[go: up one dir, main page]

TW200500813A - Exposure apparatus and method, and method of producing device - Google Patents

Exposure apparatus and method, and method of producing device

Info

Publication number
TW200500813A
TW200500813A TW093104895A TW93104895A TW200500813A TW 200500813 A TW200500813 A TW 200500813A TW 093104895 A TW093104895 A TW 093104895A TW 93104895 A TW93104895 A TW 93104895A TW 200500813 A TW200500813 A TW 200500813A
Authority
TW
Taiwan
Prior art keywords
liquid
substrate
exposure apparatus
region
feeding
Prior art date
Application number
TW093104895A
Other languages
English (en)
Other versions
TWI361957B (zh
Inventor
Yasufumi Nishii
Soichi Owa
Hiroyuki Nagasaka
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200500813A publication Critical patent/TW200500813A/zh
Application granted granted Critical
Publication of TWI361957B publication Critical patent/TWI361957B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
    • H10P76/204—

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • User Interface Of Digital Computer (AREA)
TW093104895A 2003-02-26 2004-02-26 Exposure apparatus and method, and method of producing device TW200500813A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003049365 2003-02-26
JP2003110748 2003-04-15
JP2003320100 2003-09-11

Publications (2)

Publication Number Publication Date
TW200500813A true TW200500813A (en) 2005-01-01
TWI361957B TWI361957B (zh) 2012-04-11

Family

ID=33101941

Family Applications (6)

Application Number Title Priority Date Filing Date
TW100140676A TWI621923B (zh) 2003-02-26 2004-02-26 Exposure apparatus, exposure method, and component manufacturing method
TW107141889A TW201908879A (zh) 2003-02-26 2004-02-26 曝光裝置、曝光方法及元件製造方法
TW103143643A TWI591445B (zh) 2003-02-26 2004-02-26 Exposure apparatus, exposure method, and device manufacturing method
TW106102146A TW201719296A (zh) 2003-02-26 2004-02-26 曝光裝置、曝光方法及元件製造方法
TW093104895A TW200500813A (en) 2003-02-26 2004-02-26 Exposure apparatus and method, and method of producing device
TW101105430A TWI468876B (zh) 2003-02-26 2004-02-26 Exposure apparatus, exposure method, and device manufacturing method

Family Applications Before (4)

Application Number Title Priority Date Filing Date
TW100140676A TWI621923B (zh) 2003-02-26 2004-02-26 Exposure apparatus, exposure method, and component manufacturing method
TW107141889A TW201908879A (zh) 2003-02-26 2004-02-26 曝光裝置、曝光方法及元件製造方法
TW103143643A TWI591445B (zh) 2003-02-26 2004-02-26 Exposure apparatus, exposure method, and device manufacturing method
TW106102146A TW201719296A (zh) 2003-02-26 2004-02-26 曝光裝置、曝光方法及元件製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101105430A TWI468876B (zh) 2003-02-26 2004-02-26 Exposure apparatus, exposure method, and device manufacturing method

Country Status (9)

Country Link
US (15) US7268854B2 (zh)
EP (9) EP2945184B1 (zh)
JP (11) JP4640516B2 (zh)
KR (11) KR101442361B1 (zh)
CN (2) CN104678715B (zh)
HK (1) HK1247997A1 (zh)
SG (4) SG2012087615A (zh)
TW (6) TWI621923B (zh)
WO (1) WO2004086468A1 (zh)

Families Citing this family (148)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004053956A1 (ja) * 2002-12-10 2004-06-24 Nikon Corporation 露光装置及び露光方法、デバイス製造方法
EP2945184B1 (en) 2003-02-26 2017-06-28 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
KR20150036786A (ko) 2003-04-09 2015-04-07 가부시키가이샤 니콘 노광 방법 및 장치, 그리고 디바이스 제조 방법
KR101497289B1 (ko) 2003-04-10 2015-02-27 가부시키가이샤 니콘 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템
KR101724117B1 (ko) 2003-04-10 2017-04-06 가부시키가이샤 니콘 액침 리소그래피 장치용 진공 배출을 포함하는 환경 시스템
TWI612557B (zh) * 2003-05-23 2018-01-21 Nikon Corporation 曝光方法及曝光裝置以及元件製造方法
US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
EP1491956B1 (en) 2003-06-27 2006-09-06 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1494079B1 (en) * 2003-06-27 2008-01-02 ASML Netherlands B.V. Lithographic Apparatus
JP3862678B2 (ja) * 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
US6809794B1 (en) * 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
JP4515385B2 (ja) 2003-07-09 2010-07-28 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
KR101296501B1 (ko) 2003-07-09 2013-08-13 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
TWI245163B (en) * 2003-08-29 2005-12-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP2960702B1 (en) 2003-09-03 2017-02-22 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
JP4444920B2 (ja) 2003-09-19 2010-03-31 株式会社ニコン 露光装置及びデバイス製造方法
TWI628698B (zh) 2003-10-28 2018-07-01 尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造方法
US7528929B2 (en) * 2003-11-14 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TW201809801A (zh) 2003-11-20 2018-03-16 日商尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法、以及元件製造方法
TWI366219B (en) 2004-02-06 2012-06-11 Nikon Corp Polarization changing device, optical illumination apparatus, light-exposure apparatus and light-exposure method
DE102004013886A1 (de) 2004-03-16 2005-10-06 Carl Zeiss Smt Ag Verfahren zur Mehrfachbelichtung, Mikrolithografie-Projektionsbelichtungsanlage und Projektionssystem
KR101851511B1 (ko) 2004-03-25 2018-04-23 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
US7034917B2 (en) * 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
KR101330370B1 (ko) * 2004-04-19 2013-11-15 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
EP1747499A2 (en) 2004-05-04 2007-01-31 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN1954408B (zh) * 2004-06-04 2012-07-04 尼康股份有限公司 曝光装置、曝光方法及元件制造方法
US20070103661A1 (en) * 2004-06-04 2007-05-10 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8717533B2 (en) 2004-06-10 2014-05-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US20070222959A1 (en) * 2004-06-10 2007-09-27 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8373843B2 (en) 2004-06-10 2013-02-12 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
EP2605068A3 (en) 2004-06-10 2013-10-02 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8508713B2 (en) 2004-06-10 2013-08-13 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
CN100570822C (zh) 2004-06-10 2009-12-16 尼康股份有限公司 曝光装置、曝光方法、以及元件制造方法
US20070139628A1 (en) * 2004-06-10 2007-06-21 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
ATE476828T1 (de) * 2004-06-15 2010-08-15 Quantum Semiconductor Llc Mit mehreren seitenverhältnissen betreibbare abbildungseinrichtungen
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TW201804516A (zh) 2004-09-17 2018-02-01 日商尼康股份有限公司 曝光裝置、曝光方法及元件製造方法
US7133114B2 (en) 2004-09-20 2006-11-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI553703B (zh) 2004-11-18 2016-10-11 尼康股份有限公司 A position measuring method, a position control method, a measuring method, a loading method, an exposure method and an exposure apparatus, and a device manufacturing method
EP1821337B1 (en) * 2004-12-06 2016-05-11 Nikon Corporation Maintenance method
US7180571B2 (en) * 2004-12-08 2007-02-20 Asml Netherlands B.V. Lithographic projection apparatus and actuator
EP1837896B1 (en) 2004-12-15 2015-09-09 Nikon Corporation Substrate holding apparatus, exposure apparatus and device manufacturing method
EP1681597B1 (en) * 2005-01-14 2010-03-10 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US20090262316A1 (en) 2005-01-31 2009-10-22 Nikon Corporation Exposure apparatus and method for producing device
US8692973B2 (en) 2005-01-31 2014-04-08 Nikon Corporation Exposure apparatus and method for producing device
US7324185B2 (en) 2005-03-04 2008-01-29 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006261606A (ja) * 2005-03-18 2006-09-28 Canon Inc 露光装置、露光方法及びデバイス製造方法
JP4605219B2 (ja) 2005-03-30 2011-01-05 株式会社ニコン 露光条件の決定方法、露光方法及び露光装置、並びにデバイス製造方法
US20070132976A1 (en) * 2005-03-31 2007-06-14 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
TW200644079A (en) * 2005-03-31 2006-12-16 Nikon Corp Exposure apparatus, exposure method, and device production method
US7411654B2 (en) 2005-04-05 2008-08-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060232753A1 (en) 2005-04-19 2006-10-19 Asml Holding N.V. Liquid immersion lithography system with tilted liquid flow
KR101396620B1 (ko) 2005-04-25 2014-05-16 가부시키가이샤 니콘 노광 방법, 노광 장치, 및 디바이스 제조 방법
EP1876637A4 (en) 2005-04-28 2010-01-27 Nikon Corp EXPOSURE METHOD, EXPOSURE DEVICE AND COMPONENT MANUFACTURING METHOD
US7317507B2 (en) * 2005-05-03 2008-01-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8248577B2 (en) 2005-05-03 2012-08-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101544336B1 (ko) 2005-05-12 2015-08-12 가부시키가이샤 니콘 투영 광학계, 노광 장치 및 노광 방법
EP1895571A4 (en) 2005-06-21 2011-04-27 Nikon Corp EXPOSURE DEVICE, EXPOSURE METHOD, MAINTENANCE METHOD AND COMPONENT MANUFACTURING METHOD
US20070085989A1 (en) * 2005-06-21 2007-04-19 Nikon Corporation Exposure apparatus and exposure method, maintenance method, and device manufacturing method
US7170583B2 (en) * 2005-06-29 2007-01-30 Asml Netherlands B.V. Lithographic apparatus immersion damage control
WO2007004552A1 (ja) 2005-06-30 2007-01-11 Nikon Corporation 露光装置及び方法、露光装置のメンテナンス方法、並びにデバイス製造方法
JP5040653B2 (ja) 2005-08-23 2012-10-03 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
US7751026B2 (en) 2005-08-25 2010-07-06 Nikon Corporation Apparatus and method for recovering fluid for immersion lithography
KR20080059572A (ko) * 2005-10-07 2008-06-30 가부시키가이샤 니콘 광학 특성 계측 방법, 노광 방법 및 디바이스 제조 방법,그리고 검사 장치 및 계측 방법
WO2007055199A1 (ja) 2005-11-09 2007-05-18 Nikon Corporation 露光装置及び方法、並びにデバイス製造方法
US20070127002A1 (en) * 2005-11-09 2007-06-07 Nikon Corporation Exposure apparatus and method, and device manufacturing method
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
US7782442B2 (en) 2005-12-06 2010-08-24 Nikon Corporation Exposure apparatus, exposure method, projection optical system and device producing method
TW200725195A (en) 2005-12-06 2007-07-01 Nikon Corp Exposure method, exposure apparatus, and unit manufacturing method
KR20080071555A (ko) 2005-12-06 2008-08-04 가부시키가이샤 니콘 노광 장치, 노광 방법, 투영 광학계 및 디바이스 제조방법
EP1978546A4 (en) * 2005-12-28 2010-08-04 Nikon Corp EXPOSURE DEVICE, EXPOSURE METHOD AND COMPONENT MANUFACTURING METHOD
US8953148B2 (en) * 2005-12-28 2015-02-10 Nikon Corporation Exposure apparatus and making method thereof
KR101889245B1 (ko) 2006-01-19 2018-08-16 가부시키가이샤 니콘 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 패턴 형성 장치, 노광 방법 및 노광 장치, 그리고 디바이스 제조 방법
EP1986222A4 (en) 2006-02-16 2010-09-01 Nikon Corp EXPOSURE DEVICE, EXPOSURE METHOD AND COMPONENT MANUFACTURING METHOD
WO2007094431A1 (ja) 2006-02-16 2007-08-23 Nikon Corporation 露光装置、露光方法及びデバイス製造方法
EP1986223A4 (en) 2006-02-16 2010-08-25 Nikon Corp EXPOSURE APPARATUS, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
US7714982B2 (en) 2006-02-16 2010-05-11 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
CN101986209B (zh) 2006-02-21 2012-06-20 株式会社尼康 曝光装置、曝光方法及组件制造方法
SG178816A1 (en) 2006-02-21 2012-03-29 Nikon Corp Measuring apparatus and method, processing apparatus and method, pattern forming apparatus and method, exposure appararus and method, and device manufacturing method
EP3293577A1 (en) 2006-02-21 2018-03-14 Nikon Corporation Exposure apparatus, exposure method and device manufacturing method
WO2007102484A1 (ja) 2006-03-07 2007-09-13 Nikon Corporation デバイス製造方法、デバイス製造システム及び測定検査装置
WO2007105645A1 (ja) 2006-03-13 2007-09-20 Nikon Corporation 露光装置、メンテナンス方法、露光方法及びデバイス製造方法
JP4889331B2 (ja) * 2006-03-22 2012-03-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
WO2007119821A1 (ja) * 2006-04-14 2007-10-25 Nikon Corporation 露光方法及び露光装置、並びにデバイス製造方法
US9477158B2 (en) 2006-04-14 2016-10-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8477283B2 (en) 2006-05-10 2013-07-02 Nikon Corporation Exposure apparatus and device manufacturing method
SG175671A1 (en) 2006-05-18 2011-11-28 Nikon Corp Exposure method and apparatus, maintenance method and device manufacturing method
KR20090023335A (ko) * 2006-05-22 2009-03-04 가부시키가이샤 니콘 노광 방법 및 장치, 메인터넌스 방법, 그리고 디바이스 제조 방법
CN102156389A (zh) 2006-05-23 2011-08-17 株式会社尼康 维修方法、曝光方法及装置、以及组件制造方法
KR20090023545A (ko) 2006-05-31 2009-03-05 가부시키가이샤 니콘 노광 장치 및 노광 방법
EP2043134A4 (en) * 2006-06-30 2012-01-25 Nikon Corp MAINTENANCE METHOD, EXPOSURE METHOD, AND DEVICE AND DEVICE MANUFACTURING METHOD
US7826030B2 (en) * 2006-09-07 2010-11-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7872730B2 (en) 2006-09-15 2011-01-18 Nikon Corporation Immersion exposure apparatus and immersion exposure method, and device manufacturing method
KR101413891B1 (ko) 2006-09-29 2014-06-30 가부시키가이샤 니콘 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
US8253922B2 (en) * 2006-11-03 2012-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography system using a sealed wafer bath
US8208116B2 (en) 2006-11-03 2012-06-26 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography system using a sealed wafer bath
US20080158531A1 (en) * 2006-11-15 2008-07-03 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP5055971B2 (ja) 2006-11-16 2012-10-24 株式会社ニコン 表面処理方法及び表面処理装置、露光方法及び露光装置、並びにデバイス製造方法
US7948616B2 (en) 2007-04-12 2011-05-24 Nikon Corporation Measurement method, exposure method and device manufacturing method
JP2009033111A (ja) 2007-05-28 2009-02-12 Nikon Corp 露光装置、デバイス製造方法、洗浄装置、及びクリーニング方法並びに露光方法
US8164736B2 (en) * 2007-05-29 2012-04-24 Nikon Corporation Exposure method, exposure apparatus, and method for producing device
US8098362B2 (en) 2007-05-30 2012-01-17 Nikon Corporation Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method
US20080304025A1 (en) * 2007-06-08 2008-12-11 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for immersion lithography
US8194232B2 (en) 2007-07-24 2012-06-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, position control method and position control system, and device manufacturing method
US8547527B2 (en) 2007-07-24 2013-10-01 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and pattern formation apparatus, and device manufacturing method
TWI475336B (zh) 2007-07-24 2015-03-01 尼康股份有限公司 Mobile body driving method and moving body driving system, pattern forming method and apparatus, exposure method and apparatus, and component manufacturing method
US9304412B2 (en) 2007-08-24 2016-04-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, and measuring method
US8218129B2 (en) 2007-08-24 2012-07-10 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, device manufacturing method, measuring method, and position measurement system
US8237919B2 (en) 2007-08-24 2012-08-07 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method for continuous position measurement of movable body before and after switching between sensor heads
US8867022B2 (en) 2007-08-24 2014-10-21 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, and device manufacturing method
US20090051895A1 (en) * 2007-08-24 2009-02-26 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, device manufacturing method, and processing system
US8023106B2 (en) 2007-08-24 2011-09-20 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
WO2009050977A1 (en) 2007-10-16 2009-04-23 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
WO2009050976A1 (en) 2007-10-16 2009-04-23 Nikon Corporation Illumination optical system, exposure apparatus, and device manufacturing method
US8279399B2 (en) 2007-10-22 2012-10-02 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9013681B2 (en) * 2007-11-06 2015-04-21 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
CN101675500B (zh) * 2007-11-07 2011-05-18 株式会社尼康 曝光装置、曝光方法以及元件制造方法
US9256140B2 (en) * 2007-11-07 2016-02-09 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method with measurement device to measure movable body in Z direction
US8665455B2 (en) * 2007-11-08 2014-03-04 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
US8422015B2 (en) 2007-11-09 2013-04-16 Nikon Corporation Movable body apparatus, pattern formation apparatus and exposure apparatus, and device manufacturing method
US8711327B2 (en) * 2007-12-14 2014-04-29 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
KR20100102580A (ko) * 2007-12-17 2010-09-24 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
CN101681809B (zh) 2007-12-28 2012-04-25 株式会社尼康 曝光装置、曝光方法以及器件制造方法
NL1036715A1 (nl) * 2008-04-16 2009-10-19 Asml Netherlands Bv Lithographic apparatus.
CN105606344B (zh) 2008-05-28 2019-07-30 株式会社尼康 照明光学系统、照明方法、曝光装置以及曝光方法
US20100165309A1 (en) * 2008-07-10 2010-07-01 Nikon Corporation Deformation measuring apparatus, exposure apparatus, jig for the deformation measuring apparatus, position measuring method and device fabricating method
JP4922359B2 (ja) 2008-07-25 2012-04-25 エーエスエムエル ネザーランズ ビー．ブイ． 流体ハンドリング構造、リソグラフィ装置及びデバイス製造方法
US8384875B2 (en) 2008-09-29 2013-02-26 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US8619231B2 (en) 2009-05-21 2013-12-31 Nikon Corporation Cleaning method, exposure method, and device manufacturing method
JP2013509610A (ja) * 2009-10-29 2013-03-14 エルジー・ケム・リミテッド 低反射および高接触角を有する基板およびこの製造方法
EP2502115A4 (en) * 2009-11-20 2013-11-06 Pelican Imaging Corp RECORDING AND PROCESSING IMAGES THROUGH A MONOLITHIC CAMERA ARRAY WITH HETEROGENIC IMAGE CONVERTER
US9651873B2 (en) 2012-12-27 2017-05-16 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
US9057955B2 (en) 2013-01-22 2015-06-16 Nikon Corporation Functional film, liquid immersion member, method of manufacturing liquid immersion member, exposure apparatus, and device manufacturing method
US9352073B2 (en) 2013-01-22 2016-05-31 Niko Corporation Functional film
JP5979302B2 (ja) 2013-02-28 2016-08-24 株式会社ニコン 摺動膜、摺動膜が形成された部材、及びその製造方法
US20140292111A1 (en) * 2013-03-28 2014-10-02 Ebara Corporation Stage device and electron beam application apparatus
JP6649636B2 (ja) 2015-02-23 2020-02-19 株式会社ニコン 計測装置、リソグラフィシステム及び露光装置、並びにデバイス製造方法
TWI809882B (zh) 2015-02-23 2023-07-21 日商尼康股份有限公司 測量裝置、曝光裝置、微影系統、測量方法以及曝光方法
JP6719729B2 (ja) 2015-02-23 2020-07-08 株式会社ニコン 基板処理システム及び基板処理方法、並びにデバイス製造方法
CN119414669A (zh) 2016-08-24 2025-02-11 株式会社 尼康 测量系统及基板处理系统、以及元件制造方法
KR102625369B1 (ko) 2016-09-30 2024-01-15 가부시키가이샤 니콘 계측 시스템 및 기판 처리 시스템, 그리고 디바이스 제조 방법
JP7431597B2 (ja) * 2020-02-05 2024-02-15 キヤノン株式会社 振動制御装置、露光装置、および物品製造方法
JP2024155058A (ja) * 2023-04-20 2024-10-31 株式会社荏原製作所 膜厚測定装置、膜厚測定方法及び基板研磨装置

Family Cites Families (246)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1242527A (en) * 1967-10-20 1971-08-11 Kodak Ltd Optical instruments
US3573975A (en) 1968-07-10 1971-04-06 Ibm Photochemical fabrication process
ATE1462T1 (de) 1979-07-27 1982-08-15 Werner W. Dr. Tabarelli Optisches lithographieverfahren und einrichtung zum kopieren eines musters auf eine halbleiterscheibe.
FR2474708B1 (fr) 1980-01-24 1987-02-20 Dme Procede de microphotolithographie a haute resolution de traits
JPS5754317A (en) 1980-09-19 1982-03-31 Hitachi Ltd Method and device for forming pattern
US4346164A (en) * 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
US4509852A (en) * 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
US4390273A (en) 1981-02-17 1983-06-28 Censor Patent-Und Versuchsanstalt Projection mask as well as a method and apparatus for the embedding thereof and projection printing system
JPS57153433A (en) * 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPS58202448A (ja) 1982-05-21 1983-11-25 Hitachi Ltd 露光装置
DD206607A1 (de) 1982-06-16 1984-02-01 Mikroelektronik Zt Forsch Tech Verfahren und vorrichtung zur beseitigung von interferenzeffekten
JPS5919912A (ja) 1982-07-26 1984-02-01 Hitachi Ltd 液浸距離保持装置
DD242880A1 (de) 1983-01-31 1987-02-11 Kuch Karl Heinz Einrichtung zur fotolithografischen strukturuebertragung
DD221563A1 (de) * 1983-09-14 1985-04-24 Mikroelektronik Zt Forsch Tech Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur
DD224448A1 (de) 1984-03-01 1985-07-03 Zeiss Jena Veb Carl Einrichtung zur fotolithografischen strukturuebertragung
JPS6194342U (zh) 1984-11-27 1986-06-18
JPS6265326A (ja) * 1985-09-18 1987-03-24 Hitachi Ltd 露光装置
JPS62121417A (ja) 1985-11-22 1987-06-02 Hitachi Ltd 液浸対物レンズ装置
JPS63157419A (ja) 1986-12-22 1988-06-30 Toshiba Corp 微細パタ−ン転写装置
US5040020A (en) 1988-03-31 1991-08-13 Cornell Research Foundation, Inc. Self-aligned, high resolution resonant dielectric lithography
JPH0263664A (ja) 1988-08-31 1990-03-02 Keihin Seiki Mfg Co Ltd 真空ダイカスト装置
JPH069195B2 (ja) 1989-05-06 1994-02-02 大日本スクリーン製造株式会社 基板の表面処理方法
JPH03209479A (ja) 1989-09-06 1991-09-12 Sanee Giken Kk 露光方法
US5121256A (en) 1991-03-14 1992-06-09 The Board Of Trustees Of The Leland Stanford Junior University Lithography system employing a solid immersion lens
JPH04305915A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH04305917A (ja) 1991-04-02 1992-10-28 Nikon Corp 密着型露光装置
JPH0562877A (ja) 1991-09-02 1993-03-12 Yasuko Shinohara 光によるｌｓｉ製造縮小投影露光装置の光学系
JPH06188169A (ja) 1992-08-24 1994-07-08 Canon Inc 結像方法及び該方法を用いる露光装置及び該方法を用いるデバイス製造方法
JPH06124873A (ja) * 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
US5304759A (en) 1992-10-15 1994-04-19 Johnson Service Company Direct mount pressure control with a field adjustable trip point and reset point
JP2753930B2 (ja) * 1992-11-27 1998-05-20 キヤノン株式会社 液浸式投影露光装置
JP2520833B2 (ja) 1992-12-21 1996-07-31 東京エレクトロン株式会社 浸漬式の液処理装置
JPH07220990A (ja) * 1994-01-28 1995-08-18 Hitachi Ltd パターン形成方法及びその露光装置
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US5528118A (en) 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US7365513B1 (en) 1994-04-01 2008-04-29 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
US6989647B1 (en) 1994-04-01 2006-01-24 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
US5623853A (en) 1994-10-19 1997-04-29 Nikon Precision Inc. Precision motion stage with single guide beam and follower stage
US6008500A (en) 1995-04-04 1999-12-28 Nikon Corporation Exposure apparatus having dynamically isolated reaction frame
JPH08316125A (ja) 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
JPH08316124A (ja) * 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
US5661092A (en) 1995-09-01 1997-08-26 The University Of Connecticut Ultra thin silicon oxide and metal oxide films and a method for the preparation thereof
US6297871B1 (en) * 1995-09-12 2001-10-02 Nikon Corporation Exposure apparatus
WO1998009278A1 (en) 1996-08-26 1998-03-05 Digital Papyrus Technologies Method and apparatus for coupling an optical lens to a disk through a coupling medium having a relatively high index of refraction
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
JP4029183B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 投影露光装置及び投影露光方法
SG88823A1 (en) 1996-11-28 2002-05-21 Nikon Corp Projection exposure apparatus
JP4029182B2 (ja) 1996-11-28 2008-01-09 株式会社ニコン 露光方法
JP3728613B2 (ja) 1996-12-06 2005-12-21 株式会社ニコン 走査型露光装置の調整方法及び該方法を使用する走査型露光装置
JP2000505958A (ja) 1996-12-24 2000-05-16 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ２個の物品ホルダを有する二次元バランス位置決め装置及びこの位置決め装置を有するリソグラフ装置
US5815246A (en) 1996-12-24 1998-09-29 U.S. Philips Corporation Two-dimensionally balanced positioning device, and lithographic device provided with such a positioning device
JP3612920B2 (ja) 1997-02-14 2005-01-26 ソニー株式会社 光学記録媒体の原盤作製用露光装置
US6262796B1 (en) 1997-03-10 2001-07-17 Asm Lithography B.V. Positioning device having two object holders
JPH10255319A (ja) * 1997-03-12 1998-09-25 Hitachi Maxell Ltd 原盤露光装置及び方法
JP3747566B2 (ja) * 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
US5744294A (en) * 1997-04-30 1998-04-28 Eastman Kodak Company Radiographic element modified to provide protection from visual fatigue
JP3817836B2 (ja) * 1997-06-10 2006-09-06 株式会社ニコン 露光装置及びその製造方法並びに露光方法及びデバイス製造方法
US5900354A (en) * 1997-07-03 1999-05-04 Batchelder; John Samuel Method for optical inspection and lithography
US6563565B2 (en) * 1997-08-27 2003-05-13 Nikon Corporation Apparatus and method for projection exposure
AU1051999A (en) 1997-11-12 1999-05-31 Nikon Corporation Projection exposure apparatus
JPH11176727A (ja) * 1997-12-11 1999-07-02 Nikon Corp 投影露光装置
WO1999031717A1 (en) 1997-12-12 1999-06-24 Nikon Corporation Projection exposure method and projection aligner
US6208407B1 (en) 1997-12-22 2001-03-27 Asm Lithography B.V. Method and apparatus for repetitively projecting a mask pattern on a substrate, using a time-saving height measurement
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
AU4975499A (en) * 1998-07-08 2000-02-01 Bryan Maret Identifying and handling device tilt in a three-dimensional machine-vision image
KR19980081982A (ko) * 1998-08-11 1998-11-25 양승창 형광등 반사갓
JP2000058436A (ja) 1998-08-11 2000-02-25 Nikon Corp 投影露光装置及び露光方法
JP2000173884A (ja) * 1998-12-02 2000-06-23 Canon Inc デバイス製造装置および方法ならびにデバイス製造装置の配線・配管実装方法
US6377332B1 (en) * 1999-02-03 2002-04-23 Nikon Corporation Optical member for photolithography and photolithography apparatus
US6707529B1 (en) * 1999-02-12 2004-03-16 Nikon Corporation Exposure method and apparatus
AU2233900A (en) 1999-03-23 2000-09-28 Kaneka Corporation Photovoltaic module
TWI242111B (en) 1999-04-19 2005-10-21 Asml Netherlands Bv Gas bearings for use in vacuum chambers and their application in lithographic projection apparatus
JP2001021875A (ja) 1999-07-12 2001-01-26 Seiko Epson Corp 液晶装置及びこれを用いた投写型表示装置
WO2001027978A1 (en) 1999-10-07 2001-04-19 Nikon Corporation Substrate, stage device, method of driving stage, exposure system and exposure method
JP3679668B2 (ja) 1999-12-20 2005-08-03 キヤノン株式会社 インクジェット記録ヘッドの製造方法
US7187503B2 (en) * 1999-12-29 2007-03-06 Carl Zeiss Smt Ag Refractive projection objective for immersion lithography
US6995930B2 (en) * 1999-12-29 2006-02-07 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
JP2001272604A (ja) 2000-03-27 2001-10-05 Olympus Optical Co Ltd 液浸対物レンズおよびそれを用いた光学装置
US20020014403A1 (en) * 2000-04-07 2002-02-07 Eiichi Hoshino Method of fabricating reflective mask, and methods and apparatus of detecting wet etching end point and inspecting side etching amount
JP2002014005A (ja) 2000-04-25 2002-01-18 Nikon Corp 空間像計測方法、結像特性計測方法、空間像計測装置及び露光装置
US20020041377A1 (en) 2000-04-25 2002-04-11 Nikon Corporation Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method
WO2001084241A1 (en) 2000-05-03 2001-11-08 Silicon Valley Group, Inc. Non-contact seal using purge gas
US6488040B1 (en) 2000-06-30 2002-12-03 Lam Research Corporation Capillary proximity heads for single wafer cleaning and drying
JP3682914B2 (ja) 2000-07-31 2005-08-17 巌 秋月 データ通信システムおよびこれに用いるデータ処理装置、ブラウザを利用した接続維持方法、記録媒体
TW591653B (en) * 2000-08-08 2004-06-11 Koninkl Philips Electronics Nv Method of manufacturing an optically scannable information carrier
KR100866818B1 (ko) 2000-12-11 2008-11-04 가부시키가이샤 니콘 투영광학계 및 이 투영광학계를 구비한 노광장치
JP2002198286A (ja) * 2000-12-25 2002-07-12 Nikon Corp 露光装置
KR100555930B1 (ko) * 2001-01-19 2006-03-03 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치, 디바이스 제조방법 및 그 디바이스
KR20040007444A (ko) 2001-02-06 2004-01-24 가부시키가이샤 니콘 노광장치 및 노광방법, 그리고 디바이스 제조방법
US7095482B2 (en) * 2001-03-27 2006-08-22 Nikon Corporation Multiple system vibration isolator
WO2002091078A1 (en) 2001-05-07 2002-11-14 Massachusetts Institute Of Technology Methods and apparatus employing an index matching medium
JP2002333018A (ja) * 2001-05-09 2002-11-22 Canon Inc 流体軸受装置、およびこれを用いた露光装置ならびにデバイス製造方法
US6618205B2 (en) * 2001-05-14 2003-09-09 Pentax Corporation Endoscope objective optical system
JP2002343565A (ja) 2001-05-18 2002-11-29 Sharp Corp 有機ｌｅｄ表示パネルの製造方法、その方法により製造された有機ｌｅｄ表示パネル、並びに、その方法に用いられるベースフィルム及び基板
US6600547B2 (en) 2001-09-24 2003-07-29 Nikon Corporation Sliding seal
US20030091767A1 (en) 2001-11-02 2003-05-15 Podhajny Richard M. Anti-microbial packaging materials and methods for making the same
KR20050044371A (ko) 2001-11-07 2005-05-12 어플라이드 머티어리얼스, 인코포레이티드 광학 스폿 그리드 어레이 프린터
US20040007589A1 (en) * 2002-02-12 2004-01-15 Lindsay Leveen Device and method for dispensing carbonated beverages
DE10229818A1 (de) * 2002-06-28 2004-01-15 Carl Zeiss Smt Ag Verfahren zur Fokusdetektion und Abbildungssystem mit Fokusdetektionssystem
US7092069B2 (en) * 2002-03-08 2006-08-15 Carl Zeiss Smt Ag Projection exposure method and projection exposure system
DE10210899A1 (de) 2002-03-08 2003-09-18 Zeiss Carl Smt Ag Refraktives Projektionsobjektiv für Immersions-Lithographie
EP1532489A2 (en) 2002-08-23 2005-05-25 Nikon Corporation Projection optical system and method for photolithography and exposure apparatus and method using same
US7093375B2 (en) * 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US6954993B1 (en) * 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US6988327B2 (en) 2002-09-30 2006-01-24 Lam Research Corporation Methods and systems for processing a substrate using a dynamic liquid meniscus
US7383843B2 (en) 2002-09-30 2008-06-10 Lam Research Corporation Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
US7367345B1 (en) 2002-09-30 2008-05-06 Lam Research Corporation Apparatus and method for providing a confined liquid for immersion lithography
US6988326B2 (en) * 2002-09-30 2006-01-24 Lam Research Corporation Phobic barrier meniscus separation and containment
US6788477B2 (en) * 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
CN101349876B (zh) * 2002-11-12 2010-12-01 Asml荷兰有限公司 光刻装置和器件制造方法
US7110081B2 (en) * 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP3977324B2 (ja) * 2002-11-12 2007-09-19 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
SG121819A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
SG121822A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE60335595D1 (de) * 2002-11-12 2011-02-17 Asml Netherlands Bv Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung
SG131766A1 (en) * 2002-11-18 2007-05-28 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
DE10253679A1 (de) * 2002-11-18 2004-06-03 Infineon Technologies Ag Optische Einrichtung zur Verwendung bei einem Lithographie-Verfahren, insbesondere zur Herstellung eines Halbleiter-Bauelements, sowie optisches Lithographieverfahren
DE10258718A1 (de) 2002-12-09 2004-06-24 Carl Zeiss Smt Ag Projektionsobjektiv, insbesondere für die Mikrolithographie, sowie Verfahren zur Abstimmung eines Projektionsobjektives
JP4362867B2 (ja) 2002-12-10 2009-11-11 株式会社ニコン 露光装置及びデバイス製造方法
WO2004053956A1 (ja) 2002-12-10 2004-06-24 Nikon Corporation 露光装置及び露光方法、デバイス製造方法
AU2003289272A1 (en) 2002-12-10 2004-06-30 Nikon Corporation Surface position detection apparatus, exposure method, and device porducing method
EP1571696A4 (en) 2002-12-10 2008-03-26 Nikon Corp EXPOSURE DEVICE AND METHOD OF MANUFACTURE
SG152063A1 (en) 2002-12-10 2009-05-29 Nikon Corp Exposure apparatus and method for producing device
JP4352874B2 (ja) 2002-12-10 2009-10-28 株式会社ニコン 露光装置及びデバイス製造方法
AU2003289236A1 (en) 2002-12-10 2004-06-30 Nikon Corporation Exposure apparatus and method for manufacturing device
AU2003302831A1 (en) 2002-12-10 2004-06-30 Nikon Corporation Exposure method, exposure apparatus and method for manufacturing device
EP1571694A4 (en) 2002-12-10 2008-10-15 Nikon Corp EXPOSURE EQUIPMENT AND MANUFACTURING METHOD DAF R
WO2004053959A1 (ja) 2002-12-10 2004-06-24 Nikon Corporation 光学素子及びその光学素子を用いた投影露光装置
US6992750B2 (en) * 2002-12-10 2006-01-31 Canon Kabushiki Kaisha Exposure apparatus and method
DE10257766A1 (de) 2002-12-10 2004-07-15 Carl Zeiss Smt Ag Verfahren zur Einstellung einer gewünschten optischen Eigenschaft eines Projektionsobjektivs sowie mikrolithografische Projektionsbelichtungsanlage
DE60326384D1 (de) * 2002-12-13 2009-04-09 Koninkl Philips Electronics Nv Flüssigkeitsentfernung in einem verfahren und einer einrichtung zum bestrahlen von flecken auf einer schicht
CN100385535C (zh) 2002-12-19 2008-04-30 皇家飞利浦电子股份有限公司 照射光敏层上斑点的方法和装置
ATE365962T1 (de) 2002-12-19 2007-07-15 Koninkl Philips Electronics Nv Verfahren und anordnung zum bestrahlen einer schicht mittels eines lichtpunkts
US7010958B2 (en) * 2002-12-19 2006-03-14 Asml Holding N.V. High-resolution gas gauge proximity sensor
US7112727B2 (en) * 2002-12-20 2006-09-26 Peotec Seeds S.R.L. Mutant allele of tomato
US6781670B2 (en) * 2002-12-30 2004-08-24 Intel Corporation Immersion lithography
US7090964B2 (en) * 2003-02-21 2006-08-15 Asml Holding N.V. Lithographic printing with polarized light
JP4352930B2 (ja) * 2003-02-26 2009-10-28 株式会社ニコン 露光装置、露光方法及びデバイス製造方法
EP2945184B1 (en) 2003-02-26 2017-06-28 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US6943941B2 (en) * 2003-02-27 2005-09-13 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7206059B2 (en) * 2003-02-27 2007-04-17 Asml Netherlands B.V. Stationary and dynamic radial transverse electric polarizer for high numerical aperture systems
US7029832B2 (en) 2003-03-11 2006-04-18 Samsung Electronics Co., Ltd. Immersion lithography methods using carbon dioxide
US20050164522A1 (en) 2003-03-24 2005-07-28 Kunz Roderick R. Optical fluids, and systems and methods of making and using the same
TW585291U (en) * 2003-03-25 2004-04-21 Quanta Comp Inc A strap buckle apparatus for a notebook computer
KR101177331B1 (ko) 2003-04-09 2012-08-30 가부시키가이샤 니콘 액침 리소그래피 유체 제어 시스템
KR101724117B1 (ko) 2003-04-10 2017-04-06 가부시키가이샤 니콘 액침 리소그래피 장치용 진공 배출을 포함하는 환경 시스템
EP2921905B1 (en) 2003-04-10 2017-12-27 Nikon Corporation Run-off path to collect liquid for an immersion lithography apparatus
KR101497289B1 (ko) 2003-04-10 2015-02-27 가부시키가이샤 니콘 액침 리소그래피 장치용 운반 영역을 포함하는 환경 시스템
JP4656057B2 (ja) 2003-04-10 2011-03-23 株式会社ニコン 液浸リソグラフィ装置用電気浸透素子
EP3141953A3 (en) 2003-04-11 2017-06-07 Nikon Corporation Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine
SG2013077797A (en) 2003-04-11 2017-02-27 Nippon Kogaku Kk Cleanup method for optics in immersion lithography
JP4582089B2 (ja) 2003-04-11 2010-11-17 株式会社ニコン 液浸リソグラフィ用の液体噴射回収システム
WO2004095135A2 (en) 2003-04-17 2004-11-04 Nikon Corporation Optical arrangement of autofocus elements for use with immersion lithography
JP4146755B2 (ja) * 2003-05-09 2008-09-10 松下電器産業株式会社 パターン形成方法
JP4025683B2 (ja) * 2003-05-09 2007-12-26 松下電器産業株式会社 パターン形成方法及び露光装置
TWI295414B (en) * 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
CN1307456C (zh) 2003-05-23 2007-03-28 佳能株式会社 投影光学系统、曝光装置及器件的制造方法
JP2004349645A (ja) * 2003-05-26 2004-12-09 Sony Corp 液浸差動排液静圧浮上パッド、原盤露光装置および液侵差動排液による露光方法
TWI347741B (en) 2003-05-30 2011-08-21 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2261742A3 (en) 2003-06-11 2011-05-25 ASML Netherlands BV Lithographic apparatus and device manufacturing method.
JP4084710B2 (ja) * 2003-06-12 2008-04-30 松下電器産業株式会社 パターン形成方法
JP4054285B2 (ja) * 2003-06-12 2008-02-27 松下電器産業株式会社 パターン形成方法
US6867844B2 (en) * 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
JP4029064B2 (ja) * 2003-06-23 2008-01-09 松下電器産業株式会社 パターン形成方法
JP4084712B2 (ja) * 2003-06-23 2008-04-30 松下電器産業株式会社 パターン形成方法
JP2005019616A (ja) 2003-06-25 2005-01-20 Canon Inc 液浸式露光装置
JP4343597B2 (ja) 2003-06-25 2009-10-14 キヤノン株式会社 露光装置及びデバイス製造方法
EP1498778A1 (en) 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
JP3862678B2 (ja) 2003-06-27 2006-12-27 キヤノン株式会社 露光装置及びデバイス製造方法
EP1491956B1 (en) 2003-06-27 2006-09-06 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US6809794B1 (en) * 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
EP1494074A1 (en) 2003-06-30 2005-01-05 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7236232B2 (en) 2003-07-01 2007-06-26 Nikon Corporation Using isotopically specified fluids as optical elements
JP4515385B2 (ja) * 2003-07-09 2010-07-28 株式会社ニコン 露光装置、露光方法、及びデバイス製造方法
US7384149B2 (en) 2003-07-21 2008-06-10 Asml Netherlands B.V. Lithographic projection apparatus, gas purging method and device manufacturing method and purge gas supply system
US7006209B2 (en) 2003-07-25 2006-02-28 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7175968B2 (en) * 2003-07-28 2007-02-13 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and a substrate
EP1503244A1 (en) * 2003-07-28 2005-02-02 ASML Netherlands B.V. Lithographic projection apparatus and device manufacturing method
US7326522B2 (en) * 2004-02-11 2008-02-05 Asml Netherlands B.V. Device manufacturing method and a substrate
US7700267B2 (en) * 2003-08-11 2010-04-20 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion fluid for immersion lithography, and method of performing immersion lithography
US7061578B2 (en) 2003-08-11 2006-06-13 Advanced Micro Devices, Inc. Method and apparatus for monitoring and controlling imaging in immersion lithography systems
US7579135B2 (en) * 2003-08-11 2009-08-25 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography apparatus for manufacture of integrated circuits
US7085075B2 (en) * 2003-08-12 2006-08-01 Carl Zeiss Smt Ag Projection objectives including a plurality of mirrors with lenses ahead of mirror M3
US6844206B1 (en) 2003-08-21 2005-01-18 Advanced Micro Devices, Llp Refractive index system monitor and control for immersion lithography
US7070915B2 (en) * 2003-08-29 2006-07-04 Tokyo Electron Limited Method and system for drying a substrate
US6954256B2 (en) * 2003-08-29 2005-10-11 Asml Netherlands B.V. Gradient immersion lithography
US7014966B2 (en) * 2003-09-02 2006-03-21 Advanced Micro Devices, Inc. Method and apparatus for elimination of bubbles in immersion medium in immersion lithography systems
EP2960702B1 (en) 2003-09-03 2017-02-22 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US6961186B2 (en) 2003-09-26 2005-11-01 Takumi Technology Corp. Contact printing using a magnified mask image
US7369217B2 (en) * 2003-10-03 2008-05-06 Micronic Laser Systems Ab Method and device for immersion lithography
US7678527B2 (en) 2003-10-16 2010-03-16 Intel Corporation Methods and compositions for providing photoresist with improved properties for contacting liquids
US7411653B2 (en) 2003-10-28 2008-08-12 Asml Netherlands B.V. Lithographic apparatus
US20070105050A1 (en) 2003-11-05 2007-05-10 Dsm Ip Assets B.V. Method and apparatus for producing microchips
US7924397B2 (en) * 2003-11-06 2011-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Anti-corrosion layer on objective lens for liquid immersion lithography applications
US7528929B2 (en) 2003-11-14 2009-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7545481B2 (en) 2003-11-24 2009-06-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005054953A2 (en) 2003-11-24 2005-06-16 Carl-Zeiss Smt Ag Holding device for an optical element in an objective
US7125652B2 (en) * 2003-12-03 2006-10-24 Advanced Micro Devices, Inc. Immersion lithographic process using a conforming immersion medium
KR100965330B1 (ko) 2003-12-15 2010-06-22 칼 짜이스 에스엠티 아게 적어도 한 개의 액체 렌즈를 가진 마이크로리소그래피 투사대물렌즈로서의 대물렌즈
KR101200654B1 (ko) 2003-12-15 2012-11-12 칼 짜이스 에스엠티 게엠베하 고 개구율 및 평평한 단부면을 가진 투사 대물렌즈
JP5102492B2 (ja) 2003-12-19 2012-12-19 カール・ツァイス・エスエムティー・ゲーエムベーハー 結晶素子を有するマイクロリソグラフィー投影用対物レンズ
US7460206B2 (en) * 2003-12-19 2008-12-02 Carl Zeiss Smt Ag Projection objective for immersion lithography
US20050185269A1 (en) * 2003-12-19 2005-08-25 Carl Zeiss Smt Ag Catadioptric projection objective with geometric beam splitting
US7589818B2 (en) * 2003-12-23 2009-09-15 Asml Netherlands B.V. Lithographic apparatus, alignment apparatus, device manufacturing method, and a method of converting an apparatus
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7119884B2 (en) 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20050147920A1 (en) * 2003-12-30 2005-07-07 Chia-Hui Lin Method and system for immersion lithography
US7088422B2 (en) * 2003-12-31 2006-08-08 International Business Machines Corporation Moving lens for immersion optical lithography
JP4371822B2 (ja) * 2004-01-06 2009-11-25 キヤノン株式会社 露光装置
JP4429023B2 (ja) * 2004-01-07 2010-03-10 キヤノン株式会社 露光装置及びデバイス製造方法
US20050153424A1 (en) * 2004-01-08 2005-07-14 Derek Coon Fluid barrier with transparent areas for immersion lithography
KR101150037B1 (ko) 2004-01-14 2012-07-02 칼 짜이스 에스엠티 게엠베하 반사굴절식 투영 대물렌즈
CN101726863B (zh) 2004-01-16 2012-08-29 卡尔蔡司Smt有限责任公司 偏振调制光学元件
WO2005069078A1 (en) 2004-01-19 2005-07-28 Carl Zeiss Smt Ag Microlithographic projection exposure apparatus with immersion projection lens
KR101135232B1 (ko) 2004-01-20 2012-04-12 칼 짜이스 에스엠테 게엠베하 마이크로 리소그래픽 투영 노광 장치
US7026259B2 (en) * 2004-01-21 2006-04-11 International Business Machines Corporation Liquid-filled balloons for immersion lithography
US7391501B2 (en) * 2004-01-22 2008-06-24 Intel Corporation Immersion liquids with siloxane polymer for immersion lithography
JP2007520893A (ja) 2004-02-03 2007-07-26 ロチェスター インスティテュート オブ テクノロジー 流体を使用したフォトリソグラフィ法及びそのシステム
US7050146B2 (en) * 2004-02-09 2006-05-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005076084A1 (en) 2004-02-09 2005-08-18 Carl Zeiss Smt Ag Projection objective for a microlithographic projection exposure apparatus
CN101727021A (zh) 2004-02-13 2010-06-09 卡尔蔡司Smt股份公司 微平版印刷投影曝光装置的投影物镜
CN1922528A (zh) 2004-02-18 2007-02-28 康宁股份有限公司 用于具有深紫外光的高数值孔径成象的反折射成象系统
US20050205108A1 (en) 2004-03-16 2005-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for immersion lithography lens cleaning
US20050205180A1 (en) * 2004-03-16 2005-09-22 Goudeau Michael C Method and apparatus for three dimensional object covers
US7027125B2 (en) 2004-03-25 2006-04-11 International Business Machines Corporation System and apparatus for photolithography
US7084960B2 (en) 2004-03-29 2006-08-01 Intel Corporation Lithography using controlled polarization
US7034917B2 (en) 2004-04-01 2006-04-25 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US7227619B2 (en) 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7295283B2 (en) 2004-04-02 2007-11-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7712905B2 (en) 2004-04-08 2010-05-11 Carl Zeiss Smt Ag Imaging system with mirror group
US7898642B2 (en) 2004-04-14 2011-03-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7271878B2 (en) 2004-04-22 2007-09-18 International Business Machines Corporation Wafer cell for immersion lithography
US7244665B2 (en) 2004-04-29 2007-07-17 Micron Technology, Inc. Wafer edge ring structures and methods of formation
US20050241694A1 (en) 2004-04-29 2005-11-03 Red Flame Hot Tap Services Ltd. Hot tapping method, system and apparatus
US7379159B2 (en) 2004-05-03 2008-05-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1747499A2 (en) 2004-05-04 2007-01-31 Nikon Corporation Apparatus and method for providing fluid for immersion lithography
US20060244938A1 (en) 2004-05-04 2006-11-02 Karl-Heinz Schuster Microlitographic projection exposure apparatus and immersion liquid therefore
US7091502B2 (en) 2004-05-12 2006-08-15 Taiwan Semiconductor Manufacturing, Co., Ltd. Apparatus and method for immersion lithography
KR20180078354A (ko) 2004-05-17 2018-07-09 칼 짜이스 에스엠티 게엠베하 중간이미지를 갖는 카타디옵트릭 투사 대물렌즈
US7616383B2 (en) 2004-05-18 2009-11-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7486381B2 (en) 2004-05-21 2009-02-03 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100594430C (zh) 2004-06-04 2010-03-17 卡尔蔡司Smt股份公司 用于测量光学成像系统的图像质量的系统
JP4913041B2 (ja) 2004-06-04 2012-04-11 カール・ツァイス・エスエムティー・ゲーエムベーハー 強度変化の補償を伴う投影系及びそのための補償素子
US8717533B2 (en) * 2004-06-10 2014-05-06 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
TWI468876B (zh) 2015-01-11
SG10201809095SA (en) 2018-11-29
JP5699977B2 (ja) 2015-04-15
KR101562447B1 (ko) 2015-10-21
SG2012087615A (en) 2015-08-28
KR20130019022A (ko) 2013-02-25
KR20130119989A (ko) 2013-11-01
US8736809B2 (en) 2014-05-27
EP2466623A3 (en) 2012-11-21
JP2012129565A (ja) 2012-07-05
HK1247997A1 (zh) 2018-10-05
EP2466622A2 (en) 2012-06-20
US7542128B2 (en) 2009-06-02
TW201229691A (en) 2012-07-16
JP2011023765A (ja) 2011-02-03
TW201719296A (zh) 2017-06-01
US7911583B2 (en) 2011-03-22
JP5807696B2 (ja) 2015-11-10
JP4640516B2 (ja) 2011-03-02
TWI591445B (zh) 2017-07-11
JP6004030B2 (ja) 2016-10-05
US20060274293A1 (en) 2006-12-07
US20140253889A1 (en) 2014-09-11
HK1214405A1 (zh) 2016-07-22
EP3301511A1 (en) 2018-04-04
JP5353862B2 (ja) 2013-11-27
US20070258065A1 (en) 2007-11-08
JP5126190B2 (ja) 2013-01-23
EP2466621A2 (en) 2012-06-20
HK1170066A1 (zh) 2013-02-15
US9182684B2 (en) 2015-11-10
CN104678715A (zh) 2015-06-03
KR20110061633A (ko) 2011-06-09
EP2466624A2 (en) 2012-06-20
WO2004086468A1 (ja) 2004-10-07
EP2466624A3 (en) 2012-11-28
JP5807691B2 (ja) 2015-11-10
EP2945184A2 (en) 2015-11-18
JP2010028127A (ja) 2010-02-04
EP2466622B1 (en) 2015-05-27
US8102504B2 (en) 2012-01-24
EP2945184A3 (en) 2016-03-23
KR101381538B1 (ko) 2014-04-04
HK1208088A1 (zh) 2016-02-19
CN104678715B (zh) 2017-05-17
US20190121244A1 (en) 2019-04-25
US20070263186A1 (en) 2007-11-15
JP2014112741A (ja) 2014-06-19
KR20120063524A (ko) 2012-06-15
JP2016075963A (ja) 2016-05-12
KR20160089545A (ko) 2016-07-27
JP2015121825A (ja) 2015-07-02
EP2466623B1 (en) 2015-04-22
EP2945184B1 (en) 2017-06-28
JP2014112716A (ja) 2014-06-19
KR101643112B1 (ko) 2016-07-26
US9348239B2 (en) 2016-05-24
KR101442361B1 (ko) 2014-09-23
EP2945016B1 (en) 2017-09-06
US20070263183A1 (en) 2007-11-15
US7907253B2 (en) 2011-03-15
CN102495540A (zh) 2012-06-13
US7453550B2 (en) 2008-11-18
KR20120088846A (ko) 2012-08-08
US20050280791A1 (en) 2005-12-22
EP1598855A4 (en) 2007-08-22
EP2466621B1 (en) 2015-04-01
JP2018106206A (ja) 2018-07-05
KR20140110089A (ko) 2014-09-16
US20140240684A1 (en) 2014-08-28
JP2009302596A (ja) 2009-12-24
CN102495540B (zh) 2015-03-18
HK1168912A1 (zh) 2013-01-11
HK1214372A1 (zh) 2016-07-22
JP5126191B2 (ja) 2013-01-23
KR101563453B1 (ko) 2015-10-26
JP6428800B2 (ja) 2018-11-28
KR101169288B1 (ko) 2012-08-02
KR20170143017A (ko) 2017-12-28
EP1598855B1 (en) 2015-04-22
US7535550B2 (en) 2009-05-19
EP2466623A2 (en) 2012-06-20
EP2466625B1 (en) 2015-04-22
SG183572A1 (en) 2012-09-27
SG10201401559QA (en) 2014-06-27
US20070258066A1 (en) 2007-11-08
JP6187614B2 (ja) 2017-08-30
EP2466624B1 (en) 2015-04-22
KR101875296B1 (ko) 2018-07-05
HK1170067A1 (zh) 2013-02-15
EP2466622A3 (en) 2012-11-28
US20060146306A1 (en) 2006-07-06
US20110032498A1 (en) 2011-02-10
EP2466621A3 (en) 2012-11-21
JP2017068287A (ja) 2017-04-06
HK1170070A1 (zh) 2013-02-15
KR101921572B1 (ko) 2018-11-26
EP2945016A2 (en) 2015-11-18
EP2466625A3 (en) 2012-11-28
US7268854B2 (en) 2007-09-11
US7907254B2 (en) 2011-03-15
US7932991B2 (en) 2011-04-26
TW201220002A (en) 2012-05-16
KR20150052334A (ko) 2015-05-13
TW201908879A (zh) 2019-03-01
TWI621923B (zh) 2018-04-21
US20070258067A1 (en) 2007-11-08
US20160246188A1 (en) 2016-08-25
KR20050102676A (ko) 2005-10-26
US10180632B2 (en) 2019-01-15
EP1598855A1 (en) 2005-11-23
US20070263185A1 (en) 2007-11-15
US20170371253A1 (en) 2017-12-28
US9766555B2 (en) 2017-09-19
TW201516584A (zh) 2015-05-01
EP2466625A2 (en) 2012-06-20
TWI361957B (zh) 2012-04-11
HK1170064A1 (zh) 2013-02-15
EP2945016A3 (en) 2016-03-30
JP2009147386A (ja) 2009-07-02
KR20180126102A (ko) 2018-11-26
KR101506408B1 (ko) 2015-03-26
KR101288767B1 (ko) 2013-07-23

Similar Documents

Publication Publication Date Title
TW200500813A (en) Exposure apparatus and method, and method of producing device
EP2264533A3 (en) Exposure apparatus, method for producing device, and exposure method
EP1643543A4 (en) LINKING UNIT, EXPOSURE DEVICE AND METHOD OF PRODUCING COMPONENTS
EP2284614A3 (en) Exposure apparatus, exposure method and device producing method
SG145780A1 (en) Exposure apparatus and device fabricating method
EP1612850A4 (en) EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING THE DEVICE
EP2535769A3 (en) Exposure apparatus and method for producing device
TW200741365A (en) Exposure apparatus, exposing method, and device manufacturing method
SG148993A1 (en) Exposure apparatus, exposure method, method for producing device, and optical part
SG141385A1 (en) Lithographic apparatus and device manufacturing method
TW200736849A (en) Exposure apparatus and device manufacturing method
ATE513309T1 (de) Belichtungsvorrichtung und verfahren zur bauelementeherstellung
TW200502713A (en) Projection optical system, exposure apparatus, and device manufacturing method
ATE490548T1 (de) Belichtungsvorrichtung, belichtungsverfahren und verfahren zur bauelementeherstellung
TW200636399A (en) Exposure device, manufacturing method for exposure device and micro-device
EP1672681B8 (en) Exposure apparatus, substrate carrying method, exposure method, and method for producing device
TW200942978A (en) Exposure method, exposure apparatus, and method for producing device
WO2001090814A3 (en) Maskless exposure system
TW200707117A (en) Exposure method and lithography system
TW200700926A (en) Optical element, exposure apparatus, and device manufacturing method
TW200510964A (en) Lithographic apparatus, device manufacturing method, and device manufactured thereby
JP2006072100A (ja) 投影露光装置
TW200520133A (en) Methods and apparatuses for applying wafer-alignment marks
TW200745783A (en) Exposure apparatus, exposing method, and device manufacturing method
KR20150050371A (ko) 노출 및 현상장치, 노출 및 현상방법

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees