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TW200504819A - Room temperature metal direct bonding - Google Patents

Room temperature metal direct bonding

Info

Publication number
TW200504819A
TW200504819A TW093102781A TW93102781A TW200504819A TW 200504819 A TW200504819 A TW 200504819A TW 093102781 A TW093102781 A TW 093102781A TW 93102781 A TW93102781 A TW 93102781A TW 200504819 A TW200504819 A TW 200504819A
Authority
TW
Taiwan
Prior art keywords
metallic
bonding pads
room temperature
direct bonding
substrate
Prior art date
Application number
TW093102781A
Other languages
English (en)
Other versions
TWI339408B (en
Inventor
Qin-Yi Tong
Anthony S Rose
Paul M Enquist
Original Assignee
Qin-Yi Tong
Anthony S Rose
Paul M Enquist
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qin-Yi Tong, Anthony S Rose, Paul M Enquist filed Critical Qin-Yi Tong
Publication of TW200504819A publication Critical patent/TW200504819A/zh
Application granted granted Critical
Publication of TWI339408B publication Critical patent/TWI339408B/zh

Links

Classifications

    • H10P90/1914—
    • H10D64/011—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10W10/181—
    • H10W72/00—
    • H10W72/012—
    • H10W72/851—
    • H10W90/00—
    • H10W95/00—
    • H10W99/00—
    • H10W72/01271—
    • H10W72/019—
    • H10W72/01951—
    • H10W72/072—
    • H10W72/07221—
    • H10W72/07227—
    • H10W72/07232—
    • H10W72/07234—
    • H10W72/07236—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/07336—
    • H10W72/07337—
    • H10W72/07341—
    • H10W72/20—
    • H10W72/231—
    • H10W72/241—
    • H10W72/251—
    • H10W72/252—
    • H10W72/30—
    • H10W72/90—
    • H10W72/9415—
    • H10W80/035—
    • H10W80/301—
    • H10W80/312—
    • H10W90/722—
    • H10W90/732—
    • H10W90/792—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Combinations Of Printed Boards (AREA)
TW093102781A 2003-02-07 2004-02-06 Room temperature metal direct bonding TWI339408B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/359,608 US6962835B2 (en) 2003-02-07 2003-02-07 Method for room temperature metal direct bonding

Publications (2)

Publication Number Publication Date
TW200504819A true TW200504819A (en) 2005-02-01
TWI339408B TWI339408B (en) 2011-03-21

Family

ID=32823827

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093102781A TWI339408B (en) 2003-02-07 2004-02-06 Room temperature metal direct bonding

Country Status (8)

Country Link
US (8) US6962835B2 (zh)
EP (1) EP1603702B1 (zh)
JP (5) JP5372325B2 (zh)
KR (2) KR101257274B1 (zh)
CA (1) CA2515375C (zh)
SG (1) SG2011091576A (zh)
TW (1) TWI339408B (zh)
WO (1) WO2004071700A2 (zh)

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CN108766873A (zh) * 2011-01-25 2018-11-06 Ev 集团 E·索尔纳有限责任公司 用于永久接合晶片的方法
US10373830B2 (en) 2016-03-08 2019-08-06 Ostendo Technologies, Inc. Apparatus and methods to remove unbonded areas within bonded substrates using localized electromagnetic wave annealing
US12218059B2 (en) 2016-10-07 2025-02-04 Adeia Semiconductor Inc. Stacked IC structure with orthogonal interconnect layers

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