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Application filed by Suntek Compound Semiconductor Co LtdfiledCriticalSuntek Compound Semiconductor Co Ltd
Priority to TW092118170ApriorityCriticalpatent/TW200502442A/en
Publication of TW200502442ApublicationCriticalpatent/TW200502442A/en
An electroplating apparatus includes a electroplating bath having an electroplating substance set opening, a meshed anode electrodes is set in the electroplating bath, a cathode electrodes connect a contact of electroplating substance is set around the electroplating substance set opening, and a turbulent flow member is set between the anode electrodes and electroplating substance. The turbulent flow member has a plurality of turbulent holes for adjusting the pressure uniformity of plating solution on the electroplating area of electroplating substance.