TW200511640A - Miniature RF and microwave components and methods for fabricating such components - Google Patents
Miniature RF and microwave components and methods for fabricating such componentsInfo
- Publication number
- TW200511640A TW200511640A TW093116127A TW93116127A TW200511640A TW 200511640 A TW200511640 A TW 200511640A TW 093116127 A TW093116127 A TW 093116127A TW 93116127 A TW93116127 A TW 93116127A TW 200511640 A TW200511640 A TW 200511640A
- Authority
- TW
- Taiwan
- Prior art keywords
- components
- operations
- radiation
- depositions
- miniature
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000000151 deposition Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- 238000003491 array Methods 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000005137 deposition process Methods 0.000 abstract 1
- 238000004070 electrodeposition Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US47655403P | 2003-06-06 | 2003-06-06 | |
| US10/607,931 US7239219B2 (en) | 2001-12-03 | 2003-06-27 | Miniature RF and microwave components and methods for fabricating such components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200511640A true TW200511640A (en) | 2005-03-16 |
| TWI244799B TWI244799B (en) | 2005-12-01 |
Family
ID=37154900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW93116127A TWI244799B (en) | 2003-06-06 | 2004-06-04 | Miniature RF and microwave components and methods for fabricating such components |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI244799B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113131111A (en) * | 2021-04-17 | 2021-07-16 | 中国人民解放军国防科技大学 | W-band-pass filter |
| TWI893846B (en) * | 2024-01-31 | 2025-08-11 | 台揚科技股份有限公司 | Microwave device |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI238513B (en) | 2003-03-04 | 2005-08-21 | Rohm & Haas Elect Mat | Coaxial waveguide microstructures and methods of formation thereof |
| KR101476438B1 (en) | 2006-12-30 | 2014-12-24 | 누보트로닉스, 엘.엘.씨 | Three Dimensional Microstructure and Formation Method |
| US7898356B2 (en) | 2007-03-20 | 2011-03-01 | Nuvotronics, Llc | Coaxial transmission line microstructures and methods of formation thereof |
| EP3104450A3 (en) | 2007-03-20 | 2016-12-28 | Nuvotronics, LLC | Integrated electronic components and methods of formation thereof |
| US20110123783A1 (en) | 2009-11-23 | 2011-05-26 | David Sherrer | Multilayer build processses and devices thereof |
| US8917150B2 (en) | 2010-01-22 | 2014-12-23 | Nuvotronics, Llc | Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels |
| US8866300B1 (en) | 2011-06-05 | 2014-10-21 | Nuvotronics, Llc | Devices and methods for solder flow control in three-dimensional microstructures |
| US8814601B1 (en) | 2011-06-06 | 2014-08-26 | Nuvotronics, Llc | Batch fabricated microconnectors |
| US9993982B2 (en) | 2011-07-13 | 2018-06-12 | Nuvotronics, Inc. | Methods of fabricating electronic and mechanical structures |
| US9325044B2 (en) | 2013-01-26 | 2016-04-26 | Nuvotronics, Inc. | Multi-layer digital elliptic filter and method |
| US9306254B1 (en) | 2013-03-15 | 2016-04-05 | Nuvotronics, Inc. | Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration |
| US9306255B1 (en) | 2013-03-15 | 2016-04-05 | Nuvotronics, Inc. | Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other |
| EP3095159A4 (en) | 2014-01-17 | 2017-09-27 | Nuvotronics, Inc. | Wafer scale test interface unit: low loss and high isolation devices and methods for high speed and high density mixed signal interconnects and contactors |
| TWI573316B (en) * | 2014-07-22 | 2017-03-01 | 絡達科技股份有限公司 | Wide band directional coupler |
| US10847469B2 (en) | 2016-04-26 | 2020-11-24 | Cubic Corporation | CTE compensation for wafer-level and chip-scale packages and assemblies |
| US10511073B2 (en) | 2014-12-03 | 2019-12-17 | Cubic Corporation | Systems and methods for manufacturing stacked circuits and transmission lines |
| TWI633712B (en) * | 2017-05-16 | 2018-08-21 | 財團法人工業技術研究院 | Three-dimension butler matrix |
| US10319654B1 (en) | 2017-12-01 | 2019-06-11 | Cubic Corporation | Integrated chip scale packages |
-
2004
- 2004-06-04 TW TW93116127A patent/TWI244799B/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113131111A (en) * | 2021-04-17 | 2021-07-16 | 中国人民解放军国防科技大学 | W-band-pass filter |
| TWI893846B (en) * | 2024-01-31 | 2025-08-11 | 台揚科技股份有限公司 | Microwave device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI244799B (en) | 2005-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |