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TW200508813A - Lithographic apparatus, device manufacturing method, and device manufactured thereby - Google Patents

Lithographic apparatus, device manufacturing method, and device manufactured thereby

Info

Publication number
TW200508813A
TW200508813A TW093117964A TW93117964A TW200508813A TW 200508813 A TW200508813 A TW 200508813A TW 093117964 A TW093117964 A TW 093117964A TW 93117964 A TW93117964 A TW 93117964A TW 200508813 A TW200508813 A TW 200508813A
Authority
TW
Taiwan
Prior art keywords
contact surface
substrate
protrusions
lithographic apparatus
projection
Prior art date
Application number
TW093117964A
Other languages
English (en)
Other versions
TWI258639B (en
Inventor
Empel Tjarko Adriaan Rudolf Van
Meer Aschwin Lodewijk Hendricus Johannes Van
Koen Jacobus Johannes Maria Zaal
Ton Aantjes
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of TW200508813A publication Critical patent/TW200508813A/zh
Application granted granted Critical
Publication of TWI258639B publication Critical patent/TWI258639B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H10P72/7614—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW093117964A 2003-06-23 2004-06-21 Lithographic projection apparatus and substrate holder for the same TWI258639B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20030076959 EP1491953A1 (en) 2003-06-23 2003-06-23 Lithographic apparatus, device manufacturing method, and device manufactured thereby

Publications (2)

Publication Number Publication Date
TW200508813A true TW200508813A (en) 2005-03-01
TWI258639B TWI258639B (en) 2006-07-21

Family

ID=33395924

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093117964A TWI258639B (en) 2003-06-23 2004-06-21 Lithographic projection apparatus and substrate holder for the same

Country Status (7)

Country Link
US (1) US7113262B2 (zh)
EP (1) EP1491953A1 (zh)
JP (1) JP4291223B2 (zh)
DE (1) DE602004011705T2 (zh)
SG (1) SG117504A1 (zh)
TW (1) TWI258639B (zh)
WO (1) WO2004114018A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7372549B2 (en) 2005-06-24 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7649611B2 (en) * 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7646581B2 (en) * 2006-01-31 2010-01-12 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck
EP1840657A1 (en) * 2006-03-28 2007-10-03 Carl Zeiss SMT AG Support structure for temporarily supporting a substrate
US7978308B2 (en) 2006-05-15 2011-07-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7791708B2 (en) * 2006-12-27 2010-09-07 Asml Netherlands B.V. Lithographic apparatus, substrate table, and method for enhancing substrate release properties
JP2010207561A (ja) * 2009-02-10 2010-09-24 Kanto Auto Works Ltd 車椅子乗車可能な自動車及び車椅子乗車方法
WO2013113568A2 (en) * 2012-02-03 2013-08-08 Asml Netherlands B.V. Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder
JP6758920B2 (ja) * 2016-06-01 2020-09-23 キヤノン株式会社 チャック、基板保持装置、パターン形成装置、及び物品の製造方法
NL2021755A (en) 2017-10-27 2019-05-06 Asml Holding Nv Burls with altered surface topography for lithography applications
KR102617775B1 (ko) * 2017-11-20 2023-12-22 에이에스엠엘 네델란즈 비.브이. 기판 홀더, 기판 지지체, 및 기판을 클램핑 시스템에 클램핑시키는 방법
US11520241B2 (en) 2017-12-20 2022-12-06 Asml Holding N.V. Lithography supports with defined burltop topography
WO2020239373A1 (en) 2019-05-24 2020-12-03 Asml Holding N.V. Lithographic apparatus, substrate table, and method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5094536A (en) * 1990-11-05 1992-03-10 Litel Instruments Deformable wafer chuck
JPH0851143A (ja) * 1992-07-20 1996-02-20 Nikon Corp 基板保持装置
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
US6257564B1 (en) * 1998-05-15 2001-07-10 Applied Materials, Inc Vacuum chuck having vacuum-nipples wafer support
JP2000100895A (ja) * 1998-09-18 2000-04-07 Nikon Corp 基板の搬送装置、基板の保持装置、及び基板処理装置
TW594426B (en) * 1999-06-11 2004-06-21 Asml Netherlands Bv Lithographic projection apparatus, integrated circuit manufacturing method and integrated circuit made thereby
EP1077393A2 (en) * 1999-08-19 2001-02-21 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
EP1174910A3 (en) * 2000-07-20 2010-01-06 Applied Materials, Inc. Method and apparatus for dechucking a substrate
JP4288694B2 (ja) * 2001-12-20 2009-07-01 株式会社ニコン 基板保持装置、露光装置及びデバイス製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7372549B2 (en) 2005-06-24 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
WO2004114018A3 (en) 2005-04-07
EP1491953A1 (en) 2004-12-29
JP2005019993A (ja) 2005-01-20
DE602004011705D1 (de) 2008-03-27
SG117504A1 (en) 2005-12-29
TWI258639B (en) 2006-07-21
US7113262B2 (en) 2006-09-26
WO2004114018A2 (en) 2004-12-29
JP4291223B2 (ja) 2009-07-08
US20050024620A1 (en) 2005-02-03
DE602004011705T2 (de) 2009-01-29

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Legal Events

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MK4A Expiration of patent term of an invention patent