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TW200519238A - Electrolytic copper-stripping liquid and electrolytic stripping method - Google Patents

Electrolytic copper-stripping liquid and electrolytic stripping method

Info

Publication number
TW200519238A
TW200519238A TW093132148A TW93132148A TW200519238A TW 200519238 A TW200519238 A TW 200519238A TW 093132148 A TW093132148 A TW 093132148A TW 93132148 A TW93132148 A TW 93132148A TW 200519238 A TW200519238 A TW 200519238A
Authority
TW
Taiwan
Prior art keywords
electrolytic
stripping
copper
liquid
stripping liquid
Prior art date
Application number
TW093132148A
Other languages
Chinese (zh)
Other versions
TWI385283B (en
Inventor
Yoko Ogihara
Masao Nakazawa
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200519238A publication Critical patent/TW200519238A/en
Application granted granted Critical
Publication of TWI385283B publication Critical patent/TWI385283B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F5/00—Electrolytic stripping of metallic layers or coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

The present invention provides an electrolytic copper-stripping liquid free from a cyan compound, which comprises a copper compound or an aromatic nitro compound as a copper-oxidizing agent, and which has a pH of from 9 to 12. Also disclosed is an electrolytic stripping method using the electrolytic stripping liquid.
TW093132148A 2003-12-11 2004-10-22 Copper electrolytic stripping solution and electrolytic stripping method TWI385283B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003413387A JP4264338B2 (en) 2003-12-11 2003-12-11 Copper electrolytic stripping solution and electrolytic stripping method

Publications (2)

Publication Number Publication Date
TW200519238A true TW200519238A (en) 2005-06-16
TWI385283B TWI385283B (en) 2013-02-11

Family

ID=34650502

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093132148A TWI385283B (en) 2003-12-11 2004-10-22 Copper electrolytic stripping solution and electrolytic stripping method

Country Status (5)

Country Link
US (1) US20050126926A1 (en)
JP (1) JP4264338B2 (en)
KR (1) KR20050058184A (en)
CN (1) CN1626703A (en)
TW (1) TWI385283B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009108922A1 (en) * 2008-02-28 2009-09-03 Aeromet Technologies, Inc. Methods for removing precious metal-containing coatings and recovery of precious metals therefrom
US8506789B2 (en) 2009-07-23 2013-08-13 Ceramatec, Inc. Method of producing coupled radical products
US9957622B2 (en) 2009-07-23 2018-05-01 Field Upgrading Limited Device and method of obtaining diols and other chemicals using decarboxylation
CN103397373A (en) * 2010-06-25 2013-11-20 张红雨 Deplating solution
US9493882B2 (en) 2010-07-21 2016-11-15 Ceramatec, Inc. Custom ionic liquid electrolytes for electrolytic decarboxylation
EP2668250B1 (en) 2011-01-25 2019-04-24 Enlighten Innovations Inc. Production of fuel from chemicals derived from biomass
DE102011005918A1 (en) * 2011-03-22 2012-09-27 Airbus Operations Gmbh Peelable anodizing agent, especially for local anodic oxidation of metal surfaces
CN102168290B (en) * 2011-04-08 2012-10-17 哈尔滨工业大学 Cyanide-free silver plating electroplating solution and preparation method and electroplating method thereof
CN104404611B (en) * 2014-11-28 2016-11-30 江门市瑞期精细化学工程有限公司 A kind of release agent for electrolytic of copper alloy surface coating and preparation method thereof
WO2016147709A1 (en) 2015-03-13 2016-09-22 奥野製薬工業株式会社 Electrolytic stripping agent for jig
CN104882494B (en) * 2015-04-27 2017-02-22 中国科学院光电技术研究所 Film stripping process for removing silver reflective film with chromium-containing material as adhesive layer
CN105543948B (en) * 2015-12-23 2017-10-31 苏州卓融新能源科技有限公司 It is a kind of for PCB electroplate accompany plating plate/drag cylinder plate move back process for copper
KR102226075B1 (en) 2017-04-05 2021-03-11 단국대학교 산학협력단 A hydrogen gas filter using proton beam
CN109778299B (en) * 2019-02-22 2021-05-04 江门市瑞期精细化学工程有限公司 Electrolytic stripping agent for copper-plated layer on surface of iron base material, and preparation method and stripping process thereof
CN111487267B (en) * 2020-04-09 2023-04-14 哈尔滨工业大学 A method for peeling off double-layer oxide film defects in aluminum bronze alloy
CN113122906B (en) * 2021-03-23 2022-11-15 广州市睿承科技有限公司 Electric release oil synergist
CN113652694A (en) * 2021-06-24 2021-11-16 广东桐鸣环保科技有限公司 Copper plating layer stripping liquid and stripping method
KR102534371B1 (en) * 2021-08-30 2023-05-26 이강익 Portable Electrolytic polisher Using Neutral Salt Electrolyte

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2596307A (en) * 1947-11-05 1952-05-13 Charles Litzenberg Process of electrostripping electrodeposited metals
US4264420A (en) * 1979-10-29 1981-04-28 Oxy Metal Industries Corporation Electrolytic stripping bath and process
JPS6056800B2 (en) * 1982-08-11 1985-12-11 新光電気工業株式会社 Method for removing protruding parts of base copper plating in partial silver plating and method for finishing surface of silver plating
US7128825B2 (en) * 2001-03-14 2006-10-31 Applied Materials, Inc. Method and composition for polishing a substrate

Also Published As

Publication number Publication date
JP4264338B2 (en) 2009-05-13
KR20050058184A (en) 2005-06-16
TWI385283B (en) 2013-02-11
CN1626703A (en) 2005-06-15
US20050126926A1 (en) 2005-06-16
JP2005171320A (en) 2005-06-30

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees