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TW200601439A - Etching chamber - Google Patents

Etching chamber

Info

Publication number
TW200601439A
TW200601439A TW093117730A TW93117730A TW200601439A TW 200601439 A TW200601439 A TW 200601439A TW 093117730 A TW093117730 A TW 093117730A TW 93117730 A TW93117730 A TW 93117730A TW 200601439 A TW200601439 A TW 200601439A
Authority
TW
Taiwan
Prior art keywords
etching chamber
etching
chamber
chamber includes
protrusions
Prior art date
Application number
TW093117730A
Other languages
Chinese (zh)
Inventor
Ching-Feng Chen
Jung-Lung Huang
Chang-Kuei Huang
Chen-Hsian Ou
Chih-Hung Huang
Sheng Chou Gau
Original Assignee
Innolux Display Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innolux Display Corp filed Critical Innolux Display Corp
Priority to TW093117730A priority Critical patent/TW200601439A/en
Priority to US11/156,275 priority patent/US20050279452A1/en
Publication of TW200601439A publication Critical patent/TW200601439A/en

Links

Classifications

    • H10P72/0426—

Landscapes

  • Weting (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

The present invention relates to an etching chamber. The etching chamber includes a reaction chamber, an inlet and an outlet, wherein the base of the etching chamber includes a plurality of protrusions.
TW093117730A 2004-06-18 2004-06-18 Etching chamber TW200601439A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW093117730A TW200601439A (en) 2004-06-18 2004-06-18 Etching chamber
US11/156,275 US20050279452A1 (en) 2004-06-18 2005-06-17 Etching reaction device with protrusions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093117730A TW200601439A (en) 2004-06-18 2004-06-18 Etching chamber

Publications (1)

Publication Number Publication Date
TW200601439A true TW200601439A (en) 2006-01-01

Family

ID=35479368

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093117730A TW200601439A (en) 2004-06-18 2004-06-18 Etching chamber

Country Status (2)

Country Link
US (1) US20050279452A1 (en)
TW (1) TW200601439A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118448253A (en) * 2024-04-29 2024-08-06 通威微电子有限公司 Corrosion furnace and control method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2733771B2 (en) * 1988-07-29 1998-03-30 日本テキサス・インスツルメンツ株式会社 Liquid processing equipment
US5212116A (en) * 1990-06-18 1993-05-18 At&T Bell Laboratories Method for forming planarized films by preferential etching of the center of a wafer
KR0163362B1 (en) * 1992-03-05 1999-02-01 이노우에 아키라 Treatment bath for cleaning apparatus
US5427622A (en) * 1993-02-12 1995-06-27 International Business Machines Corporation Method for uniform cleaning of wafers using megasonic energy
US5794299A (en) * 1996-08-29 1998-08-18 Ontrak Systems, Inc. Containment apparatus
FR2755038B1 (en) * 1996-10-28 1998-12-24 Forward Technology Ind METHOD FOR CLEANING METAL PARTS
US20020166569A1 (en) * 2001-05-10 2002-11-14 Speedfam-Ipec Corporation Method and apparatus for semiconductor wafer cleaning
KR101067972B1 (en) * 2002-12-31 2011-09-26 엘지디스플레이 주식회사 Alignment film rubbing defect inspector of liquid crystal display device
US7582180B2 (en) * 2004-08-19 2009-09-01 Micron Technology, Inc. Systems and methods for processing microfeature workpieces

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118448253A (en) * 2024-04-29 2024-08-06 通威微电子有限公司 Corrosion furnace and control method thereof

Also Published As

Publication number Publication date
US20050279452A1 (en) 2005-12-22

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