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TW200517026A - Composition and method for PCB possessing improved properties - Google Patents

Composition and method for PCB possessing improved properties

Info

Publication number
TW200517026A
TW200517026A TW092131700A TW92131700A TW200517026A TW 200517026 A TW200517026 A TW 200517026A TW 092131700 A TW092131700 A TW 092131700A TW 92131700 A TW92131700 A TW 92131700A TW 200517026 A TW200517026 A TW 200517026A
Authority
TW
Taiwan
Prior art keywords
epoxy
weight
parts
composition
cne
Prior art date
Application number
TW092131700A
Other languages
Chinese (zh)
Other versions
TWI231729B (en
Inventor
Hsuen-Te Chen
Hui-Chun Chuang
Gin-Go Fan
Wei-Huan Wang
Original Assignee
Taiwan Union Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Union Technology Corp filed Critical Taiwan Union Technology Corp
Priority to TW92131700A priority Critical patent/TWI231729B/en
Application granted granted Critical
Publication of TWI231729B publication Critical patent/TWI231729B/en
Publication of TW200517026A publication Critical patent/TW200517026A/en

Links

Landscapes

  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

A composition and method of epoxy resin for PCB possessing improved heat properties is provided. The composition comprises 100 parts by weight of epoxy, 2.2 to 3.5 parts by weight of Dicyandiamide curing agent, 0.01 to 1.0 parts by weight of catalyst and 3 to 30 parts by weight of CNE(Cresol Novolac Epoxy). CNE is a epoxy without halogen and possess three polymerized function group, which polymerize with linear epoxy and curing agent to form a network polymer structure. Therefore, the addition of CNE provides rising glass transition temperature of epoxy, decreasing Z-axis coefficient of expansion, improving heat or heat-shock resistance and anti-CAF.
TW92131700A 2003-11-12 2003-11-12 Composition and method for PCB possessing improved properties TWI231729B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92131700A TWI231729B (en) 2003-11-12 2003-11-12 Composition and method for PCB possessing improved properties

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92131700A TWI231729B (en) 2003-11-12 2003-11-12 Composition and method for PCB possessing improved properties

Publications (2)

Publication Number Publication Date
TWI231729B TWI231729B (en) 2005-04-21
TW200517026A true TW200517026A (en) 2005-05-16

Family

ID=36122061

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92131700A TWI231729B (en) 2003-11-12 2003-11-12 Composition and method for PCB possessing improved properties

Country Status (1)

Country Link
TW (1) TWI231729B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449721B (en) * 2010-04-20 2014-08-21 Taiwan Union Technology Corp Epoxy resin compositions and prepregs and printed circuit boards made thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449721B (en) * 2010-04-20 2014-08-21 Taiwan Union Technology Corp Epoxy resin compositions and prepregs and printed circuit boards made thereof

Also Published As

Publication number Publication date
TWI231729B (en) 2005-04-21

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Legal Events

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