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TW200504893A - Heat pipe with temperature control - Google Patents

Heat pipe with temperature control

Info

Publication number
TW200504893A
TW200504893A TW093116100A TW93116100A TW200504893A TW 200504893 A TW200504893 A TW 200504893A TW 093116100 A TW093116100 A TW 093116100A TW 93116100 A TW93116100 A TW 93116100A TW 200504893 A TW200504893 A TW 200504893A
Authority
TW
Taiwan
Prior art keywords
heat pipe
temperature associated
temperature control
temperature
fluid
Prior art date
Application number
TW093116100A
Other languages
Chinese (zh)
Inventor
Andrew J Hazelton
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200504893A publication Critical patent/TW200504893A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)

Abstract

Methods and apparatus for controlling the boiling temperature of a fluid within a heat pipe are disclosed. According to one aspect of the present invention, a method for controlling a temperature associated with a heat pipe that contains a fluid and has an evaporator end includes measuring the temperature associated with the heat pipe and determining when the temperature associated with the heat pipe is at a desired level. The method also includes changing a pressure within the heat pipe when it is determined that the temperature associated with the heat pipe is not at a desired level. Changing the pressure within the heat pipe causes the temperature associated with the heat pipe to change.
TW093116100A 2003-06-05 2004-06-04 Heat pipe with temperature control TW200504893A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/455,004 US20040244963A1 (en) 2003-06-05 2003-06-05 Heat pipe with temperature control

Publications (1)

Publication Number Publication Date
TW200504893A true TW200504893A (en) 2005-02-01

Family

ID=33489837

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093116100A TW200504893A (en) 2003-06-05 2004-06-04 Heat pipe with temperature control

Country Status (7)

Country Link
US (1) US20040244963A1 (en)
EP (1) EP1629246A2 (en)
JP (1) JP2006526757A (en)
KR (1) KR20060018879A (en)
CN (1) CN1798953A (en)
TW (1) TW200504893A (en)
WO (1) WO2004109757A2 (en)

Cited By (3)

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TWI506261B (en) * 2014-01-27 2015-11-01 Vacuum desorption device after sample gas concentration
TWI791653B (en) * 2017-11-06 2023-02-11 新加坡商碧綠威自動化股份有限公司 Linear motor with heat dissipating capabilities and heat reducing considerations
TWI845253B (en) * 2022-06-22 2024-06-11 美商萬國商業機器公司 Electromagnetic waveguiding through liquid cooling conduit

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US7174806B2 (en) * 2001-09-13 2007-02-13 Beacon Power Corporation Flexible bearing damping system, energy storage system using such a system, and a method related thereto
US6675887B2 (en) * 2002-03-26 2004-01-13 Thermal Corp. Multiple temperature sensitive devices using two heat pipes
US7288864B2 (en) * 2004-03-31 2007-10-30 Nikon Corporation System and method for cooling motors of a lithographic tool
CN1892206A (en) * 2005-07-08 2007-01-10 鸿富锦精密工业（深圳）有限公司 Heat-pipe measuring device
US20070235161A1 (en) * 2006-03-27 2007-10-11 Eric Barger Refrigerant based heat exchange system with compensating heat pipe technology
KR101239962B1 (en) 2006-05-04 2013-03-06 삼성전자주식회사 Variable resistive memory device comprising buffer layer on lower electrode
US20080073563A1 (en) * 2006-07-01 2008-03-27 Nikon Corporation Exposure apparatus that includes a phase change circulation system for movers
KR101206036B1 (en) 2006-11-16 2012-11-28 삼성전자주식회사 Resistive random access memory enclosing a transition metal solid solution and Manufacturing Method for the same
JP2008147026A (en) * 2006-12-11 2008-06-26 Hitachi Ltd Solid oxide fuel cell
US8173989B2 (en) 2007-05-30 2012-05-08 Samsung Electronics Co., Ltd. Resistive random access memory device and methods of manufacturing and operating the same
TWM348267U (en) * 2008-07-25 2009-01-01 Micro Star Int Co Ltd Heat conducting pipe and heat dissipation system using the same
JP5355043B2 (en) * 2008-11-10 2013-11-27 キヤノン株式会社 Exposure apparatus and device manufacturing method
US8593810B2 (en) * 2009-01-23 2013-11-26 Nec Corporation Cooling device
US20100218496A1 (en) * 2009-03-02 2010-09-02 Miles Mark W Passive heat engine systems and components
NL2006809A (en) 2010-06-23 2011-12-27 Asml Netherlands Bv Lithographic apparatus and lithographic apparatus cooling method.
US8883024B2 (en) 2010-10-18 2014-11-11 Tokyo Electron Limited Using vacuum ultra-violet (VUV) data in radio frequency (RF) sources
EP2515170B1 (en) * 2011-04-20 2020-02-19 ASML Netherlands BV Thermal conditioning system for thermal conditioning a part of a lithographic apparatus and a thermal conditioning method
US8710526B2 (en) 2011-08-30 2014-04-29 Abl Ip Holding Llc Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism
US8759843B2 (en) 2011-08-30 2014-06-24 Abl Ip Holding Llc Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism
US8723205B2 (en) 2011-08-30 2014-05-13 Abl Ip Holding Llc Phosphor incorporated in a thermal conductivity and phase transition heat transfer mechanism
DE102011084324A1 (en) * 2011-10-12 2013-04-18 Siemens Aktiengesellschaft Cooling device for a superconductor of a superconducting dynamoelectric synchronous machine
WO2013113634A2 (en) * 2012-01-30 2013-08-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN104081283A (en) 2012-01-30 2014-10-01 Asml荷兰有限公司 Lithographic apparatus with a metrology system for measuring a position of a substrate table
KR101427924B1 (en) 2012-11-21 2014-08-11 현대자동차 주식회사 Cooling device of compressed air in fuel cell system
US20150068703A1 (en) * 2013-09-06 2015-03-12 Ge Aviation Systems Llc Thermal management system and method of assembling the same
US20160298915A1 (en) * 2013-09-12 2016-10-13 Renew Group Private Limited System and Method of Using Graphene Enriched Products for Distributing Heat Energy
CN105004232B (en) * 2015-08-20 2017-06-06 安徽华茂纺织股份有限公司 A kind of mike amplifying device
JP2017156465A (en) * 2016-02-29 2017-09-07 キヤノン株式会社 Drive device, lithography device, cooling method, and method for manufacturing article
CN107300334B (en) * 2017-07-31 2018-10-02 大连碧蓝节能环保科技有限公司 Adjust evaporating pressure formula heat pipe
CN110379729B (en) * 2018-04-13 2022-10-21 北京北方华创微电子装备有限公司 Heating base and semiconductor processing equipment
US10936031B2 (en) * 2018-04-13 2021-03-02 Dell Products L.P. Information handling system dynamic thermal transfer control
US10969841B2 (en) * 2018-04-13 2021-04-06 Dell Products L.P. Information handling system housing integrated vapor chamber
KR102098867B1 (en) * 2018-09-12 2020-04-09 (주)아이테드 Imprinting apparatus and imprinting method
PH12021553096A1 (en) * 2019-11-29 2022-07-25 Malcolm Barry James Fluid phase change thermal management arrangement and method
JP7182574B2 (en) * 2020-02-28 2022-12-02 株式会社日立製作所 Elevator control device and elevator control method
CN112161501B (en) * 2020-09-28 2022-02-25 北京空间飞行器总体设计部 Controllable heat pipe
CN115779812A (en) * 2022-11-15 2023-03-14 山东神驰石化有限公司 Energy-saving device of C3C4 dehydrogenation reaction feeding heating furnace

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI506261B (en) * 2014-01-27 2015-11-01 Vacuum desorption device after sample gas concentration
TWI791653B (en) * 2017-11-06 2023-02-11 新加坡商碧綠威自動化股份有限公司 Linear motor with heat dissipating capabilities and heat reducing considerations
TWI845253B (en) * 2022-06-22 2024-06-11 美商萬國商業機器公司 Electromagnetic waveguiding through liquid cooling conduit
US12451448B2 (en) 2022-06-22 2025-10-21 International Business Machines Corporation Electromagnetic waveguiding through liquid cooling conduit

Also Published As

Publication number Publication date
CN1798953A (en) 2006-07-05
US20040244963A1 (en) 2004-12-09
WO2004109757A3 (en) 2005-03-31
WO2004109757A2 (en) 2004-12-16
KR20060018879A (en) 2006-03-02
JP2006526757A (en) 2006-11-24
EP1629246A2 (en) 2006-03-01

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