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TW200505046A - Light-emitting device array module - Google Patents

Light-emitting device array module

Info

Publication number
TW200505046A
TW200505046A TW092120968A TW92120968A TW200505046A TW 200505046 A TW200505046 A TW 200505046A TW 092120968 A TW092120968 A TW 092120968A TW 92120968 A TW92120968 A TW 92120968A TW 200505046 A TW200505046 A TW 200505046A
Authority
TW
Taiwan
Prior art keywords
light
chip
emitting device
device array
driving circuit
Prior art date
Application number
TW092120968A
Other languages
Chinese (zh)
Other versions
TWI222760B (en
Inventor
Huai-Ku Chung
Chih-Hung Chuang
Shun-Lih Tu
Chien-Chen Hung
Original Assignee
Opto Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Opto Tech Corp filed Critical Opto Tech Corp
Priority to TW92120968A priority Critical patent/TWI222760B/en
Application granted granted Critical
Publication of TWI222760B publication Critical patent/TWI222760B/en
Publication of TW200505046A publication Critical patent/TW200505046A/en

Links

Landscapes

  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention is related to a light-emitting device array module, which is mainly composed of substrate, carrying base board, chip, driving circuit chip and plural metal wires for electric connection. The carrying base board is disposed on the substrate, on which at least one chip and driving circuit chip are formed. Light-emitting device array and bonding pad array are disposed on the chip. Plural metal wires are connected with the chip and the bonding pad array of the driving circuit chip for electric connection. The driving circuit is used to drive the light-emitting diode of the light-emitting device array, in which both bonding pad array and bonding pad region are disposed on the top portion for electric connection with the substrate through plural metal wires, so as to increase the product yield and lower the production cost.
TW92120968A 2003-07-31 2003-07-31 Light-emitting device array module TWI222760B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92120968A TWI222760B (en) 2003-07-31 2003-07-31 Light-emitting device array module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92120968A TWI222760B (en) 2003-07-31 2003-07-31 Light-emitting device array module

Publications (2)

Publication Number Publication Date
TWI222760B TWI222760B (en) 2004-10-21
TW200505046A true TW200505046A (en) 2005-02-01

Family

ID=34546268

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92120968A TWI222760B (en) 2003-07-31 2003-07-31 Light-emitting device array module

Country Status (1)

Country Link
TW (1) TWI222760B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109037263A (en) * 2017-06-09 2018-12-18 美商晶典有限公司 Micro- light-emitting diode display module and its manufacturing method with light-transmitting substrate

Also Published As

Publication number Publication date
TWI222760B (en) 2004-10-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees