B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/786,489 US7169330B2 (en) 2004-02-25 2004-02-25 Composition of conductive paste

Publications (2)

Publication Number Publication Date
TW200603177A true TW200603177A (en) 2006-01-16
TWI364042B TWI364042B (en) 2012-05-11

Family

ID=34750492

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105710A TWI364042B (en) 2004-02-25 2005-02-25 Composition of conductive paste

Country Status (5)

Country Link
US (1) US7169330B2 (zh)
EP (1) EP1569244B1 (zh)
JP (1) JP4879497B2 (zh)
KR (1) KR100715758B1 (zh)
TW (1) TWI364042B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006225625A (ja) * 2005-01-19 2006-08-31 Nitto Denko Corp 半導電性樹脂組成物および配線回路基板
WO2007043603A1 (en) * 2005-10-06 2007-04-19 Seiko Epson Corporation Composition for conductive materials
EP2192598A1 (en) * 2008-12-01 2010-06-02 Exax Inc. Paste composition for forming heat-resistant conductive patterns on substrate
KR100983219B1 (ko) * 2008-12-05 2010-09-20 조근호 직접인쇄방식에 의한 인쇄회로기판의 제조방법 및 이에 의하여 제조된 인쇄회로기판
US10403769B2 (en) 2012-08-31 2019-09-03 Heraeus Deutschland GmbH & Co. KG Electro-conductive paste comprising Ag nano-particles and spherical Ag micro-particles in the preparation of electrodes
JP5849036B2 (ja) * 2012-09-27 2016-01-27 富士フイルム株式会社 導電ペースト、プリント配線基板
US9649730B2 (en) 2015-08-12 2017-05-16 E I Du Pont De Nemours And Company Paste and process for forming a solderable polyimide-based polymer thick film conductor
US20170044382A1 (en) * 2015-08-12 2017-02-16 E I Du Pont De Nemours And Company Process for forming a solderable polyimide-based polymer thick film conductor
US9637648B2 (en) * 2015-08-13 2017-05-02 E I Du Pont De Nemours And Company Photonic sintering of a solderable polymer thick film copper conductor composition
US9637647B2 (en) * 2015-08-13 2017-05-02 E I Du Pont De Nemours And Company Photonic sintering of a polymer thick film copper conductor composition
CN107828351B (zh) * 2016-09-15 2021-07-27 E·I·内穆尔杜邦公司 用于粘合的导电糊料
JP6795362B2 (ja) * 2016-09-15 2020-12-02 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 接合用の導電性ペースト

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02245070A (ja) * 1989-03-17 1990-09-28 Hitachi Chem Co Ltd 導電性ペースト組成物
JPH05217420A (ja) 1992-02-04 1993-08-27 Hitachi Chem Co Ltd 導電性ペースト
JPH0696685A (ja) 1992-09-11 1994-04-08 Toshiba Corp シャドウマスク
US5667899A (en) * 1992-09-16 1997-09-16 Hitachi Chemical Co. Ltd. Electrically conductive bonding films
JPH06231614A (ja) * 1993-02-01 1994-08-19 Toshiba Chem Corp 導電性ペースト
JPH07304868A (ja) 1994-05-09 1995-11-21 Maruzen Petrochem Co Ltd ポリイミド
JP3596563B2 (ja) 1995-07-26 2004-12-02 日立化成工業株式会社 導電ペースト
JPH0977973A (ja) * 1995-09-13 1997-03-25 Mitsui Toatsu Chem Inc ポリイミドペースト
JPH0995533A (ja) 1995-09-29 1997-04-08 Maruzen Petrochem Co Ltd 無色透明性ポリイミド樹脂材料およびそれを用いたフィルムまたはコーティング膜
JP2003292619A (ja) * 1995-11-30 2003-10-15 Mitsubishi Heavy Ind Ltd ポリイミド樹脂系組成物及びそれらを用いたプリプレグの製造方法並びに樹脂硬化方法
JPH107906A (ja) * 1996-06-21 1998-01-13 Chisso Corp ポリアミド酸系ワニス、このワニスを用いて作られた液晶配向膜、およびこの配向膜を用いた液晶表示素子
JPH10152630A (ja) 1996-08-21 1998-06-09 Hitachi Chem Co Ltd 導電ペースト及び複合導電粉
JPH10134636A (ja) 1996-10-30 1998-05-22 Hitachi Chem Co Ltd 導電性粉体、導電性ペースト及び導電性ペーストを用いた電気回路
CA2247287C (en) 1996-12-27 2004-07-13 Maruzen Petrochemical Co., Ltd. Soluble polyimide resin, process for production thereof, and polyimide resin solution composition
JP2000164403A (ja) 1998-11-24 2000-06-16 Matsushita Electric Ind Co Ltd 耐熱抵抗体ペーストおよび耐熱抵抗体と耐熱抵抗体の製造方法
JP4144110B2 (ja) * 1999-04-30 2008-09-03 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体、ポリイミドの製造法、感光性樹脂組成物、パターンの製造法及び電子部品
JP2000322933A (ja) 1999-05-14 2000-11-24 Hitachi Chem Co Ltd 導電ペースト及びその製造法
JP2001213962A (ja) 2000-02-04 2001-08-07 Maruzen Petrochem Co Ltd レーザー加工用ポリイミド樹脂及びその溶液組成物
JP2002260443A (ja) 2001-02-28 2002-09-13 Hitachi Chem Co Ltd 導電ペースト
JP2002245852A (ja) 2001-02-20 2002-08-30 Hitachi Chem Co Ltd 導電ペースト
JP2002270034A (ja) 2001-03-13 2002-09-20 Hitachi Chem Co Ltd 導電ペースト
JP4019254B2 (ja) * 2002-04-24 2007-12-12 信越化学工業株式会社 導電性樹脂組成物
US7348373B2 (en) * 2004-01-09 2008-03-25 E.I. Du Pont De Nemours And Company Polyimide compositions having resistance to water sorption, and methods relating thereto
JP2006225625A (ja) * 2005-01-19 2006-08-31 Nitto Denko Corp 半導電性樹脂組成物および配線回路基板

Also Published As

Publication number Publication date
JP2005243638A (ja) 2005-09-08
EP1569244A2 (en) 2005-08-31
EP1569244B1 (en) 2011-07-27
TWI364042B (en) 2012-05-11
JP4879497B2 (ja) 2012-02-22
US7169330B2 (en) 2007-01-30
US20050187329A1 (en) 2005-08-25
KR100715758B1 (ko) 2007-05-08
EP1569244A3 (en) 2008-11-12
KR20060042229A (ko) 2006-05-12

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees