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TW200506971A - Coated conductive particles, anisotropic conductive material and conductive connection structure - Google Patents

Coated conductive particles, anisotropic conductive material and conductive connection structure

Info

Publication number
TW200506971A
TW200506971A TW093120189A TW93120189A TW200506971A TW 200506971 A TW200506971 A TW 200506971A TW 093120189 A TW093120189 A TW 093120189A TW 93120189 A TW93120189 A TW 93120189A TW 200506971 A TW200506971 A TW 200506971A
Authority
TW
Taiwan
Prior art keywords
conductive
coated
particle
connection structure
anisotropic
Prior art date
Application number
TW093120189A
Other languages
Chinese (zh)
Other versions
TWI293764B (en
Inventor
Takeshi Wakiya
Shinya Uenoyama
Akihiko Tateno
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200506971A publication Critical patent/TW200506971A/en
Application granted granted Critical
Publication of TWI293764B publication Critical patent/TWI293764B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/62—Insulating-layers or insulating-films on metal bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/64—Insulating bodies with conductive admixtures, inserts or layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

This invention provides a coated conductive particle, anisotropic conductive material using such coated conductive particle, and a conductively connected structures which are conductively connected by such coated conductive particle or anisotropic conductive material. They are suitably applicable for use in electrically connecting electronic devices or electronic components. The coated conductive particle includes a core particle having a surface formed with a conductive metal, and insulation particles covering the surface of the core particle, wherein the surface of the core particle having such surface formed with a conductive metal has a plurality of protrusions.
TW093120189A 2003-07-07 2004-07-06 Coated conductive particles, anisotropic conductive material and conductive connection structure TWI293764B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003271540 2003-07-07
JP2003413653A JP4387175B2 (en) 2003-07-07 2003-12-11 Coated conductive particles, anisotropic conductive material, and conductive connection structure

Publications (2)

Publication Number Publication Date
TW200506971A true TW200506971A (en) 2005-02-16
TWI293764B TWI293764B (en) 2008-02-21

Family

ID=33566812

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093120189A TWI293764B (en) 2003-07-07 2004-07-06 Coated conductive particles, anisotropic conductive material and conductive connection structure

Country Status (4)

Country Link
JP (1) JP4387175B2 (en)
KR (1) KR100766205B1 (en)
TW (1) TWI293764B (en)
WO (1) WO2005004172A1 (en)

Cited By (2)

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TWI486976B (en) * 2007-04-16 2015-06-01 Dexerials Corp Conductive particles and an anisotropic conductive connecting material using the same, and a method for producing a conductive particle body
TWI602201B (en) * 2012-07-03 2017-10-11 日本化學工業股份有限公司 Conductive particles, conductive material and method for producing conductive particles

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JP4563110B2 (en) 2004-08-20 2010-10-13 積水化学工業株式会社 Method for producing conductive fine particles
JP2006269296A (en) * 2005-03-24 2006-10-05 Sekisui Chem Co Ltd Projection particle manufacturing method, projection particle, conductive projection particle, and anisotropic conductive material
JP4532321B2 (en) * 2005-03-30 2010-08-25 株式会社日立製作所 Conductive pattern forming device
JP4936678B2 (en) * 2005-04-21 2012-05-23 積水化学工業株式会社 Conductive particles and anisotropic conductive materials
JP2006331714A (en) * 2005-05-24 2006-12-07 Sekisui Chem Co Ltd Conductive fine particles and anisotropic conductive materials
JP4589810B2 (en) * 2005-06-07 2010-12-01 積水化学工業株式会社 Conductive fine particles and anisotropic conductive materials
JP2006351464A (en) * 2005-06-20 2006-12-28 Sekisui Chem Co Ltd Conductive particle, method for producing conductive particle, and anisotropic conductive material
JP4950451B2 (en) * 2005-07-29 2012-06-13 積水化学工業株式会社 Conductive fine particles, anisotropic conductive material, and connection structure
JP2007035574A (en) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd Conductive fine particles, anisotropic conductive material, and connection structure
KR100719807B1 (en) 2005-12-30 2007-05-18 제일모직주식회사 Insulated conductive fine particles and anisotropic conductive film using same
JP2007207665A (en) * 2006-02-03 2007-08-16 Sekisui Chem Co Ltd Method for producing conductive particles, conductive particles and anisotropic conductive material
WO2007099965A1 (en) * 2006-02-27 2007-09-07 Hitachi Chemical Company, Ltd. Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure
KR100879450B1 (en) * 2006-10-30 2009-01-20 이계영 Electrical connection device
JP4897344B2 (en) * 2006-04-28 2012-03-14 積水化学工業株式会社 Conductive fine particles and anisotropic conductive materials
US20100133486A1 (en) * 2006-10-17 2010-06-03 Hitachi Chemical Company, Ltd. Coated particle and method for producing the same, anisotropic conductive adhesive composition using coated particle, and anisotropic conductive adhesive film
KR20100009540A (en) * 2007-05-15 2010-01-27 히다치 가세고교 가부시끼가이샤 Circuit-connecting material, and connection structure for circuit member
JP5425636B2 (en) * 2007-10-22 2014-02-26 日本化学工業株式会社 Coated conductive powder and conductive adhesive using the same
WO2009078469A1 (en) * 2007-12-18 2009-06-25 Hitachi Chemical Company, Ltd. Insulator-covered conductive particle, anisotropic conductive adhesive film, and methods for producing those
JP5626288B2 (en) * 2008-02-05 2014-11-19 日立化成株式会社 Conductive particle, anisotropic conductive adhesive, connection structure, and manufacturing method of connection structure
JP5151920B2 (en) * 2008-02-05 2013-02-27 日立化成工業株式会社 Conductive particles and method for producing conductive particles
JP5395482B2 (en) * 2008-03-25 2014-01-22 積水化学工業株式会社 Coated conductive fine particles, anisotropic conductive material, and conductive connection structure
KR20110019392A (en) * 2008-07-01 2011-02-25 히다치 가세고교 가부시끼가이샤 Circuit connection material and circuit connection structure
JP5368760B2 (en) * 2008-09-29 2013-12-18 積水化学工業株式会社 Insulating coating conductive particles, anisotropic conductive material, and connection structure
JP4758470B2 (en) * 2008-12-18 2011-08-31 シャープ株式会社 Method for forming protruding electrode and displacement gold plating solution
JP4877407B2 (en) * 2009-07-01 2012-02-15 日立化成工業株式会社 Coated conductive particles and method for producing the same
JP5554077B2 (en) * 2009-09-15 2014-07-23 株式会社日本触媒 Insulating fine particle-coated conductive fine particle, anisotropic conductive adhesive composition, and anisotropic conductive molded body
JP5534891B2 (en) * 2010-03-26 2014-07-02 積水化学工業株式会社 Conductive particle, method for producing conductive particle, anisotropic conductive material, and connection structure
JP5051553B2 (en) * 2010-04-19 2012-10-17 住友金属鉱山株式会社 Method for producing conductive paste
JP2012003917A (en) * 2010-06-16 2012-01-05 Sekisui Chem Co Ltd Conductive particle, anisotropic conductive material and connection structure
KR101232433B1 (en) * 2011-02-23 2013-02-12 세키스이가가쿠 고교가부시키가이샤 Conductive particle, conductive particle manufacturing method, anisotropic conductive material, and connective structure
JP5703149B2 (en) * 2011-07-06 2015-04-15 積水化学工業株式会社 Conductive particles with insulating particles, anisotropic conductive material, and connection structure
JP5803393B2 (en) * 2011-08-02 2015-11-04 日立化成株式会社 Insulating coated conductive particles and anisotropic conductive adhesive film
JP5421982B2 (en) * 2011-12-22 2014-02-19 積水化学工業株式会社 Conductive fine particles, anisotropic conductive material, and connection structure
KR102095826B1 (en) 2012-07-03 2020-04-01 세키스이가가쿠 고교가부시키가이샤 Conductive particles with insulating particles, conductive material, and connection structure
JP5939063B2 (en) * 2012-07-11 2016-06-22 日立化成株式会社 Insulating coated conductive particles and anisotropic conductive adhesive using the same
KR101534841B1 (en) * 2012-11-07 2015-07-07 제일모직주식회사 Bump-type conductive microspheres and an anisotropic conductive film comprising the same
JP6302336B2 (en) * 2013-04-16 2018-03-28 積水化学工業株式会社 Conductive particles for photocurable conductive material, photocurable conductive material, method for producing connection structure, and connection structure
JP2015110743A (en) * 2013-10-28 2015-06-18 積水化学工業株式会社 Method for producing organic-inorganic hybrid particles, conductive particles, conductive material, and connection structure
JP6450154B2 (en) * 2013-11-12 2019-01-09 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures
JP6577723B2 (en) * 2014-03-10 2019-09-18 積水化学工業株式会社 Conductive particles with insulating particles, conductive material, and connection structure
JP6431411B2 (en) * 2014-03-10 2018-11-28 積水化学工業株式会社 Conductive particles with insulating particles, conductive material, and connection structure
JP6592235B2 (en) * 2014-10-02 2019-10-16 積水化学工業株式会社 Conductive particles with insulating particles, method for producing conductive particles with insulating particles, conductive material, and connection structure
EP3047973A3 (en) * 2015-01-23 2016-09-07 Konica Minolta, Inc. Inkjet head, method of producing inkjet head, and inkjet recording device
JP2017111883A (en) * 2015-12-14 2017-06-22 日立金属株式会社 Crimp terminal and wire with terminal
JP7028641B2 (en) * 2016-05-19 2022-03-02 積水化学工業株式会社 Conductive materials and connection structures
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI486976B (en) * 2007-04-16 2015-06-01 Dexerials Corp Conductive particles and an anisotropic conductive connecting material using the same, and a method for producing a conductive particle body
TWI602201B (en) * 2012-07-03 2017-10-11 日本化學工業股份有限公司 Conductive particles, conductive material and method for producing conductive particles

Also Published As

Publication number Publication date
KR100766205B1 (en) 2007-10-10
JP4387175B2 (en) 2009-12-16
WO2005004172A1 (en) 2005-01-13
KR20060052782A (en) 2006-05-19
TWI293764B (en) 2008-02-21
JP2005044773A (en) 2005-02-17

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