TW200527708A - Light emitting diode illumination module - Google Patents

Abstract

A light emitting diode illumination module is provided. The light emitting diode illumination module comprises a PC board, an illumination group and a reflective covering. The illumination group comprises a plurality of illuminative units. Each illumination unit comprises a plurality of illuminative sub-units arranged into an array and a carrier. The carriers are connected electrically with the PC board. Each illuminative sub-unit comprises a plurality of different light emitting diodes falling into an array. The reflective covering is configured on the corresponding carrier above the light emitting diodes to focus the light and prevent the light from scattering. There are about 80% of the light from the light emitting diode illumination module can be limited in a range of scattering angle of ±30 DEG to increase the entirely using efficiency of the light.

Description

200527708 V. Description of the invention (1) Technical field to which the invention belongs The present invention relates to an illumination module (i 1 lumi nation module), and more particularly to an LED illumination module. In the prior art, light emitting diodes (Light Emitting Diodes) have a longer service life and lower power consumption. Therefore, the application of light emitting diodes is becoming more common, such as large-scale display electronic signboards, traffic lights, and Direction lights, etc. The current light-emitting diode industry is moving towards the goal of high brightness and low light loss, so that the light-emitting diode is sufficient to replace traditional lighting measures. In addition, light-emitting diodes have gradually been applied to large-sized light-emitting diode displays, backlights for liquid crystal displays, and projection devices such as digital light processing projectors (DLP projectors) and liquid crystal projection devices (Liquid Crystal Display projector, LCD projector). Figures 1A and 1B show the structure of a single light-emitting diode package in a conventional light-emitting diode lighting module. Please refer to Figure 1A for a conventional light-emitting diode package. 1 1 4 usually includes a single light-emitting diode wafer 100, a carrier 102, and a lens portion 104. The carrier 102 is used to carry the light-emitting diode wafer 100, and the light-emitting diode wafer 100 is electrically connected to the carrier 102 through the bonding wire 106. The lens part 104 can make the light emitted by the light-emitting diode wafer 100 from the light-emitting diode wafer 108 to be focused in the same direction after being refracted to reduce the scattering angle of the light.

12020TWF.PTD Page 8 200527708 V. Description of Invention (2) Degree. Please refer to FIG. 1A and FIG. 1B at the same time, because the light emitted by the light emitting diode wafer 100 may also be emitted from the rear of the package 1 1 4 as shown by the reference 1 1 0. Therefore, in order to concentrate all the light emitted from the light-emitting diode wafer 100 in the same direction, the conventional light-emitting diode package 114 further includes a reflective element 112, and the reflective element 112 is arranged on the light-emitting diode. The wafer 100 is behind the lens portion 104, and is connected to the lens portion 104, as shown in FIG. 1B. Then, a part of the light 108 emitted from the light-emitting diode wafer 100 can be reflected to the lens portion 104 through the reflective element 112, and then concentrated and emitted in the same direction by the refraction of the lens portion 104 to reduce the light scattering angle and increase Light output efficiency. Please refer to FIG. 2, the conventional light emitting diode lighting module is to arrange a plurality of the above light emitting diode packages 1 1 4 on the circuit board 2000 as the light source of the lighting module. However, in most lighting systems, it is often necessary to use multiple light-emitting diode wafers 100 simultaneously. However, it is generally known that a single light-emitting diode wafer 100 is individually packaged into a single light-emitting diode. The package 1 1 4, therefore, the light-emitting diode chips 100 arranged on the circuit board 200 are not closely arranged, so that the volume of the overall lighting module will vary with the number of light-emitting diode chips used. Increase and increase. When this light-emitting diode lighting module is applied to a smaller backlight module, it is often impossible to use a larger number of light-emitting diode chips due to the limitation of the volume, so that the brightness of the overall output of the lighting module (brightness) )restricted. In addition, in other applications, light-emitting diode lighting modules are often used.

12020TWF.PTD Page 9 200527708 V. Description of the invention (3) It is necessary to use multiple light-emitting diode wafers that can emit red, blue and green light at the same time to form mixed-color light and emit white light or other color light. The pitch of each light-emitting diode chip in a polar lighting module is too large, so the colored lights must be uniformly mixed with a large distance, otherwise the uniformity of the output white light will be unsatisfactory. However, with the trend of miniaturization of electrical products, the mixed light distance of various colors has been required to be shortened, so the conventional light-emitting diode lighting module cannot meet this trend. SUMMARY OF THE INVENTION Therefore, the object of the present invention is to provide a light emitting diode lighting module that can uniformly mix light within a short mixing distance to increase the uniformity of the white light emitted by the overall lighting module, while satisfying the small product size. Demand. Another object of the present invention is to provide a light emitting diode lighting module, which can enhance the brightness of the overall output of the lighting module through the improvement of light utilization efficiency. The present invention proposes a light emitting diode lighting module It includes a circuit board, a lighting group, and a reflector. Among them, the lighting group includes a plurality of lighting units arranged on a circuit board in an m X m array or an a X b array, and each lighting unit includes an η X η array or a c X d array. Most of the secondary lighting units and the carrier substrate. The supporting substrate is electrically connected to the circuit board, and each lighting unit includes a plurality of light-emitting diode wafers of different colors arranged in a p X p array or an e X f array on the supporting substrate. Among them, taking a secondary lighting unit with light emitting diode wafers arranged in a 2 × 2 array as an example, it includes

12020TWF.PTD Page 10 200527708 V. Description of the invention (4) A first light-emitting diode wafer, two second light-emitting diode wafers, and a third light-emitting diode wafer. In this array, the second light emitting diode wafers are not adjacent to each other, for example. In a preferred embodiment of the present invention, the above-mentioned light-emitting diode wafer is, for example, a flip-chip wafer. The reflection cover has a light exit section, and it is respectively arranged above the light emitting diode wafer corresponding to the supporting substrate, and the inner wall is a reflective curved surface for focusing the scattered light to the light exit section. Avoid light scattering, and make the light source of the lighting module an integrated light source to improve the light output efficiency and light directivity of the lighting module. In a preferred embodiment of the present invention, the light-emitting diode lighting module further includes a light guide plate disposed beside the light exit section of the reflection cover to guide the light and direct it to the same direction. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a detailed description is given below with reference to a preferred embodiment 'in conjunction with the accompanying drawings'. 3A of the first embodiment is a top view of a light-emitting diode lighting module in a preferred embodiment of the present invention, and FIG. 4A is a cross-section of the portion 1-1 ′ of FIG. 3A schematic diagram. Please refer to FIG. 3A and FIG. 4A at the same time. The light emitting diode lighting module includes a circuit board 3 0 0, a lighting group 3 2 2 and a reflecting cover 3 0 4. Among them, the lighting group 302 is configured on the circuit board 300, and the lighting group 302 includes a plurality of lighting units 308, and the lighting unit 308 is based on

12020TWF.PTD Page 11 200527708 V. Description of the invention (5) The array is arranged on the circuit board 300, for example, m 2 lighting units 308 are arranged on the circuit board in an array of m × m. On 3 0 0, or (a X b) lighting units 3 0 8 are arranged on the circuit board 3 0 in an a X b array. In a preferred embodiment of the present invention, the lighting units 3 0 8 are arranged on the circuit board 3 3 in an array manner of 3 × 3, for example. Of course, those skilled in the art should know after referring to the present invention that the present invention can also arrange the lighting units 308 on the circuit board 300 in other arrays. The array arrangement of m × m is not the present invention. The only option. FIG. 3B is a schematic diagram of the configuration of each light emitting diode chip in a single lighting unit of the light emitting diode lighting module in a preferred embodiment of the present invention. Please refer to FIG. 3B and FIG. 4A at the same time. Each lighting unit 308 further includes a supporting substrate 3 10 and secondary lighting units 312 arranged in an array. The length and width of the carrier substrate 310 are, for example, between 100 mi 1 and 110 mi 1, and are electrically connected to the circuit board 300 by, for example, a bonding wire 300. The sub-illumination units 3 1 2 are arranged, for example, in an array manner of η X η, or in an array manner of c X d. In a preferred embodiment of the present invention, the sub-illumination units 3 1 2 are arranged in a 2 × 2 array, for example. Following the above, the arrangement of the secondary lighting units 3 1 2 and the size of the carrier substrate 3 1 0 are merely examples, and are not intended to limit the present invention. In this embodiment, the secondary lighting unit 3 1 2 includes a plurality of light-emitting diode wafers 3 1 4 of different colors, for example, it includes p 2 light-emitting diode wafers 3 1 4. The array is arranged on the supporting substrate 3 丨, or the (e X f) light emitting diode wafers 3 丨 4 are arranged on the supporting substrate 3 1 0 in an e x f array, and for example Is by welding wire (not shown

12020TWF.PTD Page 12 200527708 V. Description of the invention (6)) Electrical connection with the carrier substrate 3 1 0. In a preferred embodiment of the present invention, the photodiode wafers 3 1 4 are arranged on the supporting substrate 3 1 0 in a 2 × 2 array, for example. Taking a 2 x 2 light emitting diode wafer 3 1 4 array as an example, it is composed of, for example, one red light emitting diode wafer, two green light emitting diode wafers G, and one blue light emitting diode wafer. The arrangement is, for example, that two green light emitting diode wafers G are not adjacent. Moreover, in another preferred embodiment of the present invention, the above-mentioned light emitting diode wafer may also be a flip-chip wafer. FIG. 4B is a partially enlarged schematic diagram of part A in FIG. 4A. Please refer to FIG. 4B. A bump 3 1 8 is formed on the light-emitting diode wafer 3 1 4 and a bump 3 1 8 is formed. The material is, for example, a metal material or other conductive materials. The light-emitting diode wafer 3 1 4 formed with the bumps 3 18 is arranged on the carrier substrate 3 1 0 in an upside-down manner, and is electrically connected to the carrier substrate 310 through the bumps 318. In addition, the carrier substrate 308 is electrically connected to the circuit board 300 through a bonding wire 306. FIG. 5 is a top view of a lighting unit in a preferred embodiment of the present invention. Please refer to FIG. 5 and FIG. 4A at the same time. The reflection cover 3 0 4 is corresponding to the supporting substrate 310 and is respectively arranged on the light emitting diode. Above the body wafer 314, there is a light exit section 316. The distance between the light exit section 316 and the light-emitting diode wafer 3 10 is, for example, between 10 mm and 20 mm. In addition, the material of the reflection cover 300 is, for example, a metal material or other material capable of reflecting light, and the inner wall thereof is, for example, an ellipsoidal curved surface. When the light-emitting diode wafer 3 1 4 emits light when stimulated by voltage, its light will be emitted from all directions, and the light scattered to the inner wall of the reflector will be reflected by the ellipsoidal reflection curved surface to change the course of travel. Therefore, this ellipsoidal reflection surface can focus the divergent light ill __ 关 关 画 _ 11 ΙΙΙϋ · Ι I 11 12020TWF.PTD Page 13 200527708 V. Description of the invention (7) Concentrated and emitted through the light exit section 316. Each lighting unit of the present invention is provided with an array of secondary lighting units, and the secondary lighting units are further configured with a plurality of light emitting diode wafers of different colors arranged in an array. Because these light emitting diode wafers are arranged It is compact, so the light emitting diode lighting module of the present invention has a smaller size than the conventional one under the same output luminous flux. Even if it is applied to a smaller backlight module, it can be configured in the same volume as the conventional one. More light-emitting diode chips can avoid the problem of insufficient output brightness. In addition, each lighting unit can independently display uniformly mixed white light, so that each lighting unit has a better white balance than conventional, and can avoid uneven color tone. In addition, in the present invention, the brightness of each color light emitting diode in the secondary lighting unit can be adjusted, so that the light emitting diode lighting module can emit expected white light, and there is room for adjustment in color temperature. In particular, the present invention is provided with a reflecting cover above each lighting unit, so that 80% of the emitted light can be concentrated within a scattering angle of, for example, ± 30 degrees, so as to avoid the light scattering phenomenon and reduce the lighting efficiency. It can improve the light directivity of the lighting module. In addition, the present invention uses a lighting unit as a package, and each lighting unit includes a plurality of light-emitting diode chips, and a single light-emitting diode chip in the conventional art is a package. In comparison, the light emitting diode lighting module of the present invention can not only output a larger luminance with a smaller volume, but also increase the light directivity of the light emitting diode lighting module.

12020TWF.PTD Page 14 200527708 V. Description of the invention (8) Second embodiment The above-mentioned light-emitting diode lighting module can be applied to a direct-type backlight module of a non-self-emitting display. Please also refer to FIG. 6 And FIG. 5, the light emitting diode lighting module 600 includes a circuit board 300, an illumination group 300, and a reflection cover 300. The lighting group 302 is arranged on the circuit board 300, and the lighting group 302 is composed of a plurality of lighting units 308, and the lighting unit 308 is arranged on the circuit board in an array. 3 0 0 on. Each lighting unit 308 further includes a secondary lighting unit 312 and a supporting substrate 310 arranged in an array. The length and width of the carrier substrate 310 are, for example, between 100mi 1 and 1 1 Omi 1, and they are electrically connected to the circuit board 300 by a bonding wire 3 06, for example. The secondary lighting unit 3 1 2 is formed by arranging a plurality of light emitting diode wafers 3 1 4 of different colors. Each illumination unit 3 1 2 includes, for example, one red light emitting diode wafer, two green light emitting diode wafers G, and one blue light emitting diode wafer, and is arranged in a 2 × 2 array on the carrier. The substrate 3 10 is arranged in a manner such that the two green light emitting diode wafers G are not adjacent to each other. The reflecting covers 3 0 4 are respectively arranged above the light emitting diode wafer 314 corresponding to the supporting substrate 3 1 0 and have a light exit section 316. A liquid crystal display panel 6 0 2 is arranged above the light emitting section 3 1 6. When the light of the light emitting diode lighting module 6 0 0 is irradiated to the liquid crystal display panel 60 2, the liquid crystal layer ( (Not shown) to control the amount of light that can pass through each day element, and then control its brightness. The light-emitting diode lighting module of the present invention can be further applied to a side-light-type backlight module of a non-self-emitting display. Please refer to Figure 7

12020TWF.PTD Page 15 200527708

The diode lighting module 700 includes a circuit board 300, a lighting group 3002, and a reflector 300. Among them, the lighting group 3002 is arranged on the circuit board 300, and the lighting group 3002 includes a plurality of lighting units 300, and the lighting unit 300 is arranged on the circuit board in an array. 3 00. Each lighting unit 3 0 8 further includes secondary lighting units 3 丨 2 arranged in an array and a supporting substrate 310 °, wherein the length and width of the 'supporting substrate 31 〇 is, for example, between 100mi 1 and 110mi 1. And, for example, it is electrically connected to the circuit board 300 by a bonding wire 300. The secondary lighting units 3 丨 2 are formed by arranging a plurality of light-emitting diode wafers 3 1 4 of different colors in an array. Each illumination unit 3 1 2 includes, for example, one red light emitting diode wafer, two green light emitting diode wafers G, and one blue light emitting diode wafer, and is arranged in a 2 × 2 array on the carrier. The two substrates 3 and 0 are arranged in a manner such that the two green light emitting diode wafers G are not adjacent to each other.

The reflecting cover 3 0 4 is respectively disposed above the light emitting diode wafer 314 corresponding to the supporting substrate 3 1 0 and has a light emitting cross section 316. A light guide plate 7 0 4 is arranged beside the light exit section 3 1 6, which is, for example, a wedge-shaped plate or a parallel plate. The light emitted by the light-emitting diode lighting module 7 0 0 is transmitted to the inside of the light guide plate 704 through the light incident surface 706 of the light guide plate 704, and the bottom inner surface is, for example, a diffusion surface 7 1 0, which can illuminate the light to The light at the bottom is diffused to be emitted from the light exit surface 7 0 8 of the light guide plate 7 0 4. The liquid crystal display panel 7 0 2 is arranged above the light guide plate 70 4. When the light guide plate 7 0 4 directs the light emitted by the light emitting diode lighting module 7 0 0 to the top and illuminates the liquid crystal display panel 7 0 2 At that time, the liquid crystal layer (not shown) in the liquid crystal display is used to control the amount of light that can pass through each day element, thereby controlling its

12020TWF.PTD Page 16 200527708 V. Description of invention (ί) Brightness and darkness. As mentioned in the foregoing example, the conventional fluorescent tube is replaced by the light-emitting diode lighting module of the present invention as a backlight module of a non-self-emitting display, which can make the display output more uniform white light and have a larger Brightness can reduce light loss and improve the light output efficiency of the display. Although the present invention has been disclosed in the preferred embodiment as above, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and retouching without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall be determined by the scope of the attached patent application.

12020TWF.PTD Page 17 200527708 Brief Description of Drawings Figures 1A and 1B show the structure of a single light-emitting diode package in a conventional light-emitting diode lighting module. Fig. 2 is a schematic diagram showing the structure of a single package in a conventional light emitting diode lighting module. Figure 3A is a top view of a light emitting diode lighting module in a preferred embodiment of the present invention. FIG. 3B is a schematic diagram of the configuration of each light emitting diode chip in a single lighting unit of the light emitting diode lighting module in a preferred embodiment of the present invention. FIG. 4A is a schematic cross-sectional view of I-Γ in FIG. 3A. FIG. 4B is a partially enlarged schematic diagram of part A in FIG. 4A. Fig. 5 is a top view of a lighting unit in a preferred embodiment of the present invention. Fig. 6 is a schematic diagram showing the application of the light emitting diode lighting module of the present invention to a direct type backlight module. FIG. 7 is a schematic diagram of a light-emitting diode lighting module of the present invention applied to a side-light-type backlight module. [Illustration of diagrammatic symbols] 1 0 0: light emitting diode 1 0 2: reflective element 1 0 4: refractive element 1 0 6: light path 200, 300: circuit board 3 0 2: lighting group 3 0 4: reflection cover

12020TWF.PTD Page 18 200527708 Brief description of the drawings 306: Welding wire 3 0 8: Lighting unit 3 1 0: Carrying substrate 3 1 2 · Sub-lighting unit 3 1 4, 3 1 4 a: Light-emitting diode wafer 316: light emitting section 3 1 8: bump 320: solder pad 6 0, 7 0 0: light emitting diode lighting module 602, 702: display panel 7 04: light guide plate _

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Claims (1)

200527708 Including the group model photo, body pole, two-light hair type Fan Yili Zhuan 1 Please ask the sixth group of the package group, group Ming Ming, to take photos of this, each board on the previous board and K * > g > ^ 13, The yuan is placed in a single set of licenses, and •, the array of plates is arranged in a row, and the array of electric arrays is one by one, which contains the hair hood and the set of shots. The pole is one, and the two are, the sheet is light and the crystal base hair, the board carries some source electrodes to support the photoelectricity, so that the light should be natural and responsive, and the opposite party will distribute the light. , The color mask film and the same material lens to the base is not as good as the anti body means to carry a uniform number, the number of even more than the number of light-emitting materials on the basis of the light out of the body pole two light Item 11 No. ο Fan Fanli intercepts the special shot and asks Zhongguang Ruyi 2 to have Jver to weld the line to the connection line. The number of welding bars should be more complex, including the electric package. The material group base includes the enveloping fan group. # Specially, please apply as described in the above. Yuan Shanming looks like a model. The description of the power generation on the upper second board light path is described in the listed item br 11 as the formula. Ί ί Column J _ 卩 卩 Special L m, please refer to X in m, as shown in the 4 series of yuan. In the above, the single-channel Mingdian photo of the Yuan Yuan includes the 纟 Λ as the package, the group Γ, and the group U 歹 明 #-according to the 3 of X and 3, which are included in the group to cover the first order Γ and surround the Ming. X Fanzhao U specifically asks the department to ask for one yuan to apply for each order as described in the Ming and Ming Dynasty, and the second group of these light-emitting statements are listed as follows: IF formulas are listed as the extremes of bn. The body should be on the board 12020TWF.PTD Page 20 200527708 6. Scope of Patent Application 6 · The light-emitting diode lighting module described in item 3 of the scope of patent application, wherein each of these lighting units includes 4 secondary lighting units, and The lighting units are arranged on the circuit board in a 2 × 2 array. 7. The light-emitting diode lighting module according to item 6 of the scope of the patent application, wherein each of these lighting units includes p 2 light-emitting diode chips, and the light-emitting diode chips are made of PXP. The array is arranged on the supporting substrate. 8 · The light-emitting diode lighting module according to item 6 of the scope of the patent application, wherein each of these lighting units includes 4 light-emitting diode wafers, and the light-emitting diode wafers are 2 X 2 The array is arranged on the supporting substrate. 9. · The light-emitting diode lighting module according to item 6 of the scope of the patent application, wherein each of these lighting units includes: a first-color light-emitting diode wafer; two second-color light-emitting diodes A wafer; and a third color light emitting diode wafer, wherein the first color light emitting diode wafer, the second color light emitting diode wafers, and the third color light emitting diode wafer are 2 X 2 The array is arranged on the supporting substrate, and the second light-emitting diode wafers are not adjacent to each other. 10. The light-emitting diode lighting module according to item 9 in the scope of the patent application, wherein the first color light-emitting diode chip is a red light-emitting diode chip, and the second color light-emitting diode chips The wafer is a green light emitting diode wafer, and the third color light emitting diode wafer is a blue light emitting diode wafer. 12020TWF.PTD Page 21 200527708 VI. Patent application scope 1 1. The light-emitting diode lighting module described in item 1 of the patent application scope, wherein the lighting group includes (a X b) lighting units, and the The lighting units are arranged on the circuit board in an axb array. 1 2. The light-emitting diode lighting module according to item 11 of the scope of patent application, wherein each of these lighting units includes (c X d) secondary lighting units, and the secondary lighting units are based on c X The array of d is arranged on the circuit board. 1 3. The light-emitting diode lighting module according to item 12 of the scope of the patent application, wherein each of these secondary lighting units includes (e X f) light-emitting diode chips, and the light-emitting diodes The wafers are arranged on the carrier substrate in an e X f array. 1 4. The light-emitting diode lighting module according to item 1 of the scope of the patent application, wherein each of the plurality of reflectors has an ellipsoidal reflection curved surface. 1 5. The light-emitting diode lighting module according to item 1 of the scope of the patent application, wherein the distance between the light-emitting sections of the reflectors and the light-emitting diodes is between 10 mm and Between 20 mm. 1 6. The light-emitting diode lighting module described in item 1 of the scope of patent application, wherein the length of each of these carrier substrates is between 100 mil (mi 1) to 1 1 0 mil (mi 1 ), And the width of each of the supporting substrates is between 100 mils and 110 mils. 1 7. The light-emitting diode lighting module according to item 1 of the scope of patent application, wherein each of the light-emitting diode wafers includes a flip-chip type wafer. 1 8. The light-emitting diode lighting module according to item 1 of the scope of patent application, further comprising a light guide plate, and the light emitted from the reflectors is arranged. 12020TWF.PTD Page 22 200527708 6. Scope of patent application Next to the cross section. imi 12020TWF.PTD Page 23