200534411 (1) 九、發明說明 【發明所屬之技術領域】 本發明’是有關將固定於作爲發生按壓操作感的震動 源的觸控板的振動零件的周圍由樹脂密封的振動零件之樹 脂密封方法。 【先前技術】 觸控板輸入裝置，也稱作數位化轉換裝置，由手寫筆 或手指，在觸控板按壓操作所設定的操作區域時，檢測其 操作區域內的按壓操作位置，朝個人電腦等的處理裝置顯 示按壓操作位置的輸入位置資料輸出。 檢測此按壓位置的方式，已知如日本實開平3 -6 73 1 號的接觸方式、日本特開平5-53715號的阻力方式等各種 的觸控板輸入裝置，但是按壓操作時，因爲皆無法獲得按 壓按鈕開關時的喀嗒感等的明瞭的輸入操作感，所以操作 者，是只可由個人電腦等的處理裝置知其操作結果，但對 於操作盤的按壓操作是否認識則有不安。 在此，本申請人，是開發了一種藉由將壓電基板固定 於觸控板，使效率地，且裝置整體不會大型化地振動觸控 板，可以朝操作者傳達按壓操作感的觸控板輸入裝置（專 利文獻1參照）。 [專利文獻1 ]日本特開2 0 0 3 _ 1 2 2 5 0 7號公報（摘要、 第1圖） 第7圖及第8圖，是顯示使用成爲此振動零件的壓電 -5- 200534411 (2) 基板的觸控板輸入裝置100，在使操作盤101及支擦基板 1 0 2稍微隔有間隙地層疊構成的觸控板內設定檢測按壓位 置的操作區域100A。圖示的觸控板輸入裝置100 ’因爲 是藉由阻力感壓方式檢測按壓位置，所以在操作盤1 0 1及 支撐基板1 02的相對面被著有由均一的阻力皮膜組成的導 電體層 101a、102a，一對的壓電基板 120、120，是在操 作區域1 0 0 A的周圍固定於支撐基板1 02的裏面側。 壓電基板1 2 0，是形成細長帶狀，在表背雙面形成一 組的驅動電極120a、120b，將表背任一的全面使用接合 劑等固定於觸控板的支撐基板102。朝操作區域100A的 按壓操作，是藉由檢測導電體層l〇la、102a間的接觸， 檢測到按壓操作的話，對於一組的驅動電極1 2 0 a、1 2 0 b 外加驅動電壓，使由固定有伸縮的壓電基板1 2 0的操作盤 1 〇 1及支撐基板1 02所構成的觸控板整體振動，操作者可 從其振動確認按壓操作。 但是此壓電基板1 2 0，驅動電極1 2 0 a、1 2 0 b因爲露 出表背雙面，所以容易引起氧化、硫化等的經年變化， 且，因爲有可能電極間或與其他的導電體短路，所以其整 體是由絕緣性的樹脂密封。 將電子零件由樹脂所密封的樹脂密封方法，以往，已 知使用分配器的密封法、及使用金屬屏蔽版的網板印刷法 (專利文獻2參照）。 [專利文獻2]日本特公平6-95594號公報（第3頁、 第2圖） -6- 200534411 (3) 使用前者的分配器的密封法，是如第9圖所示，使用 空氣壓作動方式的分配器1 0 5推出密封樹脂1 1 4，覆蓋欲 密封的電子零件1 2 0的周圍整體地塗抹的方法，之後，通 過加熱爐使密封樹脂熱硬化，固定於電子零件1 2 0的周圍 而密封。 且，後者的網板印刷法，是將密封樹脂當作網板印刷 的墨水附著於電子零件的周圍，如第1 〇圖所示，是由蝕 刻加工等形成比電子零件1 2 0的輪廓稍大的深的通孔1 1 1 的金屬屏蔽版112，覆蓋實裝有電子零件120的支撐基板 1 〇2，沿著金屬屏蔽版1 1 2的表面滑動壓輥1 1 3，朝通孔 1 1 1及電子零件1 2 0的間隙充塡密封的樹脂1 1 4。 之後，去除金屬屏蔽版1 1 2，與前者同樣，將附著於 電子零件1 20的周圍的密封樹脂1 1 4加熱硬化，使固定於 電子零件120的周圍而密封。 【發明內容】 (本發明所欲解決的課題） 使用分配器的密封法，因爲有需要從細的噴嘴推出密 封樹脂1 1 4，所以限定粘度低的密封樹脂11 4，塗抹於板 狀的壓電基板1 2 0的表面的話，至加熱硬化爲止無法保持 其形狀，在如壓電基板1 20的板狀的電子零件中，因端緣 部分露出，而無法完全密封。且，在每1個電子零件120 的周圍整體完全附著的過程，因複雜並自動化困難。 且，依據網板印刷法，因爲可以再利用金屬屏蔽版 200534411 (4) 1 1 2，將固定於支撐基板1 02上的全部的電子零件同時樹 脂密封，所以適合量産，因爲過程單純所以也適合自動 化，但是將上述的觸控板輸入裝置100的壓電基板120等 的振動零件作爲樹脂密封手段就這樣（直接）適用時，有 以下的問題。 I 即，固定於觸控板（操作盤101或是支撐基板102) 的壓電基板1 2 0，使不妨礙按壓操作位置檢測地，固定於 操作區域100A及觸控板101、102周邊之間，但是對於 安裝空間、小型化等的要求的有限大小的觸控板1 〇 1、 102，爲了按壓操作容易（操作區域100A爲透明並目視 其內方的顯示器的情況，是爲了更容易看見），要求設定 擴大的操作區域100A，壓電基板120，是固定於非常有 限的寬內。一方面，對於壓電基板1 2 0，爲了使更效果地 發生大的振動，使用在有限安裝寬內可能的大小，其結 果，如第8圖所示，壓電基板120及操作區域100A的間 隔d，是安裝在寬2mm的壓電基板120的情況，只有 〇.5mm程度的些微的間隙。 且，即使有比較多余的配置空間，將振動零件1 2 0由 樹脂密封的情況時，被密封的樹脂的板厚變厚的話，因爲 會拘束振動零件1 2 0本身的振動，而無法成爲有效果的振 動發生源，需要將密封板厚薄層化。 對於這種壓電基板1 2 0使用網板印刷法將樹脂密封的 情況時，是需要使狹窄間隔d，在密封樹脂1 1 4的厚度的 限度內，在第10圖，金屬屏蔽版112的通孔111及壓電 -8- 200534411 (5) 基板1 2 0的間隔，是設定成間隔d (例如〇 . 5 mm )以下的 寬。 一方面，因爲至少壓電基板120的平面也需要由密封 樹脂1 1 4覆蓋，所以通孔1 1 1高度需要比壓電基板1 2 0高 (例如，1 mm )，即使使用壓輥1 1 3將密封樹脂1 1 4朝此 間隙充塡，也無法充塡到達細深的間隙的觸控板1 0 2爲 止，而無法將壓電基板120整體完全地密封。 對於此問題，使用粘度低的密封樹脂1 1 4的同時，上 昇壓輥1 1 3的樹脂流入壓力（充塡壓力）地朝此間隙充塡 的話，密封樹脂1 1 4雖可到達觸控板1 02爲止，但是上昇 壓輥1 1 3的樹脂流入壓力地充塡的話，附著於壓電基板 1 20的平面側（上面側）的密封樹脂1 1 4也會被抹掉，使 平面的一部分露出。進一步，降低密封樹脂1 1 4的粘度的 話，附著於壓電基板1 20的表面之後，通過加熱爐至加熱 硬化爲止的時間，無法保持其形狀，而附著於操作區域 1 〇〇A側，或使端緣部分露出，而無法完全密封。 本發明，是考慮這種習知的問題點，其目的是提供一 種：適合量産，且由薄層的密封樹脂完全覆蓋振動零件可 能的振動零件之樹脂密封方法。 (用以解決課題的手段） 爲了達成上述的目的，申請專利範圍第1項的振動零 件之樹脂密封方法，是樹脂密封：在檢測朝操作區域的按 壓操作時’在操作區域的周圍使固定在觸控板的振動零件 -9- 200534411 (6) 振動，並發生朝操作者傳達的按壓操作感的觸控板輸入裝 置的振動零件的樹脂密封方法，其特徵爲：（甲）由在振 動零件被固定於觸控板的對應部位使比振動零件的輪廓稍 大的深的通孔穿通的金屬屏蔽版覆蓋觸控板，在振動零件 及通孔之間形成樹脂流入空間，（乙）沿著金屬屏蔽版滑 ' 動壓輥，朝樹脂流入空間通過通孔充塡具有觸變性及熱硬 ^ 化性及絕緣性的密封樹脂，（丙）取除了金屬屏蔽版後， 讓附著於滑動零件的周圍在密封樹脂加熱硬化，由硬化滑 動零件的周圍的密封樹脂所覆蓋。 具有觸變性的密封樹脂，是藉由壓輥移動金屬屏蔽版 上往樹脂流入空間充塡的流動中粘度低，即使由比較低的 樹脂流入壓力充塡的情況，也可充塡至狹窄的樹脂流入空 間的最深爲止。且，具有觸變性的密封樹脂，是去除金屬 屏蔽版且流動停止後，因爲粘度變高，所以可保持附著於 振動零件的周圍的形狀。 - (發明之效果） ^ 依據申請專利範圍第1項的發明，因爲使用再利用可 能的金屬屏蔽版，由簡單的過程就可將密封樹脂朝振動零 件附著，自動化容易，適合樹脂密封振動零件的量産。 且，因爲可以由比較低的樹脂流入壓力，將密封樹脂 充塡至狹窄的樹脂流入空間，所以振動零件的平面側的密 封樹脂不會被由壓輥抹掉，即使薄層的密封樹脂也可以完 全覆蓋振動零件的整體。因此，密封樹脂不會拘束振動零 -10- 200534411 (7) 件本身的振動，且，配置空間有限的振動零件，也可以樹 脂密封。 進一步，附著於振動零件的周圍的密封樹脂，至加熱 硬化過程爲止，因爲其形狀被保持，不會隨便排出於振動 零件的周圍’振動零件的角不會露出，可以完全覆蓋振動 零件的整體。因此，振動零件的表面因爲不會接觸外氣， 可以防止因經年變化的劣化。 【實施方式】 以下，有關本發明的一實施例的振動零件的樹脂密封 方法，使用第1圖乃至第6圖說明。第1圖乃至第6圖， 是顯示將第7圖、第8圖所示的觸控板輸入裝置1 〇 〇所使 用的作爲振動零件的壓電基板1 20樹脂密封方法的一例， 第1圖，是顯示固定在觸控板102壓電基板120及金屬屏 蔽版1的配置關係的立體圖，第2圖乃至第6圖，是顯示 將振動零件1 20樹脂密封的各過程的說明圖。 如第1圖所示，觸控板輸入裝置1 〇 〇的裏面側的觸控 板（支撐基板）1 02，是形成長方形板狀，在其中央是設 定檢測按壓操作位置的操作區域100A。觸控板1〇2，是 由操作者可一邊通過操作區域1 00A看見配置於其下方的 顯示裝置（無圖示）的顯示畫面將一邊進行按壓操作的透 明材料所形成。形成細長的薄板狀的壓電基板1 20，是從 觸控板1 02的裏面側固定，但是不會遮到操作者的顯示裝 置的顯示畫面的視線地，配置於操作區域1 〇〇A及觸控板 -11 - 200534411 (8) 1 〇 2的周邊之間的些微的間隙。在本實施例中，一對的壓 電基板120，120是分別沿著觸控板102的長度方向的周 邊固定。 金屬屏蔽版1，是由鋁、不銹鋼鋼等的金屬材料所構 成的金屬板，使覆蓋觸控板1 02的裏面整體地，形成比觸 ' 控板1 02的外形大的長方形板狀。在金屬屏蔽版1中，在 對應於壓電基板1 2 0的固定位置的部位形成通孔2。通孔 2，是如第2(a) 、 （b)圖所示，由比壓電基板120的 垂直方向（對於觸控板裏面的相互垂直方向）的投影形狀 的相似形稍大的橫剖面形狀的小孔部2 a及與其上端的階 段部連續的擴徑部2b所構成，通孔2整體的高度，是比 壓電基板120的高度稍高。 具有階段部的通孔2，是例如施加蝕刻處理各別在2 枚的金屬板形成小孔部2 a及擴徑部2 b，使2枚的金屬板 與1枚的金屬屏蔽版1重疊形成。由如此形成的金屬屏蔽 版1覆蓋觸控板102的話，在通孔2內收容壓電基板12〇 - 的整體，在通孔2的內側面及壓電基板丨2 〇之間，形成供 充塡密封樹脂3的樹脂流入空間4 (第2圖（a ) 、（ b ) 參照）。 樹脂流入空間4的間隔，特別是壓電基板丨2 〇及小孔 部2 a的間隔’是使附著於壓電基板〗2 〇的側面的密封樹 脂3不突出於操作區域} 〇 〇 a側地，作成操作區域〗〇 〇 A 及壓電基板1 2 0的間隙d以下，在此，成爲與其間隔d等 同的0.5mm。且，通孔2的高度，壓電基板]2〇的高度爲 -12- 200534411 (9) 0.7mm時，成爲比其高度高lmm。 充塡於樹脂流入空間4的密封樹脂3，是使用至少具 有絕緣性及觸變性及熱硬化性的合成樹脂，在此使用具有 這些特性的環氧樹脂。絕緣性，因爲是覆蓋1組的驅動電 極120a、120b露出的壓電基板120的表面整體，所以是 爲了不使這些的電極間短路所要求的密封樹脂3的特性， 而熱硬化性，是充塡後加熱，爲了在壓電基板1 20的周圍 硬化，所要求的密封樹脂3的特性。且，觸變性，也被稱 爲揺變性，具有流動中粘度降低，靜置的話回復至原來的 粘度高的狀態的性質，如後述，朝樹脂流入空間4充塡容 易，充塡後，至加熱硬化過程爲止可維持其形狀。 加上，密封樹脂3，是熱硬化時低收縮率，熱硬化後 有一定的彈性，即彈性係數小，低溫下熱硬化較佳。熱硬 化時的低收縮率，是因爲朝樹脂流入空間4充塡時，密封 樹脂3也附著於從壓電基板1 20拉出的配線圖案（第2圖 的 1 2 0 c、1 2 0 d、1 2 0 e、1 2 0 )上，收縮率高的話熱硬化時 _ 會將這些的配線圖案拉入，而成爲圖案剥離或切斷的原 因。且，一定的彈性，是因爲在硬化後，使不會成爲拘束 振動發生源的壓電基板1 2 0的變形’而低溫硬化，是因爲 爲了硬化而高溫的話，壓電元件1 2〇會劣化。 此密封樹脂3，是如第1圖所示’朝金屬屏蔽版1的 一端上流動的狀態下被載置’由使用壓輥5的網板印刷法 朝通孔2的樹脂流入空間4充塡。 壓輥5，可將密封樹脂3往樹脂流入空間4推出的 -13- 200534411 (10) 話，任意的材質皆可以，但是在此從金屬屏蔽版1的表面 使其一部分是進入通孔2內，使可提高朝樹脂流入空間4 的樹脂流入壓力地，使用橡膠製的壓輥5 ° 以下，使用上述的金屬屏蔽版1及壓輥5，將壓電基 板1 2 0由密封樹脂3密封的各過程，沿著第2圖乃至第6 圖說明。 一開始，在無圖示的網板印刷機的滑動載置台上將壓 電基板1 20的固定側作爲表側地組裝觸控板1 〇2，如第2 圖所示，覆蓋已組裝的觸控板1 〇2地，重疊具有通孔2的 金屬屏蔽版1。在重疊的狀態下，在壓電基板1 2 0及通孔 2之間形成樹脂流入空間4。壓電基板1 20的周圍及小孔 部2a之間的樹脂流入空間4的間隔，是0.5mm很窄，且 壓電基板120的高度，雖比通孔2低但比小孔部2a高， 成爲比小孔部2a稍突出的狀態。 之後，使壓輥5沿著金屬屏蔽版1的表面滑動，將放 置於金屬屏蔽版1的一側的密封樹脂3朝樹脂流入空間4 充塡。此充塡，是如第3圖所示，一邊將壓輥5往金屬屏 蔽版1的方向強力按壓接觸一邊滑動，使壓輥5的樹脂流 入壓力提高將密封樹脂3朝樹脂流入空間4充塡。其結 果，使密封樹脂3無空隙地充塡至壓電基板1 20的表面側 的含有空隙的樹脂流入空間4整體（第4圖（a ) ( b )參 照）。 之後，如第5圖所示，將金屬屏蔽版1朝垂直方向拉 起，如第6圖所示，有粘性的密封樹脂3是被拉起至完全 -14- 200534411 (11) 地與壓電基板1 20側分離爲止。由此，密封樹脂3是以幾 乎0.5mm的均一的厚度附著壓電基板120的全周。 如此附著密封樹脂3的壓電基板1 2 0，是連同觸控板 102 —起朝1〇〇 ° C程度的高溫爐內移動，將密封樹脂3 熱硬化固定。至此熱硬化爲止之間，附著於壓電基板1 20 的密封樹脂3因爲是靜置狀態，所以回復至原來的高粘度 的狀態而可維持其形狀。因此，不會沿著壓電基板1 2 0的 側面下方漏出，雖是0.5 mm的薄層，但可在將壓電基板 1 20的全周完全覆蓋的狀態下維持其形狀。 由熱硬化的密封樹脂3所密封的壓電基板1 2 0，是不 與外氣接觸，可防止經年變化所產生的劣化，且，因爲電 極是由絕緣性的密封樹脂3所覆蓋，所以不會與其他短 路。 上述的實施例，振動零件，是固定於觸控板的震動源 的話，壓電基板以外也可以。且，觸控板輸入裝置，是任 意的檢測方式皆佳，如本實施例的將2枚的操作盤（板） 層疊的情況時，觸控板，是上方側的操作盤1 0 1也可以。 且，充塡過程的壓輥5的滑動方向，可任意，無需是 通孔的長度方向。 (產業上的利用可能性） 本發明，是適合於將固定在觸控板的振動零件樹脂密 封的樹脂密封方法。 -15- 200534411 (12) 【圖式簡單說明】 [第1圖]固定在觸控板102的壓電基板120及金屬屏 蔽版1的配置關係的立體圖。 [第2圖]由金屬屏蔽版1覆蓋觸控板的過程，（a ) 是沿著通孔3的短手方向切斷的縱剖面圖，（b )是沿著 通孔3的長度方向切斷的一部分省略的縱剖面圖。 [第3圖]降低壓輥5的樹脂流入壓力，將密封樹脂3 往樹脂流入空間4的剩下的空隙充塡的充塡過程，（a ) 是沿著通孔3的短手方向切斷，從壓輥5的滑動方向的後 方所見的縱剖面圖，（b )是沿著通孔3的長度方向切斷 的一部分省略的縱剖面圖，。 [第4圖]充塡過程終了的密封樹脂3的充塡狀況， (a )是沿著通孔3的短手方向切斷的縱剖面圖，（b )是 沿著通孔3的長度方向切斷的一部分省略的縱剖面圖。 [第5圖]將金屬屏蔽版1朝垂直方向拉起的過程， (a )是沿著通孔3的短手方向切斷的縱剖面圖，（b )是 沿著通孔3的長度方向切斷的一部分省略的縱剖面圖。 [第6圖]分離壓電基板120側及金屬屏蔽版1側的密 封樹脂3的過程，（a )是沿著通孔3的短手方向切斷的 縱剖面圖，（b )是沿著通孔3的長度方向切斷的一部分 省略的縱剖面圖。 [第7圖]觸控板輸入裝置100的分解立體圖。 [第8圖]固定有壓電基板120的觸控板102的後視 圖。 -16- 200534411 (13) [第9圖]顯示使用習知的分配器105的密封法的立體 圖。 [第1 〇圖]顯示習知的網板印刷法的縱剖面圖。 【主要元件符號說明】 1金屬屏蔽版 2通過孔 2a小孔部 2b擴徑部 3密封樹脂 4樹脂流入空間 5壓車昆 1 〇支撐基板 100觸控板輸入裝置 100A操作區域 1 〇 1操作盤 101a、102a 導電體層 102觸控板（支撐基板） 105分配器 1 1 1通過孔 112金屬屏敝版 π 3壓輥 1 1 4密封樹脂 120振動零件（壓電基板） -17- 200534411 (14) 1 2 0 a、1 2 0 b驅動電極200534411 (1) IX. Description of the invention [Technical field to which the invention belongs] The present invention is a resin sealing method for a vibrating part sealed with resin around a vibrating part fixed to a touch panel as a vibration source that generates a pressing operation feeling. . [Prior art] A touchpad input device, also called a digitizing conversion device, detects the pressing operation position in the operation area of a touchpad by a stylus or a finger when the operation area is set by the touchpad pressing operation, and points toward the personal computer. The processing device such as the one displays the input position data output of the pressing operation position. Various methods for detecting this pressing position are known, such as the contact method of Japanese Shikaihei 3-6 73 No. 1 and the resistance method of Japanese Unexamined Japanese Heihei 5-53715. A clear input operation feeling such as a click feeling when pressing the button switch is obtained. Therefore, the operator can only know the operation result by a processing device such as a personal computer, but he is uneasy about whether he or she recognizes the pressing operation of the operation panel. Here, the applicant has developed a touch panel that fixes a piezoelectric substrate to a touch panel so as to efficiently vibrate the touch panel without increasing the size of the entire device, and can convey the feeling of pressing operation to the operator. Control panel input device (refer to Patent Document 1). [Patent Document 1] Japanese Patent Laid-Open No. 2 0 0 3 _ 1 2 2 5 0 7 (Abstract, Fig. 1) Fig. 7 and Fig. 8 show the use of a piezoelectric part which becomes this vibration part-5- 200534411 (2) The touch panel input device 100 of the substrate is provided with an operation area 100A for detecting a pressing position in a touch panel configured by laminating the operation panel 101 and the support substrate 102 with a slight gap therebetween. The touch-panel input device 100 ′ shown in the figure detects the pressing position by a resistance pressure sensing method, and therefore, a conductive layer 101 a composed of a uniform resistance film is coated on the opposite surfaces of the operation panel 101 and the support substrate 102. , 102a, a pair of piezoelectric substrates 120 and 120 are fixed to the back surface of the support substrate 102 around the operation area 100A. The piezoelectric substrate 120 is formed in an elongated strip shape, and a set of driving electrodes 120a and 120b are formed on both sides of the front and back surfaces, and one of the front and back surfaces is fixed to the support substrate 102 using a bonding agent or the like on the touch panel. The pressing operation toward the operation area 100A is performed by detecting the contact between the conductive layers 101a and 102a. If the pressing operation is detected, a driving voltage is applied to a set of driving electrodes 1 2a and 1 2 0b, so that The touch panel composed of the operation panel 100 and the support substrate 102 fixed to the retractable piezoelectric substrate 120 is vibrated, and the operator can confirm the pressing operation from the vibration. However, since the piezoelectric substrates 1 2 0 and the driving electrodes 12 0 a and 1 2 0 b are exposed on both sides of the front and back surfaces, they are liable to cause aging changes such as oxidation and vulcanization. The conductor is short-circuited, so the entire body is sealed with an insulating resin. Resin sealing methods for sealing electronic components with resin are conventionally known as a sealing method using a dispenser and a screen printing method using a metal shield (refer to Patent Document 2). [Patent Document 2] Japanese Unexamined Patent Publication No. 6-95594 (Page 3, Figure 2) -6- 200534411 (3) The sealing method using the former distributor is shown in Figure 9 using air pressure to actuate The dispenser 1 0 5 of the method introduces a sealing resin 1 1 4 to cover the entire area of the electronic parts 1 2 0 to be sealed, and then the entire coating method is applied. Then, the sealing resin is thermally hardened by a heating furnace and fixed to the electronic parts 1 2 0 Around and sealed. In the latter screen printing method, the sealing resin is used as a screen printing ink to adhere to the surroundings of the electronic parts. As shown in FIG. 10, the outline is slightly formed by etching or the like as compared to the outline of the electronic parts 1 2 0. The large, deep through-hole 1 1 1 metal shielding plate 112 covers the supporting substrate 1 with the electronic component 120 mounted thereon, and slides the pressure roller 1 1 3 along the surface of the metal shielding plate 1 1 2 toward the through-hole 1 The gap between 11 and electronic parts 1 2 0 is filled with a sealed resin 1 1 4. After that, the metal shield plate 1 1 2 is removed, and the sealing resin 1 1 4 adhered to the periphery of the electronic component 120 is heat-hardened in the same manner as the former, and is fixed to the periphery of the electronic component 120 to be sealed. [Summary of the Invention] (Problems to be Solved by the Invention) Since the sealing method using a dispenser requires the sealing resin 1 1 4 to be pushed out from a thin nozzle, the sealing resin 11 4 having a low viscosity is limited and applied to a plate-like pressure. If the surface of the electric substrate 120 is not heated until it is hardened, the shape of the plate-shaped electronic component such as the piezoelectric substrate 120 cannot be completely sealed because the edge portion is exposed. In addition, the process of completely attaching the entire periphery of each electronic component 120 is complicated and difficult to automate. In addition, according to the screen printing method, since the metal shielding plate 200534411 (4) 1 1 2 can be reused, all electronic parts fixed on the support substrate 102 are resin-sealed at the same time, so it is suitable for mass production, and it is also suitable because the process is simple. Automation, but when the vibration parts such as the piezoelectric substrate 120 of the touch panel input device 100 described above are applied as resin sealing means (directly), there are the following problems. I That is, the piezoelectric substrate 120 fixed to the touch panel (the operation panel 101 or the support substrate 102) is fixed between the operation area 100A and the periphery of the touch panels 101 and 102 so as not to hinder the detection of the pressing operation position. However, for the limited-size touchpads 101 and 102 that require space, miniaturization, and other requirements, it is easy to press. (The operation area 100A is transparent and the inside display is visible to make it easier to see.) It is required to set an enlarged operating area 100A, and the piezoelectric substrate 120 is fixed within a very limited width. On the one hand, for the piezoelectric substrate 1 2 0, in order to generate large vibrations more effectively, a size possible within a limited mounting width is used. As a result, as shown in FIG. 8, the piezoelectric substrate 120 and the operating area 100A The interval d is when mounted on the piezoelectric substrate 120 having a width of 2 mm, and has a slight gap of about 0.5 mm. In addition, even if there is a relatively large amount of arrangement space, when the vibration component 120 is sealed with resin, if the thickness of the sealed resin becomes thicker, the vibration of the vibration component 120 itself will be restricted, and it will not be possible to have As a source of effective vibration, it is necessary to reduce the thickness of the sealing plate. When using a screen printing method to seal the piezoelectric substrate 1 2 0 with this resin, it is necessary to narrow the interval d within the thickness of the sealing resin 1 1 4. As shown in FIG. 10, the metal shield plate 112 The interval between the through hole 111 and the piezoelectric-8-200534411 (5) The substrate 120 is set to a width that is equal to or smaller than the interval d (for example, 0.5 mm). On the one hand, since at least the plane of the piezoelectric substrate 120 also needs to be covered with a sealing resin 1 1 4, the height of the through hole 1 1 1 needs to be higher than the piezoelectric substrate 1 2 0 (for example, 1 mm), even if a pressure roller 1 1 is used 3 Filling the sealing resin 1 1 4 toward this gap, it is impossible to fill the touch panel 102 reaching the deep gap, and the entire piezoelectric substrate 120 cannot be completely sealed. To solve this problem, while using a low-viscosity sealing resin 1 1 4 and the resin inflow pressure (charging pressure) of the upper pressure roller 1 1 3 is charged toward the gap, the sealing resin 1 1 4 can reach the touch panel. Up to 02, but if the resin of the upper booster roller 1 1 3 is filled with pressure, the sealing resin 1 1 4 attached to the plane side (upper side) of the piezoelectric substrate 120 will also be wiped off, so that part of the plane Exposed. Further, if the viscosity of the sealing resin 1 1 4 is reduced, the shape cannot be maintained in the time after being adhered to the surface of the piezoelectric substrate 120 and passing through a heating furnace to heat-harden and adhere to the 100A side of the operation area, or The end edge is partially exposed, and cannot be completely sealed. The present invention is to take such conventional problems into consideration, and an object thereof is to provide a resin sealing method suitable for mass production and in which a vibrating part may be completely covered with a thin layer of sealing resin. (Means to Solve the Problem) In order to achieve the above-mentioned object, a resin sealing method for a vibration component of the first patent application scope is a resin sealing: when detecting a pressing operation toward an operation area, the position is fixed around the operation area. Touch panel vibration part-9- 200534411 (6) A resin sealing method for a vibration part of a touch panel input device that vibrates and generates a sense of pressing operation transmitted to an operator, characterized in that: (a) the vibration part A metal shield plate that is fixed to the corresponding part of the touchpad and penetrates a deeper through-hole slightly larger than the outline of the vibrating part covers the touchpad to form a resin inflow space between the vibrating part and the through-hole. Metal shield plate slipper 'dynamic pressure roller, which is filled with sealing resin with thixotropy, heat hardening, and insulation properties through the through hole through the resin inflow space. (C) After removing the metal shield plate, let the The surrounding sealing resin is heated and hardened, and is covered with the sealing resin around the hardened sliding parts. The sealing resin with thixotropy has a low viscosity in the flow filled with resin into the space where the resin flows into the metal shield plate by pressing the roller, and can be filled to a narrow resin even when the pressure is filled with a relatively low resin inflow pressure. So far into the space. In addition, the sealing resin having thixotropy can retain the shape around the vibrating part because the viscosity becomes higher after the metal shield plate is removed and the flow is stopped. -(Effects of the invention) ^ According to the invention in the scope of patent application No. 1, because the metal shielding plate that can be reused is used, the sealing resin can be attached to the vibration parts in a simple process. The automation is easy, and it is suitable for resin sealing vibration parts. Mass production. In addition, since the sealing resin can be filled to a narrow resin inflow space with a relatively low resin inflow pressure, the sealing resin on the flat side of the vibrating part will not be wiped off by the pressing roller, even a thin layer of sealing resin can be used. Completely covers the entirety of the vibrating part. Therefore, the sealing resin does not restrict the vibration to zero. -10- 200534411 (7) The vibration of the parts itself, and the vibration parts with limited arrangement space can also be sealed with resin. Furthermore, since the sealing resin adhered to the periphery of the vibrating part is maintained until the heat-curing process, its shape will not be discharged randomly around the vibrating part. The corner of the vibrating part will not be exposed, and the entire vibrating part can be completely covered. Therefore, since the surface of the vibrating part does not come into contact with outside air, deterioration due to changes over time can be prevented. [Embodiment] Hereinafter, a resin sealing method for a vibration component according to an embodiment of the present invention will be described with reference to Figs. 1 to 6. Figures 1 to 6 show an example of a resin sealing method for the piezoelectric substrate 120 as a vibrating part used in the touch panel input device 1000 shown in Figures 7 and 8. Figure 1 Is a perspective view showing the arrangement relationship between the piezoelectric substrate 120 and the metal shield plate 1 fixed to the touch panel 102, and FIGS. 2 to 6 are explanatory diagrams showing respective processes of resin sealing the vibration parts 120. As shown in FIG. 1, the touch pad (support substrate) 102 on the back side of the touch pad input device 100 has a rectangular plate shape, and an operation area 100A is provided at the center of the touch pad input device 100 to detect a pressing operation position. The touchpad 102 is made of a transparent material that allows the operator to press a display screen of a display device (not shown) arranged below it through the operation area 100A. The piezoelectric substrate 120 formed in a thin and thin plate shape is fixed from the back side of the touch panel 102, but is not located in the line of sight of the display screen of the display device of the operator, and is arranged in the operation area 100A and Touchpad-11-200534411 (8) 1 0 2 There is a slight gap between the periphery. In this embodiment, a pair of piezoelectric substrates 120 and 120 are fixed along the peripheral edges of the touch panel 102 in the longitudinal direction, respectively. The metal shield plate 1 is a metal plate made of a metal material such as aluminum, stainless steel, or the like. The inner surface covering the touch pad 102 is formed into a rectangular plate shape larger than the outer shape of the touch pad 102. In the metal shield plate 1, a through hole 2 is formed at a position corresponding to a fixed position of the piezoelectric substrate 120. The through hole 2 is a cross-sectional shape slightly larger than the similar shape of the projection shape of the piezoelectric substrate 120 in the vertical direction (for the mutually perpendicular direction in the touch panel) as shown in FIGS. 2 (a) and (b). The small hole portion 2 a and the enlarged diameter portion 2 b that are continuous with the upper step portion thereof are formed. The height of the entire through hole 2 is slightly higher than the height of the piezoelectric substrate 120. The through-holes 2 having a stepped portion are formed by, for example, applying an etching process to form a small hole portion 2 a and an enlarged diameter portion 2 b on two metal plates, respectively, so that two metal plates and one metal shield plate 1 are overlapped and formed. . When the touch panel 102 is covered with the metal shield plate 1 formed in this way, the entire piezoelectric substrate 120- is housed in the through-hole 2, and a charging is formed between the inner side surface of the through-hole 2 and the piezoelectric substrate 1-20. (2) The resin of the sealing resin 3 flows into the space 4 (refer to Figs. 2 (a) and (b)). The interval of the resin inflow space 4, especially the interval between the piezoelectric substrate 2 and the small hole portion 2a, is such that the sealing resin 3 attached to the side surface of the piezoelectric substrate 2 does not protrude from the operation area} 〇〇a side On the ground, the operation area [00A] and the gap d of the piezoelectric substrate 120 are made less than or equal to 0.5 mm, which is equal to the interval d. In addition, when the height of the through hole 2 and the height of the piezoelectric substrate 20 are -12 to 200534411 (9) 0.7 mm, the height becomes 1 mm higher than the height. The sealing resin 3 filling the resin inflow space 4 is a synthetic resin having at least insulating properties, thixotropy and thermosetting properties, and an epoxy resin having these characteristics is used here. The insulating property covers the entire surface of the piezoelectric substrate 120 exposed by one set of driving electrodes 120a and 120b. Therefore, it is a characteristic of the sealing resin 3 required to prevent short-circuiting between these electrodes, and the thermosetting property is sufficient After heating, the characteristics of the sealing resin 3 are required in order to harden the periphery of the piezoelectric substrate 120. In addition, thixotropy, also known as thixotropy, has the property of reducing the viscosity during flow and returning to the original state of high viscosity when standing. As described later, filling into the resin inflow space 4 is easy. After filling, it is heated. The shape can be maintained until the hardening process. In addition, the sealing resin 3 has a low shrinkage rate during thermal curing, and has a certain elasticity after thermal curing, that is, a small elastic coefficient, and thermal curing at low temperature is better. The low shrinkage during heat curing is because the sealing resin 3 also adheres to the wiring pattern pulled out from the piezoelectric substrate 120 (1 2 0 c, 1 2 0 d in FIG. 2) when it is filled into the resin inflow space 4. , 1 2 0 e, 1 2 0), if the shrinkage is high, it will pull in these wiring patterns during thermal curing and cause the patterns to peel or cut. In addition, a certain elasticity is caused by deformation of the piezoelectric substrate 120 which is not a source of restraint vibration after hardening, and is hardened at a low temperature, because the piezoelectric element 1 20 is deteriorated if it is heated at a high temperature for hardening. . This sealing resin 3 is "mounted in a state flowing toward one end of the metal shield plate 1" as shown in Fig. 1 and is filled into the resin inflow space 4 of the through hole 2 by a screen printing method using a pressure roller 5. . -13- 200534411 (10) that the pressing resin 5 can push the sealing resin 3 into the resin inflow space 4 (10) Any material is acceptable, but here a part of the surface of the metal shield plate 1 enters the through hole 2 In order to increase the pressure of resin inflow into the resin inflow space 4, a rubber pressure roller 5 ° or less is used, and the above-mentioned metal shield plate 1 and pressure roller 5 are used to seal the piezoelectric substrate 1 2 0 by the sealing resin 3. Each process will be described along Figures 2 to 6. Initially, the touch pad 1 0 2 was assembled on the sliding mounting table of a screen printer without a picture, with the fixed side of the piezoelectric substrate 120 as the front side, as shown in FIG. 2, covering the assembled touch pad. On the board 102, a metal shield plate 1 having a through hole 2 is superposed. In the overlapped state, a resin inflow space 4 is formed between the piezoelectric substrate 120 and the through hole 2. The interval between the resin inflow space 4 around the piezoelectric substrate 120 and the small hole portion 2a is 0.5mm, and the height of the piezoelectric substrate 120 is lower than the through hole 2 but higher than the small hole portion 2a. It is in a state protruding slightly from the small hole portion 2a. Thereafter, the pressing roller 5 is slid along the surface of the metal shield plate 1, and the sealing resin 3 placed on one side of the metal shield plate 1 is charged toward the resin inflow space 4. This charging is performed as shown in FIG. 3, while pressing the pressure roller 5 in the direction of the metal shield plate 1 while sliding, forcing the resin inflow pressure of the pressure roller 5 to increase, and filling the sealing resin 3 toward the resin inflow space 4 . As a result, the sealing resin 3 is filled into the entire space 4 containing the void-containing resin 4 on the surface side of the piezoelectric substrate 120 without voids (see Fig. 4 (a) (b) for reference). After that, as shown in FIG. 5, the metal shield plate 1 is pulled up vertically. As shown in FIG. 6, the adhesive sealing resin 3 is pulled up to the full -14-200534411 (11) ground and piezoelectric The substrate 1 20 side is separated. Thereby, the sealing resin 3 is adhered to the entire periphery of the piezoelectric substrate 120 with a uniform thickness of almost 0.5 mm. In this way, the piezoelectric substrate 1 2 0 to which the sealing resin 3 is attached is moved together with the touch panel 102 toward a high-temperature furnace of about 100 ° C., and the sealing resin 3 is thermally hardened and fixed. Until the thermosetting, the sealing resin 3 adhered to the piezoelectric substrate 120 is in a static state, so that it can return to its original high viscosity state and maintain its shape. Therefore, the shape of the piezoelectric substrate 120 can be maintained while completely covering the entire circumference of the piezoelectric substrate 120 without leaking out along the sides of the piezoelectric substrate 120. Although it is a thin layer of 0.5 mm. The piezoelectric substrate 1 2 0 sealed by the thermosetting sealing resin 3 is not in contact with the outside air, and can prevent deterioration due to changes over time. Since the electrodes are covered with the insulating sealing resin 3, Does not short-circuit with others. In the above embodiment, if the vibration component is a vibration source fixed to the touch panel, it may be other than the piezoelectric substrate. In addition, the touch pad input device may be any detection method. For example, when two operation pads (boards) are stacked in this embodiment, the touch pad may be the upper operation pad 1 0 1. . Moreover, the sliding direction of the pressure roller 5 during the filling process may be arbitrary, and need not be the length direction of the through hole. (Industrial Applicability) The present invention is a resin sealing method suitable for resin-sealing a vibration member fixed to a touch panel. -15- 200534411 (12) [Brief description of the drawings] [Figure 1] A perspective view of the arrangement relationship between the piezoelectric substrate 120 and the metal shield plate 1 fixed to the touch panel 102. [Figure 2] The process of covering the touch panel with the metal shield plate 1, (a) is a longitudinal sectional view cut along the short-hand direction of the through hole 3, and (b) is cut along the length direction of the through hole 3. A vertical cross-sectional view with a part omitted. [Figure 3] The filling process of reducing the resin inflow pressure of the pressure roller 5 and filling the remaining gap of the sealing resin 3 into the resin inflow space 4 (a) is cut along the short-hand direction of the through hole 3 (B) is a longitudinal cross-sectional view of a part of the longitudinal cross-sectional view seen from the rear of the pressure roller 5 in the sliding direction, and is partially cut along the longitudinal direction of the through hole 3. [Fig. 4] Filling status of the sealing resin 3 at the end of the filling process, (a) is a longitudinal sectional view cut along the short-hand direction of the through hole 3, and (b) is along the longitudinal direction of the through hole 3 A partially cutaway longitudinal sectional view. [FIG. 5] A process of pulling up the metal shield plate 1 in a vertical direction, (a) is a longitudinal sectional view cut along the short-hand direction of the through hole 3, and (b) is along the longitudinal direction of the through hole 3. A partially cutaway longitudinal sectional view. [Fig. 6] A process of separating the sealing resin 3 on the piezoelectric substrate 120 side and the metal shield plate 1 side, (a) is a longitudinal sectional view cut along the short-hand direction of the through hole 3, and (b) is taken along A longitudinal sectional view of a part of the through-hole 3 cut in the longitudinal direction is omitted. [FIG. 7] An exploded perspective view of the touch panel input device 100. [FIG. [FIG. 8] A rear view of the touch panel 102 to which the piezoelectric substrate 120 is fixed. -16- 200534411 (13) [Fig. 9] A perspective view showing a sealing method using a conventional dispenser 105. [Fig. 10] A longitudinal sectional view showing a conventional screen printing method. [Description of main component symbols] 1 Metal shielded version 2 Through hole 2a Small hole portion 2b Expanded diameter portion 3 Sealing resin 4 Resin inflow space 5 Press car 1 〇 Support substrate 100 Touchpad input device 100A Operating area 1 〇1 Operation panel 101a, 102a Conductor layer 102 Touchpad (support substrate) 105 Dispenser 1 1 1 Through hole 112 Metal screen π 3 Press roller 1 1 4 Sealing resin 120 Vibration part (piezoelectric substrate) -17- 200534411 (14) 1 2 0 a, 1 2 0 b Drive electrode
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