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TW200519969A - Conductive paste - Google Patents

Conductive paste

Info

Publication number
TW200519969A
TW200519969A TW093132354A TW93132354A TW200519969A TW 200519969 A TW200519969 A TW 200519969A TW 093132354 A TW093132354 A TW 093132354A TW 93132354 A TW93132354 A TW 93132354A TW 200519969 A TW200519969 A TW 200519969A
Authority
TW
Taiwan
Prior art keywords
conductive paste
conductive filler
conductive
binder resin
filler
Prior art date
Application number
TW093132354A
Other languages
Chinese (zh)
Inventor
Takashi Kondo
Hiroshi Tachika
Original Assignee
Toyo Boseki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Boseki filed Critical Toyo Boseki
Publication of TW200519969A publication Critical patent/TW200519969A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

To provide a conductive paste which can achieve excellent migration property and increase the concentration of the solid components therein. To provide a conductive paste characterized in comprising a binder resin and a conductive filler, wherein the conductive filler is a polygonal metal powder (A) consisting of more than 6 planes. Further, to provide another conductive paste comprising a binder resin and a conductive filler, wherein a part or all of the conductive filler is a silver powder (B) having the width of the half peak of lower than 0.31 at the diffraction angle position of 38.05 DEG as measured in the X-ray diffraction.
TW093132354A 2003-10-27 2004-10-26 Conductive paste TW200519969A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003365423 2003-10-27
JP2004060278 2004-03-04
JP2004066637 2004-03-10
JP2004092312 2004-03-26

Publications (1)

Publication Number Publication Date
TW200519969A true TW200519969A (en) 2005-06-16

Family

ID=34528114

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093132354A TW200519969A (en) 2003-10-27 2004-10-26 Conductive paste

Country Status (3)

Country Link
JP (1) JPWO2005041213A1 (en)
TW (1) TW200519969A (en)
WO (1) WO2005041213A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI709627B (en) * 2015-09-30 2020-11-11 日商同和電子科技有限公司 Electroconductive paste and electroconductive film

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7982129B2 (en) * 2005-08-15 2011-07-19 Konarka Technologies, Inc. Photovoltaic cells with interconnects to external circuit
WO2007037440A1 (en) 2005-09-29 2007-04-05 Alpha Scientific, Corporation Conductive powder and process for producing the same, conductive powder paste, and process for producing the conductive powder paste
CN102696075B (en) * 2010-01-08 2015-11-25 东洋纺织株式会社 Conductive paste and metallic film
JP5488282B2 (en) 2010-07-13 2014-05-14 昭栄化学工業株式会社 Conductive paste
US20120119163A1 (en) * 2010-11-17 2012-05-17 E. I. Du Pont De Nemours And Company Solderable polymer thick film silver electrode composition for use in thin-film photovoltaic cells and other applications
JP5773292B2 (en) * 2012-07-20 2015-09-02 東洋紡株式会社 Conductive paste, conductive thin film and conductive laminate for laser etching
WO2014103569A1 (en) * 2012-12-25 2014-07-03 住友金属鉱山株式会社 Conductive adhesive composition and electronic element using same
EP2986682B1 (en) * 2013-04-17 2021-10-20 Henkel AG & Co. KGaA Electrically conductive inks
WO2017057201A1 (en) * 2015-09-30 2017-04-06 Ｄｏｗａエレクトロニクス株式会社 Conductive paste and conductive film
JP7122528B2 (en) * 2017-08-09 2022-08-22 パナソニックＩｐマネジメント株式会社 THERMALLY CONDUCTIVE COMPOSITION AND SEMICONDUCTOR DEVICE
US12441896B2 (en) 2022-04-27 2025-10-14 Fujikura Kasei Co., Ltd. Conductive coating material and circuit former

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2767729B2 (en) * 1992-06-30 1998-06-18 アルプス電気株式会社 Alloy powder, dispersion-type conductor using the alloy powder, and method for producing alloy powder
JPH09111317A (en) * 1995-10-16 1997-04-28 Tanaka Kikinzoku Kogyo Kk Method for producing fine silver powder
JP3429985B2 (en) * 1997-10-02 2003-07-28 三井金属鉱業株式会社 Method for producing silver powder composed of hexagonal plate-like crystal silver particles
JP4012961B2 (en) * 1998-06-10 2007-11-28 Ｄｏｗａエレクトロニクス株式会社 Production method of plate copper powder
JP2000001706A (en) * 1998-06-17 2000-01-07 Tanaka Kikinzoku Kogyo Kk High crystalline silver particles, method for producing the same, and conductive paste comprising high crystalline silver particles
JP2001226596A (en) * 2000-02-14 2001-08-21 Sumitomo Bakelite Co Ltd Conductive resin paste and semiconductor device manufactured using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI709627B (en) * 2015-09-30 2020-11-11 日商同和電子科技有限公司 Electroconductive paste and electroconductive film

Also Published As

Publication number Publication date
WO2005041213A1 (en) 2005-05-06
JPWO2005041213A1 (en) 2007-04-26

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