TW200512476A - In-situ detection of thin-metal interface using optical interference via a dynamically updated reference - Google Patents
In-situ detection of thin-metal interface using optical interference via a dynamically updated referenceInfo
- Publication number
- TW200512476A TW200512476A TW092126205A TW92126205A TW200512476A TW 200512476 A TW200512476 A TW 200512476A TW 092126205 A TW092126205 A TW 092126205A TW 92126205 A TW92126205 A TW 92126205A TW 200512476 A TW200512476 A TW 200512476A
- Authority
- TW
- Taiwan
- Prior art keywords
- spectrum data
- data sample
- reflected spectrum
- optical interference
- thin
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title abstract 2
- 238000001514 detection method Methods 0.000 title 1
- 238000011065 in-situ storage Methods 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
- 238000001228 spectrum Methods 0.000 abstract 8
- 238000000034 method Methods 0.000 abstract 4
- 238000010606 normalization Methods 0.000 abstract 2
- 238000005498 polishing Methods 0.000 abstract 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
An invention for detecting an endpoint during a chemical mechanical polishing (CMP) process is provided. A reflected spectrum data sample is received that corresponds to a plurality of spectrums of light reflected from an illuminated portion of the surface of a wafer. The reflected spectrum data sample is normalized using a normalization reference comprising a first reflected spectrum data sample obtained earlier during the CMP process. In addition, the normalization reference is updated during the process using a second reflected spectrum data sample obtained earlier during the CMP process. The second reflected spectrum data sample is obtained after the first reflected spectrum data sample. In this manner, an endpoint is determined based on optical interference occurring in the reflected spectrum data.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/976,442 US6812478B2 (en) | 2001-03-19 | 2001-10-12 | In-situ detection of thin-metal interface using optical interference via a dynamically updated reference |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI227333B TWI227333B (en) | 2005-02-01 |
| TW200512476A true TW200512476A (en) | 2005-04-01 |
Family
ID=35696339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW92126205A TWI227333B (en) | 2001-10-12 | 2003-09-23 | In-situ detection of thin-metal interface using optical interference via a dynamically updated reference |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI227333B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI784719B (en) * | 2016-08-26 | 2022-11-21 | 美商應用材料股份有限公司 | Method of obtaining measurement representative of thickness of layer on substrate, and metrology system and computer program product |
| US12288724B2 (en) | 2021-03-04 | 2025-04-29 | Applied Materials, Inc. | Region classification of film non-uniformity based on processing of substrate images |
-
2003
- 2003-09-23 TW TW92126205A patent/TWI227333B/en not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI784719B (en) * | 2016-08-26 | 2022-11-21 | 美商應用材料股份有限公司 | Method of obtaining measurement representative of thickness of layer on substrate, and metrology system and computer program product |
| US11682114B2 (en) | 2016-08-26 | 2023-06-20 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
| US12148148B2 (en) | 2016-08-26 | 2024-11-19 | Applied Materials, Inc. | Thickness measurement of substrate using color metrology |
| US12288724B2 (en) | 2021-03-04 | 2025-04-29 | Applied Materials, Inc. | Region classification of film non-uniformity based on processing of substrate images |
| US12322659B2 (en) | 2021-03-04 | 2025-06-03 | Applied Materials, Inc. | Pixel classification of film non-uniformity based on processing of substrate images |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI227333B (en) | 2005-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |