TW200533257A - Circuit board structure and method for fabricating the same - Google Patents

Abstract

A circuit board structure and a method for fabricating the same are proposed, wherein a core substrate formed with a metal layer on surfaces thereof and a plurality of plated through holes therein is provided. A conductive layer is formed on the surface of the terminal portions of the plated through holes, and a patterned circuit layer is formed on the core substrate by patterning the metal layer. A conductive film and a first resist layer are formed on the circuit layer, wherein a plurality of openings are formed in the resist layer to expose the conductive film and at least an opening is formed corresponding to the terminal portion of the plated through hole. Then, the conductive film which isn't covered by the first resist layer is removed and a second resist layer is formed to cover the conductive film remaining in the opening of the first resist layer. A third resist layer is formed to cover the opening excluding the plated through hole and a metal layer is formed on the plated through hole exposed to the second resist layer for an electrical connection pad by an electroplating process. Moreover, the third resist layer is removed and a protective metal layer is formed on the electrical connection pad of the core substrate by an electroplating process.

Description

200533257 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a circuit board structure and a manufacturing method thereof, and more particularly to a circuit for electrically connecting upper and lower circuit layers in a multi-layer circuit board by using a plated through-hole structure to conduct electricity. Plate structure and its manufacturing method. [Previous technology] With the vigorous development of the electronics industry, electronic products have gradually entered the trend of multi-function and high-performance research and development. In order to meet the packaging requirements of semiconductor packages with high accumulation (11 ^ 62 ^ 1 ^ 011) and miniaturization (^^ 1 ^ 31: 111 ^ 231: 1011), for more active and passive components and circuits Carrying, the circuit board carrying the semiconductor wafer has also gradually evolved from a double-layer board to a multi-layer board (Mul t 丨 —Uyer b〇ard). In a limited space, the use of InterUyer connect ion to expand the circuit board The available circuit layout area can be used to match the integrated circuit with high circuit density. The integrated circuit f should be based on the same circuit board unit area to accommodate a larger number of circuits and elements. ^ Operational requirements, circuit boards; high-performance chips such as d green map chips, and impedance control functions are required to achieve == ;;; ^ 4 'chip signal, improve bandwidth, and conform to the thinness and lightness of semiconductor packages: / 装 j Development of cattle. However, the development of… the circuit board has been functional, the south speed and the high frequency circuit board process has developed from the traditional 100 micron < and the small hole ^. Existing power… delete, line spacing (Spac:) i; =: Α = line width (L- reduced to less than 30 microns, and hold (Aspect ratio), etc., and continue to research towards smaller line accuracy

200533257

In order to improve the wiring accuracy of the circuit board, the industry has developed a build-up technology, that is, a core circuit board (co circu ^ boar d) is used to interactively stack multiple layers of insulation and A circuit layer, and a conductive blind via (conductUve via) is opened in the insulation layer for the electrical connection between the upper and lower lines. Among them, the process of increasing the thickness of the circuit is the key to the density of the circuit board of the shadow plastic circuit board. According to the current technology, the industry often uses multilayers to make multilayer circuit boards. t Please refer to Sections 1A to ⑽, which adopt a circuit layer-adding process such as a semi-additive process (^ ... an additive process, SAP). First, a core circuit board 10 is provided and an insulation is formed on its surface. Layer i1 uses laser drilling ing technology to form an opening 11o in the insulating layer 丨 丨 to communicate with the inner circuit layer i2 of the core circuit board 10 (as shown in FIG. 丨 A) . Next, 'a conductive seed layer 1 3 is formed on the insulating layer 11 in an electroless copper shovel manner' and a patterned resist layer 14 is applied on the seed layer 13 to perform electroplating on the seed layer 1 3 A patterned circuit layer 15 is formed on the surface (as shown in FIG. 1B). After that, the resist layer 14 is peeled off and etched to remove the seed layer 1 3 previously covered under the resist layer 14 (as shown in FIG. 1C). In this way, using these steps to repeatedly form the insulating layer and Adding a circuit layer is to make a circuit board with a multilayer circuit structure. ® However, the multilayer circuit board produced by the build-up method is generally used. If the electronic signal is to be transmitted from the upper layer of the circuit board to the lower layer, the signal must be from the upper build-up circuit layer, the conductive blind hole between the upper circuit layers, and To the upper circuit layer of the core circuit board, and then pass through the plated through hole (PTT) inside the core circuit board, the lower circuit layer of the core circuit board,

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200533257

V. Description of the invention (4) When it is almost the same size as the chip (about 2 times the size of the chip), how to open a matching thin line (Flne circuU) to pass the high-pass line will not increase the manufacturing cost. In addition, the road-striking boards, the related electronics industry entered the next generation & f ZV limb industry and even other [invention content] important research and development issues of the generation technology. #Disadvantages of the known technology described above 'The main purpose of the present invention is to provide: a circuit, a structure and a manufacturing method thereof, which can directly form an electrical connection terminal on the electroplating guide, and at the same time provide a lightning failure and a meticulous electrical circuit. Thin circuit structure i, octagonal connection terminal and guide • 本 为 月 之 # The purpose is to provide a circuit board structure and a conductive blind hole wiring space for the conductive blind hole money layer: Bell conductive vias to form better electricity Sexual connection. —Another object of the present invention is to provide a circuit board structure and a manufacturing method thereof to shorten the signal transmission path to avoid crosstalk and noise from occurring and further improve the electrical quality of the circuit board. Another object of the present invention is to provide a circuit board structure and a manufacturing method thereof, thereby increasing the circuit layout area of the circuit board and improving the layout flexibility of the interlayer circuits (Interlayer c i r c u i t s). In order to achieve the above and other objectives, the present invention discloses a method for manufacturing a semi-circuit board. The method includes: providing a core board, the core board having a metal layer on the surface, and forming a plurality of plated through-holes; A conductive layer is formed on the end surface of the through hole of the electrical slab of the laminate; the metal layer on the surface of the core board is patterned to form a patterned circuit; a conductive film is formed on the core board with the patterned circuit structure; Forming a first patterned resist layer on the conductive film

17660 Quan 懋 .ptd Page 14 200533257 V. Description of the Invention (5), by forming a plurality of openings to expose part of the conductive film, at least one of the openings corresponds to the end of the plated through-hole; A conductive film covered by the first patterned resist layer; forming a second patterned resist layer on the core layer board to cover the conductive film remaining in the opening of the first resist layer; on the core layer board A third resist layer is formed thereon to cover the opening outside the plating via hole; a plating process is performed to form a metal layer on an end of the plating via hole exposing the second pattern resist layer. In this way, a metal layer can be optionally formed on a part of the plated through-holes for subsequent use as an electrical connection terminal. After that, the third resistive layer is removed, and a plating process is performed to form a metal protective layer on the surface of the electrical connection end (including the metal layer at the end of the plated via hole). Then, the second resistive layer is removed. , A first patterned resist layer, and a conductive film covering the surface, and a patterned solder resist layer is formed on the surface of the core board on which the patterned circuit is completed, and a portion of the metal protective layer on the surface of the electrical connection end is exposed. . That is, through the above process, the present invention first covers the area where the patterned fine lines are formed by using a resistive layer, and then selectively forms a metal layer at the end of a part of the plated-through hole without affecting the layout space of the circuit board and the fine lines. At the same time, it can be further applied in the process of layer buildup of the circuit. The electrical connection terminals formed on the plated through holes can reduce the electrical connection terminals and the circuit occupied by the conductive blind holes. Board space, effectively increasing the density of circuit wiring. In addition, through the foregoing process, the present invention also discloses a circuit board structure including: a core board, the surface of which is formed with a patterned circuit and a plurality of plated through holes penetrating through the core board, among which at least one electric Sexual connection

17660 Quan 懋 .ptd Page 15 Wuchengtong and Baoke can be connected to electricity. The blind electricity needs to be borrowed by this borrowing layer. 200533257, description of the invention (6) on the plated through hole; a metal protective layer is coated on the plated The upper surface of the electrical connection terminal on the via hole and the upper surface sides of the remaining electrical connection terminals; and a patterned solder mask layer formed on the surface of the circuit board so that the solder mask layer has a plurality of openings. The electrical connection end which exposes the electrical connection end and at least one opening corresponding to the end of the plated through hole can be reinforced by the metal protection layer of the solder resist layer covering portion to effectively adhere to the metal protection layer. The electrical connection terminal. The core board is a multi-layer circuit board that has completed the previous process. Therefore, with the circuit board structure and the manufacturing method of the present invention, it is optional to form the electrical connection terminal on a part of the plated through-holes where the electrical connection terminal is to be formed for subsequent connection with conductive elements, and to provide the circuit. The electrical connection between the board and other sub-components (semiconductor wafers or circuit boards), or a conductive layer (C ο nductivevia) of the circuit build-up structure can be formed at the electrical connection end of the plated through hole to reduce the habit When a conductive blind hole is formed, the space of the connection pad (P ad) is extended to increase the density and spirituality of the wiring, and shorten the conductive path, reduce inductance, crosstalk, and noise. In addition, the electricity on the plated through hole The electrical connection terminals are formed independently in the manufacturing process without affecting the remaining electrical connection terminals and conductive lines of the circuit board. This is to avoid the need to form the electrical connection terminals on the plated through holes in the conventional technology. An excessively thick or uneven thickness metal is formed on the top, resulting in subsequent difficulties in forming conductive lines and electrical connection ends in the patterning process, which prevents the formation of a thin Deletion circuit configuration of a circuit board or the like to provide a fine line (F i n e c i r c u i t) and high-density wiring board structure.

17660 全 想 .ptd Page 16 200533257 V. Description of the Invention (7) [Embodiments] The following is a description of specific embodiments of the present invention. Those skilled in the art can easily read the contents disclosed in this specification. Learn about other advantages and effects of the present invention. The present invention can also be implemented or applied by other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention. Hereinafter, the preferred embodiments of the circuit board structure and the manufacturing method of the present invention will be described in detail with reference to FIGS. 2A to 2M. It should be noted that these drawings are simplified schematic diagrams, and the circuit board structure of the present invention is only illustrated schematically. However, the drawings only show the elements related to the present invention. The elements shown are not the actual implementation. The number, shape, and size ratio of the elements during actual implementation are an optional design. The layout pattern may be more complicated. As shown in FIGS. 2A and 2B, first, a core board 20 having a thin metal layer formed on its surface is provided. The core board 20 may also be a multilayer circuit board that has been subjected to pretreatment. In the drawing of this embodiment, the core layer board 20 is composed of an insulating layer 200 and a thin metal layer 2 01 formed on the surface of the insulating layer 200; further, a mechanical or laser drill is used. A plurality of through holes 2 0 2 are drilled in the core layer plate 20 in a manner such as holes (as shown in FIG. 2B). Wherein, the insulating layer 200 may be epoxy resin, Polyimide, Cyanate Ester, glass fiber, bismaleimide / imide / triazine trap. (B isma 1 eimide Triazine, BT) or FR 5 material mixed with epoxy resin and glass fiber, the metal thin layer 2 0 1-generally is better conductive

17660 Quan 懋 .ptd Page 17 ¥ 1 200533257 V. Description of the invention (8) Copper (Cu) is mainly used as a signal transmission wire material, and the thin metal layer 2 01 can be first laminated or deposited thereon. The insulating layer 200 is formed on the insulating layer 200 or is made of resin-coated copper foil (RCC). This embodiment is described by using a resin-compressed copper drop (RCC) as an example. As shown in Figure 2C, next, physical vapor deposition (PVD), chemical vapor deposition (CVD), electroless plating, or chemical deposition are used, such as sputtering, evaporation, and arcing. Arc vapor deposition, Ion beam sputter ing, Laser ab 1 at i on posit ion, plasma-assisted chemical vapor deposition or electroless plating, etc. A conductive layer (not shown) is formed on the surface of the core board 20 and its through-holes 202, and the conductive layer is used as a current conduction path to pass on the surface of the core board 20 and the through-holes. A metal layer 203 having a sufficient thickness is formed on the hole wall by electroplating. As shown in FIG. 2D, the through hole 2 0 2 (such as an ink resin) is filled with a gadolinium filler material (such as an ink resin) to form a key hole (PTH) 2 0 5 to electrically conduct the core. The metal layers 2 0 3 on the upper and lower surfaces of the layer 2 0. Next, a conductive layer is formed on the surface of the end of the key via 250 that exposes the core board 20. It can perform processes such as direct plating (DP) on the laminated board 20 to form a conductive film 2 0a on the surface of the core board such as (pd), and then chemically Stripping process 'to make the palladium metal layer adhere to the end surface of the filling material 204 of the plated through hole 205, or to perform chemical copper etc.' to fill the electric mine through hole 205 The surface of the end of the material 2 0 4 is covered with a conductive film 2 0 3 a; in addition, as shown in FIG. 2 D

17660 懋 .ptd page 18 200533257

V. Description of the invention (9) shows that it is also possible to form M ^ ^ ^ aw h through the conductive layer (not shown, i money, etc.) on this surface. The conductive path is formed on the surface of the core board 20 and the surface of the core plate (including the end of the filler 204 of the plated through-holes 205) to form a 仏 ht γ rh, Zeng Shiweiwei 0, γ 后 # , S ^ For example, a conductive thin layer 2 1 of copper (C u) (thickness may be generally 3 to 10 / zm). Among them, the conductive thin layer 2 formed on the end surface of the filling material 204 of the plated through hole 2 0 5丨 or conductive film 2 03a, which is mainly used as a current conduction path, and can be selectively formed with a plated metal layer on the plated through hole 205 during the subsequent plating process. The following description of the subsequent process is mainly based on A method of forming a conductive film 2 0 3 a which can be, for example, palladium or copper is formed on the core layer board 20, and an end of a filling material 2 0 4 of the plated through hole 2 0 5 is covered with a plated copper method. The subsequent process method is similar to the process steps described below, so it will not be repeated here, and will be described first. As shown in Figure 2E The metal layer on the surface of the core board is patterned to form a patterned circuit. A resist layer (not shown) such as a dry film or a photoresist can be formed on the core board 20 and exposed ( Exposure), development (Development), etc., so that the resist layer is formed with a metal layer on the surface of the core board 20 outside the majority of the opening, and an etching process is performed to remove the resist layer that is not covered by the resist layer. As shown in FIG. 2F, a conductive film 23 is formed on the core layer board 20 of the patterned circuit 22, and the conductive film 23 is mainly described later. The current conducting path required for the electroplated metal layer may be composed of metal, alloy or stacked metal layers, and may be selected from the group consisting of copper, tin, nickel, chromium, titanium, copper-chromium alloy The conductive film 23 can be formed by physical vapor deposition.

200533257 V. Description of the invention (10) PVD, chemical vapor deposition (CVD), electroless plating or chemical deposition and other methods to form 'such as Sputtering, Evaporation, Arc vapor d epos it ion), ion beam sputtering, laser ablation deposition, plasma-assisted chemical vapor deposition, or electroless plating. However, according to actual operation experience, the conductive film 23 is preferably composed of copper particles without a mirror. As shown in FIG. 2G, a first patterned resist layer 2 4 is formed on the conductive film 23, and the resist layer 24 is formed with a plurality of openings 2 4 0 to expose the patterned circuit 2 2 An electrical connection end portion is to be formed, and at least one resistance layer opening 240 is to selectively expose the end of the plated through hole 205. The openings of these resistance layers 240 are used to expose the subsequent electrical connection ends of the circuit board. The resist layer 24 can be a dry film or a photoresist, which can be used as a plating resist layer in the subsequent clock process. As shown in FIG. 2, the portion of the conductive film 23 that is not covered by the first patterned resist layer 24 is removed. As shown in FIG. 2I, a second patterned resist layer 25 is formed on the core layer board to cover the conductive film 23 remaining inside the first resist layer opening 240. As shown in FIG. 2J, a third resistive layer 26 is formed on the core layer board 20, and the first patterned resistive layer opening 2 4 0 located outside the plated through hole 2 05 is cleanly covered, and A plating process is performed to form a metal layer on the end of the plated through hole 205 where the second patterned resist layer 25 is exposed. In this way, a portion of the plated through hole 205 can be selectively formed directly. A metal layer for subsequent use as an electrical connection terminal 27. Among them, since the electroplated metal layer is only

17660 Quan 懋 .ptd Page 20 200533257 V. Description of the invention (11) It is selectively formed on part of the plated through hole 2 05, so in addition to being formed on the plated through hole 2 05, it can also be formed on the core at the same time. Patterned fine lines are formed on the remaining areas of the laminate. As shown in FIG. 2K, after the electrical connection terminal 27 is formed on the plated through-hole 250, the third resistance layer 26 can be removed, and the patterned circuit on the surface of the core layer board can be removed. The portion which is intended to be the electrical connection terminal 2 2 1 is exposed in the first patterned resist layer opening 2 4 0. As shown in FIG. 2L, a plating process is performed to form a metal protective layer 28 on the surface of the electrical connection terminals 2 7, 2 2 1 exposed in the first patterned resist opening 2 4 0, such as nickel. / A gold metal layer, through which the metal protective layer 28 can provide an electrical connection end to be effectively connected to a conductive element (such as a wire, a solder ball, or a metal bump, etc.). As shown in FIG. 2M, the second patterned resist layer, the first patterned resist layer, and a conductive film covering the second patterned resist layer are removed, and then a patterned solder resist layer 29 is formed, and the outer surface is exposed. A part of the metal protective layer 28 on the surface of the electrical connection terminals 27 and 2 2 1. In addition, please refer to FIG. 2M ′, which is formed on the surface of the core board 20 (the end of the filler material 2 0 4 including the plated-through holes 2 0 5) as shown in the previous 2 D ′ drawing. When the thin conductive layer 21 is copper (Cu), the foregoing process is used to selectively form a metal layer on a part of the plated through hole 2 0 5 for subsequent use as an electrical connection terminal 2 7 and electrically connect A metal protective layer 28 is formed on the surface of the terminal 27, and a circuit board structure is obtained. As shown in Figs. 2M and 2M ', through the foregoing process, the present invention also discloses a circuit board structure including a core layer board 20 with a pattern formed on its surface.

17660 Quan 懋 .ptd Page 21 200533257 V. Description of the invention C12) The patterned circuit 22 and most of the electroforged vias 205 'through which the laminated board 20 passes, at least one electrical connection end is formed in the electroforged via A hole 2 0 5; a 1 metal protective layer 2 8 covers the upper surface of the electrical connection terminal and the upper surface and sides of the remaining electrical connection terminals on the electroforged via hole 2 05; and 1 The patterned solder resist layer 29 is formed on the surface of the core board, so that the solder resist layer 29 is formed with a plurality of openings to expose the electrical connection ends 2 of the patterned circuit 2 2 and 7, 2 2 1 And at least one opening is an electrical connection end corresponding to the end of the plated through hole 205, so as to strengthen the metal protection layer 28 by covering the metal protection layer 28 of the solder resist layer 29. Can be effectively attached to the electrical connection _27. Among them, the upper surface of the electrical connection terminal 27 on the plated-through hole 2 05 is covered with a metal protective layer 28 such as nickel / gold, and the upper surface and side edges of the remaining electrical connection terminals 2 2 1 are The metal protective layer 28 is completely covered, and then a solder resist layer 29 is formed on the patterned circuit structure with the metal protective layer 28 completed. In addition, as shown in FIG. 3, after the electrical connection end is formed at the end of the plated-through hole 305 in the core layer board 30, it can also be used to receive the conductive blind hole 32 in the subsequent layer buildup structure 31.俾 It is possible to directly form a conductive blind hole 32 on the electroplating continuity 305, so that the space of the circuit board occupied by the setting and connection of the electrical parameter connection end of the conductive blind hole 32 can be reduced, and the conductivity and the remaining percentage can be shortened. Effectively increase the space for circuit layout 'Improve the flexibility of the layout of the circuit ^ Continue to carry out the process of adding layers to the circuit, and form a circuit board structure that is equal to' ^ '. In addition, although the previous illustration of the present invention uses a double-layer board as an illustration, the present invention

200533257 V. Description of the invention (13) The process of the invention can also be applied to multilayer boards, that is, the core board of the previous diagram can be a multilayer board that has completed the previous process, and a multilayer circuit can be formed according to the aforementioned process The structure of the circuit board structure, as shown in FIG. 4A and FIG. 4B, is a circuit board 40 A with a four-layer circuit structure and a circuit board 400 B with a six-layer circuit structure obtained by applying the foregoing process of the present invention. Of course, the application of the present invention is not limited to the aforementioned two-layer, four-layer, or six-layer circuit board, but it can be applied to any circuit board with a multilayer circuit structure. Therefore, with the circuit board structure and the manufacturing method of the present invention, the electrical connection terminal can be selectively formed on a part of the plated through-holes where the electrical connection terminal is to be formed, so that a conductive element is subsequently connected to provide the circuit board. Electrically conductive connection with other electronic components (semiconductor wafers or circuit boards), or conductive blind holes with a layer build-up structure can be formed at the electrical connection ends of the plated vias, and the formation of conductive blind holes can be reduced. (Conduct i ve via), it is necessary to extend the space of the pad to increase the density and flexibility of the wiring, shorten the conductive path, reduce inductance, crosstalk, and noise; in addition, the plated via The above electrical connection terminals are formed independently in the manufacturing process without affecting the process of the remaining electrical connection terminals and conductive lines of the circuit board. In order to avoid the formation of electrical connection terminals on the plated through holes in the conventional technology, it is necessary to A metal layer with an excessively thick or uneven thickness is formed on the overall circuit board, which causes the subsequent precision of forming conductive lines and electrical connection terminals in the patterning process, and A method of forming a fine wiring structure deletion, serve to provide a fine line (F i n e C i r c u i t) and high-density wiring circuit board construction. The above descriptions are merely preferred embodiments of the present invention, and are not intended to be limiting.

17660 Quan 懋 .ptd Page 23 200533257 V. Description of the invention (14) The scope of the essential technical content of the present invention is defined broadly within the scope of the patent application described below. Any technical entity completed by others or If the method is exactly the same as defined in the patent application scope described below, or the same equivalent change, it will be considered to be covered by this patent application scope.

17660 Quan 懋 .ptd Page 24 200533257 Simple description of the drawings [Simplified illustration of the drawings] Figures 1A to 1C are the conventional semi-additive circuit board structure manufacturing process, which is not intended. Figures 2A to 2 Figure 2M is a schematic sectional view of the manufacturing process of the circuit board structure manufacturing method of the present invention; Figures 2D 'and 2M' are schematic sectional views of another embodiment of the circuit board structure manufacturing method of the present invention; Figure 3 is the present invention A schematic cross-sectional view of the circuit board structure manufacturing method applied to the build-up structure; and FIGS. 4A and 4B are schematic cross-sectional views of the circuit board structure manufacturing method of the present invention applied to the multilayer board. 10 Core circuit board 11 Insulating layer 110 Opening hole 12 Inner circuit layer 13 Seed layer 14 Resistive layer 1 5 Patterned circuit layer 2 0 Core board 2 0 0 Insulation layer 201 Thin metal layer 2 0 2 Through hole 2 0 3 Metal Floor

17660 Quan 懋 .ptd Page 25 200533257 Brief description of the diagram 2 0 3a conductive film 2 0 4 filling material 2 0 5 plated through hole 21 conductive thin layer 22 patterned circuit 221 electrical connection end 23 conductive film 2 4 resist layer 24 0 Resistive layer opening_ Resistive layer 2 6 Resistive layer 27 Electrical connection terminal 2 8 Metal protective layer 2 9 Solder resist layer 3 0 Core board 3 0 5 Electrical vias 31 Line build-up structure 32 Conductive blind hole 40A Four layers Circuit board ft B six-layer circuit board

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Claims (1)

200533257 6. Scope of patent application 1. A method for manufacturing a circuit board structure includes: providing a core board, the core board having a metal layer on the surface, and forming a plurality of plated through-holes; A conductive layer is formed on the end surface of the plated-through hole; a metal layer on the surface of the core board is patterned to form a patterned circuit; a conductive film is formed on the core board with the patterned circuit; a conductive film is formed on the conductive film The first patterned resist layer is used to form a plurality of openings to expose a part of the conductive film, at least one of the openings corresponds to an end portion of the plated through hole; and the first patterned resist layer is not covered by the first patterned resist layer. A conductive film; forming a second patterned resist layer on the core layer board to cover the conductive film remaining inside the opening of the first resist layer; forming a third resist layer on the core layer board to cover Accommodating the opening outside the plated through hole; and performing a plating process to form a metal layer on the end of the plated through hole exposing the second patterned resist layer as an electrical connection terminal 2. The patent application range of the circuit board structure production method of item 1, wherein the conductive layer formed on the plated via hole formed through an end surface of the direct plating line mode (Direct plating, DP). 3. The method for manufacturing a circuit board structure according to item 1 of the scope of patent application, wherein the inside of the plated through hole is filled with a filling material. 17660 Quan 懋 .ptd Page 27 200533257 'Sixth, the scope of patent application, 4. The method of manufacturing the circuit board structure as described in the first patent scope, wherein the conductive layer on the surface of the end of the plated through hole is chemically deposited. form. 5. For the method of manufacturing a circuit board structure according to item 4 of the patent application, wherein the material of the conductive layer on the surface of the end of the plated-through hole may be one of copper and palladium. 6. For the method of manufacturing a circuit board structure according to the scope of the patent application, wherein the surface of the core board uses the conductive layer as a current conduction path to form a conductive thin layer on the surface of the core board by electro-mineralization. • The method for manufacturing a circuit board structure according to item 1 of the patent application scope, wherein the conductive layer on the surface of the end of the plated through hole is formed by electroless plating. 8. If the method of manufacturing a circuit board structure according to item 1 of the patent application method, wherein the core board is a resin-bonded copper alloy (RCC). 9. For the method of manufacturing a circuit board structure according to item 1 of the patent application, wherein the core board may be a multi-layer circuit board that has completed the previous process. 10. The manufacturing method of the circuit board structure according to item 1 of the scope of patent application, wherein the metal layer on the plated through hole functions as an electrical connection end, which is selectively formed on a part of the plated through hole and is used in advance. The barrier layer covers the area where the fine lines are formed without affecting the layout space of the remaining lines and the process of the fine lines. ‘1 1. If the method of manufacturing a circuit board structure according to item 1 or 10 of the scope of patent application, wherein the electrical connection end can be used as a subsequent connection of the circuit board to the conductive element 17660 Quan 懋 .ptd Page 28 200533257 VI. Patent application scope 1 2. For the method of manufacturing circuit board structure with patent application scope item 1 or 10, in which the electrical connection end can be used as a subsequent layer in the layered structure The use of conductive blind vias enables the formation of conductive blind vias on plated vias to shorten conductive paths, increase circuit layout space, and increase flexibility in circuit layout. 1 3. If the method of manufacturing a circuit board structure according to item 1 or 10 of the scope of patent application, the method further comprises: removing the third patterned resist layer and performing a plating process to form a metal on the surface including the electrical connection end A protective layer; removing the second and first patterned resist layers and a conductive film covering the second layer; and forming a patterned solder resist layer on a core layer board on which a patterned circuit is completed on the surface to expose the electrical properties A part of the metal protective layer on the surface of the connection end. 14. The method for manufacturing a circuit board structure according to item 13 of the scope of patent application, wherein the metal protective layer is a nickel / gold metal layer. 1 5. A circuit board structure comprising: a core board having a patterned circuit structure and a plurality of plated vias penetrating through the core board, wherein at least one electrical connection end is formed on the plating On the via; a metal protective layer covering the upper surface of the electrical connection terminal on the plated via and the upper surfaces and sides of the remaining electrical connection terminals; and. A patterned solder resist layer is formed On the surface of the core board, the rejection 17660 Quan 懋 .ptd Page 29 200533257 6. Scope of patent application The solder layer is formed with a plurality of openings to expose the electrical connection end of the gold protective layer. 16. The circuit board structure according to item 15 of the scope of patent application, wherein the core board may be a resin laminated copper foil (RCC). 17. The circuit board structure according to item 15 of the scope of patent application, wherein the core board can be a multi-layer circuit board that has completed the previous process. 18. The circuit board structure according to item 15 of the scope of patent application, wherein the electrical connection end can be used as a subsequent connection of conductive elements on the circuit board. 19. The circuit board structure according to item 15 of the scope of patent application, wherein the electrical connection ends on the plated-through holes are selectively selected on part of the plated-through holes without affecting the process of the remaining patterned circuit structures. 20. If the circuit board structure of item 15 of the scope of patent application, the electrical connection end can be used to accept conductive blind holes in the subsequent layer build-up structure, so that conductive blind holes can be formed on the plated through holes, In order to shorten the conductive path, increase the space for wiring, and increase the flexibility of wiring layout. 2 1. The circuit board structure according to item 15 of the patent application scope, wherein the metal protective layer is a nickel / gold metal layer. 17660 懋 .ptd Page 30