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TW200600261A - Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method - Google Patents

Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method

Info

Publication number
TW200600261A
TW200600261A TW094112745A TW94112745A TW200600261A TW 200600261 A TW200600261 A TW 200600261A TW 094112745 A TW094112745 A TW 094112745A TW 94112745 A TW94112745 A TW 94112745A TW 200600261 A TW200600261 A TW 200600261A
Authority
TW
Taiwan
Prior art keywords
chemical mechanical
mechanical polishing
manufacturing process
mgr
pad
Prior art date
Application number
TW094112745A
Other languages
Chinese (zh)
Other versions
TWI290505B (en
Inventor
Yukio Hosaka
Yuuji Shimoyama
Hiroshi Shiho
Nobuo Kawahashi
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200600261A publication Critical patent/TW200600261A/en
Application granted granted Critical
Publication of TWI290505B publication Critical patent/TWI290505B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A chemical mechanical polishing pad having a polishing surface with an arithmetic mean roughness (Ra) of 0.1 to 15 μm, a 10-point height (Rz) of 40 to 150 mgr;m, a core roughness depth (Rk) of 12 to 50 mgr;m and a reduced peak height (Rpk) of 7 to 40 mgr;m, a manufacturing process thereof and a chemical mechanical polishing method. Even when the chemical mechanical polishing of a large-diameter wafer as an object to be polished is carried out by this pad, a polished surface having excellent in-plane uniformity and flatness can be formed.
TW094112745A 2004-04-21 2005-04-21 Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method TWI290505B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004125064 2004-04-21

Publications (2)

Publication Number Publication Date
TW200600261A true TW200600261A (en) 2006-01-01
TWI290505B TWI290505B (en) 2007-12-01

Family

ID=34935462

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094112745A TWI290505B (en) 2004-04-21 2005-04-21 Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method

Country Status (5)

Country Link
US (1) US20050239380A1 (en)
EP (1) EP1588803A1 (en)
KR (1) KR100640141B1 (en)
CN (1) CN100537143C (en)
TW (1) TWI290505B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568541B (en) * 2010-12-22 2017-02-01 Jsr Corp Chemical mechanical grinding method
TWI822861B (en) * 2018-09-28 2023-11-21 日商富士紡控股股份有限公司 Polishing pad and method of manufacturing same

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070161720A1 (en) * 2005-11-30 2007-07-12 Applied Materials, Inc. Polishing Pad with Surface Roughness
JP2007255277A (en) * 2006-03-23 2007-10-04 Jtekt Corp Cam follower
US8388799B2 (en) * 2008-01-24 2013-03-05 Jsr Corporation Composition for forming polishing layer of chemical mechanical polishing pad, chemical mechanical polishing pad and chemical mechanical polishing method
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
JP2014095392A (en) * 2012-11-07 2014-05-22 Toyota Motor Corp Gear and manufacturing method thereof
JP6010511B2 (en) 2013-08-22 2016-10-19 株式会社荏原製作所 Method for measuring surface roughness of polishing pad
US10996241B2 (en) 2016-10-31 2021-05-04 Kyocera Corporation Probe card board, probe card, and inspection apparatus
EP3550383B9 (en) * 2016-11-29 2024-08-14 Kyocera Corporation Timepiece case
JPWO2018181347A1 (en) * 2017-03-31 2020-03-05 古河電気工業株式会社 Polishing pad
JP7083256B2 (en) 2018-02-19 2022-06-10 富士電機株式会社 Semiconductor module and its manufacturing method
US11759909B2 (en) * 2020-06-19 2023-09-19 Sk Enpulse Co., Ltd. Polishing pad, preparation method thereof and method for preparing semiconductor device using same
CN112461265B (en) * 2020-11-20 2023-03-24 大连理工大学 Nano manufacturing method of quartz hemispherical harmonic oscillator
KR102512675B1 (en) * 2020-12-30 2023-03-21 에스케이엔펄스 주식회사 Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08216029A (en) 1995-02-07 1996-08-27 Daiki:Kk Precision polishing sheet
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
JP3668046B2 (en) 1998-05-11 2005-07-06 株式会社東芝 Polishing cloth and method for manufacturing semiconductor device using the polishing cloth
JP3918359B2 (en) 1998-05-15 2007-05-23 Ｊｓｒ株式会社 Polymer composition for polishing pad and polishing pad
JP2000296461A (en) * 1999-04-13 2000-10-24 Speedfam-Ipec Co Ltd Backing pad structure
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
US6679769B2 (en) * 2000-09-19 2004-01-20 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
JP2003039329A (en) * 2001-08-02 2003-02-13 Mitsubishi Materials Corp Single layer whetstone and method of manufacturing the same
CN100550311C (en) * 2001-10-09 2009-10-14 日立化成工业株式会社 Polishing pad for CMP, method for polishing substrate using same, and method for producing polishing pad for CMP
TWI260256B (en) * 2002-03-25 2006-08-21 Thomas West Inc Conditioner and conditioning methods for smooth pads
US20030216111A1 (en) * 2002-05-20 2003-11-20 Nihon Microcoating Co., Ltd. Non-foamed polishing pad and polishing method therewith
JP4790973B2 (en) * 2003-03-28 2011-10-12 Ｈｏｙａ株式会社 Method for manufacturing glass substrate for information recording medium using polishing pad and glass substrate for information recording medium obtained by the method
JP2004303983A (en) * 2003-03-31 2004-10-28 Fuji Photo Film Co Ltd Polishing pad

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568541B (en) * 2010-12-22 2017-02-01 Jsr Corp Chemical mechanical grinding method
TWI822861B (en) * 2018-09-28 2023-11-21 日商富士紡控股股份有限公司 Polishing pad and method of manufacturing same

Also Published As

Publication number Publication date
US20050239380A1 (en) 2005-10-27
TWI290505B (en) 2007-12-01
CN100537143C (en) 2009-09-09
KR20060047248A (en) 2006-05-18
CN1699019A (en) 2005-11-23
EP1588803A1 (en) 2005-10-26
KR100640141B1 (en) 2006-10-31

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees