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TW200601473A - Bump structure - Google Patents

Bump structure

Info

Publication number
TW200601473A
TW200601473A TW093119203A TW93119203A TW200601473A TW 200601473 A TW200601473 A TW 200601473A TW 093119203 A TW093119203 A TW 093119203A TW 93119203 A TW93119203 A TW 93119203A TW 200601473 A TW200601473 A TW 200601473A
Authority
TW
Taiwan
Prior art keywords
layer
wafer
under bump
bump metallurgy
barrier layer
Prior art date
Application number
TW093119203A
Other languages
Chinese (zh)
Other versions
TWI249211B (en
Inventor
Min-Lung Huang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW093119203A priority Critical patent/TWI249211B/en
Publication of TW200601473A publication Critical patent/TW200601473A/en
Application granted granted Critical
Publication of TWI249211B publication Critical patent/TWI249211B/en

Links

Classifications

    • H10W72/012—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A wafer bump structure mainly comprises wafer pads, under bump metallurgy layers and bumps. Therein, the wafer pads are formed on an active surface of the wafer and exposed out of openings formed in a passivation layer over the active surface, and each under bump metallurgy layer is formed over the corresponding wafer pad. Each under bump metallurgy layer includes an adhesive layer, a barrier layer, and a wetting layer which are sequentially formed on the wafer pads. Specifically, the material of the barrier layer mainly includes nickel-copper alloy and the wetting layer mainly includes a titanium layer and a copper layer sequentially formed on the barrier layer.
TW093119203A 2004-06-29 2004-06-29 Bump structure TWI249211B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW093119203A TWI249211B (en) 2004-06-29 2004-06-29 Bump structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093119203A TWI249211B (en) 2004-06-29 2004-06-29 Bump structure

Publications (2)

Publication Number Publication Date
TW200601473A true TW200601473A (en) 2006-01-01
TWI249211B TWI249211B (en) 2006-02-11

Family

ID=37429494

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093119203A TWI249211B (en) 2004-06-29 2004-06-29 Bump structure

Country Status (1)

Country Link
TW (1) TWI249211B (en)

Also Published As

Publication number Publication date
TWI249211B (en) 2006-02-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees