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TW200517817A - Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator - Google Patents

Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator

Info

Publication number
TW200517817A
TW200517817A TW093134399A TW93134399A TW200517817A TW 200517817 A TW200517817 A TW 200517817A TW 093134399 A TW093134399 A TW 093134399A TW 93134399 A TW93134399 A TW 93134399A TW 200517817 A TW200517817 A TW 200517817A
Authority
TW
Taiwan
Prior art keywords
expansion tank
tank device
hole
cooling liquid
tank
Prior art date
Application number
TW093134399A
Other languages
Chinese (zh)
Other versions
TWI331270B (en
Inventor
Yoshinori Katada
Kazuo Taga
Original Assignee
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk filed Critical Showa Denko Kk
Publication of TW200517817A publication Critical patent/TW200517817A/en
Application granted granted Critical
Publication of TWI331270B publication Critical patent/TWI331270B/en

Links

Landscapes

  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An expansion tank device 14 comprises a tank installation base 16 having a cooling liquid channel 17 and an expansion tank 18 provided on the upper surface of the installation base 16. The base 16 has a communication hole 19 for holding space above the upper surface thereof in communication with the cooling liquid channel 17. The expansion tank 18 has a tank main body 21 including an upwardly bulging portion 22 having an opening at its lower end, and a bottom plate 23 joined to the lower end of the tank main body 21 for closing the lower-end opening of the bulging portion 22 and joined to the upper surface of the tank installation base 16. The bottom plate 23 is provided at a portion thereof corresponding to the communication hole 19 with a through hole 25 communicating with the communication hole 19. The bottom plate 23 is provided with a baffle plate 26 formed along the entire circumference of the inner peripheral edge thereof defining the through hole 25 and slanting upwardly toward the center of the through hole 25. The expansion tank device 14 removes the air in the cooling liquid from the circulating system, precludes the system from breaking and prevents the decrease in the amount of cooling liquid within the circulating system.
TW93134399A 2003-11-11 2004-11-11 Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator TWI331270B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003380876 2003-11-11
JP2003380869 2003-11-11
JP2004216732 2004-07-26

Publications (2)

Publication Number Publication Date
TW200517817A true TW200517817A (en) 2005-06-01
TWI331270B TWI331270B (en) 2010-10-01

Family

ID=45074638

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93134399A TWI331270B (en) 2003-11-11 2004-11-11 Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator

Country Status (1)

Country Link
TW (1) TWI331270B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116984840A (en) * 2023-08-22 2023-11-03 康耐拓(苏州)汽车技术有限公司 Cold plate production method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116984840A (en) * 2023-08-22 2023-11-03 康耐拓(苏州)汽车技术有限公司 Cold plate production method

Also Published As

Publication number Publication date
TWI331270B (en) 2010-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees