200527997 九、發明說明： 【發明所屬之技術領域】 本發明關於—種具有與被接觸體進行電性接觸的電性接 觸部的電性接觸結構體，具體而言，為關於作爲ic插座或 連接器等的零件而使用的電性接觸結構體，特別是關於與 先前相比，可實現小型化及零件數的減少，並且，在與印 刷線路板等被連接部之間可以以簡單的結構容易且可靠地 導通連接的電性接觸結構體及其製造方法。 【先前技術】 作爲内置有電性接觸結構體的裝置的一例，可列舉出以 下的半導體檢查裝置。在專利文獻丨中所記載的半導體檢 查裝置是暫時將半導體電連接在外部的電路基板等上的裝 置。在半導體的背面側設有多個球狀觸頭，且這些多個球 狀觸頭配置成格子狀或矩陣狀，在與其相對的絕緣基板上 設有多個凹部，螺旋觸頭相對配置在該凹部内。 在將上述半導體的背面側向上述絕緣基板按壓時，上述 螺旋觸頭捲繞成螺旋狀地與上述球狀觸頭的外表面相接 觸’所以能夠可靠地進行各個球狀觸頭與各個螺旋觸頭之 間的電連接。 專利文獻1 :特開2002-175859號公報 發明所欲解決之問題 具有上述絕緣基板及螺旋觸頭而構成的電性接觸結構體 例如有圖17所示的形狀。 上述電性接觸結構體1係將多個螺旋觸頭2安裝在絕緣基 97422.doc 200527997 板（以下，稱爲基台）3上的結構。在上述基台3上設有從其 表面向背面貫通的多個凹部（通孔）3a，在上述凹部3a的上 表面設有上述螺旋觸頭2。 圖1 8係攸基口 3的为面側觀察圖1 7所示的螺旋觸頭2中的 一個螺旋觸頭2的局部放大後視圖。 如圖18所示，在上述凹部3a的周圍露出有與上述螺旋觸 頭2導通連接的導通部丨〇。上述導通部丨〇的背面與上述基 台3的背面呈同一平面。 上述電性接觸結構體丨例如經圖19所示的各工序而形 成。 在圖19A的工序中，在Cu基板4上形成藉由曝光顯影而 形成有螺旋觸頭2的圖案5a的抗蝕劑層5，在上述抗蝕劑層 5的圖案5 a内形成螺旋觸頭2。 在圖19B所示的工序中，除去上述抗蝕劑層5後，定位由 樹脂等構成的引導框架6，且使設在上述引導框架6上的孔 部6a正好與各螺旋觸頭2相面對，然後，將上述引導框架6 粘貼在各螺旋觸頭2的基部2a之間（亦參照圖17)。 接著，在圖19C的工序中，例如以蝕刻等方法除去上述 Cu基板4。各螺旋觸頭2藉由上述引導框架6連起來。 接著，在圖19D的工序中，利用導電粘合劑8等將上述螺 旋觸頭2粘接固定在基台3上，其中，該基台3的正好與螺 旋觸頭2面對的位置形成有貫通孔3a。 藉由濺射法等在上述基台3的貫通孔3&的内面7b上形成 導電部10。 97422.doc 200527997 …、、後’在圖19E的工序中，利用上述突出調整零件9立體 成形螺旋觸頭2。 在圖19F的工序中，經由導電粘合劑14在上述基台3的背 面側設置連接端子丨1。 並且，在上述基台3的下方設置具有多個佈線圖案及其 他的電路零件的印刷線路板12，將上述基台3固定在上述 印刷線路板12上。 在上述印刷線路板12的表面設有與設於上述基台3的底 的連接端子11相對的相對電極13，經由導電性粘合劑 等來使上述各連接端子丨丨與各相對電極丨3導通連接。 但是，在經圖19A〜圖19F的工序得到的電性接觸結構體 1中，存在有下述的問題。 首先，第一、上述電結構體丨主要具有螺旋觸頭2、基台 3、引導框架6、導通部1〇、及連接端子u，但如此形成上 述電性接觸結構體1，零件數多，而會導致生産成本增 尤”基台3係在貝通孔3 a的内面藉由濺射法形成有 導通部10的複雜的結構體，上述基台3的成本高，成爲使 電性接觸結構體丨的生産成本增大的原因之一。 第一、將上述螺旋觸頭2、連接端子丨丨與上述導通部1〇 ,間經由導電性枯合劑8、14枯接固定，另外，上述連接 知子11與印刷線路板12的相對電極13之間亦經由導電性枯 合劑粘接固定。 但是，在使用導電性粘合劑的粘接固定方法中，這時需 要對零件之間進行熱麈接，若該熱壓接在上述之間整體上 97422.doc 200527997 不均句日守’結果會導致兩零件之間的導通性變差、可靠性 降低，因此，出於高精度地進行熱壓接的必要性考慮，不 知不進行極為細膩的製造。 第 在先刚的電性接觸結構體1中，是不適應於小型 的構成例如，在螺旋觸頭1自身進一步小型化時，與 其相$配亦必須減小設在上述基台3上的貫通孔“，但在 ^述貝通孔3a過小時，無法在上述貫通孔3a内以適當的膜 厚元成導通部1 〇 ’從而成爲電特性差的電性接觸結構體 1因此，上述貫通孔3&不能太小，結果，即使可將螺旋 觸頭1本身形成得小，亦不能將上述基台3形成得小，另 外，在基台3的膜厚過於薄時，基台3自身的強度降低，從 而無法使用導電性粘合劑、藉由熱壓接、在上述基台3上 導通性良好地連接螺旋觸頭2及連接端子11。因而，無法 更加促進電性接觸結構體1的小型化。 【發明内容】 本發明係爲了解決上述先前存在的問題而提出的，其目 的在於提供一種尤其與先前相比可實現小型化及零件數的 減 ’並且，在與印刷線路板等被連接部之間可以以簡單 的結構容易且可靠地導通連接的電性接觸結構體及其製造 方法。 本發明，係一種電性接觸結構體，其構成為具有與被接 觸體電性接觸的電性接觸部，及保持上述電性接觸部的保 持體，其特徵在於： 上述電性接觸部由上述保持體的表面側保持，在上述保 97422.doc 200527997 持體上設有一直到背面的凹部，在上述凹部内設有導通 部； 上述導通部直接與上述電性接觸部導通連接，並且，在 上述保持體的背面側與被連接部導通連接。 本毛明的電性接觸結構體，由電性接觸部、保持體和導 電部構成，與先前相比，可減少零件數，能夠得到簡單的 結構的電性接觸結構體。 尤八無而先則所必需的基台，而以保持體取而代之。 另外，上述導通部與上述電性接觸部直接導通連接，能 夠提供不需先前般的導電㈣合劑且導祕優越的結構。 、卜在本毛明中，較佳為：上述保持體由有機絕緣材 料形成，藉此，上述保持體的成形、加工容易，在形成上 述保持體的過程中亦能夠使上述保持體形成得薄，可以實 現電性接觸結構體的薄型化。 此外’在本發財，較佳為：上述有機絕緣材料使用阻 知d (solder resist)。在本發明中，該阻焊劑到最後作爲保200527997 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to an electrical contact structure having an electrical contact portion for making electrical contact with a contacted body, and more specifically, it is used as an ic socket or connection. Electrical contact structures used for components such as electronic devices, and more particularly with respect to reductions in size and number of parts compared to conventional ones, and can be easily connected to connected parts such as printed wiring boards with a simple structure The electrical contact structure and the manufacturing method thereof are reliably connected. [Prior Art] As an example of a device in which an electrical contact structure is built, the following semiconductor inspection device can be cited. The semiconductor inspection device described in Patent Document 丨 is a device that temporarily electrically connects a semiconductor to an external circuit board or the like. A plurality of spherical contacts are provided on the back side of the semiconductor, and the plurality of spherical contacts are arranged in a grid or matrix shape. A plurality of recesses are provided on the insulating substrate opposite to the semiconductor contacts. Inside the recess. When the back side of the semiconductor is pressed against the insulating substrate, the spiral contacts are wound spirally to contact the outer surface of the spherical contacts. Therefore, each spherical contact and each spiral contact can be reliably performed. Electrical connection between. Patent Document 1: Japanese Patent Application Laid-Open No. 2002-175859 Problem to be Solved by the Invention An electrical contact structure having the above-mentioned insulating substrate and spiral contacts has, for example, a shape as shown in FIG. 17. The above-mentioned electrical contact structure 1 is a structure in which a plurality of spiral contacts 2 are mounted on an insulating base 97422.doc 200527997 board (hereinafter referred to as a base) 3. The base 3 is provided with a plurality of recessed portions (through holes) 3a penetrating from the front surface to the back surface, and the spiral contact 2 is provided on the upper surface of the recessed portion 3a. FIG. 18 is a partially enlarged rear view of the spiral contact 2 in the spiral contact 2 shown in FIG. 17 as viewed from the surface side. As shown in FIG. 18, a conductive portion 丨 0 which is conductively connected to the spiral contact 2 is exposed around the concave portion 3a. The back surface of the conductive portion 11 is the same plane as the back surface of the base 3. The electrical contact structure described above is formed, for example, through each step shown in FIG. 19. In the step of FIG. 19A, a resist layer 5 is formed on the Cu substrate 4 with a pattern 5 a of the spiral contacts 2 formed by exposure and development, and a spiral contact is formed in the pattern 5 a of the resist layer 5. 2. In the step shown in FIG. 19B, after the resist layer 5 is removed, the guide frame 6 made of resin or the like is positioned so that the hole portion 6 a provided in the guide frame 6 faces the spiral contacts 2 exactly. Right, the above-mentioned guide frame 6 is stuck between the base portions 2a of the spiral contacts 2 (see also FIG. 17). Next, in the step of FIG. 19C, the Cu substrate 4 is removed by, for example, etching or the like. The spiral contacts 2 are connected by the above-mentioned guide frame 6. Next, in the step of FIG. 19D, the above-mentioned spiral contact 2 is adhered and fixed to the base 3 by using a conductive adhesive 8 or the like, wherein the position of the base 3 facing the spiral contact 2 is formed. Through-hole 3a. The conductive portion 10 is formed on the inner surface 7b of the through hole 3 & of the base 3 by a sputtering method or the like. 97422.doc 200527997…, and back 'In the step of FIG. 19E, the spiral contact 2 is three-dimensionally formed by using the above-mentioned protruding adjustment member 9. In the step of FIG. 19F, a connection terminal 1 is provided on the back surface side of the base 3 via the conductive adhesive 14. A printed wiring board 12 having a plurality of wiring patterns and other circuit components is provided below the base 3, and the base 3 is fixed to the printed wiring board 12. A counter electrode 13 is provided on the surface of the printed wiring board 12 opposite to the connection terminal 11 provided on the bottom of the base 3, and each of the connection terminals 丨 丨 and each of the opposite electrodes 丨 3 are made through a conductive adhesive or the like. Connected. However, the electrical contact structure 1 obtained through the steps of Figs. 19A to 19F has the following problems. First of all, first, the above-mentioned electrical structure 丨 mainly has a spiral contact 2, a base 3, a guide frame 6, a conducting portion 10, and a connection terminal u, but the electrical contact structure 1 is formed in this way, and the number of parts is large. It will lead to increased production costs. "The abutment 3 is a complex structure with the conductive portion 10 formed by sputtering on the inner surface of the through-hole 3 a. The above-mentioned abutment 3 has a high cost and becomes an electrical contact structure. One of the reasons for the increase in the production cost of the body. First, the spiral contact 2 and the connecting terminal 丨 and the conducting portion 10 are connected to each other via a conductive compound 8 and 14, and the connection The Zhizi 11 and the counter electrode 13 of the printed wiring board 12 are also fixed by using a conductive bulking agent. However, in the bonding and fixing method using a conductive adhesive, it is necessary to heat-bond the parts at this time. If the thermocompression bonding between the above is 97422.doc 200527997, the results will lead to poor continuity and lower reliability between the two parts. Therefore, the thermocompression bonding is performed with high precision. Necessity consideration, do not know It is delicate to manufacture. The first rigid electrical contact structure 1 is not suitable for a small structure. For example, when the spiral contact 1 itself is further miniaturized, it is necessary to reduce the size of the screw contact 1. The through hole on the stage 3 ", but if the through hole 3a is too small, the conductive portion 10 'cannot be formed in the through hole 3a with an appropriate film thickness, thereby becoming an electrical contact structure 1 with poor electrical characteristics. Therefore, the through hole 3 cannot be too small. As a result, even if the spiral contact 1 itself can be formed small, the abutment 3 cannot be formed small. In addition, when the film thickness of the abutment 3 is too thin, the base The strength of the stage 3 itself is reduced, so that the conductive contact cannot be used to connect the screw contact 2 and the connection terminal 11 to the base 3 with good conductivity by thermal compression bonding. Therefore, the miniaturization of the electrical contact structure 1 cannot be further promoted. SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and an object thereof is to provide a miniaturization and a reduction in the number of parts, particularly compared with the prior art. The electrical contact structure can be connected easily and reliably with a simple structure and its manufacturing method. The present invention relates to an electrical contact structure, which is configured to have an electrical contact portion that is in electrical contact with a contacted object, and a holding body that holds the electrical contact portion, wherein the electrical contact portion is formed by the above The holder is held on the front side of the holder. A concave portion extending to the back is provided on the holder 97422.doc 200527997. A conductive portion is provided in the concave portion. The conductive portion is directly connected to the electrical contact portion. The back side of the holding body is electrically connected to the connected portion. The electrical contact structure of the present Maoming is composed of an electrical contact portion, a holder, and a conductive portion. Compared with the prior art, the number of parts can be reduced, and an electrical contact structure with a simple structure can be obtained. You Bawu first took the necessary abutment and replaced it with a retaining body. In addition, the conductive portion and the electrical contact portion are directly connected to each other, which can provide a structure that does not require a conventional conductive coupler and has excellent guidance. In the present invention, it is preferable that the holding body is formed of an organic insulating material, whereby the forming and processing of the holding body are easy, and the holding body can be made thin in the process of forming the holding body. The thickness of the electrical contact structure is reduced. In addition, in the present invention, it is preferable that the organic insulating material uses a solder resist (d). In the present invention, the solder resist is finally used as a protection
持體殘留。在本發日月φ，^ 卜 隹丰毛月中，迠夠利用簡單的製造方法在由阻 焊劑形成的保持體上# # μ、+、 Α 上$成上述凹部及導通部等，可以實現 生産成本的降低。 並且，在本發明中，較佳兔 、 ？乂佳為在上述保持體上設有從表 通到背面的貫通孔，上述 … 迩電拴接觸。卩的端部由上述保持 上的上述貝通孔的周邊部保 f 並且，上述電性接觸部 除了上述端部之外的部分 丨刀延伸叹置到與上述貫通孔 方向相對的位置； 貝、扎义勝, 97422.doc 10 200527997 上述凹部係在比上述貫通孔偏向外側的位置，從上述保 持體的背面通到上述端部而形成。 藉此，能夠從貫通孔對上述電性接觸部進行立體成形等 的預定的加工。另夕卜藉由形成上述貫通孔而能夠利用與 被接觸體的接觸而將上述電性接觸部彎曲進入上述貫通孔 内，結果，上述電性接觸部可在上述貫通孔内包入被接觸 體地變形，能夠使上述電性接觸部與被接觸體之間的電性 接觸性良好。另外，上述凹料設在從上述貫通孔錯開的 位置，其結果，形成在上述凹部内的導通部，不會在上述 貫通孔的形成過程中受到影響，能夠得到保持上述電性接 觸部與被接觸體的良好的導通性、且電特性優越的電性接 觸結構體。 另外，在本發明中，較佳為：上述電性接觸部由以螺旋 狀形成的螺旋接觸部，及與上述螺旋接觸部相連並圍嘵上 述螺旋接觸部㈣的基料構成，上述基部㈣持在上述 保持體上，並且，上述螺旋接觸料在與上述貫通孔於膜 厚方向相對的位置。 如上所述，上述電性接觸部係作爲—個具體例而具有螺 •接觸部的結構。呈有螺絲^g μ t /、有螺鉍接觸部的電性接觸部可與被接 觸體適當地電性接觸。 並且’在上述構造的情況下，較佳為：上述凹部在比上 述貫通孔偏向外側的位置’圍繞上述貫通孔周圍地從上述 保持體的背面通到上述基部而形成，形成在上述凹部内的 導通部在上述保持體的背面 月曲以圍繞上述貫通孔的周邊部 97422.doc -11 - 200527997 的形狀而露出。 在本發明中，較佳為：上述導通部被電鍍形成。 另外’在本發財，較佳為：上料通部具有從上述伴 持體的背面向上述被連接部側突出的突出部，上邮 形成為其寬度尺寸比形成在上述凹部内的導通部的寬以 寸為寬。藉此，可增大上述被連接部與上述導通部之二 導通連接®積，能夠使兩者之間良好地導通連接。 此外，在本發明中，亦可為：上述突出部的表面爲凸型 的曾曲面狀，較佳為：上述導通部藉由輝錫而與上述被連 接部連接固定。在本發明巾，上料通料的從上述保持 體的背面突出的突出部做成凸起部’可以藉由銲錫與上述 被連接部之間連接固^，與如先前般利用導電性枯合劑等 熱壓接的情況相比，可使兩間的導通性良好。 另外，在本發明巾’可適詩上述被連接部被形成在印 刷線路板上的形式。 另外，本發明係一種電性接觸結構體之製造方法，其係 製造具有與被接觸體電性接觸的電性接觸部及保持上述電 性接觸部的保持體的電性接觸結構體，其特徵在於具有·· (a) 在基板上電鍍形成電性接觸部的工序； (b) 藉由成爲保持體的有機絕緣材料層來 接觸部之上及上述基板之上的工序； 过電杜 (c) 在上述有機絕緣材料層上形成從上述有機材料層的表 面側通到上述電性接觸部的預定部位上的凹部的工序； (d) 在上述凹部内電鍍形成導通部，使上述導通部直接 97422.doc 12 200527997 導通連接在上述電性接觸部上的工序· (e)去除上述基板的工序。 在本發明中，藉由上述的工序，可 部、保持體及導通部的電性接觸結;性接觸 少製造工序數，並且，益需先前右①°與先前相比可減 "、、而先别在電性接觸結構體的 中所必需的基台，而代之以設置由 佯捭r … 機絕緣材料層構成的 保持體。如上述⑷工序及（d)工序所示，能夠 述保持體上形成凹部、導通部，盥 在上 本的降低。 〜先-相比可實現生産成 另外，在上述的工序中的上述（b)工序中，由於在基板 = 在的階段將由有機絕緣材料層形成的保持體形成在上 述基板及電性接觸部上，所以 不而如先則般利用熱壓接等 方法來安裝基台單體與從基板上 >肪 土敉上取下的電性接觸部，容易 按…、所欲使上述保持體薄型化 小型化。 了|現電性接觸結構體的 並且，在上述⑷工序中，能夠直接使㈣ 述電性接觸部上，所以無需如先前般將兩者間一邊利用導 通枯合劑來熱麼接一邊連接固定的繁項的工序，另外，上 述電性接觸料上料通部之㈣導通性亦與先 良好。 另外’在本發明甲，較佳為：在上述⑷工序與上述⑷ 工序之間具有以下（f)工序。 ⑴在偏離上述導通部的位置且至少與上述電性接觸部的 -部分於膜厚方向相對的位置’從上述有機絕緣材料層的 97422.doc 200527997 表面到月㈣成貫通孔，使上述電性接觸部的 述貫通孔内露出的工序。 〇刀在上 並且，較佳為：在上述⑺工序與上述⑷工序之間呈有 以下（g)工序。 間具有 ⑻立體成形露出於上述貫通孔内的電性接觸部的工 ° 另外，在本發財，較佳為··在上述⑷工料，由以螺 ==的螺旋接觸部、及與上述螺旋接觸部一體成形的 :、「上述螺旋接觸部的周圍的基部，形成上述電性接觸 在上述⑷工序中，在上述有機絕緣材料層上形成從上述 :機材料層的表面側通到上述電性接觸部的基部上的凹 部； 在上述⑴工序中，藉由形成上述貫通孔，而使構成上述 電性接觸部的螺旋接觸部的部分在上述貫通孔内露出。 此外，在本發明中，較佳為：在上述（b)工序中所用的 有機絕緣材料層使用阻焊劑。 廷時’較佳為：上述阻焊劑使用正性抗蝕劑，藉由在上 述（C)工序中利用掩模層進行曝光顯影而去除被曝光部分的 阻焊劑來形成凹部。並且，較佳為：藉由在上述⑴工序中 和用掩模層進行曝光顯影，而去除被曝光部分的阻焊劑來 形成貫通孔。 如上所述，藉由使用正性阻焊劑，能夠容易且適當地在 上述保持體上形成凹部及貫通孔。在本發明中，可將由上 97422.doc -14- 200527997 述阻焊劑形成的有機絕緣材料層殘留到最後而作爲保持體 發揮作用。 先前，需要另外準備安裝上述電性接觸部的基台，但在 本毛月中，在一連串的製造過程中，亦能形成成爲基台的 保持體，這是本發明的特徵之一。在先前般另外設置基台 的Μ況下’存在生產成本增大、製造工序變長等不良現 象，而在本發明中，能夠以一連串的過程連續製造電性接 蜀Η保持體’此夠以簡單的方法製造電性接觸結構體 勺並且亦此使上述電性接觸結構體的結構變得簡單。 另外，在本發明中，較佳為··在上述（d)工序甲，以從 上述有機絕緣材料層白令表面隆起的方式凸起形成上述導通 P藉此，可增大設在印刷線路板上的被連接部與上述導 通部之間的連接面積，另外，上述導通部向被連接部側突 出，因此，在使上述導通部與被連接部相對時，在上述保 持體的背面與上述被連接部之間易形成空間，能夠將該空 間設成用於焊接的空間部’能夠容易藉由焊接來連接固定 上述導通部與上述被連接部之間。 本發明的電性接觸結構體，由電性接觸部、保持體和導 電部構成，與先前相比可減少上述零件數，能夠得到簡單 的結構的電性接觸結構體。尤其，無需先前所必需的基 台，而代之以設置保持體。 另外，上述導通部與上述電性接觸部直接導通連接，能 夠提供無需先前般的導電性粘合劑、並且導電性優越2 構。 、、力 97422.doc 15 200527997 此外，根據本發明的製造方法，與1前相比可減少製造 工序數，並且，無需先前在電性接觸結構體的製造中所必 而的基σ，而代之以設置由有機絕緣材料層構成的保持 體。在本發明令，能夠簡單地在上述保持體上形成凹部、 導通部’與先前相比可實現生產成本的降低。 卜在上述的工序中，由於在基板還存在的階段將由 有機、邑緣材料層形成的保持體形成在上述基板及電性接觸 部上，所以不需如先前般利用熱壓接等方法來安裝基台單 體與從基板上取下的電性接觸部，容易按照所欲使上述保 持體薄型化，可實現電性接觸結構體的小型化。 並且，能夠直接使導通部連接在上述電性接觸部上，所 以無需如先前般將兩者間一邊利用導通吻來熱星接一 邊連接固定的繁靖的工序’另外，上述電性接觸部與上述 導通部之間的導通性亦與先前相比更為良好。 【實施方式】 圖1係表示在用於確認雷早焚Α ΑΑ “ a , 电于零件的動作的試驗中所使用 的檢查裝置的立體圖。 如圖1所示’檢查裝置20具有凹部形狀的座21、經由設 在該座m邊緣部的鉸鏈部23轉動自如地被支樓的蓋體 22。上述座21及蓋體22由絕緣性的樹脂材料等形成，在上 述座21的中心部形成有向圖示古 口不Z2方向凹進去的填裝區域 21Α。…在上述填裝區域21Α内設有下面說明的電性 接觸結構體24’可在上述電性接觸結構體24±安 等電子零件25。另外，在座21 、守且 ]另方的邊緣部形成有被 97422.doc -16- 200527997 鎖定部24。 如圖1所示，在上述檢查裝置20的蓋體22的内面的中央 位置，與上述填裝區域21入相相對地設有向圖示下方按壓 電子零件25的凸形狀的按麼部22a。另外，在與上述錢鍵 部23相反的一側的位置形成有鎖定部％。 在上述蓋體22的内面與按壓部22a之間設有向遠離蓋體 22的内面的方向推動上述按壓部22a的盤簧等構成的推動 零件（未圖示）。從而，在將電子零件25裝入上述安裝區域 2 1 A内、關閉盍體22進行鎖定後，可以向接近填裝區域 21A的表面的方向（Z2方向）彈性地推電子零件25。 圖2係電性接觸結構體24的俯視圖，圖3係放大圖2所示 的A的區域的局部放大俯視圖，圖4係從上述電性接觸結構 體24的为面側觀察a區域的局部放大後視圖，圖5係從膜厚 方各切斷圖2所示的A區域時的上述電性接觸結構體24的局 部放大剖視圖、和從上述電性接觸結構體24的上側抵接的 電子零件25及連接固定在上述電性接觸結構體24的下側的 印刷線路板3 0的局部放大剖視圖。 圖2所示的電性接觸結構體24結構上具有保持體25和多 個螺旋觸頭（電性接觸部）26。上述螺旋觸頭26在圖2中，以 圍繞上述保持體25表面的周邊的2列的框狀形式規則地排 列’但上述螺旋觸頭26的排列的形式可以根據設在上述電 子零件25的背面側的觸頭35(被接觸體）的形成位置而改 變。 如圖3及圖5所示，在上述保持體25上設有從表面25]3貫 97422.doc 200527997 通到背面25c的貫通孔25a。在圖3中，μ、+、* 你a ，上述貫通孔25a的向 膜面方向（與圖示χ-γ平面平行的方 卞仃的方向）的剖面爲大致圓形 狀。上述貫通孔25a的形狀亦可以爲其他的形狀，但由於 設在上述貫通孔25a之上的觸頭26爲螺旋狀，所以在栌上 述螺旋觸頭26適當地與上述貫通孔25a之上相相對、^上 述螺旋觸頭26與電子零件25的觸頭35電性接觸時，爲了順 利地進入上述貫通孔253内，與上述貫通孔25a的膜面方向Remaining body. In the present day and month φ, 隹, and 隹, it is enough to use simple manufacturing methods to ## μ, +, Α form the above-mentioned recesses and conduction portions on the holder formed of the solder resist, and the production cost can be realized. The reduction. And, in the present invention, rabbit,?乂 Jia is provided with a through-hole from the front to the back of the holder, and the 迩 迩 is in contact with the bolt. The end portion of 卩 is maintained by the peripheral portion of the Betong hole on the holding, and a portion of the electrical contact portion other than the end portion is extended to a position opposite to the direction of the through hole; Zha Yisheng, 97422.doc 10 200527997 The recessed portion is formed at a position further outward than the through hole, and is formed by passing from the back surface of the holder to the end portion. Thereby, predetermined processing such as three-dimensional molding of the electrical contact portion can be performed from the through hole. In addition, by forming the through-hole, the electrical contact portion can be bent into the through-hole by contact with the contacted body. As a result, the electrical contact portion can be enclosed in the to-be-contacted body in the through-hole. The deformation can make the electrical contact between the electrical contact portion and the object to be contacted good. In addition, the concave material is provided at a position staggered from the through hole. As a result, the conductive portion formed in the concave portion is not affected during the formation of the through hole, and the electrical contact portion and the substrate can be maintained. An electrical contact structure having good electrical conductivity and excellent electrical characteristics. In addition, in the present invention, it is preferable that the electrical contact portion includes a spiral contact portion formed in a spiral shape, and a base material connected to the spiral contact portion and surrounding the spiral contact portion, and the base portion is held. On the holding body, the spiral contact material is at a position opposed to the through hole in the film thickness direction. As described above, the electrical contact portion has a structure having a screw contact portion as a specific example. The electrical contact portion having the screw ^ g μ t / and the spiral bismuth contact portion can be in proper electrical contact with the contacted body. Further, in the case of the above-mentioned structure, it is preferable that the recessed portion is formed at a position that is more outward than the through hole, and is formed by passing from the back surface of the holder to the base portion around the through hole and formed in the recessed portion. The conductive portion is exposed on the back of the holder in a shape that surrounds the peripheral portion of the through-hole 97422.doc -11-200527997. In this invention, it is preferable that the said conduction part is formed by electroplating. In addition, in the present invention, it is preferable that the feeding portion has a protruding portion protruding from the back surface of the supporting body toward the connected portion side, and the post is formed as a conductive portion having a width-to-size ratio formed in the recessed portion. Width is inch wide. This makes it possible to increase the conduction connection product between the connected portion and the conduction portion, and to make a good conduction connection between the two. In addition, in the present invention, the surface of the protruding portion may have a convex zigzag shape, and it is preferable that the conducting portion is connected and fixed to the connected portion through tin solder. In the towel of the present invention, the protruding portion protruding from the back surface of the holder through the feeding material is made into a protruding portion, which can be fixed by soldering to the connected portion, and the conductive desiccant is used as before. Compared with the case of isothermal compression bonding, the conductivity between the two can be made good. In the present invention, the towel ' may be adapted to a form in which the connected portion is formed on a printed wiring board. In addition, the present invention relates to a method for manufacturing an electrical contact structure, which is to produce an electrical contact structure having an electrical contact portion that is in electrical contact with a contacted body and a holder that holds the electrical contact portion. It includes: (a) a step of forming an electrical contact portion by electroplating on a substrate; (b) a step of contacting the contact portion and the above substrate by an organic insulating material layer serving as a holder; over-electricity (c A step of forming a recessed portion on the organic insulating material layer from the surface side of the organic material layer to a predetermined portion of the electrical contact portion; (d) forming a conductive portion by electroplating in the recessed portion, so that the conductive portion is directly 97422.doc 12 200527997 Step of conducting connection to the electrical contact part. (E) Step of removing the substrate. In the present invention, through the above-mentioned steps, the electrical contact junction of the part, the holder, and the conducting part; the number of manufacturing steps for the sexual contact is small; Instead of the necessary abutment in the electrical contact with the structural body, a retaining body composed of a 佯 捭 r ... mechanical insulating material layer is provided instead. As shown in the above step (d) and step (d), it is possible to form a recessed portion and a conductive portion in the holding body, thereby reducing the cost. ~ First-comparable production can be achieved. In addition, in the step (b) of the above-mentioned steps, a holder formed of an organic insulating material layer is formed on the substrate and the electrical contact portion at the substrate = stage. Therefore, instead of using conventional methods such as thermocompression bonding to mount the abutment single body and the electrical contact portion removed from the substrate > fatty soil, it is easy to reduce the thickness of the holder as desired. miniaturization. In the above-mentioned process, the electrical contact portion can be directly contacted with the structure, so it is not necessary to connect and fix the two while using a conductive compound to heat and connect them as before. Various steps, and in addition, the electrical conductivity of the above-mentioned electrical contact material feeding passage is also good. In addition, in the present invention (A), it is preferable that the following step (f) is provided between the step (i) and the step (ii).偏离 At a position deviating from the conducting portion and at least opposite to the -part of the electrical contact portion in the film thickness direction ', a through hole is formed from the surface of the above-mentioned organic insulating material layer 97422.doc 200527997 to the moon to make the electrical property The step of exposing the contact hole in the through hole. 〇 Knife is above. Preferably, the following step (g) is performed between the step (i) and the step (ii). There is a method of three-dimensionally forming an electrical contact portion exposed in the through hole. In addition, in the present invention, it is preferable that the above-mentioned concrete material includes a screw contact portion with a screw == and a screw contact with the screw. "The base portion around the spiral contact portion forms the electrical contact. In the step of ⑷, the organic insulating material layer is formed from the surface side of the organic material layer to the electrical contact. In the above-mentioned step, the through-hole is formed so that a portion of the spiral contact portion constituting the electrical contact portion is exposed in the through-hole. In addition, in the present invention, it is preferred In order to use a solder resist in the organic insulating material layer used in the step (b), it is preferable that the solder resist is made of a positive resist by using a mask layer in the step (C). The exposure is developed to remove the solder resist of the exposed portion to form a recessed portion. Further, it is preferable to perform the exposure and development using the mask layer in the above-mentioned step and remove the solder resist of the exposed portion. Through holes are formed. As described above, by using a positive solder resist, recesses and through holes can be easily and appropriately formed on the holder. In the present invention, the solder resist described in the above 97422.doc -14-200527997 can be used. The formed organic insulating material layer remains to the end and functions as a holder. Previously, it was necessary to separately prepare a base for mounting the above-mentioned electrical contact portion, but in this hair month, it can also form a base during a series of manufacturing processes. One of the features of the present invention is the holder of the stage. In the case where the abutment is separately installed as before, there are disadvantages such as an increase in production cost and a long manufacturing process. In the present invention, a series of The process of continuously manufacturing the electrical contact holder is sufficient to manufacture the electrical contact structure in a simple manner and also simplifies the structure of the electrical contact structure. In addition, in the present invention, it is preferably ·· In the step (d) above, the conduction P is convexly formed so as to bulge the surface of the organic insulating material layer, thereby increasing the number of substrates provided on the printed wiring board. The connection area between the contact portion and the conductive portion, and the conductive portion protrudes toward the connected portion. Therefore, when the conductive portion is opposed to the connected portion, the back surface of the holder and the connected portion It is easy to form a space between them, and the space can be provided as a space portion for welding. 'The conductive portion and the connected portion can be easily connected and fixed by welding. The electrical contact structure of the present invention is made by electrical contact. Compared with the previous structure, the number of parts can be reduced compared with the previous one, and the electrical contact structure with a simple structure can be obtained. In particular, the previously required abutment is not required, and a holder is provided instead. In addition The conductive portion is directly conductively connected to the electrical contact portion, which can provide a structure that does not require a conductive adhesive as before and has excellent electrical conductivity. In addition, according to the manufacturing method of the present invention, Compared with before 1, the number of manufacturing steps can be reduced, and the basis σ previously required in the manufacture of the electrical contact structure is not required, and instead, it is provided by Holding the insulating material layer. According to the present invention, it is possible to simply form the recessed portion and the conductive portion 'on the holding body, and it is possible to reduce the production cost as compared with the conventional case. In the above-mentioned steps, since a holding body formed of an organic or eutectic material layer is formed on the substrate and the electrical contact portion while the substrate is still present, it is not necessary to use a method such as thermocompression bonding as before. The base contact alone and the electrical contact portion removed from the substrate can easily reduce the thickness of the holder as desired, and can achieve miniaturization of the electrical contact structure. In addition, since the conducting portion can be directly connected to the electrical contact portion, there is no need to perform the troublesome process of connecting and fixing the two while thermally star-connecting them with a conductive kiss as in the past. In addition, the electrical contact portion and The continuity between the aforementioned conducting portions is also better than before. [Embodiment] Fig. 1 is a perspective view showing an inspection device used in a test for confirming the operation of electric parts by lightning early burning Α ΑΑ "a." As shown in FIG. 1, 'the inspection device 20 has a recess-shaped seat. 21. The cover body 22 which is rotatably supported by the building via a hinge portion 23 provided at an edge portion of the seat m. The seat 21 and the cover body 22 are formed of an insulating resin material or the like, and are formed in a center portion of the seat 21 Filling area 21A recessed in the direction shown in the illustration of Z2 .... The above-mentioned filling area 21A is provided with an electrical contact structure 24 'described below. Electronic components 25 such as the above-mentioned electrical contact structure 24 can be installed. In addition, on the other side of the seat 21, Mori] is formed with a locking portion 24 locked by 97422.doc -16-200527997. As shown in FIG. 1, at the center of the inner surface of the cover 22 of the inspection device 20, The filling area 21 is oppositely provided with a convex-shaped pressing portion 22a for pressing the electronic component 25 downward as shown in the figure. In addition, a locking portion% is formed at a position opposite to the money key portion 23. Between the inner surface of the cover 22 and the pressing portion 22a A pushing member (not shown) composed of a coil spring or the like that pushes the pressing portion 22a in a direction away from the inner surface of the cover 22 is provided. Thus, the electronic body 25 is placed in the mounting area 2 1 A and the carcass is closed. After 22 is locked, the electronic component 25 can be elastically pushed in a direction close to the surface of the filling area 21A (Z2 direction). Fig. 2 is a plan view of the electrical contact structure 24, and Fig. 3 is an enlarged view of A shown in Fig. 2 A partially enlarged plan view of a region, FIG. 4 is a partially enlarged rear view of the region a viewed from the side of the electrical contact structure 24 on the surface side, and FIG. 5 is the above when the region A shown in FIG. 2 is cut from each of the film thickness sides. An enlarged cross-sectional view of a portion of the electrical contact structure 24, an electronic component 25 abutting from the upper side of the electrical contact structure 24, and a portion of the printed wiring board 30 connected and fixed to the lower side of the electrical contact structure 24 Enlarged sectional view. The electrical contact structure 24 shown in FIG. 2 has a holder 25 and a plurality of spiral contacts (electrical contact portions) 26 on the structure. The spiral contacts 26 are shown in FIG. 2 to surround the holder 25. Frame shape of 2 rows around the surface Regularly arranged 'However, the arrangement of the spiral contacts 26 may be changed according to the formation position of the contacts 35 (contacted bodies) provided on the back side of the electronic component 25. As shown in FIGS. 3 and 5, The holding body 25 is provided with a through hole 25a that passes from the surface 25] 97422.doc 200527997 to the back surface 25c. In FIG. 3, μ, +, * you a, the through hole 25a faces the film surface (and The cross section of the figure (the direction parallel to the χ-γ plane) is roughly circular. The shape of the through hole 25a may be other shapes, but the contact 26 provided on the through hole 25a is spiral. Therefore, when the spiral contact 26 is appropriately opposed to the through hole 25a, and when the spiral contact 26 and the contact 35 of the electronic component 25 are in electrical contact, in order to smoothly enter the through hole 253 With the film surface direction of the through hole 25a
平行的面袁好爲大致圓形狀。在圖3中以斜線圖示出 位於該貫通孔25a之上的螺旋觸頭26。 如圖3及圖5所示，上述螺旋觸頭％由露出在上述貫通孔 25a之上而形成爲螺旋狀，並與上述電子零件乃的觸頭電 性接觸的接觸部26a，和與上述接觸部263形成爲一體並圍 繞上述接觸部26a的周圍的基部26b構成。如圖5所示，上 述接觸部26a以向上方呈螺旋狀突出的方式被立體成形。 藉此，能夠在與設於上述電子零件25的背面的觸頭35之間 得到良好的電連接。The parallel faces Yuan Hao have a substantially circular shape. The spiral contact 26 located above the through hole 25a is shown in diagonal lines in FIG. 3. As shown in FIG. 3 and FIG. 5, the spiral contact% is formed in a spiral shape by being exposed on the through hole 25 a, and the contact portion 26 a is in electrical contact with the contact of the electronic component and the contact. The portion 263 is formed integrally and is configured by a base portion 26b that surrounds the periphery of the contact portion 26a. As shown in Fig. 5, the contact portion 26a is three-dimensionally formed so as to protrude upward in a spiral shape. This makes it possible to obtain a good electrical connection with the contact 35 provided on the back surface of the electronic component 25.
如圖5所示，上述基部26b被上述保持體25的表面25b所 保持。上述保持體25的表面25b，在形成有上述貫通孔25a 的周圍形成低表面25b 1，在遠離上述貫通孔25 a的方向上 還开》成有比低表面25bl的外緣部高一層的高表面25b2。在 上述高表面25b2與低表面25bl之間的切口部内形成上述基 部26b ’上述基部26b的表面26bl與上述高表面25b2呈同一 平面。 在上述基部26b與上述保持體25之間不夾有導電性粘合 97422.doc -18- 200527997 劑等其他材料，上述基部26b與上述保持體25被直接接 · ^ 士後述的製造方法所說明般，上述保持體25由有機絕 緣材料开y成，首先，以覆蓋上述螺旋觸頭％之上的方式進 行塗覆，上述螺旋觸頭26的基部2讣與上述保持體h藉由 錨定效果等進行連接固定。 士圖5所示，在上述保持體25上，形成有從上述基部 勺下面2 6b 2直至月面25c的凹部27。在上述凹部27内藉由 例如電鍍等形成導通部28。 上述凹部27，在比形成於上述保持體25上的貫通孔25a # 偏向外側的位置，環繞上述貫通孔25a的周圍而形成，如 圖4所示，形成在上述凹部27内的導通部28，在上述保持 體25的背面25c露出，成爲包圍上述貫通孔25a的周邊部的 大致圓形的鑲邊狀。 上述導通部28，被形成在上述保持體25内，除了從上述 保持體25的月面25c露出之外，不從保持體25的其他的部 位路出。即，上述導電部28在上述貫通孔ha内亦不露 出。上述導通部28亦可以形成爲露出到上述貫通孔2加 · 的方式’但’若如此形成，則有可能導致電特性的降低 等，因此，最好不使上述導電部28露出到上述貫通孔ha 内。 從而’在本發明中，爲了將上述導電部28形成於上述保 持體25的㈣’而㈣於形成上述導電部28的凹部27設纟 * 比上述貫通孔25a偏向外側的位置。 如圖5所不，上述凹部27從上述螺旋觸頭％的基部％匕的 97422.doc -19- 200527997 下面26b2到上述保持體25的背面25c以直線形狀形成，但 亦可以疋直線形狀以外的形狀。但，直線形狀最容易製 成，另外上述基部26b與上述導通部28的導通性亦能夠良 好，所以較佳。 如圖5所示，上述導通部28具有從上述保持體25的背面 25c突出的突出部28a，上述突出部28a以比形成在上述凹 部27内的上述導通部28的寬度尺寸寬的寬度尺寸形成。 上述突出部28a係在導通部28電鍍時藉由形成突出部而 形成的，上述突出部2 8 a的表面2 8 a 1以凸型的彎曲面狀形 成。如此藉由形成凸起而構成上述突出部28a，可增大與 设在上述電性接觸結構體24的下側的印刷線路板3〇上的相 對電極31(被連接部）之間的導通接觸面積，並且在配合上 述相對電極31與上述突出部28a時，在上述保持體25與上 述相對電極31之間形成空間部32，因此，該空間部32可作 爲藉由銲錫33連接上述相對電極31與上述突出部28a之間 時的銲錫形成部來利用，能夠適當地焊接上述相對電極3 ^ 和上述犬出部2 8 a之間，能夠確保上述相對電極3 1與導通 部28之間的良好的導通連接性。另外，在本發明中，由於 月匕夠知接上述相對電極3 1與上述突出部28a之間，所以無 需如先前般使用導電性粘合劑時的熱壓接工序等，能夠簡 早且可靠地使上述相對電極3丨與上述突出部28&之間導通 連接。 對各零件的材質等進行說明。上述螺旋觸頭26藉由電鍍 或銅'4等形成，但形成電鍍能夠微細加工上述螺旋觸頭 97422.doc -20- 200527997 故車乂佳。藉由形成電鍍構成的螺旋觸頭26較佳爲層疊 鍍層的結構，其—例係從下起依Au/Ni/Au的順序層疊的構 成。 4 上述保持體25較佳為由有機絕緣材料形成。藉由由有機 、、、邑、，彖材料形成上述保持體25，而能夠不會損傷上述螺旋觸 頭26地在上述保持體25上適當且容易形成凹部”及貫通孔 25a，而可咼精度地形成上述凹部27及貫通孔25a。 ^尤其，較佳為上述保持體25使用阻焊劑形成。如後述的 裝w方法所說明般，藉由對由阻焊劑形成的保持體h曝光 颁〜，此夠谷易且鬲精度地形成凹部27及貫通亦Ua。 上述導通部28較佳為藉由電鍍形成。上述導電部28較佳 為使用由Cu、Au、鉑族類元素等導電性優越的金屬材 料在本發明中，藉由電鍍形成上述導通部28，而能夠在 同樣金屬製的螺旋觸頭2 6的基部2 6 b的下方電鍍成長上述 導通部28，能夠在上述導通部28與上述基部之間不使 用導電性粘合劑等，適當且可靠地導通連接兩者。 上述焊接3 3例如使用膏狀焊接。 在汝上述般形成的電性接觸結構體上，從圖5所示的 β頭方向配置電子零件25、將圖1所示的蓋體22的鎖定部 26鎖定在座21的被鎖定部24上時，由於藉由上述按壓部 22a向圖示下方按壓電子零件乃，所以，設在上述電子零 件25的奇面的觸頭3 5將各螺旋觸頭％向形成在上述保持體 25上的貫通孔25a的内部方向（圖示下方）按下。並且，螺旋 觸頭26的外形擴展變形，抱入上述觸頭35的外表面般地捲 97422.doc 21 200527997 繞’良好地電連接各觸頭35與各螺旋觸頭26。 圖6係具有本發明的電性接觸結構體41的連接器45的分 解立體圖。 上述電性接觸結構體41，如圖6所示在結構上具有多個 螺旋觸頭43與保持體44，具體的内部結構等構成如圖2〜圖 5所示。 上述電性接觸結構體41被收容在形成於基座4〇上的切口 W 40a内，上述電性接觸結構體4丨的導通部（與圖$所示的 導通部28相同的構成）藉由焊接連接固定在設在該切口部 _ 4〇a的表面的連接端子之間。 符號46係印刷線路板46，在上述印刷線路板钧的背面設 有多個電極部（未圖示）。在上述印刷線路板牝上設有樹脂 等形成的蓋體42，上述蓋體42嵌在上述基座4〇的切口部 4〇a内。在將上述蓋體42嵌入上述基座43的切口部⑽&内 時，上述電性接觸結構體41的螺旋觸頭43與上述印刷線路 板46的電極部導通連接。 圖6所不的連接器45能夠裝在便攜電話等電子設備内& _ 用。 以下，對本發明的電性接觸結構體24的特徵部分進行說 明0 瓤 立 土月中，上述電性接觸結構體24具有作爲電性接觸 p螺旋觸頭26、保持體25及導通部28，基本上可只由$ · ^零件構成。從而’與先前的電性接觸結構體相比可減少 v'件數’⑨夠製造簡單結構的電性接觸結構體Μ。 97422.doc •22- 200527997 在本發明中，能夠將螺旋觸頭26直接安裝在上述保持體 25上另外，在形成在上述保持體25上的凹部27，藉由電 鍍等形成上述導通部28，而能夠使上述導通部28直接與上 述螺旋觸頭26導通連接。先前，使用導電性枯合劑來將螺 疋觸頭26女哀在另外購入的基台上，使之與設在上述基台 上的導通部導通連接，但，在上述的情況下，需要熱壓 接，根據安裝精度有時得不到良好的導通性，而在本發明 中，無需使用導電性钻合劑，能夠直接地將螺旋觸頭26安 裝在保持體25上，使之與上述導通部28導通連接，安裝簡 單且能夠得到良好的導通性。 另外，尤其在本發明中，由有機絕緣材料等形成上述保 持體25,不會損傷上述螺旋觸頭％，能夠在上述保持體乃 上簡單且高精度地形成凹部27及貫通孔25a。在本發明 中，在上述凹部27内由電鍍等方法形成導通部28，但分別 形成上述貫通孔25a與凹部27 ,不需如先前的基台般藉由 濺射法在設於基台上的貫通孔的内面形成導通部。在先前 的基台的内部結構中，從確保預定尺寸的上述導通部的膜 厚等的必要性出發’上述基台的貫通孔不能太小，無法適 田促進電性接觸結構體整體的小型化，而在本發明中，在 用於形成導通部28的凹部27之外，另外形成貫通孔25a， '由於由有機絕緣材料等易精密加工的材質形成上述 保持體25，所以能夠配合螺旋觸頭％的大小，而在上述保 持體25上形成細微的貫通孔2兄’成爲與先前相比能夠促 進上述電性接觸結構體25的小型化的結構。 97422.doc 200527997 另外在本舍a月中，可由從上述保持體的背面〜突 出的凸起形狀形成上述導通部28，在上述導通㈣與印刷 線路板30上的相對電極33之間，可以藉由輝錫邮連接固 疋月匕夠病單且可#地進行上述電性接觸結構體Μ與印刷 線路板30之間的固定。 圖7〜圖16係表示本發明的電性接觸結構體24的製造方法 的工序圖。各工序圖係從膜厚方向切斷製造工序中的電性 接觸結構體24的局部剖視圖。 圖7中所示的符號50爲例如Cu基板。在上述Cu基板5〇之 上粘貼幹膜抗蝕劑，或藉由旋塗法等塗覆液體抗蝕劑來形 成抗蝕劑層51，再在抗蝕劑層51上藉由曝光顯影形成與上 述螺旋觸頭26相同形狀的鏤空圖案5 1 a。 接著，在圖8所示的工序中，在上述鏤空圖案51a中電鍍 形成螺旋觸頭26，如圖9所示，再利用域溶液等溶解去除 上述抗蝕劑層51。在圖9中，只剩下電鍍形成在上述以基 板50之上的螺旋觸頭26。 在圖ίο的工序中，由有機絕緣材料覆蓋在上述(：11基板5〇 之上及螺旋觸頭26之上，而在上述Cu基板5〇之上及螺旋觸 頭26之上形成有機絕緣材料層52。 較佳為上述有機絕緣材料使用阻焊劑。藉由使用上述阻 太干劑’而可以容易且高精度地進行後工序的凹部5 4的形成 及貫通孔61的形成。另外，較佳為上述阻焊劑爲正性。 即，使用光照射部分可溶化的抗蝕劑。這是因爲，使用曝 光顯影處理進彳于上述的凹部5 4的形成及貫通孔6 1的形成， 97422.doc -24- 200527997 而藉由使用正性阻焊劑可以適當進行這2個形成工序。此 ， 外，上述有機絕緣材料層52係作爲保持體25一直殘留到最 後的層。 接著，在圖11所示的工中，在上述有機絕緣材料層52的 上方配置掩模層53。在上述掩模層53上形成鏤空圖案 53a 〇 該鏤空圖案53a正好位於上述螺旋觸頭26的基部26b的上 方。例如，上述基部26b，由於圍繞上述螺旋觸頭26中的 螺旋狀的接觸部26a的周圍地以圓形的鑲邊形狀形成（參照 籲 圖3)，所以，較佳為上述鏤空圖案53a亦係沿上述基部26b 之上的圓形的鑲邊形狀的形式。 攸°亥鎮二圖案53a照射光，對處於與上述鏤空圖案532在 膜厚方向上相相對位置的有機絕緣材料層52進行曝光顯 影’在上述有機絕緣材料層52上形成從上述有機絕緣材料 層52的表面52a通到上述螺旋觸頭26的基部。❿上的凹部 54 °上述凹部54從上述有機絕緣材料層52的表面52a垂直 地形成到上述螺旋觸頭26的基部261)上，另外，從正上方 籲 觀察時，上述凹部26b呈現爲沿上述基部26b上的大致圓形 的鑲邊形狀的形式。 上述凹部54的形成位置可以任意決定，但較佳為形成在 ， 上述螺旋觸頭26等電性接觸部的端部上。上述端部以外的 “ 接觸°卩’成爲在以後工序形成的貫通孔61内露出、並 在與電子零件29的觸頭35電連接時被按壓而彈性變形進入 述貝通孔61内的部分。從而，較佳為上述凹部54儘量形 97422.doc -25- 200527997 成在上述電性接觸部的端部上。在螺旋觸頭26的情況下， 螺旋狀的接觸部26a的部分成爲在貫通61内露出而可彈性 變形的部分，因此，將上述凹部54設在上述基部26b上。 在圖12所示的工序中，在上述凹部54内電鍍形成導通部 55。在上述凹部54内露出上述基部26b，由金屬形成的上 述基部26b因爲作爲電解鍍時的電極發揮作用，所以上述 導通部55適當地在上述基部26b之上電鍍成長。 在本發明中，如圖12所示，並不只在上述凹部$ 4内形成 上述導通部55，還與形成在凹部54内的上述導通部55連續 地電鍍形成（所謂凸起形成）從上述有機絕緣材料層52的表 面52a突出來的突出部55a。上述突出部55a不只在上述凹 部54上、亦在上述有機絕緣材料層52的表面52a上延伸形 成。但’在延伸到上述有機絕緣材料層52的表面52a的部 分’由於底層爲絕緣性的層，所以鈍化電鍍成長，如圖13 所示，上述突出部55a的表面以凸型的彎曲面形成。如 此，在上述導通部55上形成從上述有機絕緣材料層52的表 面52a突出的凸起形狀的突出部55a，從而使上述突出部 55a作爲與設在印刷線路板上的相對電極的安裝面來有效 地發揮作用。 在圖14的工序中，使掩模層60與上述有機絕緣材料層52 的上方相對。在上述掩模層6〇上形成有鏤空圖案6〇a，上 述鏤空圖案60a的平面形狀例如爲與圖3所示的形成在保持 體25上的貫通孔25a相同的圓形狀。這裏，將上述鏤空圖 案60a形成在與上述.螺旋觸頭26中的螺旋狀的接觸部^以部 97422.doc -26- 200527997 分沿膜厚方向相對的位置。換句話說，使上述鏤空圖案 6〇a位於比形成在上述有機絕緣材料層52上的凹部54更靠 内側處’上述鏤空圖案6〇a不沿膜厚方向與上述凹部54相 相對。處於與上述鏤空圖案60a相相對的位置的有機絕緣 材料層52在接下來的工序中，藉由曝光顯影除去，若在與 上述鏤空圖案60a沿膜厚方向相對的位置存在上述凹部 5 4，則在接下來的工序中所形成的貫通孔内露出電鍍形成 在上述凹部54内的導通部55。因此，使上述鏤空圖案6〇a 位於比开> 成在上述有機絕緣材料層52上的凹部54更靠内側 處。 在圖14的工序中，從上述鏤空圖案6〇a朝向上述有機絕 緣材料層52照射光。如已說明般，上述有機絕緣材料層52 由正性阻焊劑形成。在圖丨丨的工序中，爲了在上述有機絕 緣材料層52上形成凹部54，而只在要利用上述掩模層53形 成凹部54的位置的上述有機絕緣材料層52進行光照射。從 而，在圖1 4的工序的時刻，不在剩餘的有機絕緣材料層52 上進行光照射。 因而，在圖14的工序中，利用掩模層6〇，對要形成貫通 孔61的位置的有機絕緣材料層52局部地光照射而可適當地 進行曝光顯影。如果爲負性抗蝕劑，則不進行光照射的地 方被抽去，但在使用負性抗蝕劑形成有機絕緣材料層52 時，圖14的時刻剩餘的有機絕緣材料層52全部成爲照射光 的部分。從而，產生不能適當形成貫通孔61的問題。因 而，在上述有機絕緣材料層52上利用各自的工序形成凹部 97422.doc -27- 200527997 4人貝通孔61 4，較佳為在上述有機絕緣材料層上使用 正性阻焊劑。 如圖15所示，利用掩模層6〇對處於沿膜厚方向與上述掩 模層60的鏤空圖案6〇a相對的位置的有機絕緣材料層”進 行曝光顯影而形成圖丨5所示的貫通孔6丨。如圖丨5所示，上 述貫通孔61從上述有機絕緣材料層52的表面52&形成到背 面52c，上述螺旋觸頭26的螺旋狀的接觸部26&從上述貫通 孔61露出。 接著，在圖16所示的工序中，利用直到圖15的工序製得 的電性接觸結構體的上述貫通孔61，從上述貫通孔61的下 側對接突出調整零件62，向箭頭方向推起上述突出調整零 件62，從而將露出於上述貫通孔61的螺旋狀的接觸部 朝上立體成形爲螺旋狀。藉此，如圖5所示，能夠立體成 形上述接觸部26a。 此外，在圖16的工序中，將圖15工序中的電性接觸結構 體翻轉過來，使上述接觸部26a位於保持體52的上側，使 導通部55的突出部55a位於下側，在該狀態下從上述貫通 孔61朝上推起上述突出調整零件62，但保持圖15的狀態使 上述犬出凋整零件62位於上述貫通孔61之下、並向上推起 上述突出調整零件62,在上述貫通孔61内立體成形上述接 觸部26a進入的構成當然亦是可以的。 利用圖7〜圖16所示的各工序成形的電性接觸結構體中， 基本上只由螺旋觸頭26、由有機絕緣材料層52構成的保持 體、及導通部55構成。如此，能夠利用一連串的工序成形 97422.doc -28 - 200527997 結構非常簡單的電性接觸結構體。 由方；尤其在切要另外購人基台等，所 框架連結各螺旋觸藤夕門、± > 等 貝之間以使多個螺旋觸頭分別不分散的 工序(圖鮮和將上述螺旋觸頭枯貼在上述基台上的工 序(^圖19D) ’但本發明無需如此的工序而實現了製造工序 的間化。尤其無需先前般的基台，上述基台是經複雜加工 而形成的’價格很高，但根據本發明，以非常簡單的方法 在連串的製造工序中形成保持多個螺旋觸頭26的有機絕 :材料層52 $外’可以將上述有機絕緣材料層μ最終作 爲保持體而汶留，目此，與先前相比，保持體成形的製造 工序容易，能夠實現生産成本的降低。 尤其’能夠容易且高精度地在上述保持體的任意位置形 成凹部54及貫通孔61，另外，能夠將上述有機絕緣材料層 52形成在形成上述螺旋的基板5()上，所料存在如 先前般以各自的工序形成基台與螺旋觸頭26、並在後工序 中枯貼兩零件的情況，其結果，與先前相比能夠更加進一 步地使電性接觸結構體小型化，，能夠配合螺旋觸頭％ 的形狀而在上述保持體54上形成細微的貫通孔61以及比先 前任意薄地形成膜厚等。 另外，在本發明中，利用阻焊劑等作爲構成上述保持體 的有機絕緣材料層52，在上述阻焊劑的形成過程中，能夠 直接將上述螺旋觸頭26安裝在上述有機絕緣材料層52上， 另外，在上述有機絕緣材料層52上形成凹部54，再在其中 電鍍形成導通部55，使上述螺旋觸頭26的基部2补與上述 97422.doc -29- 200527997 導通部55直接導通連接等，從而，無需先前必需的由導電 t生粘口劑進行的安裝工序，能夠使安裝工序變得簡單，並 且’亦無需利科電性&合劑時所必需的熱屢接工序，與 先刚相比，可以使上述導通部55和上述螺旋觸頭26間的導 通性良好。 此外，在本發明中，作爲上述有機絕緣材料層52而列舉 出阻焊劑的-例’但亦可以由聚醯亞胺等樹脂形成上述有 機絕緣材料層52。在上述的情況下，較佳為利賴射加工 等方法形成上述凹部54及貫通孔61。 另外，在本發明中，能夠如圖16的工序所示般利用形成 在有機絕緣材料層52上的貫通孔61來立體成形上述螺旋觸 頭26的接觸部26a，另外，在使圖16所示的導通部55的突 出部55a導通連接在設於上述電性接觸結構體的下側的印 刷線路板的相對電極上時，由於如圖5所述般，在兩零件 間形成空間部32，所以可以利用該空間部“焊接接合上述 突出部55a與上述相對電極31間。尤其，上述突出部55&係 凸起形成的，與上述相對電極31的導通 此，可以簡單且可靠地焊接上述突出部55a與上=對； 極31之間。 此外’在圖7〜圖所示的各工序中，作爲電性接觸部例 示了螺旋觸頭26,但上述電性接觸部亦可爲螺旋狀以外的 形態，則自不待言。 【圖式簡單說明】 圖⑽表示在用於確認電子零件的動作的試驗中所使用 97422.doc •30- 200527997 的檢查裝置的立體圖。 圖2係本發明的電性接觸結構體的俯視圖。 圖3係放大圖2的A區域的電性接觸結構體的局部放大俯 視圖。 圖4係從背側觀察圖3的電性接觸結構體的局部放大後視 圖。 圖5係放大圖2的A區域的電性接觸結構體的局部放大剖 視圖、及與上述電性接觸結構體上方相對的電子零件及連 接在上述電性接觸結構體的下側的印刷線路板的局部放大 剖視圖。 圖6係將本發明的電性接觸結構體作為連接器的内部零 件時的上述連接器的分解立體圖。 圖7係表示本發明的電性接觸結構體的製造方法的一工 序圖。 圖8係在圖7之後進行的一工序圖。 圖9係在圖8之後進行的一工序圖。 圖10係在圖9之後進行的一工序圖。 圖11係在圖10之後進行的一工序圖。 圖12係在圖11之後進行的一工序圖。 圖13係在圖12之後進行的一工序圖。 圖14係在圖13之後進行的一工序圖。 圖15係在圖14之後進行的一工序圖。 圖16係在圖15之後進行的一工序圖。 圖17係先前的電性接觸結構體的局部放大立體圖。 97422.doc -31 - 200527997 圖1 8係進一步放大圖1 7所示的電性接觸結構體的一部分 的局部放大後視圖。 圖19A係表示用於製造先前的電性接觸結構體的製造工 序的一工序的圖。 圖19B係在圖19A之後進行的一工序圖。 圖19C係在圖19B之後進行的一工序圖。 圖19D係在圖19C之後進行的一工序圖。 圖19E係在圖19D之後進行的一工序圖。As shown in Fig. 5, the base portion 26b is held by the surface 25b of the holding body 25. The surface 25b of the holder 25 is formed with a low surface 25b 1 around the through hole 25a, and is opened in a direction away from the through hole 25a. The lower surface 25b is formed to be one level higher than the outer edge of the low surface 25bl. Surface 25b2. The base portion 26b is formed in a cutout portion between the high surface 25b2 and the low surface 25bl. The surface 26bl of the base portion 26b is on the same plane as the high surface 25b2. No other materials such as conductive adhesive 97422.doc -18- 200527997 are interposed between the base portion 26b and the holder 25, and the base portion 26b and the holder 25 are directly connected to each other, as explained by a manufacturing method described later. Generally, the holder 25 is made of an organic insulating material. First, the holder 25 is coated so as to cover the spiral contact%. The base 2 讣 of the spiral contact 26 and the holder h are anchored by an anchoring effect. Wait for the connection to be fixed. As shown in FIG. 5, a recess 27 is formed in the holder 25 from the base portion 2b to the lunar surface 25c. The conductive portion 28 is formed in the recessed portion 27 by, for example, plating. The recessed portion 27 is formed to surround the through hole 25a at a position more outward than the through hole 25a # formed in the holder 25. As shown in FIG. 4, a conductive portion 28 formed in the recessed portion 27, The rear surface 25c of the holder 25 is exposed, and has a substantially circular band shape that surrounds a peripheral portion of the through hole 25a. The conducting portion 28 is formed in the holding body 25 and does not exit from other positions of the holding body 25 except that it is exposed from the moon surface 25c of the holding body 25. That is, the conductive portion 28 is not exposed in the through hole ha. The conductive portion 28 may be formed so as to be exposed to the through-hole 2. However, if the conductive portion 28 is formed in this way, the electrical characteristics may be deteriorated. Therefore, it is preferable not to expose the conductive portion 28 to the through-hole. within ha. Therefore, in the present invention, in order to form the conductive portion 28 on the holder 25, the recessed portion 27 on which the conductive portion 28 is formed is provided at a position * outside of the through hole 25a. As shown in FIG. 5, the recessed portion 27 is formed in a linear shape from the surface of the spiral contact% base portion 97222.doc -19- 200527997 below 26b2 to the back surface 25c of the holder 25, but may be formed in a shape other than a linear shape. shape. However, a straight shape is the easiest to form, and the conductivity between the base portion 26b and the conducting portion 28 is also good, so it is preferable. As shown in FIG. 5, the conducting portion 28 has a protruding portion 28 a protruding from the back surface 25 c of the holder 25, and the protruding portion 28 a is formed with a width dimension wider than a width dimension of the conducting portion 28 formed in the recessed portion 27. . The protruding portion 28a is formed by forming a protruding portion when the conductive portion 28 is electroplated, and the surface 2 8 a 1 of the protruding portion 2 8 a is formed in a convex curved shape. By forming the protrusions 28a by forming the protrusions in this manner, it is possible to increase the conductive contact with the opposite electrode 31 (the connected portion) provided on the printed wiring board 30 on the lower side of the electrical contact structure 24. Area, and when the opposing electrode 31 and the protruding portion 28 a are matched, a space portion 32 is formed between the holding body 25 and the opposing electrode 31. Therefore, the space portion 32 can be used to connect the opposing electrode 31 by a solder 33. It is used as a solder forming portion when it is in contact with the protruding portion 28a, and it is possible to appropriately weld between the opposing electrode 3 ^ and the dog-out portion 2 8 a, and it is possible to ensure a good relationship between the opposing electrode 31 and the conducting portion 28. Continuity. In addition, in the present invention, since the moon dagger is sufficiently connected between the counter electrode 31 and the protruding portion 28a, the thermal compression bonding process and the like when using a conductive adhesive as before are unnecessary, and it is simple and reliable. Groundingly connects the above-mentioned opposing electrode 3 丨 with the above-mentioned protruding portion 28 &. The material and the like of each part will be described. The spiral contact 26 is formed by electroplating or copper 4 or the like, but forming the electroplating can finely process the spiral contact 97422.doc -20- 200527997, so the car is excellent. The spiral contact 26 formed by forming the electroplated layer is preferably a layered structure, which is, for example, a layered structure in the order of Au / Ni / Au from the bottom. 4 The holder 25 is preferably formed of an organic insulating material. By forming the holding body 25 from an organic material, the material can be formed in the holding body 25 appropriately and easily without damaging the spiral contact 26 and the through hole 25a, and the accuracy can be improved. The recessed portion 27 and the through hole 25a are formed on the ground. ^ In particular, it is preferable that the holding body 25 is formed using a solder resist. As described later in the mounting method, the holding body h formed of the solder resist is exposed, This allows easy and accurate formation of the recesses 27 and penetrations Ua. The conductive portions 28 are preferably formed by electroplating. The conductive portions 28 are preferably made of Cu, Au, platinum group elements, and other materials having excellent conductivity. Metallic material In the present invention, the conductive portion 28 is formed by electroplating, and the conductive portion 28 can be electroplated under the base portion 2 6 b of the same metal spiral contact 26, and the conductive portion 28 and the conductive portion 28 can be electroplated. There is no conductive adhesive or the like between the base portions, and the two are appropriately and reliably connected to each other. The soldering 33 is, for example, paste soldering. On the electrical contact structure formed as described above, from FIG. 5 β head direction When the electronic component 25 is placed and the locking portion 26 of the cover 22 shown in FIG. 1 is locked to the locked portion 24 of the seat 21, the electronic component is pressed downward by the pressing portion 22a as shown above. The contact 35 of the odd surface of the electronic component 25 pushes each of the spiral contacts in the direction of the through hole 25a formed in the holder 25 (below), and the shape of the spiral contact 26 is expanded and deformed. The outer surface of the above-mentioned contact 35 is rolled like 97422.doc 21 200527997, and the contacts 35 and the spiral contacts 26 are electrically connected well. Fig. 6 shows the connection of the electrical contact structure 41 of the present invention. An exploded perspective view of the device 45. The electrical contact structure 41 has a plurality of spiral contacts 43 and a holder 44 as shown in FIG. 6, and specific internal structures and the like are shown in FIGS. 2 to 5. The electrical contact structure 41 is housed in a cutout W 40a formed in the base 40, and the conductive portion (the same structure as the conductive portion 28 shown in FIG. 2) of the electrical contact structure 4 is welded. The connection is fixed to the connection provided on the surface of the cutout portion_40a The symbol 46 is a printed wiring board 46, and a plurality of electrode portions (not shown) are provided on the back of the printed wiring board. A cover 42 made of resin or the like is provided on the printed wiring board 牝. The cover 42 is fitted into the cutout portion 40a of the base 40. When the cover 42 is fitted into the cutout portion ⑽ of the base 43, the spiral contacts 43 of the electrical contact structure 41 and The electrode portions of the printed wiring board 46 are electrically connected. The connector 45 shown in FIG. 6 can be installed in electronic devices such as mobile phones. The following describes the characteristic parts of the electrical contact structure 24 of the present invention. In the stand-up earth month, the electrical contact structure 24 has the p-shaped spiral contact 26 as an electrical contact, the holding body 25 and the conducting portion 28, and can basically be composed of only $. ^ Parts. Therefore, 'the number of v'pieces can be reduced compared to the previous electrical contact structure', which is enough to manufacture the electrical contact structure M of a simple structure. 97422.doc • 22- 200527997 In the present invention, the spiral contact 26 can be directly mounted on the holding body 25. In addition, the conductive portion 28 is formed on the recessed portion 27 formed on the holding body 25 by plating or the like. Instead, the conducting portion 28 can be directly connected to the spiral contact 26. Previously, the conductive screw compound was used to hold the snail contact 26 on a separately purchased abutment to make it conductively connect with the conducting portion provided on the abutment. However, in the above case, hot pressing is required. In some cases, good continuity cannot be obtained depending on the mounting accuracy. In the present invention, the spiral contact 26 can be directly mounted on the holding body 25 without using a conductive drill-in. Continuity connection, simple installation and good continuity. Further, in the present invention, in particular, forming the holder 25 from an organic insulating material or the like does not damage the spiral contact%, and it is possible to easily and accurately form the recess 27 and the through hole 25a on the holder. In the present invention, the conductive portion 28 is formed in the recessed portion 27 by a method such as plating, but the through-holes 25a and the recessed portion 27 are formed separately. A conductive portion is formed on the inner surface of the through hole. In the previous internal structure of the abutment, the necessity of ensuring the film thickness of the conductive portion of a predetermined size and the like was stated. 'The through hole of the abutment must not be too small, and Shita cannot promote the miniaturization of the entire electrical contact structure. In the present invention, in addition to the recessed portion 27 for forming the conductive portion 28, a through hole 25a is additionally formed. 'Because the holder 25 is formed of a material that is easy to be precisely processed, such as an organic insulating material, the screw contact can be matched. It is a structure that can form a minute through-hole 2 in the holder 25 to promote the miniaturization of the electrical contact structure 25 as compared with the conventional method. 97422.doc 200527997 In addition, in this month, the conductive portion 28 may be formed in a convex shape protruding from the back surface of the holder to the conductive electrode 28 and the opposite electrode 33 on the printed wiring board 30. It is sufficient to connect the fixed moon dagger with the Huixi post and fix the electrical contact structure M and the printed wiring board 30 mentioned above. 7 to 16 are process diagrams showing a method of manufacturing the electrical contact structure 24 of the present invention. Each process drawing is a partial cross-sectional view of the electrical contact structure 24 in the manufacturing process cut from the film thickness direction. Reference numeral 50 shown in FIG. 7 is, for example, a Cu substrate. A dry film resist is pasted on the above-mentioned Cu substrate 50, or a resist layer 51 is formed by applying a liquid resist by a spin coating method or the like, and then exposed and developed on the resist layer 51 to form a resist layer 51. The hollow pattern 5 1 a having the same shape as the spiral contact 26. Next, in the step shown in FIG. 8, the spiral contact 26 is electroplated in the hollow pattern 51a, and as shown in FIG. 9, the resist layer 51 is removed by dissolving with a domain solution or the like. In Fig. 9, only the spiral contacts 26 plated on the above-mentioned substrate 50 are left. In the process of FIG. Ο, the above (: 11 substrate 50 and the spiral contact 26 are covered with an organic insulating material, and the organic insulating material is formed on the above Cu substrate 50 and the spiral contact 26. Layer 52. It is preferable that the above-mentioned organic insulating material uses a solder resist. By using the above-mentioned too-drying resist, the formation of the recesses 54 and the through-holes 61 in the subsequent steps can be easily and accurately performed. The above-mentioned solder resist is positive. That is, a resist that is partially irradiated with light is used. This is because the formation of the recessed portions 5 4 and the formation of the through-holes 61 by the exposure and development process are used, 97422.doc -24- 200527997 By using a positive solder resist, these two formation steps can be appropriately performed. In addition, the organic insulating material layer 52 described above remains as the holder 25 until the last layer. Next, as shown in FIG. 11 In the process, a mask layer 53 is disposed above the organic insulating material layer 52. A hollow pattern 53a is formed on the mask layer 53. The hollow pattern 53a is located just above the base 26b of the spiral contact 26. For example, on The base portion 26b is formed in a circular fringe shape around the spiral contact portion 26a of the spiral contact 26 (see FIG. 3). Therefore, it is preferable that the hollow pattern 53a is also along the above-mentioned The form of a circular rim shape above the base 26b. The second pattern 53a is exposed to light and exposed to the organic insulating material layer 52 at a position opposite to the above-mentioned hollow pattern 532 in the film thickness direction. The organic insulating material layer 52 is formed from the surface 52a of the organic insulating material layer 52 to the base of the spiral contact 26. The recessed portion 54 on the ridge is formed vertically from the surface 52a of the organic insulating material layer 52. On the base portion 261) of the spiral contact 26, when viewed from directly above, the recessed portion 26b is in the form of a substantially circular band shape along the base portion 26b. The formation position of the recessed portion 54 can be determined arbitrarily, but it is preferably formed on the end of the electrical contact portion such as the spiral contactor 26. The “contact angle” other than the above-mentioned end portion is exposed in the through-hole 61 formed in a later step, and is pressed while being electrically connected to the contact 35 of the electronic component 29 to be elastically deformed into the through-hole 61. Therefore, it is preferable that the recessed portion 54 is formed as far as possible at the end portion of the electrical contact portion. In the case of the spiral contact 26, a portion of the spiral contact portion 26a becomes a through hole 61. The recessed portion 54 is exposed inside and is elastically deformable. Therefore, the recessed portion 54 is provided on the base portion 26b. In the step shown in FIG. 12, a conductive portion 55 is formed by plating in the recessed portion 54. The base portion is exposed in the recessed portion 54 26b, since the base portion 26b made of metal functions as an electrode during electrolytic plating, the conducting portion 55 is appropriately electroplated and grown on the base portion 26b. In the present invention, as shown in FIG. 12, it is not limited to the above. The conductive portion 55 is formed in the recessed portion $ 4, and is continuously plated with the conductive portion 55 formed in the recessed portion 54 (so-called bump formation) to protrude from the surface 52a of the organic insulating material layer 52. The protruding portion 55a. The protruding portion 55a is formed not only on the recessed portion 54 but also on the surface 52a of the organic insulating material layer 52. However, 'the portion extending to the surface 52a of the organic insulating material layer 52' is An insulating layer is grown by passivation plating. As shown in FIG. 13, the surface of the protruding portion 55a is formed with a convex curved surface. In this way, the conductive portion 55 is formed to protrude from the surface 52a of the organic insulating material layer 52. In the step of FIG. 14, the mask layer 60 and the above-mentioned organic layer are effectively made to function as a mounting surface with a counter electrode provided on a printed wiring board. The upper side of the insulating material layer 52 is opposed to each other. A hollow pattern 60a is formed on the mask layer 60, and the planar shape of the hollow pattern 60a is, for example, the same as the through hole 25a formed in the holder 25 shown in FIG. Here, the above-mentioned hollow pattern 60a is formed at a position corresponding to the spiral contact portion in the spiral contact 26. The portion 97422.doc -26- 200527997 is located opposite to the film thickness direction. In other words, the hollowed-out pattern 60a is located more inward than the recessed portion 54 formed on the organic insulating material layer 52. The hollowed-out pattern 60a does not face the recessed portion 54 in the film thickness direction. The organic insulating material layer 52 at a position opposite to the hollow pattern 60a is removed by exposure and development in the next step. If the concave portion 54 is present at a position opposite to the hollow pattern 60a in the film thickness direction, The through-holes formed in the subsequent steps expose the conductive portions 55 that are plated in the recessed portions 54. Therefore, the hollowed-out pattern 60a is positioned in the recessed portions 54 formed on the organic insulating material layer 52. Closer to the inside. In the step of Fig. 14, light is irradiated from the hollow pattern 60a toward the organic insulating material layer 52. As described above, the organic insulating material layer 52 is formed of a positive solder resist. In the step of FIG. 丨, in order to form the recessed portion 54 in the organic insulating material layer 52, the organic insulating material layer 52 is irradiated with light only at the position where the recessed portion 54 is to be formed by the mask layer 53. Therefore, at the time of the step of FIG. 14, light irradiation is not performed on the remaining organic insulating material layer 52. Therefore, in the step of FIG. 14, the organic insulating material layer 52 at the position where the through hole 61 is to be formed is partially irradiated with light by the mask layer 60, and the exposure and development can be performed appropriately. In the case of a negative resist, the place where light is not irradiated is removed. However, when the organic insulating material layer 52 is formed using the negative resist, all of the remaining organic insulating material layer 52 at the time of FIG. 14 is irradiated with light. part. Therefore, a problem arises that the through-hole 61 cannot be properly formed. Therefore, in the organic insulating material layer 52, recesses are formed by respective processes. 97422.doc -27-200527997 Four-person through-hole 61 4 is preferably a positive solder resist on the organic insulating material layer. As shown in FIG. 15, the organic insulating material layer at a position opposite to the hollow pattern 60 a of the mask layer 60 in the film thickness direction is exposed and developed by using the mask layer 60 to form the layer shown in FIG. 5. Through hole 6. As shown in Figure 5, the through hole 61 is formed from the surface 52 & to the back surface 52c of the organic insulating material layer 52, and the spiral contact portion 26 of the spiral contact 26 is from the through hole 61. Then, in the step shown in FIG. 16, the through-hole 61 of the electrical contact structure obtained through the step up to FIG. 15 is used to abut the protruding adjustment member 62 from the lower side of the through-hole 61 and point in the direction of the arrow. The protrusion-adjusting member 62 is pushed up to three-dimensionally shape the spiral-shaped contact portion exposed in the through-hole 61 upward into a spiral shape. As a result, the contact portion 26a can be three-dimensionally formed as shown in FIG. 5. In the step of FIG. 16, the electrical contact structure in the step of FIG. 15 is turned over so that the contact portion 26 a is located on the upper side of the holding body 52 and the protruding portion 55 a of the conducting portion 55 is located on the lower side. Through hole 61 Push up the protrusion adjustment part 62, but keep the dog trimming part 62 under the through hole 61 while keeping the state of FIG. 15 and push up the protrusion adjustment part 62 to form the three-dimensional shape in the through hole 61. Of course, it is also possible to enter the contact portion 26a. In the electrical contact structure formed by using each of the steps shown in FIGS. 7 to 16, basically, the holding portion is composed of only the spiral contact 26 and the organic insulating material layer 52. The body and the conductive portion 55 are formed. In this way, a series of steps can be used to form 97422.doc -28-200527997. The electrical contact structure has a very simple structure. By the side; especially when a separate abutment is purchased, the frame is connected. The steps of contacting each of the spiral contact with the vine, and the > and so on to prevent the plurality of spiral contacts from being dispersed separately (the process of attaching the spiral contact to the abutment on the abutment (^ Figure 19D) '' However, the present invention does not require such a process and realizes the realization of an intermediate manufacturing process. In particular, it does not require a conventional abutment. The abutment is formed by complicated processing. The price is high, but according to the present invention, it is very simple. In a series of manufacturing processes, an organic insulation holding a plurality of spiral contacts 26 is formed: a material layer of 52 $ can be used as the holding body of the above-mentioned organic insulating material layer μ. Therefore, compared with the previous, the holding The manufacturing process of the body molding is easy, and the production cost can be reduced. In particular, the recessed portion 54 and the through hole 61 can be easily and accurately formed at any position of the holding body, and the organic insulating material layer 52 can be formed in the formation. On the above-mentioned spiral substrate 5 (), it is expected that the abutment and the spiral contact 26 may be formed in the respective steps as before, and the two parts may be dry-attached in the subsequent steps. As a result, it can be further advanced than before. In order to reduce the size of the electrical contact structure, it is possible to form minute through-holes 61 in the holder 54 and form a film thickness that is arbitrarily thinner in accordance with the shape of the spiral contact%. In addition, in the present invention, a solder resist or the like is used as the organic insulating material layer 52 constituting the holder, and the spiral contact 26 can be directly mounted on the organic insulating material layer 52 during the formation of the solder resist. In addition, a recessed portion 54 is formed on the organic insulating material layer 52, and a conductive portion 55 is formed by electroplating therein, so that the base 2 of the spiral contact 26 is directly connected to the conductive portion 55 of the aforementioned 97422.doc -29-200527997, etc. Therefore, the previously required installation process using a conductive adhesive is not required, the installation process can be simplified, and the heat-repeated connection process necessary for the Ricoh electrical & mixture is not required, which is in contrast to the first rigid phase. It is possible to improve the conductivity between the conductive portion 55 and the spiral contact 26. In addition, in the present invention, as the organic insulating material layer 52, an example of a solder resist is given. However, the organic insulating material layer 52 may be formed of a resin such as polyimide. In the above case, it is preferable to form the recessed portion 54 and the through hole 61 by a method such as laser processing. In addition, in the present invention, as shown in the step of FIG. 16, the contact portion 26 a of the spiral contact 26 can be three-dimensionally formed using the through-hole 61 formed in the organic insulating material layer 52. In addition, as shown in FIG. 16, When the protruding portion 55a of the conductive portion 55 is conductively connected to the opposite electrode of the printed wiring board provided on the lower side of the electrical contact structure, since the space portion 32 is formed between the two components as shown in FIG. 5, This space portion can be used to "weld-join" the protruding portion 55a and the opposing electrode 31. In particular, the protruding portion 55 & is formed as a protrusion and communicates with the opposing electrode 31, so that the protruding portion can be simply and reliably welded. 55a and upper = pair; between pole 31. In addition, in each of the steps shown in FIG. 7 to FIG., The spiral contact 26 is exemplified as the electrical contact portion, but the electrical contact portion may be other than a spiral shape. [Schematic description] Figure ⑽ shows a perspective view of an inspection device 97422.doc • 30- 200527997 used in a test for confirming the operation of an electronic part. Figure 2 shows the electrical properties of the present invention. The top view of the contact structure. Fig. 3 is a partially enlarged top view of the electrical contact structure in region A of Fig. 2. Fig. 4 is a partially enlarged rear view of the electrical contact structure of Fig. 3 viewed from the back side. A partially enlarged cross-sectional view of the electrical contact structure in the area A of FIG. 2, and a partially enlarged cross-sectional view of an electronic component opposite to the electrical contact structure and a printed wiring board connected to a lower side of the electrical contact structure. FIG. 6 is an exploded perspective view of the connector when the electrical contact structure of the present invention is used as an internal part of the connector. FIG. 7 is a process diagram showing a method of manufacturing the electrical contact structure of the present invention. FIG. 8 FIG. 9 is a process diagram performed after FIG. 7. FIG. 9 is a process diagram performed after FIG. 8. FIG. 10 is a process diagram performed after FIG. 9. FIG. 11 is a process diagram performed after FIG. Fig. 12 is a process chart performed after Fig. 11. Fig. 13 is a process chart performed after Fig. 12. Fig. 14 is a process chart performed after Fig. 13. Fig. 15 is a process performed after Fig. 14 Figure 16 series A process diagram performed after Fig. 15. Fig. 17 is a partially enlarged perspective view of the previous electrical contact structure. 97422.doc -31-200527997 Fig. 18 is a further enlarged view of the electrical contact structure shown in Fig. A partially enlarged rear view of a part. FIG. 19A is a diagram showing a process for manufacturing a conventional electrical contact structure. FIG. 19B is a process diagram performed after FIG. 19A. FIG. FIG. 19D is a process diagram performed after FIG. 19C. FIG. 19E is a process diagram performed after FIG. 19D.
圖19F係在圖19E之後進行的一工序圖。 【主要元件符號說明】 1 電性接觸結構體 2 螺旋觸頭 2a 基部 3 基台 3a 凹部FIG. 19F is a process diagram performed after FIG. 19E. [Description of main component symbols] 1 Electrical contact structure 2 Screw contact 2a Base 3 Abutment 3a Recess
4 Cu基板 5 抗#劑層 5a 圖案 6 引導框架 6a 孔部 7b 内面 8 導電粘合劑 9 調整零件 10 導通部 97422.doc -32- 200527997 11 連接端子 12 印刷線路板 13 相對電極 14 導電性粘合劑 24 電性接觸結構體 25 保持體 25a 貫通孔 26 螺旋觸頭 26a 接觸部 26b 基部 27 凹部 28 導通部 28a 突出部 30 印刷線路板 40 基座 40a 切口部 41 電性接觸結構體 42 蓋體 43 螺旋觸頭 44 保持體 45 連接器 46 印刷線路板 50 Cu基板 51 抗#劑層4 Cu substrate 5 Anti-agent layer 5a Pattern 6 Guide frame 6a Hole 7b Inner surface 8 Conductive adhesive 9 Adjusting part 10 Conducting portion 97422.doc -32- 200527997 11 Connection terminal 12 Printed wiring board 13 Opposite electrode 14 Conductive adhesive Mixture 24 Electrical contact structure 25 Holder 25a Through hole 26 Spiral contact 26a Contact portion 26b Base 27 Recess 28 Conduction portion 28a Protrusion 30 Printed circuit board 40 Base 40a Notch portion 41 Electrical contact structure 42 Cover 43 Screw contact 44 Holder 45 Connector 46 Printed circuit board 50 Cu substrate 51 Anti- # agent layer
97422.doc -33- 200527997 51a 鏤空圖案 52 有機絕緣材料層 52a 表面 52c 背面 53 掩模層 53a 鏤空圖案 54 凹部 55 導通部 55a 突出部 60 掩模層 60a 鏤空圖案 61 貫通子L 62 突出調整零件 97422.doc -34-97422.doc -33- 200527997 51a Hollow pattern 52 Organic insulating material layer 52a Surface 52c Back surface 53 Mask layer 53a Hollow pattern 54 Recessed part 55 Conducting part 55a Projection part 60 Masking layer 60a Hollow pattern 61 Penetration L 62 Projection adjustment part 97422 .doc -34-