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TW200509234A - Method for wafer drying - Google Patents

Method for wafer drying

Info

Publication number
TW200509234A
TW200509234A TW092123074A TW92123074A TW200509234A TW 200509234 A TW200509234 A TW 200509234A TW 092123074 A TW092123074 A TW 092123074A TW 92123074 A TW92123074 A TW 92123074A TW 200509234 A TW200509234 A TW 200509234A
Authority
TW
Taiwan
Prior art keywords
liquid
wafers
wafer
drying
inlet
Prior art date
Application number
TW092123074A
Other languages
Chinese (zh)
Other versions
TWI236061B (en
Inventor
Yuan-Hsin Li
Chih-Hung Wu
Yang-Shih Hsu
Original Assignee
Grand Plastic Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grand Plastic Technology Corp filed Critical Grand Plastic Technology Corp
Priority to TW92123074A priority Critical patent/TWI236061B/en
Publication of TW200509234A publication Critical patent/TW200509234A/en
Application granted granted Critical
Publication of TWI236061B publication Critical patent/TWI236061B/en

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  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention discloses a wafer drying method by using liquid phase drying liquid (e.g.isopropanol, IPA) to displace water, such that the wafer may dry quickly and cleanly. Comprising: (a) Moving the wafers into the rinse tank(202); (b) Adjusting the flow rate of the flow controller(s) of the liquid inlet(s)(206); (c) Rinsing the wafers by using the drainng open to carry the particle and chemical quickly ; (d) Close the liquid inlet and open the liquid outlet, controlling the flow rate to drain the liquid to a level just over the wafers, injecting a given quantity of liquid phase dring liquid to form two liquid phase layer; (e) Keep draining until the drying liquid reached the lower edge of the wafer carrier; (f) Pumping out the remaining liquid; (g) in the rinse tank, inlet room temperature N2 and warm N2 to dry the sliquid on the wafers.
TW92123074A 2003-08-21 2003-08-21 Method for wafer drying TWI236061B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92123074A TWI236061B (en) 2003-08-21 2003-08-21 Method for wafer drying

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92123074A TWI236061B (en) 2003-08-21 2003-08-21 Method for wafer drying

Publications (2)

Publication Number Publication Date
TW200509234A true TW200509234A (en) 2005-03-01
TWI236061B TWI236061B (en) 2005-07-11

Family

ID=36648938

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92123074A TWI236061B (en) 2003-08-21 2003-08-21 Method for wafer drying

Country Status (1)

Country Link
TW (1) TWI236061B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8038804B2 (en) 2005-05-13 2011-10-18 Lam Research Ag Method for drying a surface

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI740267B (en) * 2019-11-08 2021-09-21 弘塑科技股份有限公司 Method for wafer cleaning and drying, and wafer cleaning and drying device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8038804B2 (en) 2005-05-13 2011-10-18 Lam Research Ag Method for drying a surface

Also Published As

Publication number Publication date
TWI236061B (en) 2005-07-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees