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TW200507954A - Megasonic cleaning using supersaturated cleaning solution - Google Patents

Megasonic cleaning using supersaturated cleaning solution

Info

Publication number
TW200507954A
TW200507954A TW093116958A TW93116958A TW200507954A TW 200507954 A TW200507954 A TW 200507954A TW 093116958 A TW093116958 A TW 093116958A TW 93116958 A TW93116958 A TW 93116958A TW 200507954 A TW200507954 A TW 200507954A
Authority
TW
Taiwan
Prior art keywords
megasonic
cleaning
substrates
carbon dioxide
supersaturated
Prior art date
Application number
TW093116958A
Other languages
Chinese (zh)
Other versions
TWI330552B (en
Inventor
Cole S Franklin
Yi Wu
Brian Fraser
Original Assignee
Goldfinger Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goldfinger Technologies Llc filed Critical Goldfinger Technologies Llc
Publication of TW200507954A publication Critical patent/TW200507954A/en
Application granted granted Critical
Publication of TWI330552B publication Critical patent/TWI330552B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H10P52/00—
    • H10P72/0414—

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

A method and system for the megasonic cleaning of one or more substrates that reduces damage to the substrate(s) resulting from the megasonic energy. The substrates are supported in a process chamber and contacted with a cleaning solution comprising a cleaning liquid having carbon dioxide gas dissolved in the cleaning liquid in such amounts that the carbon dioxide gas is at a supersaturated concentration for the conditions within the process chamber. Megasonic energy is then transmitted to the substrate. The cleaning solution provides protection from damage resulting from the application of megasonic/acoustical energy. In another aspect, the invention is a system for carrying out the method. The invention is not limited to carbon dioxide but can be used in conjunction with any gas that, when so dissolved in a cleaning liquid, protects substrates from being damaged by the application of megasonic/acoustical energy.
TW093116958A 2003-06-11 2004-06-11 Megasonic cleaning using supersaturated cleaning solution TWI330552B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47760203P 2003-06-11 2003-06-11

Publications (2)

Publication Number Publication Date
TW200507954A true TW200507954A (en) 2005-03-01
TWI330552B TWI330552B (en) 2010-09-21

Family

ID=34061915

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093116958A TWI330552B (en) 2003-06-11 2004-06-11 Megasonic cleaning using supersaturated cleaning solution

Country Status (6)

Country Link
EP (1) EP1631396A4 (en)
JP (1) JP4643582B2 (en)
KR (1) KR101110905B1 (en)
CN (1) CN1849182A (en)
TW (1) TWI330552B (en)
WO (1) WO2005006396A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564112B (en) * 2012-12-28 2017-01-01 荏原製作所股份有限公司 Polishing apparatus

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010108641A (en) * 2000-05-30 2001-12-08 강병근 Healthy beverage with radish and manufacturing method thereof
KR20020037177A (en) * 2000-11-13 2002-05-18 김용현 Honey drink added radish
KR100827618B1 (en) * 2006-05-11 2008-05-07 한국기계연구원 Ultrasonic cleaning device and ultrasonic cleaning system using the same
US7969548B2 (en) * 2006-05-22 2011-06-28 Asml Netherlands B.V. Lithographic apparatus and lithographic apparatus cleaning method
JPWO2008050832A1 (en) * 2006-10-27 2010-02-25 東京エレクトロン株式会社 Substrate cleaning apparatus, substrate cleaning method, program, and recording medium
KR100748480B1 (en) * 2007-06-27 2007-08-10 한국기계연구원 Ultrasonic Cleaning System Using Ultrasonic Cleaning Device
JP4532580B2 (en) 2008-08-20 2010-08-25 株式会社カイジョー Ultrasonic cleaning equipment
JP4915455B2 (en) * 2010-02-25 2012-04-11 トヨタ自動車株式会社 Degreasing system using microbubbles for large products such as vehicles
JP6678448B2 (en) * 2015-12-22 2020-04-08 株式会社Ｓｃｒｅｅｎホールディングス Substrate cleaning method and substrate cleaning apparatus
WO2020095091A1 (en) * 2018-11-06 2020-05-14 Arcelormittal Equipment improving the ultrasound cleaning
JP7233691B2 (en) * 2019-03-28 2023-03-07 株式会社エアレックス Decontamination method for low-temperature goods and pass box used for this
CN119376198B (en) * 2023-11-10 2026-01-06 深圳市昇维旭技术有限公司 Photoresist removal methods and systems

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5368054A (en) * 1993-12-17 1994-11-29 International Business Machines Corporation Ultrasonic jet semiconductor wafer cleaning apparatus
JPH1022246A (en) 1996-07-04 1998-01-23 Tadahiro Omi Cleaning method
WO1998008248A1 (en) 1996-08-20 1998-02-26 Organo Corporation Method and device for washing electronic parts member, or the like
US5800626A (en) 1997-02-18 1998-09-01 International Business Machines Corporation Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates
US5849091A (en) * 1997-06-02 1998-12-15 Micron Technology, Inc. Megasonic cleaning methods and apparatus
US6167891B1 (en) 1999-05-25 2001-01-02 Infineon Technologies North America Corp. Temperature controlled degassification of deionized water for megasonic cleaning of semiconductor wafers
JP3322853B2 (en) * 1999-08-10 2002-09-09 株式会社プレテック Substrate drying device and cleaning device, and drying method and cleaning method
US6743301B2 (en) * 1999-12-24 2004-06-01 mFSI Ltd. Substrate treatment process and apparatus
US6684890B2 (en) * 2001-07-16 2004-02-03 Verteq, Inc. Megasonic cleaner probe system with gasified fluid
US20030084916A1 (en) * 2001-10-18 2003-05-08 Sonia Gaaloul Ultrasonic cleaning products comprising cleaning composition having dissolved gas

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564112B (en) * 2012-12-28 2017-01-01 荏原製作所股份有限公司 Polishing apparatus

Also Published As

Publication number Publication date
KR20060037270A (en) 2006-05-03
EP1631396A2 (en) 2006-03-08
JP2007502032A (en) 2007-02-01
KR101110905B1 (en) 2012-02-20
TWI330552B (en) 2010-09-21
EP1631396A4 (en) 2013-08-14
CN1849182A (en) 2006-10-18
WO2005006396A3 (en) 2005-09-15
WO2005006396A2 (en) 2005-01-20
JP4643582B2 (en) 2011-03-02

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Legal Events

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MK4A Expiration of patent term of an invention patent