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TW200508799A - Photosensitive resin composition and color filter using the same - Google Patents

Photosensitive resin composition and color filter using the same

Info

Publication number
TW200508799A
TW200508799A TW093123169A TW93123169A TW200508799A TW 200508799 A TW200508799 A TW 200508799A TW 093123169 A TW093123169 A TW 093123169A TW 93123169 A TW93123169 A TW 93123169A TW 200508799 A TW200508799 A TW 200508799A
Authority
TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
reacting
parts
weight
Prior art date
Application number
TW093123169A
Other languages
Chinese (zh)
Other versions
TWI351581B (en
Inventor
Manabu Higashi
Masahiro Tsuchiya
Masanori Kono
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200508799A publication Critical patent/TW200508799A/en
Application granted granted Critical
Publication of TWI351581B publication Critical patent/TWI351581B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D471/00—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, at least one ring being a six-membered ring with one nitrogen atom, not provided for by groups C07D451/00 - C07D463/00
    • C07D471/02—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, at least one ring being a six-membered ring with one nitrogen atom, not provided for by groups C07D451/00 - C07D463/00 in which the condensed system contains two hetero rings
    • C07D471/08—Bridged systems
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D498/00—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and oxygen atoms as the only ring hetero atoms
    • C07D498/02—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and oxygen atoms as the only ring hetero atoms in which the condensed system contains two hetero rings
    • C07D498/04—Ortho-condensed systems
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)
  • Liquid Crystal (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

The present invention is aimed to provide a photosensitive resin composition for use in color filters, which can form a pattern with excellent dimensional stability, proper margin, good adherence and sharp edge shape. Namely, the photosensitive resin composition according to the present invention contains the following ingredients (A) to (D) as the essential ingredients: (A) an unsaturated group-containing, alkali-soluble resin obtained by reacting an epoxy compound containing 2 glycidyl ether group derived from a bisphenolic compound with (meth)acrylic acid, then reacting the resulting product with a polybasic carboxylic acid or an anhydride thereof, (B) a photopolymerizable monomer having at least one of ethylenic unsaturated bond, (C) a photopolymerization initiator, and (D) a coloring agent; characterized in that (A)/(B) ratio is 20/80 to 90/10 (by weight), the content of (C) is 2 to 30 parts by weight relative to 100 parts of total weight of (A) and (B), and the ingredient (C) is an O-acyloxime compound represented by the formula of (I): , (wherein, R1 represents phenyl, alkyl etc.; R2 represents acyl).
TW093123169A 2003-08-28 2004-08-03 Photosensitive resin composition and color filter TWI351581B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003304248A JP4437651B2 (en) 2003-08-28 2003-08-28 Photosensitive resin composition and color filter using the same

Publications (2)

Publication Number Publication Date
TW200508799A true TW200508799A (en) 2005-03-01
TWI351581B TWI351581B (en) 2011-11-01

Family

ID=34407988

Family Applications (2)

Application Number Title Priority Date Filing Date
TW093123169A TWI351581B (en) 2003-08-28 2004-08-03 Photosensitive resin composition and color filter
TW100126952A TWI447523B (en) 2003-08-28 2004-08-03 Photosensitive resin composition and color filter using the same

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW100126952A TWI447523B (en) 2003-08-28 2004-08-03 Photosensitive resin composition and color filter using the same

Country Status (3)

Country Link
JP (1) JP4437651B2 (en)
KR (1) KR101077077B1 (en)
TW (2) TWI351581B (en)

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JP3754065B2 (en) * 2003-06-10 2006-03-08 三菱化学株式会社 Photopolymerizable composition and color filter using the same
JP4484482B2 (en) * 2003-09-25 2010-06-16 東洋インキ製造株式会社 Photosensitive coloring composition and color filter
JP2005202252A (en) * 2004-01-16 2005-07-28 Dainippon Printing Co Ltd Photosensitive coloring composition for solid-state image sensor color filter, solid-state image sensor color filter, solid-state image sensor, and solid-state image sensor color filter manufacturing method
JP2005215147A (en) * 2004-01-28 2005-08-11 Fuji Photo Film Co Ltd Polymerizable composition
TWI285297B (en) * 2004-02-09 2007-08-11 Chi Mei Corp Light-sensitive resin composition for black matrix
JP4556479B2 (en) * 2004-04-27 2010-10-06 Ｊｓｒ株式会社 Radiation-sensitive composition for forming colored layer, color filter, and liquid crystal display panel
JP4448381B2 (en) * 2004-05-26 2010-04-07 東京応化工業株式会社 Photosensitive composition
JP4492238B2 (en) * 2004-07-26 2010-06-30 Ｊｓｒ株式会社 Radiation-sensitive composition for forming colored layer, color filter, and color liquid crystal display panel
TWI385485B (en) * 2004-11-17 2013-02-11 Jsr股份有限公司 A photosensitive resin composition, a display panel spacer, and a display panel
JP2006195425A (en) * 2004-12-15 2006-07-27 Jsr Corp Radiation-sensitive composition for forming colored layer, color filter, and color liquid crystal display panel
JP4526964B2 (en) * 2005-01-27 2010-08-18 旭化成イーマテリアルズ株式会社 Photopolymerizable resin laminate, glass substrate with black matrix using the same, and method for producing color filter
JP4508929B2 (en) * 2005-03-31 2010-07-21 新日鐵化学株式会社 Photosensitive resin composition for insulating film
TW200710572A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same
KR101321838B1 (en) * 2005-07-20 2013-10-25 가부시키가이샤 아데카 Alkaline-developable photosensitive colored composition
JP4821206B2 (en) * 2005-07-29 2011-11-24 東レ株式会社 Photosensitive coloring composition for color filter and color filter
JP2007072035A (en) * 2005-09-06 2007-03-22 Tokyo Ohka Kogyo Co Ltd Photosensitive composition
KR100787341B1 (en) * 2005-09-06 2007-12-18 다이요 잉키 세이조 가부시키가이샤 A resin composition, cured material therefrom, and printing wiring boards using the same
JP4633582B2 (en) * 2005-09-06 2011-02-16 東京応化工業株式会社 Photosensitive composition
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JP4826415B2 (en) * 2005-10-12 2011-11-30 東レ株式会社 Photosensitive resin composition
KR100777561B1 (en) * 2005-11-24 2007-11-28 주식회사 엘지화학 Alkali-soluble resin and the photosensitive resin composition containing this
KR100655044B1 (en) 2005-12-30 2006-12-06 제일모직주식회사 Photosensitive resin composition for color filter having excellent electrical properties and color filter using the same
KR100740550B1 (en) * 2006-02-10 2007-07-18 주식회사 코오롱 Photosensitive resin composition for resin black matrix
JP2007233230A (en) * 2006-03-03 2007-09-13 Toyo Ink Mfg Co Ltd Photosensitive black composition and color filter
JP2007279668A (en) * 2006-03-14 2007-10-25 Asahi Kasei Electronics Co Ltd Black matrix and method for producing the same
JP5107231B2 (en) * 2006-03-28 2012-12-26 富士フイルム株式会社 Photosensitive composition, photosensitive film, permanent pattern forming method, and printed circuit board
JP5073342B2 (en) * 2006-03-31 2012-11-14 新日鐵化学株式会社 Photosensitive resin composition and color filter using the same
CN102445850B (en) * 2006-04-13 2013-07-31 太阳控股株式会社 Alkali development-type solder resist, cured product thereof, and printed wiring board prepared by using the same
JP4827088B2 (en) * 2006-04-13 2011-11-30 太陽ホールディングス株式会社 Alkali development type solder resist, cured product thereof, and printed wiring board obtained using the same
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JP5108300B2 (en) * 2006-12-28 2012-12-26 新日鉄住金化学株式会社 Photosensitive resin composition and color filter using the same
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Also Published As

Publication number Publication date
KR20050021902A (en) 2005-03-07
TWI447523B (en) 2014-08-01
KR101077077B1 (en) 2011-10-26
JP4437651B2 (en) 2010-03-24
TW201142502A (en) 2011-12-01
TWI351581B (en) 2011-11-01
JP2005077451A (en) 2005-03-24

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