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TW200509730A - Sound detection mechanism - Google Patents

Sound detection mechanism

Info

Publication number
TW200509730A
TW200509730A TW093121370A TW93121370A TW200509730A TW 200509730 A TW200509730 A TW 200509730A TW 093121370 A TW093121370 A TW 093121370A TW 93121370 A TW93121370 A TW 93121370A TW 200509730 A TW200509730 A TW 200509730A
Authority
TW
Taiwan
Prior art keywords
substrate
diaphragm
acoustic holes
sacrificial layer
acoustic
Prior art date
Application number
TW093121370A
Other languages
English (en)
Inventor
Yoshiaki Ohbayashi
Mamoru Yasuda
Shinichi Saeki
Masatsugu Komai
Kenichi Kagawa
Original Assignee
Hosiden Corp
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hosiden Corp, Tokyo Electron Ltd filed Critical Hosiden Corp
Publication of TW200509730A publication Critical patent/TW200509730A/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
TW093121370A 2003-07-17 2004-07-16 Sound detection mechanism TW200509730A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003276009A JP2005039652A (ja) 2003-07-17 2003-07-17 音響検出機構

Publications (1)

Publication Number Publication Date
TW200509730A true TW200509730A (en) 2005-03-01

Family

ID=34074575

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093121370A TW200509730A (en) 2003-07-17 2004-07-16 Sound detection mechanism

Country Status (8)

Country Link
US (1) US7570773B2 (zh)
EP (1) EP1648195A4 (zh)
JP (1) JP2005039652A (zh)
KR (1) KR20060033021A (zh)
CN (1) CN1823551A (zh)
SG (1) SG129444A1 (zh)
TW (1) TW200509730A (zh)
WO (1) WO2005009077A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419575B (zh) * 2009-08-19 2013-12-11 Hon Hai Prec Ind Co Ltd 熱致發聲裝置及其製備方法

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DE102005004877A1 (de) * 2005-02-03 2006-08-10 Robert Bosch Gmbh Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
JP4715260B2 (ja) * 2005-03-23 2011-07-06 ヤマハ株式会社 コンデンサマイクロホンおよびその製造方法
US7449356B2 (en) * 2005-04-25 2008-11-11 Analog Devices, Inc. Process of forming a microphone using support member
US7825484B2 (en) * 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
KR100765149B1 (ko) 2005-10-05 2007-10-15 전자부품연구원 초소형 음향 감지 장치 및 그 제조 방법
US8130986B2 (en) * 2006-01-23 2012-03-06 The Regents Of The University Of Michigan Trapped fluid microsystems for acoustic sensing
JP4737720B2 (ja) * 2006-03-06 2011-08-03 ヤマハ株式会社 ダイヤフラム及びその製造方法並びにそのダイヤフラムを有するコンデンサマイクロホン及びその製造方法
GB2435544B (en) * 2006-02-24 2008-11-19 Oligon Ltd Mems device
JP2007267272A (ja) * 2006-03-29 2007-10-11 Matsushita Electric Ind Co Ltd コンデンサマイクロフォン
DE102006022378A1 (de) * 2006-05-12 2007-11-22 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Bauelements und mikromechanisches Bauelement
KR20080005854A (ko) 2006-07-10 2008-01-15 야마하 가부시키가이샤 압력 센서 및 그의 제조 방법
DE102006052630A1 (de) * 2006-10-19 2008-04-24 Robert Bosch Gmbh Mikromechanisches Bauelement mit monolithisch integrierter Schaltung und Verfahren zur Herstellung eines Bauelements
EP1931173B1 (en) * 2006-12-06 2011-07-20 Electronics and Telecommunications Research Institute Condenser microphone having flexure hinge diaphragm and method of manufacturing the same
CN101606397A (zh) * 2006-12-15 2009-12-16 加利福尼亚大学董事会 声学基片
JP2009044600A (ja) * 2007-08-10 2009-02-26 Panasonic Corp マイクロホン装置およびその製造方法
TWI333933B (en) * 2007-08-17 2010-12-01 Advanced Semiconductor Eng Microelectromechanical-system package and method for manufacturing the same
US8258591B2 (en) * 2008-01-16 2012-09-04 Solid State System Co., Ltd. Micro-electro-mechanical systems (MEMS) device
US7951636B2 (en) * 2008-09-22 2011-05-31 Solid State System Co. Ltd. Method for fabricating micro-electro-mechanical system (MEMS) device
TWI398172B (zh) * 2008-12-17 2013-06-01 Goertek Inc Microphone vibration film and electret condenser microphone
US8368153B2 (en) * 2010-04-08 2013-02-05 United Microelectronics Corp. Wafer level package of MEMS microphone and manufacturing method thereof
CN101959107A (zh) * 2010-04-19 2011-01-26 瑞声声学科技(深圳)有限公司 Mems麦克风
JP5348073B2 (ja) * 2010-06-01 2013-11-20 船井電機株式会社 電気音響変換素子搭載基板及びマイクロホンユニット、並びにそれらの製造方法
JP6426620B2 (ja) * 2012-12-18 2018-11-21 Tdk株式会社 トップポートｍｅｍｓマイクロフォン及びその製造方法
US9148695B2 (en) * 2013-01-30 2015-09-29 The Nielsen Company (Us), Llc Methods and apparatus to collect media identifying data
JP6390423B2 (ja) * 2014-12-26 2018-09-19 オムロン株式会社 音響センサおよび音響センサの製造方法
CN105182583B (zh) 2015-09-17 2018-11-23 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置及其健康监测方法
KR102511103B1 (ko) 2016-04-26 2023-03-16 주식회사 디비하이텍 멤스 마이크로폰 및 이의 제조 방법
KR102486586B1 (ko) * 2016-06-13 2023-01-10 주식회사 디비하이텍 멤스 마이크로폰의 제조 방법
CN108622846B (zh) * 2017-03-22 2020-09-08 中芯国际集成电路制造(上海)有限公司 Mems麦克风及其形成方法
US12253391B2 (en) 2018-05-24 2025-03-18 The Research Foundation For The State University Of New York Multielectrode capacitive sensor without pull-in risk
KR20210089292A (ko) 2020-01-07 2021-07-16 삼성전자주식회사 음성 인식 시스템 및 이를 이용한 디스플레이 장치
CN111491244B (zh) * 2020-03-16 2021-11-16 歌尔微电子有限公司 一种mems麦克风的加工方法和mems麦克风

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EP0561566B1 (en) 1992-03-18 1999-07-28 Knowles Electronics, Inc. Solid state condenser and microphone
JP3216065B2 (ja) * 1994-09-27 2001-10-09 キヤノン株式会社 中空構造体の製造方法
WO1997039464A1 (en) * 1996-04-18 1997-10-23 California Institute Of Technology Thin film electret microphone
DE19648424C1 (de) 1996-11-22 1998-06-25 Siemens Ag Mikromechanischer Sensor
JP2002095093A (ja) 2000-09-12 2002-03-29 Seiko Epson Corp コンデンサマイクロホンおよびその製造方法および音声入力装置
JP2002209298A (ja) 2001-01-11 2002-07-26 Seiko Epson Corp コンデンサマイクロホンの製造方法、コンデンサマイクロホンおよび電子機器
JP3873630B2 (ja) 2001-01-29 2007-01-24 セイコーエプソン株式会社 コンデンサマイクロホンの製造方法
JP4697763B2 (ja) * 2001-07-31 2011-06-08 パナソニック株式会社 コンデンサマイクロホン
TW518900B (en) * 2001-09-11 2003-01-21 Ind Tech Res Inst Structure of electret silicon capacitive type microphone and method for making the same
JP2003163998A (ja) * 2001-11-27 2003-06-06 Seiko Epson Corp コンデンサマイクロホンの製造方法、コンデンサマイクロホンおよび電子機器
US6870939B2 (en) * 2001-11-28 2005-03-22 Industrial Technology Research Institute SMT-type structure of the silicon-based electret condenser microphone

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419575B (zh) * 2009-08-19 2013-12-11 Hon Hai Prec Ind Co Ltd 熱致發聲裝置及其製備方法

Also Published As

Publication number Publication date
JP2005039652A (ja) 2005-02-10
US7570773B2 (en) 2009-08-04
WO2005009077A1 (ja) 2005-01-27
KR20060033021A (ko) 2006-04-18
EP1648195A4 (en) 2010-07-14
SG129444A1 (en) 2007-02-26
US20060233400A1 (en) 2006-10-19
EP1648195A1 (en) 2006-04-19
CN1823551A (zh) 2006-08-23

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