TW200528927A - Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems - Google Patents
Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems Download PDFInfo
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- TW200528927A TW200528927A TW093106253A TW93106253A TW200528927A TW 200528927 A TW200528927 A TW 200528927A TW 093106253 A TW093106253 A TW 093106253A TW 93106253 A TW93106253 A TW 93106253A TW 200528927 A TW200528927 A TW 200528927A
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- polarized light
- polarizer
- radiation
- radial
- polarizer element
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F41—WEAPONS
- F41B—WEAPONS FOR PROJECTING MISSILES WITHOUT USE OF EXPLOSIVE OR COMBUSTIBLE PROPELLANT CHARGE; WEAPONS NOT OTHERWISE PROVIDED FOR
- F41B11/00—Compressed-gas guns, e.g. air guns; Steam guns
- F41B11/60—Compressed-gas guns, e.g. air guns; Steam guns characterised by the supply of compressed gas
- F41B11/62—Compressed-gas guns, e.g. air guns; Steam guns characterised by the supply of compressed gas with pressure supplied by a gas cartridge
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C13/00—Details of vessels or of the filling or discharging of vessels
- F17C13/04—Arrangement or mounting of valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C2205/00—Vessel construction, in particular mounting arrangements, attachments or identifications means
- F17C2205/03—Fluid connections, filters, valves, closure means or other attachments
- F17C2205/0302—Fittings, valves, filters, or components in connection with the gas storage device
- F17C2205/0323—Valves
- F17C2205/0335—Check-valves or non-return valves
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Polarising Elements (AREA)
Abstract
Description
200528927 玖、發明說明: 【發明所屬之技術領域】 本發明大體上係關於光學偏光器。更 _ 一 文特疋&之,係關於 鬲數值孔徑微影之偏光器。 【先前技術】 這類範例中,-圖案化元件產生對應至航之軍獨一層之 -電路圖案’且可將本圖案成像在已塗佈一層放射感 料(光阻劑)之基底(石夕晶圓)之乾材部分(例如包括一或更多 晶粒)。大體上,單-晶圓或基底將包含經由該投射系统一 次一個連續放射之相鄰靶材部分之整個網路。 ,=使用之術語”㈣化元件,,應廣義解釋為對應至該 材部分所產生之圖案,可給予-進入放射束一已圖 ==件。…也可使用該術語”光間”。大體上, 在該峨份產生之例如-積體電路或其 匕兀•件之兀件中之一層特定功能。 這類圖案化元件之一範例係為一光 ::眾所周知、,且它包含例如二位元、交替相 以及各觀合式光罩類型。將這類光罩 束中會根撼兮水當L 夏7、。系敦射 地穿透(在穿透式光吏撞在該光罩之放射選擇性 幻或反射(在-反射式光罩中)。在 罩可支撐結構大體上係為-光罩桌,其確峨 持於^人放射束之期❹ 於該放射束來㈣。 在’。要時可相對 91784.doc 200528927 另一圖笨仆-^ 〃 ” 70件範例係為一可程式鏡面陣列。一這類陣 ::例係為—具有-層黏縮控制及-反射表面之可定址矩 車表面m裝置之基本原理係為例如該反射表面之可定 =反射入射光成為衍射光,而未定址區域反射入射光 成為未衍射φ。π 使用—適當的濾光片’可將該未衍射光濾 矩❹束’只留下該衍射光。本方式中,根據該可定址 矩陣表面使該光束圖案化。 另:可程式鏡面陣列具體實施例使用一極小鏡面矩陣配 動==小鏡面可藉由㈣—合適局部電場或使用壓電致 :刀別堆傾斜於—主軸附近。再次地,該些鏡面係為 1之址矩陣’以使定址鏡面會以—與定址鏡面不同之方向 “反射―進人放射束°本方式中,該反射束係根據該可定 址矩陣之定址圖荦來圏 _ ,, Α — 茶米圖案化。可使用合適之電子元件來進 订所而之矩陣定址。上述兩情況中,該圖案化元件可包括 或更多可程式鏡面陣列。在此所稱之鏡 5,29M91,5^;3; pct公告wo 98/38597及w〇 9_96。—可程式鏡面陣列 中,該支撐結構可被具體實施成為例如一依需要被固定或 可移動之框架或桌子。 另-圖案化元件範例係為—可程式lcd陣列。一這類竿 構範例係給予於美國專利5,229,872中。如上述,本範例中、 之支撑結構可被具體實施成為例如一依需要被固移 動之框架或桌子。 # 基於簡化目的’本文接下來部分會在一些特定地點特別 91784.doc 200528927 4曰向牽涉到_ >k ^ — ,十.… 罩及光罩桌之範例。然而,這類範例中所 —丄- 愿見於則述圖案化元件之較大内文範圍中。 精 光罩桌上之光罩來進行圖案化之目前裝置令,可 在一不同類型機 戍杰之間產生差別。在某類型微影投射裝置 八各乾材部分係以將整個光罩圖案-次曝光於該乾材部 之方式來恥射。這類裝置通常被稱之為一晶圓步進 機。在另一裝置中,通常稱之為一步進及掃描裝置,各乾 π h係在平仃或反平行掃描方向同步掃描基底桌時在該 &射光束下以-給予之參考方向(該,,掃描"方向)連續性掃 描該光罩圖案來照射。因為大體上該投射系統會具有一放 大口子叫大體上<;1),掃描該基底桌之速度V會是-因子Μ =以知“該光罩桌之速度。在此所述微影元件之更多相關 資訊可見於例如美國專利6,〇46,792。 在使用-微影投射裝置之一已知製造方法中,一圖案(例 如,於-光罩中)係成像於至少部分覆蓋一層放射感光材料 (光阻劑)之基底上。在本成像前,該基底可進行例如塗底、 鑛上光阻及-軟烤之各種程序。曝光後,該基底可實施例 如一曝後烤(ΡΕΒ)、顯影、一硬烤及測量及/或檢視該影像 特徵之其匕%序。該程序陣列被使用做為圖案化例如一工匸 之元件之一個別層之基礎。這類已圖案化層可接著進行例 如蝕刻、離子植入(摻雜)、金屬化、氧化、化學式、機械式 研磨等等之各種製程,皆是要完成一個別層。若需一些層, 貝J整個程序或其改版將必須重複用於每個新層且該些不同 堆叠層之重疊(並置)係儘可能正確地被執行。基於此目的, 91784.doc 200528927 在該晶圓之一或更多位置上提供一小的參考一 + 匕早’ 以疋 義一在該晶圓上之座標系統原點。使用光 一 卞人电于疋件結 合該基底支架定位元件(此後稱之為”對準系統"),接著本光 罩可於每次需要並置一新層於一現有層上時重新定位,也 可被使用成為一對準參考。事實上,一元件陣列會出現於 該基底(晶圓)上。這些元件接著利用一例如切割或割鋸技述 以分開彼此,由此該些個別元件可被安裝在一載具上並連 接至接腳等等。這類製程之進一步相關資訊可得自例如 McGraw Hill出版公司1997年出版國際書碼為is· 0-07-06725 0-4 ,由Peter van Zant著作之第三版書籍”微晶片 製造:半導體製程之實務導引(Microchip Fabrication: a200528927 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates generally to optical polarizers. More _ A Wen special 疋 & is a polarizer about 鬲 numerical aperture lithography. [Prior art] In this type of example, the -patterned element generates a -circuit pattern 'that corresponds to the only layer of the Air Force Army, and this pattern can be imaged on a substrate (Shi Xi) that has been coated with a layer of radioactive material (photoresist). Wafer) (for example, including one or more dies). In general, a single-wafer or substrate will contain the entire network of adjacent target portions that are successively emitted one at a time via the projection system. , = The term "fluoridation element used" should be interpreted broadly to correspond to the pattern produced by the material part, which can be given to-enter the radiation beam = = pieces. ... The term "light room" can also be used. Generally On the other hand, there is a layer of specific functions in, for example, integrated circuits or components produced by the Efen. One example of such a patterned element is a light :: well-known, and it contains, for example, two Bits, alternating phases, and various types of masks. The masks in this type of mask will be shaken as L Xia 7, and penetrate penetratingly (the penetrating light hits the mask Radiation-selective magic or reflection (in a reflective mask). The supportable structure in the mask is basically a mask table, which is held in the period of the human radiation beam, and the radiation beam comes from. '. If necessary, it can be relative to 91784.doc 200528927 Another figure stupid- ^ 〃 ”70 examples are a programmable mirror array. A type of array :: Examples are-with-layer shrink control and-reflective surface The basic principle of the addressable moment car surface m device is, for example, the fixability of the reflective surface = reflected incident light becomes a Light, and the unaddressed area reflects the incident light to become undiffracted φ. Π Use—Appropriate filters 'can filter the undiffracted light moment beam' leaving only the diffracted light. In this way, according to the addressable matrix The surface patterns the light beam. In addition, the programmable mirror array embodiment uses a very small mirror matrix to coordinate == the small mirror can be adjusted by ㈣—appropriate local electric field or using piezoelectricity: the blade is tilted near the main axis. Again, the mirrors are an address matrix of 1 so that the addressing mirror will "reflect-enter the human radiation beam in a direction different from the addressing mirror." In this method, the reflection beam is based on the addressing map of the addressable matrix.荦 来 圏 _ ,, Α — Camellia patterning. You can use appropriate electronic components to order the matrix addressing. In the above two cases, the patterning component can include or more programmable mirror array. Here Called mirrors 5,29M91,5 ^; 3; pct announcements wo 98/38597 and wo9_96.-Programmable mirror array, the support structure can be embodied as, for example, a frame that can be fixed or movable as needed or The table. Another- An example of a documented component is a programmable LCD array. An example of such a rod structure is given in US Patent No. 5,229,872. As mentioned above, the support structure in this example can be embodied into a frame that is fixed and moved as needed, for example. Or table. # For the sake of simplification, the next part of this article will be 91784.doc 200528927 in some specific locations. In the 4th part, we will involve _ > k ^ —…. Examples of masks and mask tables. However, such examples中 所 — 丄-Would like to be seen in the larger context of the patterned elements described above. The current device orders for patterning with a photomask on the table for fine masking can make a difference between different types of machines. Each dry material part of a certain type of lithographic projection device is shamed by exposing the entire mask pattern to the dry material part. This type of device is often referred to as a wafer stepper. In another device, commonly referred to as a stepping and scanning device, each of the π h is a reference direction given by-under the & (Scanning " direction) continuously scan the mask pattern to illuminate. Because in general the projection system will have an enlarged mouth called < 1), the speed V of scanning the base table will be -factor M = to know "the speed of the mask table. The lithographic element described here More relevant information can be found in, for example, U.S. Patent No. 6,040,792. In one known manufacturing method using a lithographic projection device, a pattern (for example, in a photomask) is imaged at least partially overlying a layer of radioactive light. Material (photoresist) on the substrate. Prior to this imaging, the substrate can be subjected to various procedures such as coating, photoresist and soft baking. After exposure, the substrate can be subjected to, for example, post exposure baking (PEB). , Development, a hard baking and measurement and / or inspection of the image features. The program array is used as the basis for patterning an individual layer of a component such as a work piece. Such patterned layers can be Next, various processes such as etching, ion implantation (doping), metallization, oxidation, chemical formula, mechanical grinding, etc. are performed to complete a separate layer. If some layers are required, the entire program or its modification will be Must be reused for each new Layers and the overlapping (co-location) of these different stacked layers is performed as accurately as possible. For this purpose, 91784.doc 200528927 provides a small reference on one or more locations on the wafer- Yoshiichi's origin of the coordinate system on the wafer. Use light-to-electricity to integrate the base holder positioning element (hereinafter referred to as "alignment system"), and then the photomask can be juxtaposed each time A new layer is repositioned on top of an existing layer and can also be used as an alignment reference. In fact, an array of components will appear on the substrate (wafer). These components are then separated from one another using, for example, a cutting or cutting saw technique, whereby the individual components can be mounted on a carrier and connected to pins and the like. Further information about this type of process can be obtained, for example, from McGraw Hill Publishing Company, 1997. International book code is 0-07-06725 0-4, third edition by Peter van Zant. "Microchip Manufacturing: Semiconductor Processes." Practical Guide (Microchip Fabrication: a
Practical Guide to Semiconductor Processing)”。 基於簡化理由,該投射系統此後會稱之為”透鏡”。然而, 本術語應廣義解釋為包含各種類型之投射系統,包含例如 折射光學設備、反射光學設備及折反射式系統。該放射系 統也可包含根據指示、塑形或控制該放射之投射光束之這 些設計類型中任一者操作之元件,且這類元件也於下統稱 或單獨稱之為”透鏡”。進一步,該微影裝置可為一具有二 或更多基底桌(及/或二或更多光罩桌)類型。以並行或預備 步驟使用該些額外桌子之這類”多階段”元件可於一或更多 桌子上實行,而一或更多其它桌子係用來曝光。雙階段微 影裝置係說明於例如美國專利5,969,441及6,262,796中。 發展微影之新工具及方法已帶來一例如元件上所圖案 化之影像特徵解析度之改善。光學微影之工具及技術持續 91784.doc 200528927 改進可讓解析度小於50奈米。這個可使用相對高數值孔經Practical Guide to Semiconductor Processing). For simplicity reasons, this projection system will be called "lens" hereafter. However, this term should be interpreted broadly to include various types of projection systems, including, for example, refractive optics, reflective optics, and Reflective system. The radiation system may also include elements that operate according to any of these design types that instruct, shape, or control the projected beam of radiation, and such elements are collectively referred to below or individually as "lenses" Further, the lithographic device may be of the type having two or more base tables (and / or two or more mask tables). Such "multi-stage" components using the additional tables in parallel or preliminary steps may be Implemented on one or more tables, while one or more other tables are used for exposure. The two-stage lithographic device is described in, for example, US Patents 5,969,441 and 6,262,796. New tools and methods for developing lithography have brought for example Improving the resolution of image features patterned on components. Optical lithography tools and techniques continue to be 91784.doc 200528927 Improvements allow analysis Less than 50 nm. This may be by using a relatively high numerical aperture
(NA)透鏡(大於〇·75 NA)、波長短至157奈米及例如相移Z 罩、非彳i統照明及先進光阻製程之眾多技術來達成。 這些次波長解析度之製程成功將取決於印刷低調變影像 之能力或提升該影像調變至可接受微影良率程度之能力。 典型地,工業已使用瑞利(Rayleigh)準則來評量一製程解 析度及聚焦深度能力。該解析度及聚焦深度⑴〇F)係經由下 列方程式而得·· 解析度=ΚΚλ/ΝΑ), 以及 其中人係為該照明源波長,而kjk2係用於—特定微影製 私之常數。 因此,用於一特定波長,當解析度透過較高NA工具之使 用而增加時,可減少該聚焦深度。具有高NA之d〇f損失係 廣為人知。然而’用於高NA部分同調系統之偏光乾材尚未 被檢驗。根據下列方程式: I(r,Z〇)^J^(P〇)|Fr{0(P^〇)^ 其中在給予之例如一光阻薄片中之影像丨係為位置r及一 給予聚焦位置ZQ之函數。本方程式對所有NA係有效的,而 該影像係為所有偏光狀態i之總和。該積分係涵蓋由J所定義 之來源分佈。括號内之傅立葉項代表離開透光孔之電場分 佈括遽内的四項係分別為標線圖案之物鏡光譜0、偏光函 數P、薄片函數F及透光孔函數Η。 ·., 91784.doc 10- 200528927 根據本方程式,高ΝΑ影像係本徵地與該偏光狀態及該薄 片結構連結,其中電場耦合及一光阻薄片所吸收之功率可 被徹底性地改變。因一光阻薄片上之入射平面波而吸收之 功率係與顯影該薄片所需之曝光量成比例。 在美國加州之Santa Clara,於2002年2月27曰至3月3曰, SPIE有關微影技術之25周年國際論壇中,由Donis G, , Flagello et al:所出版名稱為”進入黃金時代之光學微影:像 : 差、振動及偏光靈敏度(Optical Lithography into the Millennium: _ Sensitivity to Aberrations,Vibrations and Polarization)’’ 的研究中 已顯示二個正交偏光(橫向電偏光TE及橫向磁偏光)在高 NA下相當地分離,高達25%功率變化。一影像系統包含許 多入射角以減少這個效應。然而,交替式相移光罩(PSMs) 需要一小部分同調以限制角度總數量因而產生類似之曝光 變化。 結果已透過模擬而得,其顯示與一完全極化狀態之關鍵 尺寸差值,而該未極化狀態視該數值孔徑N A而定。結果也 β 顯示具有一交替相移光罩(PSM)之密集線係為最關鍵特徵 / 且這個已經由該透光孔配置在該晶圓層級主要產生2束干 : 涉之事實做說明,且本範例傾向於極大化偏光效應。例如 若選擇一 0.85(相對高的)數值孔徑並要限制該系統關鍵尺 寸CD誤差小於3%,該殘餘偏光應被限制至於1 0%。該關鍵 尺寸CD係為製造一元件所允許一線之最小寬度或二線間 之最小空隔。該模擬結果也指示透光孔填充及部分同調層 級可減少該偏光效應。使用傳統照明在該些特徵上之小偏 91784.doc 200528927 光影響已被顯示。 因此’當使用更多相交 像技術時,該透鏡“要" 小同調層級之成 度量衡。例如,高NA偏光 '二影工具之照明偏光產生相當緊固之規格。 為’夜啦:/文潤”之解析度強化技術(ret)之出現可延 ^申157奈^學微影至較佳地低㈣奈米並可能低於50奈 而不改艾妝明源(雷射)或光罩技術。根據麻省理工學院 (MIT)2001 年 11/12月份在 J· Vac· Sci· Technology B 19⑷中 、、由Μ· Switkes et a1·所著名為,,157奈米之浸潤微影", 液體/文潤技術可潛在性地加強例如極紫外線(刪)及電子 技射微〜(EPL)之下—代微影(NGL)技術之需求。該液體浸 二技術牽涉到使用化學製品及光阻劑來提升解析度。浸潤 微影可加強具有數值孔徑之投射光學系統解析度高達該浸 潤流體之折射率。該數值孔徑NA係等於該媒體指數η與收 縮至該晶圓之某點影像(NA=n sin θ)之光圓錐正弦半角㊀之 乘積。因此,若ΝΑ隨該指數Ν增加而增加時,該解析度可 被增加(見方程式:解析度=kl(UNA))。然而,如上述,較 同na可在微影工具之照明偏光上產生相當緊固規格。因 此,偏光於浸潤微影中扮演增量角色。 【發明内容】 本發明之一觀點提供一種徑向橫向電子偏光器元件,包 含一具有一第一折射率之第一層材料、一具有一第二折射 率之第二層材料、及在方位角上週期性隔開並放置於該第 一層及泫第二層之間之複數個細長元件。該複數個細長元 91784.doc 12 200528927 件與放射之電磁波互動以傳送放射之電磁波之 光。 甸 在一具體實施例中,該第_折射率係等於該第二折射 率。在另一具體實施例中, °玄硬數個細長兀件形成複數個 間隙。14些間隙可包含例如* — ^或一具有—第三折射率材 广 具to声、%例中,該些細長元件週期性地隔開所 選之一間距以極化—橫向電偏光中之放射之電磁波。在_ 具體實苑例中,該電磁放射係為紫外線放射。 本㈣之另—觀點提供—種徑向橫向電子偏光器元件, 包含一具有H射率之基底材料及耗合至該基底材料 之禝數個細長方位角上定向之元件,該些細長元件具有一 第二折射率。該些元件係週期性隔開以形成複數個間隔以 使該徑向橫向電子偏光器元件與一具有第一及第二偏光之 電磁放射互動以實質反射所有放射之第-偏光並實質傳送 所有放射之第二偏光。 在本發明一具體實施例中,該第一偏光係為一橫向磁偏 & (TM) @該第—偏光係為—橫向電(TE)偏光。該複數個細 長兀件可由例如!g、鉻、銀及金構成。該基底材料可為例 女英氧化矽、氮化矽、砷化鎵、一介電材料及以上之 結合。 在本發明另一具體實施例中,該徑向橫向電子偏光器選 擇性地又包含—薄層吸收材料。該複數個細長it件係塗佈 者0亥薄層吸收材料以吸收該電磁放射之某-波長。該薄層 吸收材料被選擇以使可轉換成一第二度放射之第二偏光之 9I784.doc 200528927 該第一偏光中之一部分反射之放射被該薄層吸收材料真正 地吸收。〜在本方式中,該薄層吸收材料可真正地消除該第 二偏光中之傳送放射之偏光光暈。 本發明另一觀點係提供一種偏光器元件,包含一極化元 件及一置於該極化元件背側上之吸收器。該極化元件與含 第一及第二偏光之電磁放射互動以實際反射所有放射之第 一偏光及實際傳送所有放射之第二偏光。該吸收器包含吸 收該私磁放射之某一波長之材料。該材料實際吸收所有放 射之第二偏光。該偏光器可使用於一反射式微影裝置。 在一具體實施例中,該極化元件包含複數個細長方位角 疋向之疋件。該複數個元件係週期性地隔開以形成複數個 間隙。該複數個細長元件在該電磁放射之波長可為例如電 性傳導的。在一示範具體實施例中,該第一偏光係為一橫 向磁偏光而該第二偏光係為一橫向電偏光。 在另一具體實施例中,該極化元件包含集中配置且週期 性間隔之複數個環。在一示範具體實施例中,該第一偏光 係為一橫向電偏光而該第二偏光係為一橫向磁偏光。 根據本發明之另一觀點,一微影投射裝置被提供,該裝 置包含架構配置以提供一放射之投射光束之一放射系統、 架構配置以支撐一圖案化元件之一支撐結構、該圖案化元 件破架構配置以根據一想要圖案來圖案化該投射光束、一 基底桌持住一基底、架構配置以投射該圖案化光束至該基 底乾材部分之一投射系統、及架構配置以極化一橫向電偏 光方向中之放射束之一偏光器元件。 9l784.doc -14· 200528927 本發明又一觀點係提供一種元件製造方法,包含將一圖 案化放射束投射在至少涵蓋部分基底之一層放射之感光材 料之乾材部分上;及極化一橫向電偏光中之放射束。本發 明再另一觀點係使用上述方法製造之元件來提供一元件。 雖然根據本發明在製造10中,特定參數在本文中可被產 t β咸置使用’但應清楚地了解這類裝置具有舉多其 它可能應用。例如,可被使用於製造用於磁性記憶體、液 晶顯示面板、薄膜磁頭等等之整合性光學系統、導引及偵 測圖案。一個人將了解在這類其它應用内容中,本文中任 何使用之術語,,標線”、,,晶圓,,或”裸晶,,應考慮分別由通用性 術語”光罩”、”基底”及”靶材部分,,所取代。 在本文件中,該術語"放射”及”束”被使 放射⑽如,具有-卿㈣ EUV(極紫外線,例如具有一 5,奈米範圍波長)之所有類型 電磁放射及例如離子束或電子束之微粒束。 【實施方式】 一些技術已被使用以產生極化光。基本上有四種極化一 自然光束,也以未極化光。—技術係以雙折射或雙徑向 材料為主。一第二技術係以使用例如”人造偏光板色 性材料為主。_第三技術使用薄膜技術並使用布魯斯特 (Brewster)效應。一第四技術係以導線格或傳導光柵為主。 在製造雙折射偏光器中使用雙折射材料以極化光係為已 知。雙折射偏光器可產製自許多結晶及一些延伸聚合物。 雙折射材料相較於另一者係於某方向中具有—不同:學指 91784.doc 200528927 數兩方向間光學指數之相差程度隨光波長而變化。 差錢用以分開-線性偏光束與另-光束。使用雙折身;偏 光為之特欲為無效、波長依賴效率且需要高度準直光。義 於這些理由,通常不在光學投㈣統中使用雙折射偏光器土。 -色性偏光㈣為將偏光器設計來吸收-偏光並傳送另 個大邛刀$用之二色性偏光器由被延伸以定向它的分 子並以碘及/或其它材料或化學品來處理之一聚合層所2 成,以使該些分子吸收—方向偏光。延伸聚合物偏:器吸 收一偏光之所有強度及至少15%所傳送之偏光。在該聚合 材料之感光化學品改變使材料變成黃色或易碎時,延伸聚 合物偏光器隨時間降低。二色性偏光器也是對熱及其它環 境改變敏感。 在最近十年中,一偏光器元件已於產製之雙折射延伸聚 合物層有所發展。這些延伸層反射一偏光及穿過另一個。 一使用本偏光器技術之問題係為近乎丨5之低消滅比。在可 用之一些應用中,本消滅比係不適合沒有一第二偏光器之 成像應用中。本類偏光器也遭受上述環境問題。 薄膜偏光為技術使用布魯斯特效應,其中以布魯斯特角 度(近乎45度)入射在例如玻璃、塑膠或雷同者之材料表面上 之光束可被區分成一傳送而另一個反射之二極化束。然 而,薄膜偏光器技術限制該光束入射之角度範圍。在大部 分元件中該接收角範圍係相當狹窄地限定在幾度内。薄膜 偏光器技術也因該入射光波長上布魯斯特角之相依性而遭 受波長相依性的問題。 91784.doc 16 200528927 用於尋求極化光束應用之影像投射系統中,一較亮 光束總是可期待的。—極化光束亮度係由許多因素所決 ^,該些因素其中之一係為它本身之光源。使用一偏光器 尔統之另一因素係為接收角。-具有-窄小或有限接收角 之偏光器不能自-發散光源中收集到與—使用—廣接收角 系統樣多的光。一具有大接收角之偏光器使設計一投射 光學系、统具㈣性。這是因為額光器不冑定位及定向於 該光源之窄接收角範圍内。 偏光器之另一想要特徵係為有效地分開一偏光元件與 另一 70件。這個被稱之為該消滅比,其係為想要偏光元件 光里對不想要偏光元件光量之比值。其它想要特徵包含於 一光學投射系統中自由定位該偏光器而不減少該偏光器效 率及/或對例如該光束方向等等之系統上引入額外限制。 另一偏光技術使用一傳導光柵或導線格。一導線格偏光 器係為一平均間隔平行電性導體之平面組件,其長度係遠 大於它們的寬度,且該些傳導元件間之空隔係小於該入射 光束之最尚頻光元件之波長。本技術已成功地在該無線電 頻率領域並咼達該光譜中之紅外線區域中使用一些年。具 有一平行於該導體(S偏光)偏光波被反射而正交偏光(P偏光) 波被傳送透過該導線格。該導線格偏光器係主要使用於雷 達、微波及紅外線領域。 除了可見光波長範圍中之少數範例例外,該導線格偏光 器技術未被使用於較短波長。例如,在美國專利6,2 8 8,8 4 0 中,一用於可見光光譜之導線格偏光器被揭示。該導線格 91784.doc -17- 200528927 偏光器被嵌入例如玻璃材料中並包含一夾在第一層及第二 層材料中^之平行細長隔開元件陣列。該些細長元件在該 些元件間形成複數個間隔以提供比該第-層折射率小之折 射率。該元件陣列被架構以與可見光譜中之電磁波互動以 反射-第-偏光中之大部分光並傳送一第二偏光中之大部 分光。該些元件具有—小於G 3微米週期及小於m卡寬 度0 /將-導線格偏光器使用於可見光光譜中偏光之另一範例 係述於美國專利5,3 83,G53。-導線格偏光器被使用於一虛 擬影像顯示器以改善傳統分束器之反射及穿透效率。該導 線格偏光器在一軸上極化虛擬影像顯示器中被當做一分束 凡件使用。該導線格偏光||之消滅比因該影像已被極化而 不是本應用言義豸,只有相冑高效率之反射A穿透才是本應 用之興趣。 出版在光學設備文件⑴ptics Letters)第23冊2〇號第 1627-1629頁文章中,1^〇1^2以&1說明使用類似導線格技術 之表面消除光柵偏光。Lopez et al說明於可見光譜(一 632 8 奈米He-Ne雷射之輸出)中使用光柵偏光做為正常入射下之 1/4波板偏光器(相延遲π /2)及做為一入射角4〇。下之極化分 束态(PBS)。該偏光器係為一具有〇·3微米週期及5〇%工作週 期之一維表面消除光栅。該光栅材料係為夾在一接熔線石 英基底上之二層SisN4(折射率2.20)中間之Si02(折射率 1.457)單層。 然而,該導線格偏光器技術未被建議使用於紫外線波長 9l784.doc -18- 200528927 粑圍中’也就是短於400奈米可見光下限波長。如上述,發 展-用於紫外線放射之偏光器將增加微影投射系統解析 度,且更特定言之,增加例如在浸潤微影系統範例中之具 有高NA之微影投射系統解析度。 ’、 出版在1999年9月在SPIE第3879冊第138-146頁文章中, Feml et ai說明使用"高頻"光柵做為偏光元件。具有小於 650奈米照明波長特徵尺寸之二位元光柵係藉由微結構技 術使用直接式電子束寫人法結合連續反應式離子姓刻以石 夬玻璃來製造。在偏光分束器中得到約8〇%第]階橫向電子 TE偏光之衍射效率及9〇%第〇階橫向磁性tm偏光之衍射效 率 〇 一波之偏光狀態可由二參數㊀及^來定義,其中θ定義ΤΕ 及丁W波兀件之相對量而φ定義它們的相對相位。該入射波 可以下列方程式對來表示:(NA) lenses (greater than 0.75 NA), wavelengths as short as 157 nanometers, and many technologies such as phase shift Z-hoods, non-uniform illumination, and advanced photoresistance processes. The success of these sub-wavelength resolution processes will depend on the ability to print low-modulation images or to enhance the image's ability to tune to acceptable lithographic yield. Typically, the industry has used Rayleigh criteria to evaluate the resolution and focus depth capabilities of a process. The resolution and depth of focus (° F) are obtained through the following equations: Resolution = Κκλ / ΝΑ), and where human is the wavelength of the illumination source, and kjk2 is a constant for a specific lithography system. Therefore, for a specific wavelength, when the resolution is increased by the use of a higher NA tool, the depth of focus can be reduced. Dof losses with high NA are well known. However, polarized dry materials for high-NA partial coherence systems have not been tested. According to the following equation: I (r, Z〇) ^ J ^ (P〇) | Fr {0 (P ^ 〇) ^ where the image given, for example, a photoresist sheet, is the position r and a given focus position ZQ function. This equation is valid for all NA systems, and the image system is the sum of all polarized states i. This integral covers the distribution of sources defined by J. The Fourier terms in parentheses represent the electric field distribution leaving the transparent aperture. The four terms in 遽 are the objective lens spectrum 0, the polarization function P, the sheet function F, and the transparent aperture function 标. ·., 91784.doc 10- 200528927 According to this equation, the high NA image is intrinsically connected to the polarized state and the sheet structure, in which the electric field coupling and the power absorbed by a photoresist sheet can be completely changed. The power absorbed by an incident plane wave on a photoresist sheet is proportional to the amount of exposure required to develop the sheet. In Santa Clara, California, USA, February 27th to March 3rd, 2002, SPIE's 25th Anniversary Forum on Lithography Technology, published by Donis G, Flagello et al: "Entering the Golden Age Optical Lithography: Image: Optical Lithography into the Millennium: _ Sensitivity to Aberrations (Vibrations and Polarization) '' research has shown two orthogonal polarizations (transverse electrical polarization TE and transverse magnetic polarization) Quite apart at high NA, up to 25% power change. An imaging system contains many angles of incidence to reduce this effect. However, alternating phase shift masks (PSMs) require a small amount of homology to limit the total number of angles and thus produce similar The results have been obtained through simulation. It shows the difference in key dimensions from a fully polarized state, and the unpolarized state depends on the numerical aperture NA. The results also show that β has an alternating phase shift mask (PSM) dense line system is the most critical feature / and this has been configured by the transparent hole at the wafer level mainly produces 2 beams: the facts involved And this example tends to maximize the polarization effect. For example, if you choose a 0.85 (relatively high) numerical aperture and want to limit the system's critical dimension CD error to less than 3%, the residual polarization should be limited to 10%. The critical dimension CD is the minimum width of one line or the minimum space between two lines that is allowed to make a component. The simulation results also indicate that the filling of transparent holes and a part of the coherence level can reduce the polarization effect. The traditional lighting is small in these features. Partial 91784.doc 200528927 Light effects have been shown. Therefore 'when more intersecting image techniques are used, the lens "requires a small coherence level of weight." For example, high NA polarized light's polarized lighting produces fairly tight specifications. The emergence of the resolution enhancement technology (ret) for 'night :: / wenrun' can be extended ^ Shen 157 nanometers ^ learn lithography to a better low nanometer and may be lower than 50 nanometers without changing Ai makeup Mingyuan (Laser) or photomask technology. According to the Massachusetts Institute of Technology (MIT) in November / December 2001, J. Vac · Sci · Technology B 19⑷, famous by M · Switkes et a1 ·, 157 na Mizhi's infiltration lithography ", liquid / wenrun technology can potentially enhance the requirements of next generation lithography (NGL) technology such as extreme ultraviolet (UV) and electronic technology to shoot micro (EPL). The liquid immersion Technology involves the use of chemicals and photoresist to improve resolution. Wetting lithography can enhance the resolution of a projection optical system with a numerical aperture up to the refractive index of the wetting fluid. The numerical aperture NA is equal to the media index η and shrinks to The product of the light cone sine half-angle 影像 of a certain point image of the wafer (NA = n sin θ). Therefore, if NA is increased as the index N increases, the resolution can be increased (see equation: resolution = kl (UNA)). However, as mentioned above, the same na can be used on the polarized light of the lithography tool. Therefore, polarized light plays an incremental role in immersion lithography. [Abstract] An aspect of the present invention provides a radial transverse electronic polarizer element including a first layer having a first refractive index. Material, a second layer of material having a second refractive index, and a plurality of elongated elements periodically spaced in azimuth and placed between the first layer and the second layer. The plurality of elongated elements 91784 .doc 12 200528927 The piece interacts with the radiated electromagnetic wave to transmit the radiated electromagnetic wave light. In a specific embodiment, the first refractive index is equal to the second refractive index. In another specific embodiment, ° mysterious Several elongated elements form a plurality of gaps. 14 Some of the gaps may include, for example, *-^ or a third refractive index material with sound, in the example, the elongated elements periodically separate one of the selected one The pitch is the electromagnetic waves radiated in polarized-transverse electrical polarized light. In the specific example, this electromagnetic radiation is ultraviolet radiation. This alternative—a perspective provides—a radial transverse electronic polarizer element, including A base material having an H-emissivity and a plurality of elongated azimuth elements oriented to the base material, the elongated elements having a second refractive index. The elements are periodically spaced to form a plurality of intervals In this way, the radial transverse electronic polarizer element interacts with an electromagnetic radiation having first and second polarized light to substantially reflect the first polarized light of all radiation and transmit the second polarized light of substantially all radiation. In a specific embodiment of the present invention The first polarizing system is a transverse magnetic polarization & (TM) @The first polarizing system is a transverse electrical (TE) polarization. The plurality of elongated elements may be composed of, for example,! G, chromium, silver, and gold. The base material can be exemplified by silicon oxide, silicon nitride, gallium arsenide, a dielectric material, and a combination thereof. In another embodiment of the present invention, the radial transverse electronic polarizer optionally further comprises a thin layer of absorbing material. The plurality of elongated IT pieces are coated with a thin layer of absorbing material to absorb a certain wavelength of the electromagnetic radiation. The thin layer of absorbing material is selected so that the second polarized light which can be converted into a second degree of radiation 9I784.doc 200528927 the partially reflected radiation of the first polarized light is truly absorbed by the thin layer of absorbing material. ~ In this mode, the thin-layered absorbing material can truly eliminate the polarized halo of the transmitted radiation in the second polarized light. Another aspect of the present invention is to provide a polarizer element including a polarizing element and an absorber disposed on the back side of the polarizing element. The polarizing element interacts with the electromagnetic radiation including the first and second polarized light to actually reflect the first polarized light of all radiation and the second polarized light to actually transmit all radiation. The absorber contains a material that absorbs a certain wavelength of the private magnetic radiation. This material actually absorbs all the emitted second polarized light. The polarizer can be used in a reflective lithography device. In a specific embodiment, the polarizing element includes a plurality of elongated azimuth-oriented elements. The plurality of elements are periodically spaced to form a plurality of gaps. The plurality of elongated elements may be, for example, electrically conductive at a wavelength of the electromagnetic radiation. In an exemplary embodiment, the first polarization system is a transverse magnetic polarization and the second polarization system is a transverse electrical polarization. In another specific embodiment, the polarizing element includes a plurality of rings that are arranged centrally and periodically spaced. In an exemplary embodiment, the first polarization system is a lateral electrical polarization and the second polarization system is a lateral magnetic polarization. According to another aspect of the present invention, a lithographic projection device is provided. The device includes a radiation system configured to provide a radiated projection beam, a support structure configured to support a patterned element, the patterned element. A structured configuration to pattern the projected beam according to a desired pattern, a base table to hold a substrate, a structured configuration to project the patterned beam to one of the substrate dry material projection systems, and a structured configuration to polarize a A polarizer element that is a beam of radiation in the direction of transverse electrical polarization. 9l784.doc -14 · 200528927 Yet another aspect of the present invention is to provide a method for manufacturing a device, comprising projecting a patterned radiation beam onto a dry material portion of a photosensitive material covering at least part of a layer of radiation; and polarizing a lateral electric current. Radiation beam in polarized light. Another aspect of the present invention is to provide an element using the element manufactured by the above method. Although in the manufacture 10 according to the present invention, certain parameters can be used herein for the production of tβ, it should be clearly understood that such devices have many other possible applications. For example, it can be used to manufacture integrated optical systems, guidance and detection patterns for magnetic memory, liquid crystal display panels, thin film magnetic heads, and the like. One will understand that in this category of other applications, any terminology used in this article, reticle, wafer, or "bare die", should be considered by the generic terms "mask", "substrate", respectively And "the target part," are replaced. In this document, the terms "radiation" and "beam" are radiated as follows, with -UVEUV (extreme ultraviolet, for example, with a wavelength of 5, nanometer range) All types of electromagnetic radiation and particle beams such as ion beams or electron beams. [Embodiments] Some techniques have been used to generate polarized light. There are basically four kinds of polarized-natural beams, also unpolarized light. -Technology is based on birefringent or bi-radial materials. A second technology is based on the use of, for example, artificial coloring materials. _ The third technology uses thin film technology and uses the Brewster effect. A fourth technology is based on wire grids or conductive gratings. Manufacturing The use of birefringent polarizers in birefringent polarizers is known to polarize the light system. Birefringent polarizers can be produced from many crystals and some extended polymers. Compared to the other, birefringent materials have- Different: Academic index 91784.doc 200528927 The degree of difference in optical index between the two directions varies with the wavelength of the light. The difference is used to separate-linearly polarized beams from the other-beams. Use double folding; polarized light is especially invalid, Wavelength depends on efficiency and requires highly collimated light. For these reasons, birefringent polarizers are generally not used in optical systems.-Chromatic polarization is designed to absorb-polarize and transmit another large trowel The dichroic polarizer used is composed of a polymer layer that is extended to orient its molecules and treated with iodine and / or other materials or chemicals to make the molecules absorb-directionally polarized light. Object Polarization: The device absorbs all the intensity of a polarized light and at least 15% of the transmitted polarized light. When the photosensitive chemical of the polymeric material changes to make the material yellow or fragile, the extended polymer polarizer decreases with time. The device is also sensitive to heat and other environmental changes. In the last decade, a polarizer element has been developed in birefringent extended polymer layers. These extended layers reflect one polarized light and pass through another. The problem with polarizer technology is the low extinction ratio, which is close to 5. In some of the applications available, this extinction ratio is not suitable for imaging applications without a second polarizer. This type of polarizer also suffers from the aforementioned environmental problems. Thin film polarization The Brewster effect is used for the technology, where a light beam incident on a material surface such as glass, plastic or the like at a Brewster angle (approximately 45 degrees) can be divided into two polarized beams that are transmitted and the other reflected. Polarizer technology limits the range of angles at which the light beam is incident. In most components, the range of reception angles is quite narrowly limited to a few degrees. Thin Film polarizer technology also suffers from wavelength dependence due to the dependence of the Brewster angle on the wavelength of the incident light. 91784.doc 16 200528927 In image projection systems for applications that seek polarized beams, a brighter beam can always be used. Expected.-The brightness of the polarized beam is determined by many factors, one of which is its own light source. The other factor using a polarizer is the reception angle.-Has-Narrow or A polarizer with a limited reception angle cannot collect as much light as from a -use-wide reception angle system from a divergent light source. A polarizer with a large reception angle enables the design of a projection optical system, which is flexible. This is because The forehead is not positioned and oriented within the narrow range of the receiving angle of the light source. Another desirable feature of the polarizer is to effectively separate one polarizing element from the other 70 pieces. This is called the elimination ratio, which It is the ratio of the amount of light in the wanted polarizer to the amount of light in the unwanted polarizer. Other desirable features include free positioning of the polarizer in an optical projection system without reducing the efficiency of the polarizer and / or introducing additional constraints on systems such as the beam direction and the like. Another polarization technique uses a conductive grating or wire grid. A wire-lattice polarizer is a planar component with evenly spaced parallel electrical conductors, the length of which is much larger than their width, and the space between the conductive elements is smaller than the wavelength of the most frequent optical element of the incident beam. The technology has been successfully used in the radio frequency field and in the infrared region of the spectrum for several years. A polarized wave parallel to the conductor (S-polarized light) is reflected and an orthogonally polarized (P-polarized) wave is transmitted through the wire grid. This wire grid polarizer is mainly used in the fields of radar, microwave and infrared. With few exceptions in the visible wavelength range, this wire grid polarizer technology is not used for shorter wavelengths. For example, in U.S. Patent 6,288,840, a wire grid polarizer for the visible light spectrum is disclosed. The wire grid 91784.doc -17- 200528927 the polarizer is embedded in, for example, a glass material and includes an array of parallel elongated spacer elements sandwiched between a first layer and a second layer of material ^. The elongated elements form a plurality of spaces between the elements to provide a refractive index that is smaller than the refractive index of the first layer. The element array is structured to interact with electromagnetic waves in the visible spectrum to reflect most of the light in the first-polarized light and transmit most of the light in a second polarized light. These devices have-less than G 3 micron period and less than m card width 0 / will-another example of the use of wire grid polarizers for polarized light in the visible light spectrum is described in U.S. Patent 5,3 83, G53. -Wire grid polarizers are used in a virtual image display to improve the reflection and penetration efficiency of traditional beam splitters. The linear grid polarizer is used as a beam splitter in an axis-polarized virtual image display. The extinction ratio of the polarized light || is because the image has been polarized instead of the meaning of this application. Only high-efficiency reflection A penetration is of interest in this application. Published in the optical equipment document (ptics Letters), Volume 23, No. 20, pages 1627-1629, 1 ^ 〇 1 ^ 2 & 1 illustrates the use of wire grid-like surface to eliminate grating polarization. Lopez et al. Demonstrated the use of grating polarized light as a quarter-wave plate polarizer (phase delay π / 2) and normal incidence in the visible spectrum (the output of a 632 8 nm He-Ne laser). Angle 40. Polarized beam splitting state (PBS). The polarizer is a one-dimensional surface cancellation grating with a period of 0.3 micron and a 50% duty cycle. The grating material is a single layer of Si02 (refractive index 1.457) sandwiched between two layers of SisN4 (refractive index 2.20) on a fused zeolite substrate. However, the wire grid polarizer technology is not recommended for use in the ultraviolet wavelength 9l784.doc -18- 200528927, which is shorter than the lower visible wavelength limit of 400 nm. As described above, the development of a polarizer for ultraviolet radiation will increase the lithographic projection system resolution, and more specifically, increase the lithographic projection system resolution with a high NA, such as in the immersion lithographic system example. ’, Published in the SPIE Book 3879, pages 138-146 in September 1999, Feml et ai describes the use of " high frequency " gratings as polarizing elements. Two-dimensional gratings with characteristic wavelengths of illumination wavelengths less than 650 nanometers are manufactured by microstructure technology using direct electron beam writing method combined with continuous reactive ion engraving and stone glass. The diffraction efficiency of about 80% of the first-order transverse electron TE polarization and 90% of the diffraction efficiency of the 0th-order transverse magnetic tm polarization in a polarizing beam splitter can be defined by the two parameters ㊀ and ^. Where θ defines the relative quantities of TE and DW components and φ defines their relative phases. The incident wave can be represented by the following pair of equations:
Ate = cos Θ及 ΑτΜ = ej(i>sin Θ。 因此’用於φ=〇,該波係以一角度㊀線性極化。當θ==π/4 且φ ±π/2 h可彳于到環狀偏光。一 τε極化波係由㊀所代表。 一 ΤΜ波係由θ=π/2所代表。ΤΕ及ΤΜ偏光係為基本偏光元 件。 在進入偏光系統及偏光透鏡之相關細節前,應明智的將 偏光加入它的應用内文中,也就是加入微影工具及方法内 文中。 圖1根據本發明一具體實施例略述一微影投射裝置1。該 裝置包含架構及配置一放射系統Εχ、IL以提供一放射(例如 9l784.doc 19 200528927 極紫外線放射)之投射束PB,其在本特定例中也包括一放射 源LA; 一—第一物件桌(光罩桌)MT提供一光罩支架以持住一 光罩MA(例如一標線)並連接至一第一定位元件pM以相對 於一投射系統PL精確地定位該光罩。—第二物件桌(基底 桌)WT提供一基底支架以持住一基底w(例如一塗佈光阻劑 之矽aa圓)並連接至一第一定位元件p w以相對於該投射系 統PL精確地定位該基底。該投射系統("透鏡")pL(例如一鏡 群)被架構並配置以將該光罩MA之放射部分成像在該基底 w之乾材部分C(例如包括一或更多裸晶)上。 如在此所述,該裝置係為一穿透型(也就是具有一穿透光 罩)。然而,大體上,也可以是一反射型(具有一反射光罩)。 另外’該裝置可使用例如上面所指之某型可程式鏡陣列之 另一種圖案元件。 該來源LA(例如一排出或雷射製造電漿源)產生一放射 束。本放射束以例如直接或在橫過例如一放射束擴大器Εχ 之條件作用元件後饋入一照明系統(照明器)IL。該照明器IL 可包括一調整元件AM以設定在該束内強度分佈之外部及/ 或内部徑向區(通常分別稱之為σ外部及σ内部)。此外,大 體上會包括例如一積算器IN及一聚光器CO之各種其它元 件。本方式中,打在該光罩MA上之束PB在它的剖面具有一 想要的均勻性及強度分佈。 對應圖1應注意該來源LA可在該微影投射裝置(就例如當 3玄來源L A係為一水銀燈時之常見範例)外罩,但也可遙距該 微影投射裝置,所產生之放射·.束被饋入該裝置(例如藉由合 91784.doc -20- 200528927 適的指向面鏡)。後者方案係為該來源la係為一準分子雷射 時之常見範例。本發明包括這些方案中之兩者。 4束PB接著截取持在一光罩桌]viA上之光罩MA。橫過該Ate = cos Θ and ΑτΜ = ej (i > sin Θ. So 'for φ = 0, the wave system is linearly polarized at an angle 。. When θ = = π / 4 and φ ± π / 2 h can be less than To circular polarized light. A τε polarized wave system is represented by ㊀. A TM wave system is represented by θ = π / 2. TE and TM polarized systems are basic polarizing elements. Before entering the details of polarizing systems and polarizing lenses It should be wise to add polarized light to its application text, that is, to the lithography tool and method text. Figure 1 outlines a lithography projection device 1 according to a specific embodiment of the present invention. The device includes a structure and a radiation The system Eχ, IL provides a projected beam PB of radiation (eg 9l784.doc 19 200528927 extreme ultraviolet radiation), which also includes a radiation source LA in this specific example; a first object table (mask table) MT provides A photomask holder to hold a photomask MA (such as a graticule) and connected to a first positioning element pM to accurately position the photomask relative to a projection system PL.-Second object table (base table) WT Provide a substrate holder to hold a substrate w (such as a photoresist-coated silicon aa ) And connected to a first positioning element pw to accurately position the substrate relative to the projection system PL. The projection system (" lens ") pL (e.g. a lens group) is structured and configured to place the mask MA The radiating portion is imaged on the dry material portion C (for example, including one or more bare crystals) of the substrate w. As described herein, the device is a transmissive type (that is, has a transmissive mask). However, in general, it can also be a reflective type (with a reflective mask). In addition, the device can use another pattern element such as a programmable mirror array of the type referred to above. The source LA (such as a discharge or A laser manufacturing plasma source) generates a radiation beam. The radiation beam is fed, for example, directly or after crossing a conditionally acting element such as a radiation beam expander Ex, into a lighting system (luminaire) IL. The illuminator IL may Includes an adjustment element AM to set the outer and / or inner radial regions of the intensity distribution within the beam (commonly referred to as σexternal and σinternal, respectively). In addition, it will generally include, for example, an integrator IN and a condenser Various other elements of CO In this method, the beam PB hitting the mask MA has a desired uniformity and intensity distribution in its cross section. Corresponding to FIG. 1 it should be noted that the source LA can be in the lithography projection device (for example, when 3 Mysterious source LA is a common example when a mercury lamp is used, but it can also be remotely located from the lithographic projection device, and the radiation produced by the beam is fed into the device (for example, by combining 91784.doc -20- 200528927 suitable The latter scheme is a common example when the source la is an excimer laser. The present invention includes both of these schemes. 4 beams of PB are then intercepted and held on a mask table] viA Photomask MA. Cross that
光罩MA,該束PB穿過該透鏡pl以聚焦該束pb於該基底W 之乾材部分C上。經該第二定位元件pw及干涉計iF幫助, 该基底桌WT可精確地被移動’例如藉此定位該束pB路徑之 不同靶材部分c。類似地,該第一定位元件PM可被使用以 例如自一光罩庫機械式取出該光罩MA後或掃描時相對於 该束PM路徑精確地定位該光罩MA。大體上,移動該些物 件桌MT、WT會以一長擊模組(普遍定位)及一短擊模組(微 调定位)之幫助來實施,其未被明顯地描述於圖丨中。然而, 在一晶圓步進機(相對於一步進及掃描裝置)範例中,該光罩 桌MT可只連接至一短擊致動器,也可以是固定的。該光罩 MA及該基可使用光罩對準標記Μι、Μ4基底對準標記 Pl、P2來對準。 所述裝置可被使用於二種不同模式中。在步進模式,該 光罩桌MT主要係保持不動的,而—整個光罩影像馬上被投 射二也就是投射一單”閃光”至—乾材部分c。該基底桌资 接著在該X及/或γ方向中移動以使—不同靶材部分C可被 該束PB所放射。 在掃描模式中,將一仏子鈀姑 、,σ亍耙材σ卩分未曝露於一單”閃光·, 中排除外,主要施用相同荦。 、 j力系朁代地,該光罩桌MT可以 速度v移動於一給予方向(所謂, 、 v |月评抱方向,例如Y方向)之 中’以引起該投射束PB掃描過_ 尤卓衫像。同時地,該基 91784.doc 200528927 底桌WT同時以速度V二Mv在相同或相反方向移動,其中M 係為該透鏡PL(典型地,1/4或1/5)倍率。本方式中,一 相對大的靶材部分C可被曝光,而不必對解析度妥協。 目前’使用於投射微影之透鏡不使用TE偏光器。它們不 是具有線性偏光就是環狀偏光。先前本發明所使用之微影 工具中之偏光狀態不是線性、環狀就是未極化。該些發明 人已決定為了改善解析度並可在例如NA大於1之浸潤微影 中之高ΝΑ下有較佳成像,它會需要壓抑所有特徵定向之τμ 偏光。否則該對比損失會嚴重到足以損傷任何可見成像。 為了消除ΤΜ偏光及只使用微影投射中之τε偏光,該些發 明人已發現在環狀對稱透鏡中使用徑向偏光器可選擇性消 除該ΤΜ偏光元件。製造徑向偏光器係類似於前述導線格技 術中之製造徑向偏光器。此可在一透鏡元件上或嵌入該透 鏡元件内藉由例如鉻或銀、介電質或多層之徑向週期性金 屬線之製造以完成之。 圖2 Α係一根據本發明之徑向偏光器具體實施例示意圖。 徑向偏光器20具有配置於一徑向對稱圖案中之週期光柵 22。該光柵週期可根據其它想要參數選擇所使用之一特定 放射波長。本具體實施例中,該些光栅被沉積於一可為玻 璃或其它材料之基底24上。該些光栅22可為例如鋁、鉻、 銀、金或在該電磁放射束波長下係為傳導之任何材料之金 屬範例。該些光柵也可由例如多層結構中例如夾在一接熔 線石英基底上之二層以3队間之單一 Si〇2層之介電質或結合 所構成,但不限於此。該些光柵22也可使用電子束來蝕刻 91784.doc -22- 200528927 以例如接著轉移一圖案至一 GaAs基底。 圖2B係為在偏光器2〇區域26處之光栅22放大圖。如圖2B 所示’光栅22係交錯配置以使該偏光效應順利轉換以順著 該偏光器直徑維持該TE偏光強度之均勻性。 雖然該偏光器22係示於具有一碟形之圖2A,該偏光器2〇 也可以是例如一長方形、六角形等等之多邊形,但不限於 此。 圖3係為該徑向偏光器之另一具體實施例之側面放大 圖。徑向偏光器30包含一具有第一折射率之第一層材料 32 具有一第二折射率之第二層材料34。方位角上週期 性隔開之複數個細長36(或光柵)係配置於該第一層32及該 第二層34之間。該複數個細長元件36與光或放射之電磁波 互動以傳送橫向電TE偏光並反射或吸收TM偏光。該複數個 細長元件36可由例如二氧化矽所構成而該第一及/或第二 層32及/或34可由包括例如石英、矽氧烷、二氧化物、氮化 矽、砷化鍺等等之任何材料或該放射之電磁束波長之介電 材料所構成。類似先剎具體實施例,該些細長元件3 6間之 空隔或週期可根據想使用之偏光器來選擇,也就是根據該 微影系統中之其它參數選擇一特定波長。 類似地,雖然該偏光器3 〇係示於圖3中部分或全部具有一 碟形,該偏光器30也可是部分或全部具有一例如一長方 形、六角形等等之多邊形’但不限於此。 打在偏光器20、30上之近端丨常入射光會使它偏光狀態 改變以使該傳送偏光狀態之輸出係正交於該偏光器.2〇、3〇. 91784.doc •23- 200528927 中之光柵線22、36方向。 圖4係為一自一 τΕ偏光器輪出並具有該較佳偏光方向41 之向量圖。在具有高ΝΑ系統之ΤΕ偏光需求係大於該透光孔 邊緣日守會使較尚錯誤及缺陷朝向該偏光器中心。一同調光 照射穿過密集線(標線影像線)會產生3階衍射。在42是光束 之〇階衍射位置而在44及45為一垂直線中+1階衍射及」階 衍射之相對位置。在46及47為一水平線中+1階衍射及」階 衍射之相對位置。該+1及-1階會干擾引起觸及該晶圓之照 明中之峰谷。若將一ΤΕ偏光使用於垂直及水平兩線,一干 擾圖案發生引起一高對比因而使該些線產生良好解析度。 然而,在線性偏光範例中,只也垂直或水平線其中之一 會產生一具有高對比之純干擾圖案。!另一垂直或水平線不 會正確地極化而不會形成一干擾圖案因而該對比會較低。 高及低對比影像之結合將平均引起全部圖案產生一低分辨 率或解析度成像之結果。為了避免在該晶圓該元件未發生 干擾或少量干擾,該些發明人使用一能讓干擾圖案發生於 該透鏡中之任何方位角方向之徑向ΤΕ偏光器。在各元件係 為二線性正交偏光結合但可想成固定空間之位置函數方式 之轉彎處時,這個不是具有環狀偏光範例。因此,使用環 狀偏光不會產生干擾線,因此不適合用於微影系統之高解 析度成像,因在該晶圓平面中,環狀偏光被減少至線性偏 光且這個缺點係述於上文中。 在一浸潤微影系統中,也就是一具有一高ΝΑ微影系統 中,可能需要使用一 ΤΕ偏光以得到足以成像密集線之解析 91784.doc -24- 200528927 度。圖5顯示用於一未極化浸潤微影系統成像5〇奈米密集線 之比較例1之處理窗。本範例所使用波長係為1 93奈米。所 使用之/叉/閏"丨l體係為具有i.437(NA=1.437)折射率之水。令 空氣等效數值孔徑NA係為1.29。本範例所使用之光阻劑係 為日本Sumitomo公司所產製置於一相配基底上之 PAR710。該照明係為具有σ = 〇·9/〇 7之環狀。圖5係為比較 例1之曝光緯度對聚焦深度之關係圖。本圖指示在〇〇聚焦 沬度之曝光緯度係約為5.6%,其是一不穩定層級。在其它 聚焦深度,該曝光緯度甚至減少更多而使一未極化光在高 ΝΑ之微影系統中不穩定。 圖6根據本發明例丨顯示用於一具有ΤΕ極化光及浸潤光學 设備之50奈米密集線之處理窗。本範例所使用之波長係為 193奈米。所使用之浸潤流體係為具有丨437(να=ι ·437)折射 率之水。本範例所使用之光阻劑係在一相配基底上之 Pai*70。該照明係為具有σ =〇·9/〇·7之環狀。圖6係為曝光緯 度里對聚焦深度之關係圖。本圖指示在〇〇聚焦深度之曝光 緯度係約為9.9%,其是一不穩定層級。相較於比較例丨,在 使用本發明例1之TE徑向偏光系統時可得到75%曝光緯度 之改善。相較於比較例1,在本發明例1可得到D〇F之 改善。因此,一增加之處理窗可藉由使用本發明TE偏光器 來致此。在另一聚焦深度之曝光緯度隨著聚焦深度增加而 減少。 圖7係根據本發明另一具體實施例之徑向偏光器示意 圖。徑向TE偏光器70係由複數個面板偏光器構成。徑向偏 91784.doc -25- 200528927 光器70係經由切割具有線性偏光偏好之面板偏光器72來製 造。该面板偏光器被切割成面板區段72a_h以製造一環狀件 偏光器。該面板區段72a-h接著被組合以形成一徑向偏光器 70。各面板區段72a-h具有一線性偏光向量狀態74a-h因而經 由本方式組合該面板區段72a-h,該線性向量偏光74a-h會旋 轉以形成徑向偏光架構。然而,因該些面板區段係為不連 續元件,為了得到一,,連續” TE徑向偏光,偏光器7〇較佳地 係旋轉以隨機化該些面板間之光學路徑差並確保均勻性。 該偏光器旋轉係不需要的但在一些範例中,它會增加均勻 性且視該旋轉如何實施而定,該旋轉速度可選擇非常低或 非常快。為了執行這類旋轉,該偏光器7〇可被安裝在例如 空氣軸承上。在至少一部分微影系統係在真空中之Euv微 影範例中,可提供另一安裝解決方案。例如,該偏光器7〇 可取代空氣軸承來安裝在磁性軸承系統上。旋轉速度會主 宰該偏光均勻性。大體上,該旋轉率應夠高以隨機化該些 面板間之光學路徑差以確保均勻性。 圖8略示一使用本發明徑向TE偏光器之微影系統具體實 施例。如前述,微影系統80包括照明或放射系統源81、光 罩或標線82、投射透鏡83、基底或晶圓84及一徑向TE偏光 器20、30或70。該徑向TE偏光器2〇、3〇或7〇係示於本具體 實施例中該投射透鏡入口處,最佳地緊靠該透光孔平面, 然而,一熟知此項技術之人士會了解該徑向偏光器3〇 或70可被定位於該投射透鏡内或例如在該標線或光罩以及 該投射透鏡8 3間之投射透鏡外之任何地方。 91784.doc -26- 200528927 徑向偏光器之最好效率可在該偏光器係為一具有完美傳 導光栅(例如’導線格或細長元件)之理想偏光器時獲得。本 情況中’該徑向偏光器作用如同一偏光(例如TM偏光)中之 全反射光之完美面鏡且用於具有其它偏光(例如TE偏光)之 光將會完美地穿透。該想要偏光(TE偏光)會被傳送而該不 要偏光(TM偏光)會被反射。 然而’若該徑向偏光器係置於例如該標線82及該投射透 鏡83之間’該具有不要偏光(tm偏光)之反射光可傳回到該 “線82。該具有不要偏光之反射光可打在該標線82上並被 反射回來朝向該徑向偏光器。在本過程中,由該標線反射 之一部分光可進行一偏光變化。若例如該標線82所反射之In the mask MA, the beam PB passes through the lens pl to focus the beam pb on the dry material portion C of the substrate W. With the help of the second positioning element pw and the interferometer iF, the base table WT can be accurately moved ', for example, thereby positioning different target portions c of the beam pB path. Similarly, the first positioning element PM can be used to precisely position the mask MA relative to the beam PM path after mechanically removing the mask MA from a mask library or during scanning, for example. In general, moving the object tables MT and WT will be implemented with the help of a long-stroke module (universal positioning) and a short-strike module (fine-tuning positioning), which are not clearly described in the figure. However, in the example of a wafer stepper (as opposed to a stepping and scanning device), the reticle table MT may be connected to only a short-acting actuator, or it may be fixed. The photomask MA and the substrate can be aligned using photomask alignment marks M1 and M4 substrate alignment marks P1 and P2. The device can be used in two different modes. In step mode, the reticle table MT is mainly kept stationary, and the entire reticle image is immediately shot two, that is, a single "flash" is shot to the dry material portion c. The substrate table is then moved in the X and / or γ direction so that a different target portion C can be radiated by the beam PB. In the scan mode, one palladium palladium, σ 亍 rake material σ 卩 points are not exposed to a single "flash", except for the same, the main application is the same 、, j force is the place where the mask table MT The speed v can be moved in a given direction (the so-called, v | month evaluation direction, such as the Y direction) to cause the projected beam PB to be scanned over _ You Zhuo shirt image. At the same time, the base 91784.doc 200528927 bottom The table WT moves at the same time in the same or opposite direction at a speed of V and Mv, where M is the magnification of the lens (typically, 1/4 or 1/5). In this mode, a relatively large target portion C can be Exposure without compromising resolution. At present, lenses used to project lithography do not use TE polarizers. They are either linearly polarized or circularly polarized. The polarization state in the lithographic tools used in the present invention is not linear, The ring is unpolarized. The inventors have decided that in order to improve the resolution and to have better imaging at high NAs in immersion lithography with NA greater than 1, for example, it will need to suppress τμ polarized light in all characteristic orientations. Otherwise This contrast loss can be severe enough In order to eliminate TM polarized light and use only τε polarized light in lithographic projection, these inventors have discovered that using a radial polarizer in a ring-symmetric lens can selectively eliminate the TM polarizing element. Manufacturing radial polarized light The device is similar to the radial polarizer manufactured in the aforementioned wire grid technology. This can be fabricated on a lens element or embedded in the lens element by, for example, chromium or silver, dielectric or multilayer radial periodic metal wires. This is done. Figure 2A is a schematic diagram of a specific embodiment of a radial polarizer according to the present invention. The radial polarizer 20 has a periodic grating 22 arranged in a radially symmetrical pattern. The grating period can be according to other desired parameters. Select a specific emission wavelength to use. In this embodiment, the gratings are deposited on a substrate 24 which may be glass or other material. The gratings 22 may be, for example, aluminum, chromium, silver, gold, or Electromagnetic radiation beams are examples of metals of any material that conducts. These gratings can also be used, for example, in a multilayer structure such as two layers sandwiched between a fused quartz substrate and three layers. A SiO2 layer is composed of a dielectric or a combination, but is not limited to these. The gratings 22 can also be etched using electron beams 91784.doc -22- 200528927 to, for example, subsequently transfer a pattern to a GaAs substrate. Figure 2B It is an enlarged view of the grating 22 at the polarizer 20 area 26. As shown in FIG. 2B, the grating 22 is staggered to allow the polarization effect to be smoothly converted to maintain the uniformity of the TE polarization intensity along the diameter of the polarizer. Although the polarizer 22 is shown in FIG. 2A having a dish shape, the polarizer 20 may also be a polygon such as a rectangle, a hexagon, etc., but it is not limited to this. FIG. 3 shows a radial polarizer. An enlarged side view of another embodiment. The radial polarizer 30 includes a first layer material 32 having a first refractive index and a second layer material 34 having a second refractive index. A plurality of elongated 36 (or gratings) periodically spaced in azimuth are disposed between the first layer 32 and the second layer 34. The plurality of elongated elements 36 interact with light or radiated electromagnetic waves to transmit laterally polarized TE light and reflect or absorb TM polarized light. The plurality of elongated elements 36 may be composed of, for example, silicon dioxide and the first and / or second layers 32 and / or 34 may be composed of, for example, quartz, siloxane, dioxide, silicon nitride, germanium arsenide, etc. Any material or dielectric material of the wavelength of the emitted electromagnetic beam. Similar to the pre-brake embodiment, the spacing or period between the elongated elements 36 can be selected according to the polarizer that is desired, that is, a specific wavelength is selected according to other parameters in the lithography system. Similarly, although the polarizer 30 is shown in FIG. 3 as having a part or all of a dish shape, the polarizer 30 may be part or all of a polygon 'such as a rectangular shape, a hexagonal shape, etc., but is not limited thereto. Hitting the near ends of the polarizers 20 and 30. The often incident light will change its polarization state so that the output of the transmitted polarization state is orthogonal to the polarizer. 20, 30. 91784.doc • 23- 200528927 Grating lines 22, 36 directions. FIG. 4 is a vector diagram of a τE polarizer wheel with the preferred polarization direction 41. The polarization requirement of TE with a high NA system is larger than the edge of the light transmission hole. The day guard will cause more errors and defects towards the center of the polarizer. Dimming together Irradiation through dense lines (marked image lines) will produce 3rd order diffraction. At 42 is the 0th-order diffraction position of the light beam and at 44 and 45 are the relative positions of the + 1st-order diffraction and the "order-order diffraction" in a vertical line. 46 and 47 are the relative positions of the +1 order diffraction and "order" diffraction in a horizontal line. The +1 and -1 orders can interfere with peaks and valleys in the illumination that touches the wafer. If a TE polarized light is used for both vertical and horizontal lines, an interference pattern occurs that causes a high contrast and thus the lines have good resolution. However, in the linear polarization example, only one of the vertical or horizontal lines will produce a pure interference pattern with high contrast. !! The other vertical or horizontal line will not be properly polarized without forming an interference pattern and the contrast will be lower. The combination of high and low contrast images will, on average, cause all patterns to produce a low resolution or resolution imaging result. In order to avoid no interference or a small amount of interference from the component on the wafer, the inventors used a radial TE polarizer that allows interference patterns to occur in any azimuth direction of the lens. When each element is a combination of two linearly orthogonal polarized light but can be thought of as a function of position in a fixed space, this is not an example of circular polarization. Therefore, the use of ring-shaped polarized light does not produce interference lines, so it is not suitable for high-resolution imaging of lithographic systems, because in the wafer plane, ring-shaped polarized light is reduced to linearly polarized light and this disadvantage is described above. In an immersion lithography system, that is, a system with a high NA photolithography, it may be necessary to use a TE polarized light to obtain a resolution sufficient to image the dense line 91784.doc -24- 200528927 degrees. Figure 5 shows a processing window of Comparative Example 1 for imaging a 50 nm dense line with an unpolarized immersion lithography system. The wavelength used in this example is 193 nm. The / fork / 闰 " l system used is water with a refractive index of i.437 (NA = 1.437). Let the air equivalent numerical aperture NA be 1.29. The photoresist used in this example is PAR710 manufactured by Japan's Sumitomo Corporation on a matching substrate. This lighting system has a ring shape with σ = 0.9 / 07. FIG. 5 is a graph showing the relationship between the exposure latitude and the depth of focus in Comparative Example 1. FIG. This figure indicates that the exposure latitude at 〇focus is about 5.6%, which is an unstable level. At other focal depths, the exposure latitude decreases even more and makes an unpolarized light unstable in high NA lithography systems. Figure 6 shows a processing window for a 50 nm dense line with TE polarized light and infiltrating optical equipment according to an example of the present invention. The wavelength used in this example is 193 nm. The immersion flow system used was water with a refractive index of 437 (να = ι · 437). The photoresist used in this example is Pai * 70 on a compatible substrate. This lighting system has a ring shape with σ = 0.9 / 0.7. Fig. 6 is a graph showing the relationship between the focus depth at the exposure latitude. The figure indicates that the exposure latitude at a focus depth of 0.00 is about 9.9%, which is an unstable level. Compared with Comparative Example 丨, when using the TE radial polarizing system of Example 1 of the present invention, an improvement of 75% in the exposure latitude can be obtained. Compared with Comparative Example 1, DoF improvement in Example 1 of the present invention can be obtained. Therefore, an added processing window can be achieved by using the TE polarizer of the present invention. The exposure latitude at another focus depth decreases as the focus depth increases. Fig. 7 is a schematic diagram of a radial polarizer according to another embodiment of the present invention. The radial TE polarizer 70 is composed of a plurality of panel polarizers. Radial polarization 91784.doc -25- 200528927 The optical device 70 is manufactured by cutting a panel polarizer 72 having a linear polarization preference. The panel polarizer is cut into panel sections 72a-h to make a ring-shaped polarizer. The panel sections 72a-h are then combined to form a radial polarizer 70. Each panel segment 72a-h has a linear polarization vector state 74a-h. Therefore, by combining the panel segments 72a-h in this way, the linear vector polarization 74a-h will rotate to form a radial polarization structure. However, since the panel sections are discontinuous elements, in order to obtain one, continuous "TE radial polarization, the polarizer 70 is preferably rotated to randomize the optical path difference between the panels and ensure uniformity. The polarizer rotation system is not required but in some examples it will increase uniformity and depending on how the rotation is performed, the rotation speed can be selected to be very low or very fast. To perform this type of rotation, the polarizer 7 〇Can be mounted on, for example, an air bearing. In the Euv lithography example where at least a part of the lithography system is in a vacuum, another mounting solution can be provided. For example, the polarizer 70 can be installed on the magnetic instead of an air bearing On the bearing system. The rotation speed will dominate the polarization uniformity. In general, the rotation rate should be high enough to randomize the optical path difference between the panels to ensure uniformity. Figure 8 illustrates a radial TE polarization using the present invention. A specific embodiment of the lithography system of the camera. As mentioned above, the lithography system 80 includes an illumination or radiation system source 81, a mask or reticle 82, a projection lens 83, a substrate or wafer 84, and a radial TE polarized light. 20, 30, or 70. The radial TE polarizer 20, 30, or 70 is shown at the entrance of the projection lens in this specific embodiment, and is best close to the plane of the light transmission hole. Those skilled in the art will understand that the radial polarizer 30 or 70 can be positioned within the projection lens or, for example, anywhere outside the reticle or reticle and the projection lens between the projection lens 83. 91784.doc -26- 200528927 The best efficiency of a radial polarizer can be obtained when the polarizer is an ideal polarizer with a perfectly conducting grating (such as a 'wire grid or slender element'. In this case, the role of the radial polarizer For example, a perfect mirror with totally reflected light in the same polarized light (eg TM polarized light) and used for light with other polarized light (eg TE polarized light) will perfectly penetrate. The desired polarized light (TE polarized light) will be transmitted and the Unpolarized light (TM polarized light) will be reflected. However, 'if the radial polarizer is placed between, for example, the reticle 82 and the projection lens 83', the reflected light with unpolarized light (tm polarized light) can be transmitted back to the "Line 82. The reflected light having no polarization can be hit on the reticle 82 and reflected back toward the radial polarizer. In this process, a part of the light reflected by the graticule can undergo a polarization change. If, for example,
光偏光有至少一部分光變成TE偏光(該想要偏光),具有丁E 偏光(第二光)之這部分光可經由該徑向偏光器傳送,因該徑 向偏光器被架構以讓具有TE偏光之光通過。這部分之丁£極 化光雖其強度弱於最初傳送過該徑向偏光器(主TE偏光)之 具有TE偏光之光,但可穿透該徑向偏光器且可能真正到達 該基底84。本反射現象可重複它本身許多次以使該徑向偏 光器前後路徑產生偏光變化。這個會在該偏光中引起光暈 產生,因第二TE極化光被加至最初橫過該徑向偏光器(主te 極化光)之TE極〖光。該偏光光暈最終可引起模糊成像而導 致成像解析度之損失。 為了極小化在该成像中之偏光光暈之發生可能性,該些 毛月人已决疋在具有一層薄吸收器之徑向偏光器中塗佈該 傳導光柵(例如導線格)有助於減少來自該偏Μ及例如該 91784.doc -27- 200528927 標線8 2之微影裝置中之其它物件之回射。 在一具體實施例中,一層薄吸收器係選擇性地塗佈在圖 2A所示之徑向偏光器20之光柵22上。該些光栅22可為由例 如鋁、鉻、銀、金或其結合所產製之傳導元件。該層薄吸 收态可為例如Ah〇3及陽極氧化鋁之吸收放射波長所使用 之任何材料。該層薄吸收器也可包含一具有低反射之複合 物。一具有低反射之合適複合物可為由一來自德國冗以“公 司之製程所產製之BILATAL。其它合適的低反射複合物包 含A1N及CrOx(x為一整數)。 經由塗佈具有一層薄吸收器之偏光器之光栅22 ,來自該 徑向偏光器及該標線之回射(第二TE偏光)被該薄層吸收而 該主ΊΈ極化光極少被該薄層所吸收。這是因為強度弱於該 主TE極化光之該些回射(第二TE極化光)光係相當容易被該 層薄吸收器所吸收。該層口及收器之厚度及/或材料可被選擇 或调整以得到想要消滅之回射第二丁£極化光。 在上面示範具體實施例中,已知道發生在該徑向偏光器 及該標線間之吸收回射’然、而,應了解上述也施用在該反 射偏光路ι中之任何物件及該#向偏光器之間可能發生之 回射範例中。 藉由使用吸收媒介結合一徑向偏光器以消除不要偏光 之上述過耘係有用於使用_穿透微影工具之成像應用中, ”範例係示於圖1中。然而,在一反射微影工具範例中, 另-条構被使用以消除不要偏光。在反射式微影中,該反 射偏光被使用於成像。因此,該傳送之不要偏光會被吸收 91784.doc -28- 200528927 或消除。 圖9A顯示根據本發明一具體實施例之一具有一吸收器之 偏光器示意圖。偏光器90包含一極化元件92及一吸收器 94。吸收器94係放置在相對於入射光96之極化元件92背側 上。吸收器94可直接放置來接觸一極化元件92背面或與偏 光器元件92稍有隔離。吸收器94包含吸收所使用放射波 長,也就是入射光96之波長之材料。入射光96包含TE元件 偏光及TM元件偏光兩者。 如前述,在反射式微影中,該反射偏光被使用於成像而 該傳送偏光被傳送。本範例中,例如該TE偏光元件97(想要 偏光)被極化元件92所反射而例如該TM偏光元件98(不要偏 光)被極化元件92所傳送。 該傳送TM偏光也許在它的路徑遇到例如該微影裝置中 之其它光學成像元件之物件。因此,一部分TM極化光可被 反射回去朝向該極化元件92。這部分之TM極化光會橫過該 極化元件92,因該極化元件92對TM偏光係為’'穿透性的”。 這部分之TM極化光雖其強度弱於TE偏光(想要偏光)但可 被加入混合該想要TE偏光而致使該成像解析度惡化。At least a part of the light polarized light becomes TE polarized light (the desired polarized light), and the part of the light having the D-E polarized light (the second light) can be transmitted through the radial polarizer because the radial polarizer is structured so as to have TE Polarized light passes through. Although the intensity of this polarized light is weaker than the TE polarized light that originally transmitted through the radial polarizer (main TE polarized light), it can penetrate the radial polarizer and may actually reach the substrate 84. This reflection phenomenon can repeat itself many times to change the polarization of the radial polarizer back and forth. This will cause halo in the polarized light, because the second TE polarized light is added to the TE polar light that originally traverses the radial polarizer (main te polarized light). This polarized light halo can eventually cause blurred imaging and result in a loss of imaging resolution. In order to minimize the possibility of polarized light halos in this imaging, the Mao Yue people have decided to coat the conductive grating (such as a wire grid) in a radial polarizer with a thin absorber to help reduce Retroreflections from the partial M and other objects such as the 91784.doc -27- 200528927 reticle 82. In a specific embodiment, a thin layer of absorber is selectively coated on the grating 22 of the radial polarizer 20 shown in FIG. 2A. The gratings 22 may be conductive elements made of, for example, aluminum, chromium, silver, gold, or a combination thereof. The thin absorption state of the layer may be any material used for absorbing the emission wavelength of, for example, Ah03 and anodized aluminum. The thin absorber may also contain a compound with low reflection. A suitable compound with low reflection may be BILATAL manufactured by a company from Germany. The other suitable low reflection compound includes A1N and CrOx (x is an integer). It has a thin layer by coating. The grating 22 of the polarizer of the absorber, the retroreflection (second TE polarized light) from the radial polarizer and the reticle is absorbed by the thin layer and the main chirped polarized light is rarely absorbed by the thin layer. This is Because the intensity of the retroreflective (second TE polarized light) light that is weaker than the main TE polarized light is relatively easy to be absorbed by the thin absorber of this layer. The thickness and / or material of the layer mouth and receiver can be Select or adjust to obtain the second retroreflected polarized light that you want to eliminate. In the above exemplary embodiment, it is known that the absorption retroreflection occurs between the radial polarizer and the graticule, and It should be understood that the above also applies to any object in the reflective polarizing path and the example of retroreflection that may occur between the #directional polarizer. By using an absorption medium in combination with a radial polarizer to eliminate the above-mentioned problem of not polarizing For imaging using the Penetration Lithography tool In use, "in the example system shown in FIG. However, in an example of a reflective lithography tool, another stripe is used to eliminate unpolarized light. In reflective lithography, this reflected polarized light is used for imaging. Therefore, the transmitted unpolarized light will be absorbed or eliminated 91784.doc -28- 200528927. FIG. 9A shows a polarizer having an absorber according to one embodiment of the present invention. The polarizer 90 includes a polarizing element 92 and an absorber 94. The absorber 94 is placed on the back side of the polarizing element 92 with respect to the incident light 96. The absorber 94 may be placed directly in contact with the back surface of a polarizing element 92 or slightly separated from the polarizing element 92. The absorber 94 contains a material that absorbs the wavelength of radiation used, that is, the wavelength of the incident light 96. The incident light 96 includes both TE element polarized light and TM element polarized light. As described above, in reflective lithography, the reflected polarized light is used for imaging and the transmitted polarized light is transmitted. In this example, for example, the TE polarizing element 97 (desired polarization) is reflected by the polarizing element 92 and the TM polarizing element 98 (not polarized) is transmitted by the polarizing element 92, for example. The transmitted TM polarized light may encounter objects such as other optical imaging elements in the lithographic apparatus in its path. Therefore, a part of the TM polarized light can be reflected back toward the polarizing element 92. This part of TM polarized light will cross the polarizing element 92, because the polarizing element 92 is "transparent" to TM polarized light. Although this part of TM polarized light is weaker than TE polarized light ( Polarized light), but can be added to mix the desired TE polarized light and cause the imaging resolution to deteriorate.
為了消除來自該微影工具中之其它光學元件之可能回 射,該吸收器94被引入該不要TM極化光98之光路徑中。本 方式中,該TM極化光係藉由吸收器94順著吸收器94之厚度 ta所吸收而不會觸及該微影裝置中可能反射該TM偏光之物 件。此外,即使該TM極化光透過吸收器94之厚度ta在該光 之第一通道中未被全部消除,可能在吸收器94底部表面94B 91784.doc -29- 200528927 反射之剩餘TM極化光99可透過吸收器94之厚度以在它的第 一通道中被吸收。因此,該不要T ]y [偏光被該吸收器9 4吸收 二次而導致該ΤΜ偏光元件之二次吸收/消滅。這個可加強消 滅該ΤΜ偏光元件。可選擇或調整該吸收器之厚度ta及/或該 材料以得到想要消滅之回射第二TE極化光。 在另一具體實施例中,該極化元件92可取代該吸收器94 放置在一傳送基底頂部。當該極化元件92被放置在一傳送 基底頂部上時’一 1 / 4波板係放置在該基底背面上以吸收該 不要TM偏光。在任一具體實施例中,該tm偏光元件之消 滅係經由整合一吸收材料或一 1 /4波板之吸收器而得。甚 至,一 1/4波板也可放置於該極化元件92及該吸收器94之 間。本範例中’不要TM偏光遇到該1 /4波板並藉由穿透該1 /4 波板變成環狀極化。大部分本環狀極化光會經由吸收器94 吸收。然而,若有些光被該吸收器94表面反射回來,這個 反射光會送往該1 /4波板並再次環狀極化因而變成TE偏 光。因該極化元件92反射TE偏光,第二次穿透該1/4波板之 光會被該極化元件92反射並送往該吸收器94。本方式中, 這個反射光會再次被該吸收器94所吸收。這個提供加強消 除或消滅該不要偏光元件,也就是TM偏光。 圖9 A所示之極化元件92可具有如圖9B所略示之一光栅 偏光器92 A結構或如圖9C所略示之環狀偏光器92B結構。該 光柵偏光器92A可類似圖2A所示之徑向偏光器2〇。該光柵 偏光器92A具有在方位角上隔開配置於一徑向對稱圖案之 週期光柵93。圖9B中之實箭頭顯示該te偏光元件之架構/ 91784.doc •30- 200528927 方向而虛箭頭顯示該TM偏光件之架構/方向。如前述,一垂 直於該些—光柵(格線或細長元件)方向,也就是垂直於該些環 切線之7L件偏光被傳送而與該些環相切之偏光元件被反 射。因此,該光栅偏光器92A使該TM偏光被反射而該丁£偏 光被傳送。本範例中,成像所使用之元件係為該TM偏光元 件。然而,該吸收元件92架構很少使用於反射式微影中。 相對地,圖9C所示之環狀偏光器92B架構係最常使用於 反射式微影。該環狀偏光器92B具有可放置在吸收器94(圖 9A所示)上或如上述放置在一傳送基底上之環%。該些環% 係集中配置且為週期性分隔。圖9C中之實箭頭顯示該TE偏 光元件之架構/方向而虛箭頭顯示該TM偏光件之架構/方 向。如前述,一垂直於該些光柵方向,也就是垂直於該些 環切線之元件偏光被傳送而與該些環相切之偏光元件被反 射。本例中’該TM偏光被傳送而該te偏光被反射。該tm 偏光貫際上係經由吸收器94(示於圖9A)所吸收。本範例 中’成像所使用之元件係為該TE偏光元件。 參考圖10,一根據本發明之元件製造方法包含提供一至 少部分被一放射感光材料Sll〇所涵蓋之基底、利用一放射 系統S 1 20來提供一放射之投射束、利用一圖案元件以賦予 該投射束之剖面S130—圖案、將該圖案化放射束投射在該 層放射感光材料S140之一靶材部分上、及極化一橫向電偏 光S150之放射束。 圖Π係一根據本發明用以產生相切偏光之偏光器1 〇〇之 另一具體實施例示意圖。傳統偏光系統已知使用例如分束 91784.doc -31 - 200528927 立方之偏光單元。分束立方由小心膠合以極小化波前失真 之一對接炫絲矽之精準直角棱鏡所構成。該些棱鏡其中之 之直角二角形斜邊係塗佈著一多層極化分束塗料(例如 雙折射材料)以最佳化一特定波長。該分束器投出一入射 光量’且在該立方出口處,在該二分支其中之一中,該光 被線性極化。傳統上,為了防止印刷水平及垂直線之差異, 於該成像系統中以一 1/4波板使該偏光成為環狀。 然而’如前述,環狀偏光係由基本偏光元件TE及tm兩者 構成。根據本發明,一偏光板102被引入包括該立方分束器 1 〇3之成像系統之透光孔中。在一具體實施例中,該面板偏 光器102包括一半波板1〇4A及104B。該面板偏光器1〇2極化 該線性極化光成為一第一s極化光31及一第二s極化光§2以 使該第一 s極化光之波向量^與該第二3極化光之波向量§2 係互相垂直的。該面板偏光器係放置於該立方分束器1⑽末 &以使一偏光方向只受限於四分之二該透光孔。這個係適 用於印刷水平線,因該偏光到達成為該晶圓上之3極化光。 在另一四分之二區段,一半波相移係透過雙折射(在45度下) 引入矢狀偏光會旋轉超過9 0度而同時變成相切的。接著, 足個係適用於印刷垂直線。換言之,該第一 s極化光s丨被使 用於印刷一水平方向晶圓上之線而該第二s極化光S2被使 用於印刷一垂直方向晶圓上之線。本方式中,垂直及水平 線兩者可得到S偏光或TE偏光。 更進一步’因终多修正及變化對那些熟知此項技術之人 士疋了輕易產生’故本發明不限制於在此所述之正確架構 91784.doc -32- 200528927 及操作。甚至,例如該微影技術所使用之相關裝置及製裎 之本發明〜製程、方法及裝置傾向複雜天性且通常最好以凴 經驗決定該操作參數之適當值或進行電腦模擬以達到—^ 予應用之最佳設計來實施。有鐘於此,所有合適之修正及 等效例應落在本發明精神及範圍内。 【圖式簡單說明】 本發明之這些及其它目的會從本發明結合附圖所示之較 佳示範具體實施例之下列詳細說明中變得顯而易見並更容 易了解,其中: 圖1係根據本發明示意性說明一微影投射裝置; 圖2A係根據本發明一具體實施例之徑向偏光器示意圖; 圖2B係為圖2A中所述在偏光器區域之光栅放大圖; 圖3係根據本發明另一具體實施例之徑向偏光器側面放 大圖; 圖4係根據圖2 A及3中所示之具體實施例顯示來自一丁E 偏光器之輸出及該較佳偏光方向; 圖5係為一比較例1中之曝光緯度對聚焦深度關係圖; 圖6係為一範例1中之曝光緯度對聚焦深度關係圖; 圖7係根據本發明另一具體實施例之徑向偏光器示意圖; 圖8略示一使用本發明徑向te偏光器之微影系統具體實 施例; 圖9 A顯示根據本發明另一具體實施例之具有一極化元件 及一吸收器之橫向偏光器示意圖; 圖9B顯示圖9 a中之偏光器所使用之一偏光元件具體實 91784.doc -33- 200528927 施例示意圖; 頒示圖9A中之偏光器所使用 實施例示意圖; 圖10係根據本發明代表一元件製造方法之流程圖; 圖1 1係根據本發明之另一偏光器具體實施例示意圖 【圖式代表符號說明】 微影投射裝置 20 、 3〇 、 70 、 72 ' 90 、 92八、92B、1〇〇、1〇2 偏光器 22、36 光柵線 26 區域 32、34 一層材料 36 細長元件 72a-h 面板區段 80 微影系統 83 投射透鏡 92 極化元件 94 吸收器 94B 底部表面 93 光柵 95 環 96 入射光 97 TE偏光元件 98 TM偏光元件 91784.doc -34- 200528927 99 103To eliminate possible reflections from other optical elements in the lithographic tool, the absorber 94 is introduced into the light path of the unwanted TM polarized light 98. In this method, the TM polarized light is absorbed by the absorber 94 along the thickness ta of the absorber 94 without touching objects in the lithography device that may reflect the TM polarized light. In addition, even if the thickness ta of the TM polarized light transmitted through the absorber 94 is not completely eliminated in the first channel of the light, the remaining TM polarized light that may be reflected on the bottom surface of the absorber 94 94B 91784.doc -29- 200528927 99 is permeable to the thickness of absorber 94 to be absorbed in its first channel. Therefore, the unnecessary T] y [polarized light is absorbed twice by the absorber 94, which results in secondary absorption / extinguishment of the TM polarizing element. This enhances the elimination of the TM polarizing element. The thickness ta of the absorber and / or the material can be selected or adjusted to obtain the retroreflected second TE polarized light which is to be eliminated. In another embodiment, the polarizing element 92 may be placed on top of a transmission substrate instead of the absorber 94. When the polarizing element 92 is placed on top of a transmission substrate, a '1/4 wave plate is placed on the back surface of the substrate to absorb the unwanted TM polarized light. In any specific embodiment, the extinction of the tm polarizing element is obtained by integrating an absorber of an absorbing material or a 1/4 wave plate. Even a quarter-wave plate may be placed between the polarizing element 92 and the absorber 94. In this example, 'Do not TM polarized light encounter the 1/4 wave plate and become circularly polarized by penetrating the 1/4 wave plate. Most of the ring-shaped polarized light is absorbed by the absorber 94. However, if some light is reflected back by the surface of the absorber 94, this reflected light will be sent to the 1/4 wave plate and polarized again in a ring shape, thus becoming TE polarized light. Since the polarizing element 92 reflects TE polarized light, the light that penetrates the quarter-wave plate for the second time is reflected by the polarizing element 92 and sent to the absorber 94. In this mode, the reflected light is absorbed by the absorber 94 again. This provides enhanced elimination or elimination of the unwanted polarization element, i.e. TM polarization. The polarizing element 92 shown in FIG. 9A may have a structure of a grating polarizer 92 A as shown in FIG. 9B or a ring polarizer 92B as shown in FIG. 9C. The grating polarizer 92A may be similar to the radial polarizer 20 shown in FIG. 2A. The grating polarizer 92A has periodic gratings 93 arranged in a radial symmetrical pattern at intervals in the azimuth. The solid arrow in FIG. 9B shows the structure of the te polarizer / 91784.doc • 30-200528927 and the dashed arrow shows the structure / direction of the TM polarizer. As mentioned above, a 7L piece of polarized light perpendicular to the direction of the gratings (grid lines or elongated elements), that is, perpendicular to the tangent lines, is transmitted and the polarized elements tangent to the rings are reflected. Therefore, the grating polarizer 92A reflects the TM polarized light and the polarized light is transmitted. In this example, the element used for imaging is the TM polarized element. However, the absorbing element 92 architecture is rarely used in reflective lithography. In contrast, the ring polarizer 92B structure shown in FIG. 9C is most commonly used for reflective lithography. The ring polarizer 92B has a ring percentage that can be placed on the absorber 94 (shown in FIG. 9A) or on a transfer substrate as described above. These ring% s are configured centrally and are separated periodically. The solid arrow in FIG. 9C shows the structure / direction of the TE polarizer and the dashed arrow shows the structure / direction of the TM polarizer. As mentioned above, a polarized light of the elements perpendicular to the grating directions, that is, perpendicular to the ring tangents, is transmitted and the polarized elements tangent to the rings are reflected. In this example, the TM polarized light is transmitted and the te polarized light is reflected. This tm polarized light is absorbed through the absorber 94 (shown in FIG. 9A). In this example, the element used for imaging is the TE polarizing element. Referring to FIG. 10, a method for manufacturing a component according to the present invention includes providing a substrate at least partially covered by a radiation-sensitive material S110, using a radiation system S 1 20 to provide a radiated projection beam, and using a patterned component to impart The cross-section S130 of the projection beam is a pattern, the patterned radiation beam is projected on a target portion of the layer of radiation-sensitive material S140, and a radiation beam polarized by a laterally polarized light S150. FIG. 11 is a schematic diagram of another specific embodiment of a polarizer 1000 for generating tangential polarized light according to the present invention. Conventional polarizing systems are known using, for example, beam splitting 91784.doc -31-200528927 cubic polarizing units. Beamsplitter cubes consist of precision right-angled prisms that are carefully glued to minimize the wavefront distortion butted with dazzling silicon. One of the prisms has a right-angled diagonal hypotenuse coated with a multilayer polarizing beam splitting coating (such as a birefringent material) to optimize a specific wavelength. The beam splitter emits an amount of incident light 'and at the cubic exit, in one of the two branches, the light is linearly polarized. Traditionally, in order to prevent the difference between printing horizontal and vertical lines, the polarized light is made into a ring with a 1/4 wave plate in the imaging system. However, as described above, the ring-shaped polarizing system is composed of both the basic polarizing elements TE and tm. According to the present invention, a polarizing plate 102 is introduced into a light transmitting hole of an imaging system including the cubic beam splitter 103. In a specific embodiment, the panel polarizer 102 includes half wave plates 104A and 104B. The panel polarizer 102 polarizes the linearly polarized light into a first s-polarized light 31 and a second s-polarized light §2 so that the wave vector of the first s-polarized light and the second s-polarized light 3 The wave vector of polarized light §2 is perpendicular to each other. The panel polarizer is placed at the end of the cube beam splitter 1 so that a polarization direction is limited to only two-quarters of the light transmitting hole. This system is suitable for printing horizontal lines, because the polarized light reaches the three-polarized light on the wafer. In the other two quarters, the half-wave phase shift is introduced through birefringence (at 45 degrees) and the sagittal polarized light is rotated by more than 90 degrees while becoming tangential. Then, the line is suitable for printing vertical lines. In other words, the first s-polarized light s 丨 is used to print a line on a horizontal-direction wafer and the second s-polarized light S2 is used to print a line on a vertical-direction wafer. In this method, both S and TE polarizations can be obtained for both vertical and horizontal lines. Furthermore, 'there are many modifications and changes that are easy to produce for those who are familiar with this technology', so the present invention is not limited to the correct structure 91784.doc -32- 200528927 and operation described herein. Even, for example, the relevant device used in the lithography technology and the invention of the present invention ~ The processes, methods, and devices tend to be complex in nature and it is usually best to use experience to determine the appropriate value of the operating parameter or computer simulation to achieve-^ Apply the best design to implement. Where appropriate, all appropriate modifications and equivalents shall fall within the spirit and scope of the invention. [Brief description of the drawings] These and other objects of the present invention will become apparent and easier to understand from the following detailed description of the preferred exemplary embodiments of the present invention in conjunction with the accompanying drawings, in which: FIG. 1 is in accordance with the present invention A lithographic projection device is schematically illustrated; FIG. 2A is a schematic diagram of a radial polarizer according to a specific embodiment of the present invention; FIG. 2B is an enlarged view of a grating in a polarizer region described in FIG. 2A; An enlarged side view of a radial polarizer in another specific embodiment; FIG. 4 shows the output from a D-E polarizer and the preferred polarization direction according to the specific embodiment shown in FIGS. 2A and 3; A relational diagram of exposure latitude to focus depth in Comparative Example 1; FIG. 6 is a relational diagram of exposure latitude to focus depth in Example 1; FIG. 7 is a schematic diagram of a radial polarizer according to another embodiment of the present invention; 8 shows a specific embodiment of a lithography system using a radial te polarizer of the present invention; FIG. 9A shows a schematic diagram of a lateral polarizer having a polarizing element and an absorber according to another specific embodiment of the present invention; FIG. 9B shows a specific example of a polarizing element used in the polarizer in FIG. 9a 91784.doc -33- 200528927; a schematic diagram showing an embodiment of the polarizer used in FIG. 9A; FIG. 10 is a representative of the present invention A flowchart of a method for manufacturing a component; FIG. 11 is a schematic diagram of a specific embodiment of another polarizer according to the present invention. [Illustration of Representative Symbols of the Schematic] Lithographic projection device 20, 30, 70, 72 '90, 92, 92B , 100, 10 Polarizers 22, 36 Grating lines 26 Areas 32, 34 One-layer material 36 Slim elements 72a-h Panel section 80 Lithography system 83 Projection lens 92 Polarizing element 94 Absorber 94B Bottom surface 93 Grating 95 ring 96 incident light 97 TE polarizer 98 TM polarizer 91784.doc -34- 200528927 99 103
104A、104B104A, 104B
AMAM
CC
COCO
ExEx
IFIF
ILIL
ININ
LA、81 Μ、P MA、82 MT PB PL PM、PW SI > S2 S110 、 S140 S120 S130 S150LA, 81 Μ, P MA, 82 MT PB PL PM, PW SI > S2 S110, S140 S120 S130 S150
W 、 24 、 84 WT TM極化光 分束器 半波板 調整元件 乾材部分 聚光器 放射束擴大器 干涉計 照明器 積算器 來源 對準光罩 光罩 光罩桌 放射束 投射系統 定位元件 s極化光 感光層 放射系統 剖面 橫向電偏光 基底 基底桌 91784.doc -35-W, 24, 84 WT TM Polarized Beamsplitter Half-Wave Plate Adjustment Element Dry Material Part Concentrator Radiation Beam Expander Interferometer Illuminator Totalizer Source Alignment Mask Mask Mask Table Radiation Beam Projection System Positioning Element s-polarized light-sensing layer radiation system profile lateral electric polarization substrate base table 91784.doc -35-
Claims (1)
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| US10/374,509 US6943941B2 (en) | 2003-02-27 | 2003-02-27 | Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems |
| US10/786,473 US7206059B2 (en) | 2003-02-27 | 2004-02-26 | Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems |
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| TW200528927A true TW200528927A (en) | 2005-09-01 |
| TWI319124B TWI319124B (en) | 2010-01-01 |
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| KR (1) | KR100597039B1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3653741A (en) * | 1970-02-16 | 1972-04-04 | Alvin M Marks | Electro-optical dipolar material |
| JP2698521B2 (en) * | 1992-12-14 | 1998-01-19 | キヤノン株式会社 | Catadioptric optical system and projection exposure apparatus having the optical system |
| US5559583A (en) * | 1994-02-24 | 1996-09-24 | Nec Corporation | Exposure system and illuminating apparatus used therein and method for exposing a resist film on a wafer |
| DE19535392A1 (en) * | 1995-09-23 | 1997-03-27 | Zeiss Carl Fa | Radial polarization-rotating optical arrangement and microlithography projection exposure system with it |
| DE19621512A1 (en) * | 1996-05-29 | 1997-12-04 | Univ Schiller Jena | Polarisation establishment with respect to wavelength of source spectra |
| US6381068B1 (en) * | 1999-03-19 | 2002-04-30 | 3M Innovative Properties Company | Reflective projection screen and projection system |
| US6288840B1 (en) * | 1999-06-22 | 2001-09-11 | Moxtek | Imbedded wire grid polarizer for the visible spectrum |
| US20020167727A1 (en) * | 2001-03-27 | 2002-11-14 | Hansen Douglas P. | Patterned wire grid polarizer and method of use |
| DE10124803A1 (en) * | 2001-05-22 | 2002-11-28 | Zeiss Carl | Polarizer and microlithography projection system with polarizer |
| US6950235B2 (en) * | 2002-05-02 | 2005-09-27 | Corning Incorporated | Optical isolators and methods of manufacture |
-
2004
- 2004-03-09 TW TW093106253A patent/TWI319124B/en not_active IP Right Cessation
- 2004-03-09 KR KR1020040015702A patent/KR100597039B1/en not_active Expired - Fee Related
- 2004-04-06 CN CNB2004100335266A patent/CN100570415C/en not_active Expired - Fee Related
- 2004-06-01 SG SG200403098-7A patent/SG135034A1/en unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103033870A (en) * | 2007-06-22 | 2013-04-10 | 莫克斯泰克公司 | Durable, inorganic, absorptive, ultra-violet, grid polarizer |
| US9348076B2 (en) | 2013-10-24 | 2016-05-24 | Moxtek, Inc. | Polarizer with variable inter-wire distance |
| US9354374B2 (en) | 2013-10-24 | 2016-05-31 | Moxtek, Inc. | Polarizer with wire pair over rib |
| US9632223B2 (en) | 2013-10-24 | 2017-04-25 | Moxtek, Inc. | Wire grid polarizer with side region |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1661478A (en) | 2005-08-31 |
| KR100597039B1 (en) | 2006-07-04 |
| CN100570415C (en) | 2009-12-16 |
| KR20050087690A (en) | 2005-08-31 |
| TWI319124B (en) | 2010-01-01 |
| SG135034A1 (en) | 2007-09-28 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |