TW200607426A - Aluminum substrate for printed circuits, manufacturing method thereof, PCB, and manufacturing method thereof - Google Patents
Aluminum substrate for printed circuits, manufacturing method thereof, PCB, and manufacturing method thereofInfo
- Publication number
- TW200607426A TW200607426A TW094119107A TW94119107A TW200607426A TW 200607426 A TW200607426 A TW 200607426A TW 094119107 A TW094119107 A TW 094119107A TW 94119107 A TW94119107 A TW 94119107A TW 200607426 A TW200607426 A TW 200607426A
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- printed circuits
- aluminum substrate
- oxide layer
- pcb
- Prior art date
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title abstract 5
- 229910052782 aluminium Inorganic materials 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 title abstract 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 abstract 2
- 239000010407 anodic oxide Substances 0.000 abstract 2
- 238000001035 drying Methods 0.000 abstract 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 abstract 1
- 238000007743 anodising Methods 0.000 abstract 1
- 239000008151 electrolyte solution Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
This invention relates to a method of manufacturing an aluminum substrate for printed circuits. It comprises an oxide layer forming step, and a heat-drying step. For the oxide-layer forming step, an anodic oxide layer is formed on at least one surface of an aluminum plate by anodizing the aluminum plate in an electrolytic solution. The phosphoric acid has the concentration: 3 to 20 mass%, and bath temperature is more than 25 DEG C, but less than 40 DEG C. For the heat-drying step, the anodic oxide layer is dried by heating it at 150 to 300 DEG C for 0.5 to 3 hour. By means of this way, it forms a good oxide layer. Eventually, it enhances adhesiveness with a resin plate for manufacturing printed circuits of an aluminum substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004172607 | 2004-06-10 | ||
| US58037204P | 2004-06-18 | 2004-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200607426A true TW200607426A (en) | 2006-02-16 |
Family
ID=38083563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094119107A TW200607426A (en) | 2004-06-10 | 2005-06-09 | Aluminum substrate for printed circuits, manufacturing method thereof, PCB, and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN1965618A (en) |
| TW (1) | TW200607426A (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101384137B (en) * | 2008-10-09 | 2011-09-07 | 敬鹏(常熟)电子有限公司 | Manufacturing method for circuit board with heat radiating metallic layer |
| US9624593B2 (en) * | 2013-08-29 | 2017-04-18 | Applied Materials, Inc. | Anodization architecture for electro-plate adhesion |
| GB2521813A (en) | 2013-11-15 | 2015-07-08 | Cambridge Nanotherm Ltd | Flexible electronic substrate |
| US9359686B1 (en) * | 2015-01-09 | 2016-06-07 | Apple Inc. | Processes to reduce interfacial enrichment of alloying elements under anodic oxide films and improve anodized appearance of heat treatable alloys |
| US10760176B2 (en) | 2015-07-09 | 2020-09-01 | Apple Inc. | Process for reducing nickel leach rates for nickel acetate sealed anodic oxide coatings |
| US9970080B2 (en) | 2015-09-24 | 2018-05-15 | Apple Inc. | Micro-alloying to mitigate the slight discoloration resulting from entrained metal in anodized aluminum surface finishes |
| US10711363B2 (en) | 2015-09-24 | 2020-07-14 | Apple Inc. | Anodic oxide based composite coatings of augmented thermal expansivity to eliminate thermally induced crazing |
| US10174436B2 (en) | 2016-04-06 | 2019-01-08 | Apple Inc. | Process for enhanced corrosion protection of anodized aluminum |
| US11352708B2 (en) | 2016-08-10 | 2022-06-07 | Apple Inc. | Colored multilayer oxide coatings |
| US11242614B2 (en) | 2017-02-17 | 2022-02-08 | Apple Inc. | Oxide coatings for providing corrosion resistance on parts with edges and convex features |
| US11549191B2 (en) | 2018-09-10 | 2023-01-10 | Apple Inc. | Corrosion resistance for anodized parts having convex surface features |
| CN115279952A (en) * | 2020-03-12 | 2022-11-01 | 诺维尔里斯公司 | Electrolytic machining of metal substrates |
-
2005
- 2005-06-09 TW TW094119107A patent/TW200607426A/en unknown
- 2005-06-10 CN CN 200580019069 patent/CN1965618A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN1965618A (en) | 2007-05-16 |
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