TW200419128A - Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device - Google Patents

Abstract

A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holds are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the set is positioned a closest optimal distance to an adjacent hole the second set.

Description

200419128 V. Description of the invention (1) Related applications This patent application is a continuation of US patent application serial number 1 0/4 3 9, 6 3 5 and is proposed in 2 0 3, 5, 16 and entitled "Cooling in heating devices" The method and device of a flexible liquid for an ideal hot spot π, which is incorporated herein by reference. This application claims priority over the provisional patent application number 6 0 / under common US provisional patent application 3 5 USC 1 1 9 (e) 4 2 3,0 0 9,2 0 0 2,1 1,1, entitled "Microchannel heat sink for flexible liquid delivery and hot spot cooling method", the application is incorporated herein by reference, and US provisional patent Application No. 6 0/44 2, 3 8 3, 2 0 3, 1, 24 is filed, and the title is "Flat-plate fin heat exchanger π optimal for CPU cooling. This application is hereby incorporated by reference, and the United States The provisional patent application number is 60/4 5 5,7 2 9,2 0 3,3,17, and the title is "Microchannel heat exchanger device with porous configuration and its manufacturing method π. The application is based on Reference methods are incorporated here. This patent application under 3 5 USC 1 1 9 (e) claims priority over U.S. provisional patent application serial number 6 0/4 2 3, 0 0 9, 2 0 0 2, Π, 1 titled π with microchannel Method for cooling and transporting a flexible liquid by a heat absorber π, the application is incorporated herein by reference, and US provisional patent application serial number 60/4 4 2,3 8 3,2 0 0 3,1,24, entitled n CPU Cooling Better Plate and Fin Heat Exchanger ", this patent application is incorporated herein by reference, and US provisional patent application serial number 6 0/4 5 5, 7 2 9, 2 0 0 3, 3, 1 7 proposes, entitled "Microchannel heat exchanger device with porous configuration and its manufacturing method π, the application is incorporated herein by reference. Scope of the invention

200419128 V. Description of the invention (2) The present invention relates to a method and a device for cooling a heating device, in particular to an effective vertical liquid transfer and a minimum pressure drop of a heat exchanger to cool an electronic device. Background of the invention

Since its introduction in the early 1980s, heat exchangers have shown great potential for high heat flux cooling applications and industrial use. However, existing microchannels include traditional parallel channel arrangements, which are not suitable for cooling heating devices with spatially varying heat loads. This heating device has an area that generates more heat than others. This hotter area is called π hot spot π, and the area that does not generate much heat is called π temperature point π.

Figures 1A and 1B illustrate a side view and a top view of the heat exchanger 10 of the conventional art. The heat exchanger 10 is coupled to an electronic device 99, such as a microprocessor via a thermal interface material 98. As shown in FIGS. 1A and 1B, the liquid flows in from the single inlet port 12 and flows along the bottom surface 11 of the parallel channels 14 and flows out through the outlet port 16 as shown by the arrows. Although the heat exchanger 10 cools the electronic device 99, the liquid system from the inlet port 12 to the outlet port 14 flows in a uniform manner. In other words, the liquid actually flows in a uniform manner along the entire bottom surface 11 of the heat exchanger 10 without supplying more liquid to the area of the bottom surface 11 corresponding to the hot spot in the device 99. In addition, the temperature of the liquid flowing from the inlet increases as it flows along the bottom surface 11 of the heat exchanger. Therefore, the area of the heat source 99 is downstream or close to the outlet port 16, so no cold liquid is supplied, but the warmer liquid or two-phase liquid that has been heated upstream is actually supplied. In fact, the heated liquid actually transfers heat to the entire bottom surface of the heat exchanger 11 and the heat source 9 9, so it is close to the outlet liquid

Page 9 200419128 V. Description of the invention (3) It is not too hot, so it is not enough to effectively cool the heat source. The increase in heat causes the two-phase fluid to be unstable, and the boiling of the liquid along the bottom surface 11 forces the liquid to leave the area that generates the most heat. In addition, the heat exchanger 10, which has only one inlet 璋 12 and one outlet 珲 16, forces the liquid to be transmitted along the parallel channel 14 in the bottom surface 11 to the full length of the heat exchanger 10, so that the liquid must be transmitted. The pressure drop caused by the length. The large pressure drop in the heat exchanger 10 makes it difficult and unstable to pump the liquid to the heat exchanger. FIG. 1C illustrates a side view of a conventional heat exchanger 20. FIG. The liquid enters the multi-level quasi-heat exchanger 20 through port 2 2 and flows downward through the multiple nozzles 2 8 in the middle layer 26 to the bottom surface 27 and to the outlet 璋 2 4. In addition, the liquid transported along the nozzle 28 does not flow uniformly down to the bottom surface 27. In addition, the heat exchanger in Fig. 1C exhibits the same problem as the heat exchangers in Figs. 1 A and 1 B discussed above. Therefore, what is needed is a heat exchanger, whose configuration can achieve a low pressure drop between the inlet and the outlet, while effectively cooling the heat source. What is needed is a micro-channel heat exchanger whose configuration allows the temperature uniformity of the heat source. What is needed is a heat exchanger whose configuration can achieve the appropriate temperature uniformity of hot spots in the heat source. SUMMARY OF THE INVENTION In one feature of the present invention, the heat exchanger includes an interface layer to cool the heat source. The interface layer is in contact with the heat source and can be configured to pass liquid. The heat exchanger also includes a branch tube layer that is coupled to the interface layer. The branch pipe layer also contains a first group of individualized holes to pass liquid to the interface layer, and a second group of individualized holes to transfer liquid from the interface layer. The branch pipe layer also includes a first port, which provides liquid to the first group of individualized holes, and a second port to remove liquid transported from the second group of individualized holes. First

200419128 V. Description of Invention (4)

The arrangement of one group of holes and the second group of holes can provide the minimum liquid path distance between the first and second ports to properly cool the heat source. It is preferable that each hole in the first group is arranged at an optimal distance closest to the adjacent hole in the second group. The liquid passing through the heat exchanger is in one or more phases, or a combination thereof. The branch pipe layer still includes a circulation level, which has first and second holes extending therethrough. The flow level is coupled to the interface layer, and its configuration can transport liquid from the first and second groups of holes to the interface layer, respectively. Each of the first and second sets of holes includes a cylindrical protrusion that communicates with each other, and each cylindrical protrusion extends perpendicular to the circulation level. The branch pipe layer also includes the first level ’vehicles to the circulation level and to the first level. The first level configuration can transmit liquid between the first port and the first group of holes. The second level is coupled to the first level and the second port. The second level configuration can transport liquid between the second port and the second group of holes, and the liquid transmitted through the first level remains separated from the liquid transmitted through the second level. The first place still includes a first narrow channel, which is coupled to the first port, wherein the first set of holes and the first narrow channel are sealable arrangements. The first bit still includes a second narrow channel coupled to the second port, wherein the second set of holes and the second narrow channel are sealable arrangements. The first and second sets of holes are thermally insulated from each other to prevent heat transfer therebetween. The first and second sets of holes are arranged in a uniform manner along at least one-dimensional direction of the circulation level in an embodiment. The first and second sets of holes are arranged in a non-uniform manner along at least one-dimensional direction of the flow level in another embodiment. The first and second sets of holes are preferably hermetically separated from each other. Alternatively, the configuration of the first and second sets of holes can cool at least one interface hot spot in the heat source. In one embodiment, at least one hole in the first group has a first size that is substantially equal to the second size of at least one hole in the second group. In another embodiment, at least one of the holes in the first group has a first size.

Page 11 200419128 V. Description of the invention (5) and the second group of holes have at least a number of pillars with thermal conductivity, and the pillars of the configuration order are coated thereon along the interface layer. The cladding has a rough surface. In the proper configuration. Another feature of the invention. The heat exchanger package passes. Therefore, the liquid tank still contains a branch pipe layer and an inlet port. A liquid inlet path, which transfers liquid to an outlet port, which is coupled to the body. Inlet and outlet liquid Liquid transmission distance. The branch circulation level has a plurality of liquids from the interface layer to the circulation level along the outlet, and the inlet and outlet liquids to the outlet port. The liquid to be transported flows separately. The narrow channel has a self-entrant liquid path that contains a second hole with a different size of less than 10OW / mk. It is preferably arranged in a predetermined area along a predetermined map of the interface layer. Or the proper heat conduction of the coating includes porous microstructures arranged thereon, or, in the plurality of micro-channels, the heat exchanger may include an interface layer to engage the heat generated by the heating body and the heat source to the interface layer, The chirp is coupled to an interface layer that actually hangs down to the interface layer. The vertical outlet liquid passages of the heat exchanger are arranged as body passages to each other, and the tube layer still contains a plurality of inlet pores for vertical body passage transmission. Branch pipe layer port. Structure of the exit level Liquid that is transmitted through the inlet liquid. The liquid in the inlet level port transfers liquid horizontally to a long and narrow channel containing liquid. Che Fujia, the interface layer The interface layer still contains a copy. Alternatively, as appropriate, the column includes a rate of at least 10 W / mk. structure. Alternatively, the interface is configured in the interface layer to be light to a heat source and configured to allow liquid to heat exchange. The heat exchange layer has at least one liquid, and the straight inlet liquid still contains at least one liquid. The optimal minimum separation between the liquid removed from the interfacial layer and the interfacial layer is interposed to the interfacial layer. Extending through for liquid includes an inlet level coupling type self-exiting pore-capable body and an outlet level-passing channel that still contains a liquid inlet pore. Exit position

Page 12 200419128 V. Description of the invention (6) ___ From body to outlet port. At least one-dimensional direction of the inlet and outlet liquid ^ ^^ levels is arranged individually by means of the uniform sentence # = f in the consistent embodiment. Xi A ^ The pores are arranged at the circulation level of another embodiment, and the entrance and exit arrangements. The inlet and outlet liquid passages are preferably = / ,,, and the directions are non-uniform sentences. The outlet pores are interactively arranged, and A is preferably separated from each other. Entrance area. In an embodiment, at least one interface, at least one interface in the source is cooled by hotspots-the exit size of the exit pores is equal to the entrance pore size-the inlet size is at least the pore size is-the population size is at least-the embodiment towel, at least- Entrance is the same. The interface layer is preferably one to small; the size of the exit pores of the pores does not include a plurality of cylinders with proper heat / conductivity. The interface layer still has a proper number of cylinders along the interface layer in a predetermined area. The plurality of cylinders, including its surface layer, has a rough surface with appropriate thermal conductivity. Interface ^ 22: The device with the second coating layer having at least 10 W / mk preferably includes a plurality of circles; i :: the microstructure is disposed thereon. Heat exchange height, each-no protrusions, extending from the flow level-appropriate The cylindrical protrusions are thermally insulated to prevent two turns in between; Preferably, in another feature of the present invention, _, ^ β ^ forms a micro-channel heat exchanger, and A g t is used as a structure in the light-weight interface layer. The branch pipe layer also includes a first-temperature liquid. The body exits the branch pipe layer through the outlet port. ^ Mouth = Interlinked. The second temperature liquid-inlet channel is a direct inlet fluid channel in the upper layer, and each outlet is a direct fluid channel from the first port to the second port. The entrance and exit D channels provide the interface layer: the shortest body flow distance. The arrangement of the entrance and exit channels can be arranged in a uniform way. Or, mouth X and out: at least -feet of the second and second floor along the third floor

Page 13 200419128 V. Description of the invention (7) One less dimension is arranged in a non-uniform manner. The inlet and outlet passages are preferably hermetically separated from each other. The entrance and the exit path are alternately arranged in the third layer with at least one interface hot spot in the cold and heat source. At least one of the inlet channels has an inlet dimension that is substantially the same as an outlet dimension of at least one of the outlet channels. Alternatively, at least one of the inlet channels has an inlet dimension different from that of the at least one outlet channel. The branch pipe layer still includes a plurality of cylindrical protrusions extending at an appropriate height of the self-flowing level, and each protrusion communicates with the inlet and outlet passages individually. The cylindrical protrusion is thermally insulated to prevent heat transfer therebetween. The protrusion communicating with the inlet channel is hermetically coupled to the liquid inlet narrow channel, and the protrusion communicating with the outlet channel is hermetically coupled to the liquid outlet narrow channel. Special feature 1 In addition, Mingfa's original solution consists of a series of liquid-filled layers that pass through the surface and pass through the interlayer, forming a surface-layered medium containing the support. One method is to form a square heat into a comprehensive package. Coupling is still a source, but the hot side should be left cold. The cooler can be layer-sourced, and the cooler can be replaced by the surface of the fluid layer that passes through the body, and the vertical surface is vertical to the number of rows for re-arrangement and installation. The way is through the body fluids DD in and out. And straight mouth hangs on the occasion. A practical method should be adopted. The distance from the fluid to the liquid transmission method should be ^ 7 ο The best layer D into 1 is as small as possible, including the package, which is connected to the body fluid tube mouth, and the coupling is included. The body fluid inlet port of the body fluid is changed by the body fluid medium to the package. The method of forming the body fluid contains the package, and the heat transfer layer of the walkway enters the fluid inlet of the body tube to form a shape. The port body exchange fluid is hot out | LET is the liquid from the port to the body, and the coupling port contains the medium flow to the pass. The channel extends through the ductile body with a straight liquid sag, and the gap passes through the hole. The mouth body is filled with liquid. The number of holes is retransmission. The gap has its hole.

Page 14

200419128

V. Description of the invention (8) The pass level also has a plurality of exit apertures, which extend vertically through the interface layer and the outlet liquid through the outlet liquid passage. The step of forming the branch pipe layer further includes forming an inlet level to transfer liquid from the inlet port through the inlet narrow channel to the inlet aperture. The step of forming the branch pipe layer further includes coupling the inlet level to the circulation level, wherein the inlet aperture and the inlet narrow channel are hermetically coupled. The outlet forming the branch pipe layer is narrow and narrow, and at least the liquid inlet of the liquid source with the coupling-out channel is tight. Including electricity, including electricity, along the dielectric method, including the interface layer, the dielectric coating, and other methods such as wet-name engraving-related technology or perforation method. The machine steps also include forming a channel mouthpiece level seal. Compared with the plating method, the surface layer and the surface layer are separated by a plurality of etchings, which are formed by chemical etching on the surface layer. The method of formation is to infuse the liquid to the output level. Via the entry position. Entrance and hotspot i or. The liquid outlet is better to have one plus one heat, and the predetermined pattern configuration enables a small number of layers to form a pattern on the cylinder, such as plasma etching, etc. Branch tube heat transfer case has several holes. Reproduced, the method can be used at the level or the exit level. Shape, in which the quasi-transported exit liquid, the method still has steps, the conductivity is up to the coating layer, and a plurality of rough structures are arranged in the microchannel. Several cylinders of photochemical residual interactions form a combined interactive soft lithography technique. The process of ejecting the exit pores from the exit into a branch layer and the configuration of the liquid and the exit path includes an insulating branch so that there is less 100W / mk surface layer between them. Cylinder. Or noodles. Manufactured on the interface layer. The method still includes the formation of electrical engraved chemical worms. Electroforming method implemented. Branch tube formation. Support molding method, electrical steps still exit the exit narrow mouth level # can cool the thermal transfer spear in the tube layer > method is still. Method Θ, Manufacture> Fa Shangbao} Manufacturer S Force Ten Hot Method ”Qian I Carved and Thunder | Compared with Hot Pressing ^ Layer with Thunder Shoulder Tube Layer 4

Page 15 200419128 V. Description of the invention (9) (EDM), stamping, metal injection molding (MIM), cross cutting and recording. Other advantages and characteristics of the present invention will become more apparent after reviewing the detailed description of the preferred and other embodiments below. DETAILED DESCRIPTION OF THE INVENTION Generally, a heat exchanger passes through selected areas of a liquid and an interface layer to capture thermal energy generated by a heat source, and this layer is preferably coupled to the heat exchanger. In particular, the liquid is directed to a special area of the interface layer to cool the hot spot and the area around the hot spot to establish temperature uniformity across the heat source and maintain a small pressure drop in the heat exchanger. As discussed in the different embodiments below, the heat exchanger uses a plurality of pores, channels and / or fingers to guide the tubes in the branch and intermediate layers to direct and circulate liquid to and from the interface layer to select hot spots. Alternatively, the heat exchanger includes several ports, which are specially arranged in a predetermined position to guide the liquid transferred from the hot spot and remove the liquid to effectively cool the heat source. It is obvious to those skilled in the art that although the description and discussion of the microchannel heat exchanger of the present invention are related to cooling the hot spot position in a device, the heat exchanger can also be used to heat the cold spot position in a device. It should be noted that although the invention is described in terms of a microchannel heat exchanger, the invention can be used in other applications and is not limited to those discussed herein. Figure 2A illustrates a schematic diagram of a closed-loop sealed cooling system 30, which includes an interactive soft liquid transport microchannel heat exchanger 100 according to the present invention. In addition, FIG. 2B illustrates a schematic diagram of a closed loop cooling system 30, which includes another soft liquid transport microchannel heat exchanger 100, which has the present invention.

200419128 V. Description of the invention (ίο) Multiple ports 108, 109. It should be noted that the system can also be incorporated into other heat exchanger embodiments and is not limited to another heat exchanger 100.

As shown in FIG. 2A, the liquid ports 108 and 10 are coupled to a liquid line 38, which is connected to a pump 32 and a thermal condenser 30. Pump 3 2 pumps and circulates liquid in the closed circuit 30. In another embodiment, a liquid port 108 is used to supply liquid to the heat exchanger 100. In addition, a liquid 9109 was used to remove the liquid from the heat exchanger 100. In one embodiment, a uniform and constant amount of liquid flow enters and exits the heat exchanger 100 through the liquid ports 108,109. Alternatively, different amounts of liquid flow in and out through the inlets and outlets 璋 108, 109 at regular times. Alternatively, as shown in Figure 2B, a pump supplies liquid to several designated inlet ports 108. Alternatively, multiple pumps (not shown) provide liquid to their individual inlet and outlet ports 108,109. In addition, the dynamic detection and control module 34 can be used in the system to change and dynamically control the amount and flow rate of fluid entering and discharging a better or another heat exchanger, in response to changes in hot spots or changes in heat in hot spot locations and The location of the hot spot changes.

FIG. 3B illustrates a perspective view of a three-layer heat exchanger 100 having an alternate branch tube layer according to the present invention. Another embodiment shown in 3B is a three-position quasi-heat exchanger 100, which includes an interface layer 102, at least one intermediate layer 104, and at least one tube layer 106. Alternatively, as discussed below, the heat exchanger 100 is a two-level quasi-device that includes an interface layer 102 and a tube layer 106. As shown in FIGS. 2A and 2B, the heat exchanger 100 is coupled to a heat source 9 9. For an electronic device, including but not limited to a microchip and an integrated circuit, a thermal interface material 9 8 is preferably disposed at the heat source 9 9. And heat exchanger 100. Alternatively, the heat exchanger 100 is directly coupled to the surface of the heat source 99. It is very obvious to those skilled in this art, the heat exchanger 1 0 0 can also be

Page 17 200419128 V. Description of the invention (li)-The integration is formed in the heat source 99, and the heat exchanger 100 and the heat source 99 form a unit. Therefore, the interface layer 102 can be integrated with the heat source 99 to form an element with the heat source. Preferably, the configuration of the micro-channel heat exchanger of the present invention can be directly brought into contact with the heat source 9 9. The heat exchanger is rectangular as shown in the figure. It is obvious to those skilled in the art that the heat exchanger 100 can be of any shape to match the shape of the moon heat source 9 9. For example, the heat exchanger of the present invention can be configured to have a 'semi-circular shape' which can directly or indirectly contact a heat exchanger (not shown) with a corresponding semi-circular heat source > ('not shown). In addition, the heat exchanger is preferably larger in size than the heat source, and ranges from and including 0.5-5.0 mm. Fig. 3A illustrates a top view of another pipe layer 106 of the present invention. As shown in Fig. ’', The branch pipe layer 106 includes four sides, a top surface 130 and a bottom surface 132. However, the top surface 130 is removed in FIG. 3A to properly illustrate the work of the branch pipe layer j 06. As shown in FIG. 3A, the branch pipe layer 106 has a series of channels or passages I16 '118, 120, 122 and ports 108, 109 formed therebetween. The finger 108 '120 extends in the z direction as shown in Fig. 3B, and completely extends through the body of the branch tube layer 106. Alternatively, the finger portions 118 and 120 are partially extended through the branch tube layer 106 in the Z direction and have pores as shown in FIG. 3A. In addition, the channels 1 16 and 12 2 partially extend through the branch tube layer 10β. The remaining area between the inlet and outlet channels 116, 120 is represented by 107, extending from the top surface 130 to the bottom surface 132, and the body constituting the branch pipe layer 106. As shown in FIG. 3A, the liquid enters the branch pipe layer 106 through the inlet port 108, and flows along the mouth channel i6 to several fingers n8, which spreads the liquid knife from the channel π6 to X And / or Υ direction to apply liquid to the interface layer 102

200419128 V. Description of the invention (12) A '~-~ area. The women's volleyball team 1 1 8 is in different predetermined directions to transport liquid to each position in the interface layer 102, which corresponds to the area of the heat source at or near the hot spot. These positions in the interface layer 102 are hereinafter referred to as interface hot spots. The configuration of the finger can cool the static and time-changing interface heat and spot area. As shown in Figure 3 A, channel 11 6, eh! 2 and the fingers j i 8 2 ′; directions are arranged in the branch pipe layer 106. Therefore, the channels 116, ι2, and /: 118, 120 can transmit liquid in different directions to cool the heat source 99 and / or minimize the pressure drop in the heat exchanger 100. Or recite 122J fingers 118, 12. Regularly arranged on the branch pipe layer ..., and the pattern is shown in the examples of Figures 4 and 5. τ Wei's orbital point:: Orbital point: $ Dimensions are from the heat source 99 to be cooled ^, 10 e, / ΛTn " * Above the interface hotspot in surface layer 02. Branch f; or close to the pressure in medium system 30 (Figure 2A). Transmission to eight ^ 1: State 100 and interface hotspots and near interface hotspots are established uniformly; the liquid in the spot area is at a size of 1% | 1160 ^ 118 = number and factor =: In the example, the entrance and exit fingers 118, 12〇 has the same wide yield ί :. Or, the entrance and exit fingers ⑴, 120 are different; = inch. Finger Heart 8, 12. The width dimension includes and includes 〇25_5. : =. In another-continuous application: the middle finger portion 118 '12 has the same length and =. Or in: and out: fingers 118, 12. With different width disc lengths. In another embodiment, the entrance and exit fingers " S ’m;"

200419128 V. Description of the invention (13) refers to the width with varying length. In addition, the length dimensions of the inlet and outlet finger portions 118, 120 are three times longer than and including 0.5 mm to the length of the heat source. In addition, the finger portions 1 1 8 and 1 2 0 have a height or a depth of .25 55.0 mm. In addition, fingers less than 10 or more than 30 centimeters per cm may be alternately disposed in the interface layer 106. However, it is obvious to those skilled in this art that between 10 and 30 fingers per cm at the branch level is also feasible. _ The present invention is intended to fit the geometric shapes of the fingers 1 18, 120 and the channels 1 16 and 12 to aperiodic arrangements to increase the optimal hot spot cooling of the heat source. In order to achieve a uniform temperature across the heat source 99, the spatial distribution of heat transfer to the liquid is matched by the spatial distribution of heat generation. As the liquid flows through the microchannel 1 1 0 along the interface layer, the temperature increases and begins to change to vapor under two-phase conditions. As a result, the liquid is greatly expanded, causing a substantial increase in speed. Generally, the heat transfer efficiency from the interface layer to the liquid is improved due to the high flow rate. Therefore, the cross-sectional dimensions of the liquid transfer and the removal of the fingers 1 18, 1 2 0 and the channels 1 18, 1 2 in the heat exchanger 100 can be adjusted to match the efficiency of heat transfer to the liquid. For example, a special finger can be designed for the heat source to generate higher heat near the entrance. In addition, it is an advantage to design a larger cross-sectional area of the finger portions 118, 120 and the channels 116, 12 2 where a mixture of liquid and vapor may be generated.

Although not shown, the finger portion may be designed to start with a small cross-sectional area at the entrance to cause high-speed flow of liquid. The special finger or channel can be configured with a large cross-sectional area at the downstream outlet to cause a lower flow velocity. The fingers and channels are designed to minimize the pressure drop of the heat exchanger and increase the amount, speed and acceleration of liquid caused by the conversion of liquid in the two-phase fluid to vapor.

Page 20 200419128 V. Description of the invention (14) Optimization of hot spot cooling. In addition, the finger portions 1 18, 10 and the channels 1 16, 1 2 2 may be designed to be widen and then narrower along their length to increase the liquid velocity in different places of the microchannel heat exchanger 100. Alternatively, it is also possible to design to change the finger and the channel from large to small and then from small to large several times to match the heat transfer efficiency to achieve the desired heat consumption distribution across the heat source 99. It should be noted that the above discussion of changing the finger and channel can also be applied to other embodiments, and is not limited to this embodiment. Xin Alternatively, as shown in FIG. 3A, the branch tube layer 106 includes one or more pores 1 1 9 in the fingers 1 1 8. In the three-layer heat exchanger 100, the liquid flows down the finger 1 1 8 through the pores 1 1 9 to the middle layer 104. Alternatively, in the three-layer heat exchanger 100, the liquid flows down the finger 1 1 8 to the pore 1 1 9 and directly enters the interface layer 102. Further, as shown in FIG. 3A, the branch pipe layer 106 includes an aperture 121 in the exit finger 120. In the three-layer heat exchanger 100, the liquid flows upward from the intermediate layer 104 through the pores 1 2 1 and enters the outlet finger 1 2 0. Alternatively, in the two-layer heat exchanger 100, the liquid flows upward from the intermediate layer 102 to the pore 12 1 and enters the outlet finger 1 2 0. In another embodiment, the inlet and outlet finger portions 18, 120 are open channels without pores. The bottom surface 10 of the branch pipe layer 106 is adjacent to the surface of the intermediate layer 104 in the three-layer heat exchanger 100 or the interface layer 102 in the two-layer heat exchanger. Therefore, in the three-layer heat exchanger 100, the liquid flows freely to the intermediate layer 104 and the branch pipe layer 106. The liquid is guided by the catheter 105 in the middle layer 104 to the appropriate interface hot spot. Those skilled in the art will know that the catheter 105 is directly aligned with the fingers under or around the three-layer system. Although FIG. 3B only shows a three-layer heat exchanger with branch pipe layers, the heat exchange

Page 21 200419128 V. Description of the invention (15) The device can also have a two-layer structure including a branch pipe layer 106 and an interface layer 102, and the liquid directly passes through each of the layers between the branch layer 106 and the interface layer 102. Through the interface layer 104. It is obvious to those skilled in this art that the configuration of the branch, middle layer and interface layer is shown for example purposes only and is not limited to the configuration shown. As shown in FIG. 3B, the middle layer 104 includes a plurality of catheters 105 extending through it. The inflow conduit 105 guides the liquid from the branch tube layer 106 into the designated interface hotspot area in the interface layer 102. In the same way, the pore 105 also transmits liquid from the interface layer 102 to the outlet liquid port 109. Therefore, the middle layer 104 also provides the liquid from the interface layer 102 to the outlet liquid port 109, and the outlet liquid port 108 is in communication with the branch layer 106. The duct 105 is arranged in the interface layer 104 in a predetermined pattern according to a factor, which includes but is not limited to the position of the interface hot spot, and the amount of liquid required by the interface hot spot is to cool the heat source 99 and the temperature of the liquid. The catheter has a width of 100 microns and other sizes up to a few millimeters are possible. In addition, the catheter 105 can be of other sizes, depending on at least the factors mentioned above. For those skilled in the art, each of the catheters 105 in the intermediate layer 104 has the same shape and size but is not required. For example, as with the fingers described above, the catheter may also have variable length and / or width dimensions. In addition, the catheter 105 has a constant depth or height dimension through the intermediate layer 104. Alternatively, the catheter 105 has a variable depth dimension, such as a trapezoidal or nozzle shape, and passes through the intermediate layer 104. Although the horizontal shape of the catheter 105 shown in FIG. 2C is rectangular, the catheter 105 may have other shapes, including a circular shape (FIG. 3A), a curved shape, and an oval shape. Alternatively, one or more of the catheters 105 can be equivalent to the shape or shape of some or all fingers. The middle layer 104 is arranged horizontally in the heat exchanger 100, and the ducts are arranged vertically

200419128 V. Description of Invention (16). In addition, the intermediate layer 104 can be arranged in any direction of the heat exchanger 100, including but not limited to diagonal lines and curved shapes. Alternatively, the catheter 105 can be arranged horizontally, diagonally, curved or in any direction in the intermediate layer 104. Alternatively, the intermediate layer 104 extends horizontally along the entire length of the heat exchanger, so the intermediate layer 104 completely separates the interface layer 102 from the branch pipe layer 106 to force the liquid to pass through the duct 105. Alternatively, a part of the heat exchanger 100 does not include the intermediate layer 104 between the branch pipe layer 106 and the interface layer 102, so the liquid can flow freely therebetween. In addition, the intermediate layer 104 may extend vertically between the branch pipe layer 106 and the interface layer 102 to form a separate and distinct intermediate layer region. Alternatively, the intermediate layer 104 does not completely extend from the branch pipe layer 106 to the interface layer 102. FIG. 10A illustrates a perspective view of a preferred embodiment of the interface layer of the present invention. As shown in FIG. 10A, the interface layer 302 includes a series of pillars 303 extending upward from a bottom surface of the interface layer 302. In addition, Fig. 10A illustrates a microporous structure 3 01 disposed on the bottom surface of the interface layer 302. It is clear that the interface layer 302 may include only the microporous structure 301 and a porous structure combination with any other interface layer characteristics (ie, microchannels, pillars, etc.). The preferred interface layer 3 0 2 includes pillars 3 0 3 instead of microchannels, because the liquid flowing from the inlet pores flows to the outlet pores around the preferred branch layer 3 2 (Figure 12A). As discussed in detail below, the liquid is transported downward to the interface layer 3 0 through a series of inlet pores, and the liquid flows out of the interface layer 3 2 through a series of outlet pores. The pores are spatially separated by the optimal distance from the inlet pores. In other words, liquid is transported from each inlet pore to the nearest outlet pore. Preferably, each inlet aperture is surrounded by several outlet apertures. Therefore, the liquid entering the interface layer 3 2 will flow in a direction around the exit aperture

200419128

V. Description of the invention (17) The pillar 3003 is preferably in the interface layer 3202 to accommodate sufficient rotation f "and the liquid pressure drop is reduced by $ when the liquid flows from the inlet pore to the outlet pore. Then 302 preferably includes-a dense high, narrow array of pillars 303, the basin extends vertically from the bottom surface 301, and the branch pipe; ', the pillar 303 is in contact with the bottom surface of the interface layer 300. Alternatively, it is also preferable to be equidistant from each other along the interface layer 3.2: 1 21 = extension. The postal transfer ability of the cylinder can evenly cross the bottom surface 3. Heart; the heat transfer of the interface layer 3 02 is called the gate 3 , Cylinder 3 0 3 can also be non-equidistant

= Two: The edges of the pillars in the middle of the interface layer 3 ° 2 are separated by a greater distance. The spatial separation of the cylinder 3 is related to the size and position of the fluid resistance of the liquid, the size and position of the hot spot, and the contact with the heat flux density of the heat source 99. For example, the lower density of the cylinder 3 0 3 is less resistant to $ _ > the next day γ & mm mm π t, but also provides less surface area for thermal transfer from the interface! It should be understood that the non-intermittent partition configuration of the cylinder 303, which is not a consistent example of FIG. 10B, is not limited, and can be configured in any arrangement, depending on the heat source and cooling system 3 (Figure 2 Lixiong operation conditions ^ In addition, the cylinder 3 03 is preferably cylindrical as shown in FIG. 10a, so that the liquid flows from the inlet pore to the outlet pore with minimal resistance. However, the cylinder 3 03 The shape may include, but is not limited to, a square 303B (Figure 〇B), a diamond, an oval 303C (Figure 10C), a hexagonal 303D (Figure 10D), or other shapes. In addition, the interface The layer 3 02 may have a combination of pillars of different shapes along the bottom surface 3 0. For example, as shown in FIG. 10E, the interface layer 3 2 includes a set of distance-shaped fins 3 0 3 E The groups are arranged in a radial direction with each other. In addition, the interface layer 3 〇2 package

Page 24 200419128 V. Description of the invention (18) Include several cylinders 3 〇3 B in the configuration 'the gap is arranged radially under each inlet pore, so the radial division has a near uniform distribution and an outlet pore. The size or the configuration of the fins is different from the pin 3 that flows to the single-phase or bi-phase. The configuration of Figure 3B is shown in Figure 3B. Figure 3B shows the interface layer 110 'microchannel wall 11 (path transmission. Bottom The surface heat source 9 9 has enough heat to collect from a special location. The configuration is shown in Figure 3B between the walls. For other configurations that are good at this technique, depending on the size of the channel wall between 1 and 10, Except for the micro-channel wall, the surface and the porous structure are obvious. However, for the purpose of example, it is placed between the set of winged fins 3 0 3E. An open circle in the implementation of the winged fins 3 0 3 E The shaped area is placed on the 'fins 3 0 3E to help guide the fluid to the outlet orifice. The flaps 3 0 3E can help to minimize the pressure drop, and the cooling liquid of the cloth is in the interface layer 30 2. There are many possible configurations of cylinders and / or surface layers. The choice of the best arrangement depends on the state of the liquid. It is obvious to those skilled in this art that F can be incorporated into any embodiment and variations. Perspective view of another embodiment of the clear interface layer 102. For example, 102 includes a bottom surface 103 and a plurality of microchannel walls. The area between them can guide or transport the liquid along a liquid stream 103 which is flat and has a high thermal conductivity for self-transfer. Alternatively, the bottom surface 103 includes grooves or ridges designed for or expelled. Micro The channel wall 11 〇 is flat, so that the liquid can flow along the liquid path to the micro-passers is very obvious, the micro channel wall 1 10 can be configured as a factor. For example, the interface layer 10 2 can be in the micro groove The groove is shown in Fig. 8C. In addition, the pressure drop or pressure difference in the microchannel wall L interface layer 102 is the smallest. Other configurations can also be considered, including but not limited to rough such as sintered metal or silicon foam. It is clear that the microchannel wall 1 1 0 in FIG.

Page 25 200419128 V. Description of the invention (19) The interface layer 102 of the invention. The microchannel wall 1 10 allows the liquid to undergo heat exchange along a selected hot spot of the interface hot spot to cool the heat source 9 9 at that location. The microchannel wall is placed in a range of 20-300 microns and a height of 100 microns to 1 mm, depending on the power of the heat <. The length of the microchannel wall 110 is from 100 micrometers to several centimeters 99, depending on the size of the heat source, the size of the hot spot, and the heat flux to the heat source. Alternatively, any other microchannel wall size can be considered. Micro-pass ^ 2 and 1 1 0 separated from each other 'separation range is 50-500 microns, depending on the power of the heat source 9 9 ^, although other separation distances can also be considered. With reference to the assembly in FIG. 3B, the top surface of the branch tube layer 〇6 is cut with # 明 支 管 层 1 0 6 The channels in the body 11 6, 11 2 and the fingers 11 8, 1 2 〇 brother heat source 99 The middle place generates more heat, so it is called a hot spot, and the place where the heat source should generate a small amount of heat is called the warm spot. As shown in FIG. 3B, the hot spot area of the heat source 9 is at position A, and the warm spot area is at position β. The area where the interface layer 102 is close to the holding point and the temperature point is called the interface hotspot. As shown in FIG. 3b, the interface drawers, 102, and 102 include an interface hotspot area a, which is disposed at the location A and the interface hotspot area, and the hotspot area B is disposed above the location B. As shown in FIGS. 3A and 3B, the liquid initially enters the converter 100 through the inlet port 08. The liquid then flows to an inlet channel i 6. Alternatively, the heat exchange ^ 100 includes one or more inlet channels i. As shown in FIG. 3 level 3B, the liquid = Shanghai state. The inlet channel 116 flows from the inlet port 108 into the branch flow to the finger U8D. Outside 2 Λ, the liquid flowing along the other part of the inlet channel 1 16 continues to flow. Fingers 118B and 118C, and so on. In Figure B, the liquid reaches the finger 丨 丨 8 Α and is supplied to the interface hotspot.

This E A J

200419128 V. Description of the invention (20) The liquid flows down through the fingers 1 1 A to the middle layer 104. The liquid then flows through the entrance guide 5 A, which is located below the finger 118 A, and then flows into the interface layer 102, where the liquid is subjected to heat exchange with a heat source 99. As mentioned above, the political channels in the interface layer 102 can be configured in any direction. Therefore, the micro-channels 111 in the interface area A are arranged perpendicular to the remaining micro-channels in the interface layer 102. Therefore, the liquid from the catheter 105A is transmitted along the micro-channel i, as shown in FIG. 3, although the liquid is also transmitted in other directions along the remaining area of the interface layer 102. The heated liquid is transported upward through the catheter 1 q 5 b to the exit finger 12 A.

Similarly, the liquid flows downward in the Z direction through the fingers 1 8E and 8F to the interlayer 104. The liquid then flows down through the inlet conduit 105C in the z direction and enters the layer 102. The liquid then flows upward in the direction from the interface layer ι02 through the outlet guide = j〇5D to the outlet fingers 120 and 120F. The heat exchanger 100 removes the heated liquid in the branch pipe layer 106 from the outlet pipe 4 1 2 0, and the mouth 1 2 0 is connected to the mouth, and the smoke 1 2 is connected. The outlet channel 1 2 2 Make the liquid flow through an outlet cock 10 out of the heat exchange c. It is better to 'enter the fluid and out of the fluid duct 1 0 5 Directly configure the two P 100 gtpf jo », and the eight mountains are on the appropriate interface hotspot area to Direct supply of liquid: 敎 μ, ",, point in heat source 9 9. In addition, the configuration of the female-outlet finger 1 2 0 can be configured closest to the grain

The pressure drops 1 1 8 ′ at each entrance of the hot spot area of the interface, so that it is smaller ^! ΛΟ, whichever is smaller. Therefore, the liquid passes through the inlet finger 1 1 8Α into the interface 5, and the person “exits the interface layer 1 2 to the outlet finger 1 2 0 A before passing the shoulder book; the distance from the bottom surface 103 of 12 is very obvious. (Liquid along the line) The surface of the 1-3 transfer wheel ^ > The amount of historical distance can appropriately shift the heat generated by the heat source 9 9 f / ', without generating unnecessary pressure drops. In addition, as shown in the figure Level 3 shown in 3 B

200419128 V. Description of the invention (21) The middle corner of the finger 1 1 8 and 1 2 is the beginning of the song, and # the pressure drop of the liquid. The lowering of the flow along the fingers 1 18 is very clear to those skilled in this art. The configuration of 106 is for example purposes only. And 3B's configuration of the bureaucratic service, depending on the following factors; m channel " 6 and finger placement, flowing from and to the two hot spots of the interface hot spot area / = the hot spot area entrance and exit finger The intersection of the two energy 7 configurations includes parallelism. The main interactive arrangement of the views along the dwellings as shown in Figure 4-7A is as discussed below. Other configurations of the finger portion 118 can also be considered. Channels 1 1 6 and FIG. 4 illustrate the heat exchanger of the present invention. The branch pipe layer of FIG. 4 includes a plurality of 411, 412, # to make the single-phase or two-phase core thousands of liquid guide pressure drop to the heat exchanger 400. And the system 30 %%; the surface layer 402 is not issued, the entrance finger part ⑴ and out 4 Figure A) ·. As shown in Figure 8, Auntie Dingding ▲ Female Gan also Yu Cairi ^ 4 1 2 The father arranged each other. But be good at this ^ Z The entrance or exit fingers in the text can be adjacent to each other: the master is therefore not limited to the configuration of FIG. 4. In addition, the finger part can be designed such that one ::! Part is branched or linked with another t-line finger part. Therefore, there may be more fingers in the entrance than σ 卩 in the exit hand, and vice versa. The inlet finger or channel 411 supplies the liquid into the heat exchanger to the interface g 402, and the outlet finger or channel 412 removes the liquid from the interface layer 402 and flows out of the heat exchanger 400. The branch tube layer 406 shown is configured to allow liquid to flow into the interface layer 40 2 'and to travel a short distance in the interface layer 402 before flowing to the outlet channel 412. The reduction in the transmission length of the liquid along the interface layer 40

Page 28 200419128 V. Description of the invention (22) It can reduce the drop in the heat exchanger 400 and the system 30 (Figure 2A). As shown in Fig. 4-5, another branch pipe layer 406 includes a channel 414, which communicates with the two inlet channels 411 and provides liquid there. The branch pipe layer 406 in Figs. 8-9 includes three outlet channels 412, which communicate with the channels 418. The channels 4 1 4 in the branch pipe layer 406 have a flat bottom surface to transfer liquid to the fingers 4 1 1,

4 1 2. Alternatively, the inlet channel 4 1 4 has a small slope to assist liquid transfer to the selected liquid channel 4 1 1. Alternatively, the inlet channel 4 1 4 includes one or more pores on its bottom surface, which allows a portion of the liquid to flow down to the interface layer 402. Similarly, the channel 4118 in the branch pipe layer has a flat bottom surface, which contains liquid and transfers the liquid to port 408. Alternatively, the channel 4 1 8 has a slope to assist the transfer of liquid to the selected outlet port 4 0 8. In addition, the channels 4 1 4 and 4 1 8 have a width of about 2 mm, and other widths are also considered. Channels 4 1 4 and 4 1 8 communicate with ports 4 0 8 and 4 9 which are connected to the liquid line 38 in the system 3 0 (Fig. 2A). The branch tube layer 40 6 includes a horizontal configuration liquid spring 4 08, 40 9. Alternatively, the branch layer 406 includes vertical or diagonal structures = body ports 408, 409, as discussed below, but not shown in Figures 4-7. Or, the branch pipe layer 406 does not include the channel 414. So the liquid comes directly from port 40 = 4U on the finger. In addition, the branch pipe layer 41 does not include the channel 4U, and the medium liquid directly flows out into the exchanger 400 through the 418. Although σ 12

It communicates with the channels 414 and 418, and other numbers can also be used. ^ Bee 408 shows that the size of the inlet channel 411 allows liquid to be transmitted to the interface. A pressure drop occurs along channel 411 and system 30 (FIG. 2A). The entrance channel is not included in the range of 0.25 to 5.0 mm, although the other dimensions are also wide, the entrance channel 411 has a length dimension including the negative wish. This i 栝 0.5 position to triple the heat source 200419128 V. The length of the invention description (23). Alternatively, other lengths may be considered. As described above, the inlet channel 4 1 1 extends downward to a height slightly higher than the micro channel 4 1 0, and the thallium liquid is directly transmitted to the micro channel 410. The entrance channel 411 has a height at and includes 0.25-5. 00mm. For those skilled in the art, although the entrance channels 4 1 1 have the same size, other different sizes are also feasible. Alternatively, the passage 411 has a variable width, a cross-sectional area, and a distance between adjacent fingers. In particular, the channel 4 1 1 has a region with a larger width or depth along its length, and a region with a narrower width and depth. This change in size allows more liquid to be transmitted through the wider area to the predetermined interface hotspot area of the interface layer 402, while restricting transmission to the warm point area through the narrower portion. In addition, the outlet channel 4122 has a size that allows liquid to be transferred to the interface layer without causing a large pressure drop along the outlet channel 4 12 and the system 30 (Fig. 2A). The exit channel 4 1 2 has a width dimension including and including 0.25-5. 00mm, other dimensions are also feasible. In addition, the outlet channel 412 has a length dimension of and including 0.5 mm to three times the length of the heat source. In addition, the outlet channel 4 1 2 extends downward to the height of the micro channel 4 10, and the thallium liquid easily flows upward in the outlet channel 41 2 after flowing horizontally along the micro channel 4 10. The entrance channel 41 1 has a height in the range of 0.25-5. 0 0mm, and other height dimensions can also be considered. It is obvious to those skilled in this art that although the exit channel 4 1 2 has the same size, the exit channel 4 1 2 may have different sizes and may be considered. In addition, the exit channels 4 1 2 may have different widths, cross-sectional dimensions, and / or different distances between adjacent fingers. The inlet and outlet channels 4 1 1, 4 1 2 are segmented and different from each other. As shown in Figures 4 and 5, the liquids in the channel are not mixed with each other. In particular, as shown in Figure 8,

Page 30 200419128 V. Description of the invention (24) Two outlet channels are located on the outer edge of the branch pipe layer 4 06, and one outlet channel 4 1 2 is located in the center of the branch pipe layer 40 6. In addition, the two inlet passages 411 are configured on adjacent sides of the central outlet passage. This particular configuration causes the liquid entering the interface layer 4 02 to travel a short distance in the interface layer 4 02 before exiting the interface layer 4 02 through the outlet channel 4122. However, it is obvious to those skilled in this art that the entrance transportation and exit passage can be configured in any other suitable configuration, and therefore are not limited to the configuration described in the present invention. The number of entrance and exit channels 4 丨 丨, 4 1 2 is more than three in the officer layer 406, but each cm across the branch layer 406 is less than 10 pieces. It will be apparent to those skilled in the art that other numbers of entrance channels and exit channels may be used, and are not limited to those shown and described in the present invention. The officer layer 406 is coupled to an intermediate layer (not shown), and the intermediate layer is coupled to the interface layer 402 to form a three-layer heat exchanger 400. The intermediate layer discussed here refers to the upper layer in the embodiment shown in FIG. 3B. The branch pipe layer 406 can also be coupled to the interface layer 402 'and disposed on the interface layer 402 to form a two-layer heat exchanger 400 as shown in Fig. 7A. Figures 6A-6C illustrate coupling to the interface layer in a two-layer heat exchanger

Sectional view of another tube layer 4 0 4 of 4 0 2. FIG. Β a particularly illustrates a cross-sectional view of the heat exchange line 400 along line A-A in FIG. 5. In addition, FIG. 6 is a cross-sectional view of the heat exchanger 400 along the line B_B in FIG. 6 and FIG. 6C is a cross-sectional view of the heat exchanger 400 along the line C-C in FIG. As described above, the inlet and outlet channels 4 ^ j, 4 1 2 extend from the top surface to the bottom surface of the branch pipe layer 406. When the branch pipe layer 406 and the interface layer 402 are coupled to each other, the inlet and outlet channels 4 丨 丨, 4 丨 2 are slightly higher than the microchannel 410 in the interface layer 402. This configuration allows the liquid from the inlet channel 411 to easily flow from the channel 4 1 1 through the micro channel 4 1 0. In addition, in this configuration, the liquid flowing through the microchannel easily flows upward through the outlet after flowing through the microchannel 4

200419128 V. Description of the invention (25) Channel 4U. In another embodiment, the intermediate layer 104 (FIG. 3B) is disposed between the branch tube layer 406 and the interface layer 402, but is not shown in the figure. The intermediate layer 104 (Fig. 3B) transmits the liquid to the designated interface hotspot in the interface layer 402. In addition, an intermediate of 1 to 104 (Fig. 3B) can be used to provide a uniform flow of liquid into the interface layer 402. . In addition, the intermediate layer 104 can be used to provide liquid to the interface hot spots in the interface layer 402 to properly cool the hot spots and cause a uniform temperature in the heat source 99. The configuration of the inlet and outlet channels 4 1 1, 4 1 2 is close to or above the hot spot in the heat source 9 9. 乂 Proper cooling of the hot spot is not necessary.

FIG. 7A illustrates a block diagram of another branch layer 4 0 6 with another interface layer i 02 according to the present invention. The interface layer 1 〇 2 includes a continuous arrangement of microchannel walls π 〇 as shown in Figure 3B

During operation, it is similar to the preferred branch pipe layer 106 as shown in FIG. 3B. Liquid and liquid enter the branch pipe layer 406 at the liquid port 408 and are transmitted through the channels 4 and 4 to the flow section. In the fingers or channels 4 1 1. The liquid enters the opening of the finger portion 4 1 1 and the length of the finger portion 4 1 1 in the X direction as shown by the arrow. In addition, the liquid flows downward in the Z direction to the interface layer 402, which is arranged in the branch pipe layer 406. As shown in FIG. 7A, the liquid in the interface layer 402 flows laterally along the bottom surface in the XV direction of the interface layer 402, and performs heat exchange with the heat source 99. The cooked body, the 4'night body, flows upward in the Z direction through the outlet finger 4 1 2 and discharges the interface layer 40. The σ finger 4 1 2 transmits the heated liquid in the X direction to the branch tube layer. Channel 4 1 8. The liquid then flows along the channel 4 18 and exits the heat exchanger via port 409. The interface layer shown in FIG. 7A includes a series of grooves 4 1 6 arranged between each group ψν ^ Γ is ^ 41 0, which can help transfer liquid from the channel 411,

200419128 V. Description of the invention (26) 4 1 2 The groove 4 1 6A is located directly below the inlet channel 4 1 1 of the branch pipe layer 4 06, and the liquid entering the interface layer 1 0 2 through the inlet channel 4 1 1 is guided to the micro channel adjacent to the groove 4 16 A. Therefore, the groove 4 1 6 A can directly transfer liquid from the inlet channel 4!} To a specially designated flow path as shown in FIG. 5. Similarly, the interface layer 402 includes a groove 416B 'located directly below the outlet channel 4 1 2 in the z-direction. Therefore, the liquid transported horizontally to the outlet channel along the microchannel 4 10 is horizontally transferred to the groove 4 1 6B and vertically to the outlet channel 412 above the groove 4 16B. FIG. 6A illustrates a cross-sectional view of a heat exchanger 400 having a branch tube layer 40 6 and an interface layer 40 2. Fig. 6A particularly shows that the inlet channel 4 1 1 intersects with the outlet channel 4 1 2 and therefore the liquid in the inlet channel 4 1 1 flows downward and the liquid in the outlet channel 41 2 flows upward. In addition, as shown in FIG. 6A, the liquid flows horizontally through the microchannel 410, which is arranged between the inlet channel and the outlet channel, and is separated by grooves 4 1 6 A and 4 1 6 B. Alternatively, the microchannel wall is continuous (Fig. 3B) and is not separated by microchannels 4 1 0. As shown in Fig. 6A, the inlet and outlet channels 4 1 1, 4 1 2 are at their ends and close to the groove 4 1 Position 6 has a curved surface 4 2 0. The curved surface 4 2 0 directs the liquid down to channel 4 1 1 and to microchannel 4 1 0, which is located near channel 4 1 1. Therefore, the liquid entering the interface layer 102 is easily guided to the microchannel 4 10 instead of directly flowing to the groove 4 16 A. Similarly, the curved surface 4 2 0 in the outlet channel 4 1 2 assists the flow of liquid from the micro channel 4 1 0 to the outlet channel 412. In another embodiment, as shown in FIG. 7B, the interface layer 4 0 2 includes the inlet channel 411 , And the exit channel 412 ', as discussed with the branch layer 406 (Figure 8-9). In another embodiment, 'liquid is directly supplied from the port 4 0 8' to the interface layer 200419128 V. Description of the invention (27) 4 0 2 '. The liquid is transported along the channel 4 1 4 'to the inlet channel 4 1 1'. The liquid then travels laterally along the set of microchannels 4 1 0 ′ and performs heat exchange with a heat source (not shown), and flows to the outlet channel 4 1 2 ′. The liquid then flows along the outlet channel 4 1 2 'to the channel 4 1 8', where the liquid flows out of the interface layer 4 0 2 'via 璋 4 9'. The 珲 4 8 ', 409' configuration is in the interface layer 402 ', and it can also be configured in the branch layer 406 (Figure 7A) ° It is obvious to those skilled in this art, although this All heat exchangers in the invention show horizontal operation, and the heat exchangers can also be operated in a vertical position. When operating in a vertical position, the heat exchanger can be configured such that each inlet channel is positioned above an adjacent outlet channel. Therefore, liquid enters the interface layer through the inlet channel and is naturally transferred to the outlet channel. It is clear that any other configuration of the branch and interface layers can be used to operate the heat exchanger in a vertical position. Figure 8-C illustrates a top view of another embodiment of the heat exchanger of the present invention. Fig. 8 particularly illustrates a top view of another pipe layer 206 of the present invention. Figures B and C illustrate top views of the intermediate layer 204 and the interface layer 202. In addition, Fig. 9 illustrates a three-layer heat exchanger using another tube layer 206, and Fig. 9 illustrates a two-layer heat exchanger using another tube layer 206. As shown in Figs. 8 and 9, the branch pipe layer 206 includes a plurality of liquid ports 208 in a horizontal and vertical configuration. Alternatively, the liquid port 208 is located diagonally or in any direction with the branch layer .206. The liquid port 208 is as much as the selected position of the branch pipe layer 206 to efficiently transfer liquid to the predetermined interface hot spot in the heat exchanger 2000. The multiple liquid ports 208 provide a sufficient advantage, because liquid can be directly transferred from a liquid port to a special interface hotspot, without increasing the pressure significantly.

Page 34 200419128 V. Description of the invention (28) Heat exchanger 2 0 0. In addition, the liquid port 208 is also arranged in the branch pipe layer 206 so that the liquid in the hot area of the interface transmits a shortest distance to the outlet port 208. The liquid reaches temperature uniformity and can maintain the inlet and outlet port 2 Minimum pressure drop between 0 and 8. In addition, the use of the branch pipe layer 206 can help stabilize the two-phase liquid flow in the heat exchanger 200 and the uniform liquid flow distributed across the interface layer 202. It should be noted that more than one branch tube layer 20 6 may be included in the heat exchanger 200, and therefore, one tube layer 2 06 may route liquid to and from the heat exchanger 200, and the other tube layer (not shown) Control the liquid flow rate to the heat exchanger 2000. Alternatively, all the plurality of branch pipe layers 206 circulate liquid to the hot spot corresponding to the selection in the interface layer 202. The other branch pipe layer 20 6 has a lateral dimension closely matching the size of the interface layer 20 2. The branch pipe layer 2 06 and the heat source 9 9 have the same size. Alternatively, the branch pipe layer 206 is larger than the heat source 99. The vertical dimension of the branch pipe layer 2 0 6 is in the range of 0.1 to 1 Omm. In addition, the size of the pores in the branch pipe layer 206 receiving the liquid 璋 2 0 8 is 1 mm and the full width or length of the heat source 9 9. Figure 11 illustrates a perspective view of a three-layer heat exchanger according to the present invention having another tube layer 206. As shown in Fig. 11, the heat exchanger 2000 is divided into independent zones, depending on the heat generated along the body of the heat source 99. Each zone is separated by a vertical middle layer 204 and / or a microchannel wall 2 10 in the interface layer 202. It is obvious to those skilled in this art that the assembly shown in Figure 11 is not limited to the configuration shown, and is for example purposes only. The heat exchanger 200 is coupled to one or more pumps, one pump is coupled to inlet 208A, and the other pump is coupled to inlet 208B. As shown in FIG. 3, the heat source 9 9 has a hot spot at location A and a temperature at location B.

Page 35 200419128 V. Description of the invention (29) point, the hot spot in position A generates more heat than the temperature point in position B. It is very obvious that the heat source 9 9 can have more than one hot spot and temperature point at any location and for a fixed time. In this example, because location A is a hot spot, more heat from location A is transferred to the interface layer 2 2 above location A (designated as interface hot spot area A in Figure 11), with more liquid and / or higher The liquid at a flow rate is supplied to the interface hot spot A in the heat exchanger 200 to appropriately cool the position A. It is obvious that although the interface hotspot area B is larger than the interface hotspot area A, the interface hotspot areas A and B and other interface hotspot areas in the heat exchanger 2000 may be of any size and / or related configuration. Alternatively, as shown in FIG. 11, the liquid enters through the liquid port 208 A, flows along the middle layer 204, and is guided to the interface hot spot area A and then to the fluid conduit 205 A. The liquid then flows downward in the Z direction in the conduit 2 05 A into the interface hotspot area A in the interface layer 2 02. The liquid flows between the microchannels 2 0 A, so the heat from the position A is transferred to the liquid through the conduction of the interface layer 2 2. The heated liquid flows along the interface layer 2 2 in the interface hotspot area A toward the outlet 珲 2 9 A, where the liquid flows out of the heat exchanger 2 0 0. It is obvious to those skilled in this art that any number of entrance ports 208 and exit ports 209 can be used for a special interface hotspot or a group of interface hotspots. In addition, although exit port 209 A shows close to the interface layer 202 A, exit port 209 A can also be located in any other vertical position, including but not limited to the branch pipe layer 209B. Similarly, in the example shown in FIG. 11, the heat source 99 has a temperature point at the position B, and the position A that generates the heat source 99 is heat. The liquid entering through the port 208B is guided to the interface hotspot B by the flow along the intermediate layer 203B and flows into the fluid conduit 205B. The liquid then enters the fluid conduit 2 5B in the Z direction

Page 36 200419128 V. Description of the invention (30) The medium thermal direction flows to the interface hotspot B in the interface layer 202. The liquid flows between the micro-channels 001 = ^ and the Y direction. Therefore, heat is transferred from the ^ generated in the position B into the liquid. The heated liquid flows along the whole = layer 2 2B in the hotspot area B of the interface and flows out of the duct 2 0 2 in the middle layer 2 0 like the square σ ^ level to the outlet port 2 0 9 B, where the liquid Exhaust the heat exchanger 2000a. Alternatively, as shown in FIG. 9A, the heat exchanger 2000 may include a permeable steam composition over the interface layer 200. Vapor-permeable membranes have 214 side walls in sealed contact. The configuration of the diaphragm has a number of ^ f interface layer 2 0 2 vapor can pass through and reach port 2 0 9. The configuration is waterproof to prevent liquid fluid from permeating the vapor barrier 114 along the interface layer 202 through the spacer Γ Γ- Λ ° Γ. The details are discussed in Common United States = 66 = 128? ° 0 2,3,22, titled | "Steam channel heat parent converter", this patent application is incorporated by reference here = Description / invention perspective view of preferred heat exchanger 300. Figure 12B; = perspective view of converter 30 ° 'is shown in Figure 12, : Including the interface layer, 302, and the branch layer _, the source (not shown M = 〇 heat parent converter 3 0 0, 3 0 0, coupled to the heat) Integrated in the heat source (embedded microprocessor = combined) The exposed person shown in FIG. 12A is only an example; the second and third best include a plurality of carcasses 3 0 3 arranged along the bottom surface 301. The radially distributed wings 3 〇3E. The interface layer 302 can have any characteristics as above ^

200419128 V. Description of the invention (31) Discussant (ie microchannel, rough surface). The characteristics in the interface layer 3 02 and the layer 3 02 preferably have the same thermal conductivity characteristics, as discussed above, and will be discussed again in a preferred embodiment. Although the interface layer 302 is smaller than the branch tube layer 306, it is obvious to those skilled in the art that the interface layer 302 and the branch tube layer 306 and each other and the heat source 99 can be of any size. The other devices of the interface layer 302, 302, and 2 have the same characteristics, as described in the interface layer, and will not be described in detail. Generally, the preferred heat exchanger 300 can use the transmission channel 322 in the branch pipe layer 306 to minimize the pressure drop in the heat exchanger. The transmission channel 3 2 2 is vertically arranged in the branch pipe layer 3 06 and the liquid is vertically supplied to the interface layer 30 2 to reduce the pressure drop in the thermal parent exchange Is 300. As described above, the pressure drop is established or increased in the heat exchanger 300 because the liquid flows along the interface layer in the direction of the stage γ for a considerable time and / or a distance. The branch pipe layer 306 forces the liquid vertically, =, and each of the transmission channels 3 2 2 enters the interface layer 30 to make the liquid in the level γ direction smaller. In other words, several liquid nozzles are directly added to the interface layer from above, and the transmission channels 3 2 2 are arranged at an optimal distance from each other to minimize the liquid flow in the X = direction and flow out of the interface layer 3 02 vertically. For this reason, the force of the individual liquid path from the channel 3 2 2 = ^, naturally forces the liquid to flow out of the interface layer 3 2 in the liquid path on 2. In addition, the individual channels 32 2 can maximize the distribution of the liquid flow in several channels 3 2 2 in the plane f 3 0 2, thus reducing the pressure drop in the exchanger and effectively cooling the heat source 9 9. In addition, the better configuration of the heat exchanger 300 can make the heat exchanger smaller than other heat exchangers, because the liquid does not need to transmit a large distance in the X and Y directions, and thus can be used as a cooling heat source. 9 9. The preferred branch pipe layer 306 shown in FIG. 12A includes two levels. Branch pipe 200419128 V. Description of the invention (32) Layer 3 0 6 especially includes level 3 (] a, ,, 3 0 2 and level 3 1 2. Although the shackle gj 丨 2 3 1 2. Level 3 0 8 coupling On the interface layer, the artist 312 who is proficient in this technology can be configured on the level 308. The artist who is proficient in this technology can be configured on the level of quanchuan. It is also obvious that any number According to the present invention, another ancient total 庶 0 Λ 312, shown in FIG. 12B. The circulation level 3 04, consumes 304 '' one bit 308, and one bit 308, coupled to the circulation level 3〇 :, and 2: 30, standing up to 308, level 312, configured at level "standard 312", 12B Ming level 3 08, can be configured at level 312, above ^ this artist It can be considered that the level of MM is too obvious to those skilled in this art, and any number of levels can be implemented according to the present invention. A perspective view showing the circulation level of the present invention is 304 '. The circulation level -=. 甬 付 里 ^ 304304A and bottom surface 04B. As shown in Figures 12B and 12C, the circulation level is 3 0 4 'direction; 7 丨 tri, several holes 322 extending through the dagger. One implementation Open bottom of ': f 322' in the example The surface is difficult and flush. Or, the pores 322 'extend beyond the bottom surface 304B to supply liquid close to the interface layer 302. In addition, the circulation level 304, including a number of pores 324, extends from the top surface 304A, extending To the bottom surface 3 04B and a predetermined distance vertically protruding like a cylindrical protrusion in the z direction. It is very obvious to those skilled in this art, the holes 3 2 2 ,, 3 24 'can also extend through the circulation level at an angle, Also, it need not be completely vertical. As described above, in one embodiment, the interface layer 302, (FIG. I2B) is coupled to the bottom surface 3004 'of the circulation level 304. Therefore, the liquid flows only in the z direction Passes through the aperture 322 'and enters the interface layer 302', and flows through the aperture 3 £ 4 in the z direction, and the row

200419128 V. Description of the invention (33) _ Out interface layer 302 '. As discussed below, the liquid exiting the interface through the aperture 322 3 0 2 ′ and the aperture 324 are separated by the interface layer 3 0 4. 9, the night body is shown in Figure 12C by the circulation monument, a part of the aperture 324, from the top of the circulation level 3 04, the direction of the surface is 304A, extending ^ is the cylindrical member at 3 24 'the liquid flows directly to Level 312, where the narrow and long abundance flows through the pores 12 G). The cylindrical protrusions are preferably circular as shown in Figure ^ 2 匸 所 8 3 2 6 (Figure 1 2 F and also. Along the interface layer 3 0 2, the liquid flows from each pore 3 ^, but in other shapes. Flow to adjacent pores 3 24 ,. Pores 3 22, and 3 24 ^ Horizontal and vertical insulation, passing through the branch layer 3 0 6, exist in the interface layer 3 02, ^, and do not transfer heat to each other through the branch layer 306, the heat of the cold / hot liquid flowing to the interface layer 302, FIG. 12D illustrates a preferred implementation of the present invention at level 308. It is shown that the level 308 includes the top surface 30 8 A and the bottom surface 308B are shown in FIG. 12D as 302 ^ 〇3B; 2 ™ 308 includes a concave narrow channel 320, which includes a plurality of liquid transfer channels M2 to transfer liquid to the interface layer 302. The concave narrow channel 32〇 is in sealing contact with the interface layer 302 'where the liquid existing in the interface layer 30 2 surrounds and flows between the channels 3 2 2 in the narrow channel 3 2 0 and is discharged through the port 3 1 4. It should be noted that there is The liquid in the interface layer 302 does not enter the transmission channel 322. "FIG. 12E illustrates the perspective of the lower side of another embodiment of the level 308 'of the present invention. The level 308 includes a top surface 308A' and a bottom surface. 3〇 8B, the bottom surface of level 308B 'is directly coupled to the circulation level 304 (Fig. 12c). Level 308' preferably includes port 314 ', a narrow channel 32 °, and a plurality of The apertures 322, 324 are in the bottom surface 308B. It is very clear to those skilled in this art. 200419128 V. Description of the invention (34) It is obvious that the level 308 can include a large number of ports and narrow channels. Figure i 2 E The configuration of the pore 3 2 2 '3 2 4' is to face the circulation level 3 04. In particular, the pore 3 2 2 is guided into the narrow channel 3 2 4 as described in FIG. 1 2E. Liquid flows to level 312] Pore 324 'fully extends through level 308, the narrow channel 3 2 0 ° Pore 3 2 4 is individual and separated, and the liquid flowing through pore 3 2 4 does not flow through the relevant pores 3 2 4 'cylindrical liquid mixing and contact. Pore 3 2 4 | is individualized to ensure that each pore 3 2 4 flows, the liquid flows along the liquid path provided by the pore 324'. Pore 3 24, compared with It is preferably in a vertical configuration. Therefore, 'the liquid is transported vertically through the branch layer 3 06, the main part. Similarly,

Test A is used for pores 3 2 2, especially if the level is arranged between the interface layer and the level.

-Although the pores or holes 3 2 2 appear to have the same size, the pores 3 2 2 may have varying diameters of / or 0 length. For example, the hole 3 2 2 near the port 3 1 4 may have a smaller diameter to restrict liquid flow. The smaller holes 3 2 2 can therefore force the liquid to flow downward from the pore 3 2 2, which is further away from the port 3 1 4. The diameter of the holes 3 2 2 can be more uniformly distributed into the interface layer 3 2. It is obvious to those skilled in this technique that the diameter of the hole 3 2 2 can be changed to solve the cooling of the known “surface hotspot” in the interface layer 302. It is obvious to those skilled in this technique that the above discussion can also be applied to pore The dimensions of the 3, 24, and the pores 324 are varied or different to accommodate the uniform outward flow from the interface layer 3 0. In a preferred embodiment, the port 3 1 4 provides liquid to the level 3 0 8 and to the interface layer 3 〇 2. Port 314 in FIG. 12D preferably extends from the top surface 3 0 8A through a portion of the body at level 308 to the narrow channel 3 2 0. Alternatively, port 3 丨 4 is at the bottom of level 308卩 or the side extends to the narrow channel 3 2 0. Preferably, the port 3 0

Page 41 200419128 V. Description of the invention (35) Coupling to port 315 in level 31 2 (Figures 12A-12B). Port 31 4 leads to the narrow channel 3 2 0, which is closed as shown in Figure 1 2 C, or the recess is shown in Figure 12 D. The narrow channel 3 2 0 is preferably capable of transmitting liquid from the interface layer 3 2 to the port 3 1 4. The narrow channel 3 2 0 can also transfer liquid from port 3 1 4 to the interface layer 3 2. As shown in Figures 1 2 F and 1 2 G, port 31 5 in the 'level 312 is preferably aligned with and communicates with port 3 1 4. As shown in FIG. 12A, the liquid preferably enters the heat exchanger 3 0 through port 3 1 6 and flows downward through the transmission channel 3 2 2 through the narrow channel 3 2 8 and gradually flows to the interface layer 3 0 2. As shown in Figure 12B, the liquid can enter the heat exchanger 3 0 0 ', preferably through port 3 1 5' and enter and flow through level 3 08, middle 3 1 4 and gradually flow to the interface. Layer 3 0 2 ,. Port 315 in FIG. 12F preferably extends from the top surface 31 through the body of level 3 1 2. Or, port 3 丨 5 is extended from one of levels 3 丨 2. Alternatively, the level 3 1 2 does not include the port 3 1 5 and the liquid enters the heat exchanger 3 0 0 through the port 3 1 4 (Fig. 12 D and 1 2 E). In addition, the level 3 1 2 includes the port 3 1 6 ', which preferably transmits liquid to the narrow channel 3 2 8'. It is obvious to those skilled in this art that the level can include any number of ports and narrow passages. The narrow channel 3 28 preferably transmits liquid to the transmission channel 3 2 2 and gradually flows to the interface layer. Jl / G illustrates the perspective 312 of the present invention, another perspective view of another embodiment. Level 3 1 2 Chevrolet is up to 19 p. As shown in Figure 12F, bit. " ~ Concave and narrow channel area 328, in the body ‘It is along the bottom surface # 路 槽 长长 管 328’ is in communication with port 316 ’, so the liquid can be transferred to 槔 316 through channel 328’. The concave narrow channel is, for example, bit =, ίΓί 3m 'above the surface', so that the liquid is transmitted from the pores upward to the narrow channel 328. Concave narrow channel 32 °, and bottom

200419128 V. Description of the invention (36) The perimeter of the surface 31 2B ′ is a seal to abut the bit 312, the surface 3 0 8 A ′, all the pores 3 2 4 are free, the bass can be |, port 316. The bottom surface 312B, each of the pores 33 °, and the corresponding pores 321 in the position 0308 ', (Figure 12) ^ 赢 Win, ^ t is 3408' (Figure 12E). The gap 33Qw 1 is flush with d U 8 A. Or go to: FI gap M f) right / slightly larger than the corresponding pore 324, the direct protection, and the pore 3 of Zhengnan and Shuang has a long channel 328. Straight U Shen through the pore 33. Enter the narrow factory f2: Sectional view of the preferred heat exchanger along line H-H of Fig. 12A. # 图 12H 所 不 'Interface layer 302 coupling As described above, the heat exchanger can then be integrated with the heat source 99 to form the bottom table 308, which fits to the level 308. In addition, the level is referred to as level 30 8, so the top surface 308A of level 3 08 is the bottom surface 312B which is sealed against the level. The narrow and long channel 32 of the quasi 308 communicates with the interface layer 302. In addition, the narrow channel 3 28 in level 312 and the pore 32 in level 30 and the bottom surface 312B in level 312 and the top surface 308A in level 308 are densely ^ ° The liquid will not be at level 3 0 8,31 2 rooms leaked.俾 FIG. 121 illustrates another cross-sectional view of a heat-exchange device according to the present invention along the line of FIG. 12B. As shown in FIG. 121, the interface layer 302 is coupled to the heat source 99 ′. & The eighth layer 3 0 2 ′ is coupled to the circulation level 3 04, the bottom surface 3 0 4 β. The circulation level 'is also coupled to level 3 0', the top surface 3 0 4A of circulation level 3 0 4 and the bottom surface 308B 'at level f ^ 308. In addition, level 312, preferably lighter level 308, so the top surface 308A of level 308 is sealed with level 312 / to surface 312B. The narrow channel 320 at level 308 ’is surrounded by the cold bottom level 3 0 4 and the top surface 3 04A. The pores in the top are communicated with each other and the liquid is not connected. 200419128 V. Description of the invention (37) Leakage between levels In addition, the narrow channel 3 2 8 ′ in the level 3 1 2 ′ communicates with the pores in the top surface 3 0 8 A ′ of the circulation level 3 0 8 ′, so that the liquid does not leak out between the two levels. In a preferred operation, as shown by the arrows in Figures 12 A and 12 (2), the cooled liquid enters the heat exchanger 300 through the port 3 1 6 in the level 3 1 2 '. The cooled liquid is transmitted downward from the port 3 1 6 to the narrow channel 3 2 8 and flows downwardly through the transmission channel 3 2 2 to the interface layer 302. The cooling liquid in the narrow channel 320 is not mixed and contacted with the heating liquid in the heat exchanger 300. The liquid entering the interface layer 3 0 2 and the heat source 9 9 perform heat exchange and absorb heat generated by the heat source. The pores 3 2 2 are the best arrangement. The rhenium liquid flows the minimum distance in the X and 介 directions of the interface layer 3 02 to minimize the pressure drop in the heat exchanger 300 and effectively cool the heat source 9 9. The heated liquid then flows upward in the Z direction in the interface layer 302 to the narrow channel 320 in the level 308. The heating liquid present in the branch pipe layer 306 is not mixed and contacted with the cooling liquid entering the branch pipe layer 306. The heated liquid enters the narrow channel 3 2 0 and is transferred to ports 31 4 and 3 4 5 and then discharged out of the heat exchanger 300. It is obvious to those skilled in this art that liquids can interact with people as shown in Figure 12! The two-pounds show flow in opposite directions' without departing from the scope of the present invention. In another operation, as shown in Figs. 12B and 12I, the cooled liquid enters the heat exchanger 300 through 璋 316 'in level 312. The cooled liquid is transferred down from port 315 ’^ to port 314, in level 308. The liquid then flows into the narrow and long pass 3 2 0 'and passes through the pore level 3 04, the pores 3 2 2 and down to the intermediate layer 3 0 2 ° but the narrow and narrow channel 320, and the cooled liquid does not exchange with heat Mix or contact any liquid heated in Jie 300. After entering the interface layer 3 02, the liquid * and the heat source 9 9 generate heat to perform heat exchange and absorb the heat. As discussed below

200419128 V. Description of the invention (38) ---:-On the arrangement of the pores 3 2 2 'and the pores 3 24, the liquid can be transmitted from each pore 3 2 2', along the interface layer 3 02, an optimal The close distance to an adjacent pore 3 2 4: to reduce the pressure drop during the period and effectively cool the heat source g 9. The heated liquid passes through the interface layer 3 0 2 ′ in the Z direction through a number of holes 3 2 4 and passes to the upload wheel at level 3 0 8 and flows to level 312, the narrow channel 3 2 8. The heated liquid will not be mixed or contacted with the cooling liquid entering the branch tube layer 3 06, and transmitted upward through the pores 3 2 4. The heated liquid enters the level 3 丨 2, the middle of the narrow channel 3 2 8 and then flows to the port 3 1 6 and exits the heat exchanger 3 0 0. It is obvious to those skilled in this art that the liquid can also flow in the opposite direction to that shown in Figures 2β and 2 without departing from the scope of the present invention. In the preferred branch pipe layer 3 06, the arrangement of the pores 3 2 2 can minimize the distance that the liquid flows in the interface layer 3 Oj, and can properly cool the heat source 9 9. In the other two branch pipe layers 3 0 6 ', The arrangement of pores 3 2 2 and 324 can minimize the flow distance of the liquid in the interface layer 3 0 2 'and can properly cool the heat source 9 9. The pores 3 2 2' 3 2 4 'specially provide a vertical liquid path. Liquid The liquid flow is the smallest in the X and Y transverse direction of the heat exchanger 300 ′. Therefore, the heat exchanger 300 ′ 300 can greatly reduce the distance that the liquid must flow and can properly cool the heat source 9 9 ′ at the same time. Reduce the pressure drop in the heat exchanger 3,00, 3, and system 3, 30 '(Figure 2A-2B). The special arrangement of the pores 3 2 2 and / or pores 3 2 4 and the section size are due to the following factors Relevant, including but not limited to fluid conditions, temperature, heat generated by heat source 9 and liquid flow rate. It should be noted that although the following discussion is related to pores 3 2 2 and 3 2 4 this discussion can only be applied to pores 3 2 2 or Pore 3 2 4. Pore 3 2 2, 3 2 4 are spatially separated from each other by an optimal distance, so when Heat source

Page 45 200419128 V. Description of the invention (39) 99 When properly cooled to the ideal temperature, the pressure drop is minimized. The arrangement and maximum distance of the pores 3 2 2 and / or pores 3 2 4 in the preferred embodiment can optimize the independence of the pores 322, 324 and the liquid path through the interface 302. Generally, Achieved by changing the size and location of individual pores. In addition, the arrangement of the pores in the preferred embodiment also significantly increases the total flow into the interface layer = $ cloth 'and the amount of area cooled by the liquid entering through each pore 3 2 2. Knife In an embodiment, the pores 3 22, 3 24 are arranged in the branch layer 3 06 as an interactive configuration or a checkerboard pattern, as shown in Figs. Each pore 3 2 2 3 2 4 is separated by a small distance, and the liquid must be transmitted in a checkerboard pattern. But the gaps 3 2 2 and 3 2 4 must be separated from each other by a sufficient distance to provide the coolant interface layer 3 2 2—enough time. As shown in Figs. 13 and 14, it is preferable that / a plurality of pores 3 2 2 be arranged adjacent to a corresponding number of pores, and the liquid entering the interface layer 3 0 2 at 5 '2, before being discharged from the interface layer 3 002, L People, "~ 切 'transmits a shortest distance along the interface for 3 02. Therefore, as shown in the figure, 1 1 flat and preferably pores q 9 9 3 2 4 are radially distributed to each other to assist the liquid from the pores. 3 2 2 is transmitted to ^ B, the closest pore 32 4. For example, as shown in Fig. 13, take the short distance 3 22 into the interface layer 3 0 2 and the liquid subjected to the path of the minimum resistance is pressed &丨 Permanent pores 3 24. In addition, pores 3 22,324 are preferably rounded ^ to an adjacent shape. However, it can be other. In addition, as mentioned above, although pores 3 2 4 are shown in the figure, seven The level 3 0 4 or level 3 0 8, 3 1 2 protrudes into a cylindrical member, and the nodes do not protrude from any level in the branch pipe layer 3 6 from the circulation level. It is preferable to go to the pores without changing the direction. There is a round surface to help reduce the pressure drop in the layer 306. Of the low-heat parent converter 300

200419128 V. Description of the invention (40) The optimal distance configuration and size of the pores 3 2 2 and 3 2 4 are related to the amount of temperature at which the liquid is exposed along the interface layer 3 2. It is important that the cross-sectional dimensions of the liquid paths in the pores 3 2 2 and 3 2 4 are large enough to reduce the pressure drop in the heat exchanger 300. When the liquid is subjected to only a single-phase liquid flow along the interface layer 302, each pore is preferably surrounded by several adjacent pores 3 2 4 in a symmetrical hexagonal arrangement, as shown in FIG. 13. In addition, the number of pores in the flow level 304 for a single-phase liquid flow is preferably approximately equal. Furthermore, in the case of a single-phase liquid flow, the pores 3 2 2, 3 2 4 preferably have the same diameter. Very obvious to those skilled in this art 'Other arrangements and any of the pores 3 2 2, 3 2 4 such as when the liquid is subjected to a two-phase liquid flow along the interface layer 3 0 2 3 2 2' 3 2 4 Asymmetrical arrangements are preferred to facilitate the acceleration of the two-phase liquid. The symmetrical arrangement of pores 3 2 2, 3 24 can also be considered for two-phase liquid flow. For example, the pores 3 2 2 and 3 2 4 can be arranged symmetrically in the circulation level 3 04. The pores 3 2 4 have larger openings than the pores 3 2 2. Alternatively, the 丄 -angled symmetrical arrangement shown in Fig. 3 is used for the circulation level 3 04 for the two-phase liquid flow. Therefore, more pores 3 24 than the pores 3 2 2 appear at the circulation level 3 0. 4 in. It should be noted that the pores 3 2 2 and 3 2 4 in the circulation level can be arranged alternately, but the hot spots of the heat source 9 9. For example, the two pores 3 2 2 are arranged alternately with each other, and X is colder than the circulation level 304. Therefore, the two pores 322 are arranged close to or 'above the hot spot area. It is quite obvious that a proper number of pores 3 24 and a medium 2 pores 3 2 2 are adjacent to reduce the pressure drop in the interface layer 3 02. Therefore, the -turn gap 3 2 2 supplies cooling liquid to the interface hotspot area to force the interface hotspot hole 200419128 V. Description of the invention (41)-As mentioned above, the better heat exchanger 300 has important advantages over other heat exchangers . The preferred configuration of the heat exchanger 300 is because the pressure drop of the vertical liquid pump is reduced, and a medium-performance pump can be used. In addition, the relatively good configuration of the exchanger 3 0 0 can optimize the entrance and the liquid path along the interface layer 3 0 2 independently. In addition, the independent level can achieve a customized design basis to reduce the pressure drop and optimize the size of each component. The preferred configuration of the heat exchanger 300 can also reduce the pressure drop in the system, where the liquid is subjected to a two-phase ° liquid flow, so it can be used in single-phase and two-phase systems. As discussed below, the preferred heat exchanger can be used with many different manufacturing methods, and the group two geometry can be adjusted for tolerance purposes. , ^ To: Discuss how the heat exchanger 100 and the various layers in the heat exchanger 100 are made, ie, field sections. The following discussion applies to the preferred and another heat exchange of the present invention. Although the heat exchanger and each layer in FIG. 3B are simple, they are shown separately. It is very obvious to those skilled in this art, although the details of the construction / manufacturing method and the method of the present invention, and also the method of the brother ^ are also applicable to other heat exchangers and the use of a liquid inlet port and a liquid layer two and three layers of heat exchange Device, as shown in Figure 1 A- 1 C. The surface layer preferably has a thermal expansion t number equal to the thermal expansion coefficient (CTE) of the heat source 99. Therefore, the 'interface layer' is preferably expanded and contracted with the heat source 99. Or, the CTE of the material of the interface layer 302 is different from that of the heat source material. If the interface layer 2 is made of Shi Xi, its CTE can be matched with the CTE of the heat source 99, and has sufficient thermal conductivity to properly transfer heat from the heat source 9 to the liquid. However, other materials can be used for the interface layer 302, which has a CTE that can be matched with the heat source 99. The interface layer preferably has a high thermal conductivity so that it is sufficiently conductive to pass through

Page 48 200419128 V. Description of the invention (42) ~ ^ _ Between the heat source 99 and the liquid flowing along the interface layer 302, heat is generated. The interface layer is preferably made of high thermal conductivity $ ',,,'. However, it is very obvious to those skilled in this art that the thermal conductivity is less than or equal to the bay plate, and is limited by the value of ^ 2. It can have a large size: or, two-layer ㊁Π; ::: preferably made of semiconductor substrate such as broken crystal dielectric Material, metal :: stone package r is not limited to a single compound and any suitable alloy. Graphite, diamond, mixed organic grid. a 302 other materials are patterns or molds as shown in Figure 15, the interface layer is preferably the material of the interface layer, and the interface is modified to provide a chemical protection, such as coating; :: J characteristics. The coating 1 12 is used. For example, the interface layer 3 (^ in ^ and the interface layer 3 02) is chemically used as the interface layer 102 will deteriorate in time. 25 micrometers, with electroplating in the heart: top 1: is a thin layer of nickel, the thickness of which can be reacted without causing the big towel 5 to change the surface of the person to chemically purify any other material and have suitable rhinoceros; meaning) 丨 surface layer The thermal characteristics of 302. Any other material; coatings pre-treated by the field layer factory can also be considered, depending on the interface layer 302. The interface layer 302 is made of steel material η @ ^ to protect the interface layer 302. Or the layer The etching method of the coating layer is made of plastic or other materials. The interface layer 302 is made of aluminum or silicon substrate. It should be made with a suitable coating material 30 2 if the material has a poor thermal conductivity. Electrically form the interface ^ = Layer, to improve the thermal layer of the interface layer 3 0 2 or other appropriate metal II 'is applied along the bottom surface of the interface layer 3 0 2 9 ′ and applying an appropriate voltage to the seed layer

200419128 V. Description of invention (43) is made by electrical connection. The π suppression of the electrical layer on the interface layer 302 therefore constitutes a characteristic dimension of a thermally conductive coating material. ^ Hong formation method also constitutes plating in the range of 10-100 cases. In addition, the medium ^ 2 can be formed by an electric forming method, such as grinding, or combined with other methods such as photochemical etching or chemical lithography to process the interface. The standard of chemical grinding can use laser to help students to change this. The column 3 of the aspect ratio and the tolerance is above 〇3 is made of square prism 3 0 3 and has a high thermal conductivity cylinder. However, it should be noted that the conductivity material is made of copper. But Potam / Body 3 03 Che Fujia was considered by the Southern Commissioner. The cylinder 3.3 is made by different parties, or it can be made by the skilled EDM line, embossing, MIM and machinery ^ The kernel is not limited to electric formation, the cutting of the grinding tool can also produce 2 ore and / or Second, the ideal configuration of seated students. In terms of silicon 1; surface layer 3 02, the pillar 3003 will use the film pattern and different wet etching methods to control the principle of the ratio of the saw and cry, and a U visual interface layer 3 0 2 The rationality and rationality of the middle pillar 3003 is rather obvious. Radially distributed rectangular wings are manufactured by the lithographic pattern method, in which ^ μ々 is fixed in a mold by using a lightning. "Using table etching or electroplating on the lithography limit In one embodiment, the microchannel wall is used for the interface layer 102. The microchannel wall 110 may also be made of other materials, such as but not limited to patterned glass 'polymer' and a molded polymer grid. Although the microchannel wall is made of the same material as the bottom surface 103 of the interface layer 112, the microchannel wall may also be made of a different material from other components of the interface layer 102. In another embodiment, the thermal conductivity characteristic of the microchannel wall 110 is at least page 50 200419128. V. Description of the invention (44) is 10 W / mk. It is obvious to those skilled in this art that the microchannel wall 1 1 0 can also have a thermal conductivity characteristic of less than 1 OW / mk. At this time, a coating material ii 2 is added to the microchannel wall 1 1 0, as shown in Figure 1 5 to increase the thermal conductivity of the microchannel wall 110. For example, if the microchannel wall 110 is made of a material with good thermal conductivity, the thickness of the daily τγ 'coating 1 12 is at least 25 microns, which can protect the surface of the microchannel wall 110. When the microchannel wall 1 1 〇 is made of a material with poor thermal conductivity, the thermal conductivity of the coating 112 is at least 50 W / mk, and can be higher than 25 micrometers. It is obvious for those skilled in this art. Other types of Coating materials and thickness dimensions can also be considered. To configure a microchannel wall 110 with a suitable thermal conductivity of at least 10 W / mk, the microchannel wall 110 must be electrically formed with a coating material 112 (Fig. 5), such as nickel or metal as described above. Configuration-a microchannel wall with a thermal conductivity of at least 50 W / mk, the microchannel wall 110 is plated with copper on a thin metal seed layer. Alternatively, the micro-channel wall i 丨 0 need not be coated with a coating material 0 The micro-channel wall 11 〇 can be hot-pressed to achieve along the interface layer! 〇bottom surface 10 03 channel wall} 丨 〇 high aspect ratio. The microchannel wall 1 丨 can be constructed as a silicon structure deposited on a glass surface, which is etched on the glass in an ideal configuration. The microchannel wall 10 can also be constructed by standard lithographic techniques, embossing or casting k-method, or other appropriate methods. The microchannel wall 1 10 can also be made and formed with the interface chip 102, and bonded to the interface layer 102 by anode or resin bonding. In addition, the micro-channel wall 110 is coupled to the interface using conventional electroforming techniques such as electroplating. There are several methods for constructing the intermediate layer 104. The middle layer is made by the Institute of Silicon and the invention description (45) is very good for those who are skilled in this technology. ^ # 一 ^ d, five systems-C small, y 刿 is visible in laser pattern glass, polymer, Z is Suitable materials include but are not limited to materials and any combination. • Intermediate: Broken, plastic, molded organic, or sintered, the intermediate layer i 〇 Heli Yue Zhan 1 04 is formed by electro-forging technology including machine method, etching, extrusion, pre-etching technology. Other square shapes. The intermediate layer 104 can also be a plastic mesh cover and / or cast metal as an ideal configuration. The intermediate layer 104 can be punctured by laser: injection molding is an ideal configuration. Or the tier 3 306 can use different methods 劁 = to become an ideal configuration. Medium-complete one piece. Or, preferably ^. The preferred branch pipe layer 3 06 is made as shown in Figure 12, and then coupled together. s f 3 0 6 can be made into individual components such as polymer, polymer mixture or other drip tube layers 3 06 can be made of plastic, each layer of gold is made of the same material. The material is formed by injection molding, and the material is formed. The sound of the branch pipe] n / As mentioned above, each layer is made of different materials to those skilled in the art, and is formed by mechanical and metal cutting techniques. form. The “Qiaoyue” staff and officer layer m can be coupled to the interface layer 102 and the branch layer 106 by any suitable method to form a thermal parent converter 100 using different methods. The interface layer 1 02, the intermediate layer 104 and the branch tube layer 106 are coupled to each other by the anode adhesive and the fusible bonding agent. The intermediate layer 104 can also be integrated with the components in the branch tube layer 106 and the interface layer 102. The intermediate layer 104 The chemical bonding method is used to couple to the interface layer 102. The intermediate layer 104 can also be formed by thermal projection and soft lithography technology. At this time, the wire layer EDM or silicon master is used to stamp the intermediate layer 104. The intermediate layer 1 〇 4 and then electroplated with a metal or suitable material to improve the thermal conductivity of the intermediate layer 104. Or the 'intermediate layer 104' is injection-molded to the micro-pass in the interface layer 102.

Page 52 200419128 V. Description of the invention (46)-The manufacturing of the road wall 110 is jointly formed. Alternatively, the intermediate layer 104 may be formed by other methods and the fabrication of the microchannel wall 110. Other manufacturers of heat exchangers include, but are not limited to, welding, fusion bonding, fusible bonding, intermetallic bonding, and any suitable technique, depending on the type of material used in the layer. . Another manufacturing method of the thermal parent converter of the present invention is illustrated in FIG. 6. As shown in FIG. 16, another method for manufacturing a heat exchanger includes establishing a hard mask formed by Shi Ximei plate as an interface layer (step 500). The hard mask is made of '" or by spin on glass. After the hard film is formed, a plurality of lower channels are formed in the mask, and the lower channels constitute a liquid path between the microchannels Π 0 (step 5 2). The lower channel is formed by a suitable method, including but not limited to & surgery 'chemical milling soft lithography or xenon defluorination. In addition, sufficient space must be ensured between the microchannels to prevent the lower microchannels from forming bridges with each other. 'On the conventional method, spin on glass is applied to the surface of the hard mask to form the middle and branch tube layers (step 5 〇4). Subsequently, the intermediate layer and the branch pipe layer are hardened by the coagulation method (step 5 06). When the middle layer and the branch tube layer are formed and hard / dark = multiple liquid ports are formed in the hardened layer (step 508). The liquid port is Qian Lieyu, who is studying in the branch pipe layer. Although other methods can be used to fabricate the interface layer 102, the intermediate layer 104, and the branch tube layer 106, other methods of manufacturing the heat exchanger 100 can also be considered. Figure 17 illustrates another embodiment of the heat exchanger of the present invention. As shown in FIG. 6, the 'two heat exchangers 200, 2000' are coupled to the heat source 99. The heat source 99, such as an electronic device, is coupled to the circuit board 96 and arranged in an upright position, so that each side of the heat source 99 is exposed. The heat exchanger of the present invention is coupled to one of the exposed sides of the heat source 9 9 | Therefore, the two heat exchangers 2 0, 2 0 0 'can provide the maximum cooling of the heat source 9 9. Or rail

Page 53 200419128 V. Description of the invention (47) The sources are horizontally coupled to the circuit board, so more than one heat exchanger is stacked on top of the heat source 9 9 (not shown), so each heat exchanger is coupled to the heat source 9 9. The details of this embodiment are disclosed in U.S. Patent Application Serial No. 10/07, 2, 37, which was proposed in 2000, 2, 7, and titled π power adjustment module π. This patent is incorporated by reference here. As shown in FIG. 17, a heat exchanger 200 having two layers is coupled to the left side of the heat source 99, and the handle of the heat exchanger 200 'is connected to the right side of the heat source 99. It is obvious to those skilled in this art that it can be coupled to each side of the heat source 9 9. It is obvious to a person skilled in the art that another embodiment of the heat exchanger 200 'can also be coupled to the side of the heat source 9 9. Another embodiment shown in FIG. 17 enables more accurate hot spot cooling of the heat source 99, because it applies liquid to cool the hot spot existing in the thickness of the heat source 99. Therefore, the embodiment of Fig. 17 applies heat to the center of the heat source 99 by exchanging heat from both sides of the heat source 99. It is obvious to those skilled in this art that the embodiment of Fig. 17 is shared by the cooling system 30 in Figs. 2A-2B, although other closed systems may be considered. As mentioned above, the heat source 9 9 has other characteristics, where the location of one or more hot spots may change due to different tasks that the heat source 9 9 needs to perform. To properly cool the heat source 9 9, the system 30 may include a sensing and control module 3 4 (Figure 2A-2B), which dynamically changes the flow rate and / or the liquid flow rate into the heat exchanger 100 in response to the location of the hot spot. change. As shown in FIG. 17 in particular, one or more detectors 1 2 4 are arranged in each interface hotspot area of the heat exchanger 200, and / or each possible hotspot location of the heat source 99. Alternatively, a plurality of heat sources are uniformly arranged between the heat source and the heat exchanger, and / or are arranged in the heat exchanger. Control film group 38 (Fig. 2A-

Page 54 200419128 V. Description of the invention (48) 2 B) is also coupled to a plurality of flaps in the loop 30 to control the flow of liquid to the heat exchanger 100. One or more flaps are arranged in the fluid line but can also be arranged in other positions. A plurality of detectors 1 2 4 are coupled to the control module 34, and the control module 34 is preferably arranged upstream of the self-heat exchanger 100, as shown in FIG. Alternatively, the control module 34 is arranged at any position of the closed loop system 30. The detector 1 2 4 provides information to the control module 34, including but not limited to the flow velocity of the liquid flowing in the interface hotspot area, the temperature of the interface layer 1 0 2 and / or the heat source 9 9 in the interface hotspot area, and the temperature of the liquid . For example, referring to FIG. 17, the detector 1 2 4 disposed on the interface provides information to the control module 34 and indicates that the temperature of a hot spot in a special interface in the heat exchanger 200 is increasing, and the heat exchanger 2 0 0 'The temperature in the hotspot of a particular interface is decreasing. In response to this, the control module 34 increases the flow to the heat exchanger 200 and decreases the flow to the heat exchanger 200 '. Alternatively, the control module 34 can change the liquid flow rate to one or more of the interface hot spots in one or more heat exchangers in response to the information received from the detector 1 1 8. Although the detector 1 1 8 is shown in FIG. 17 with the two heat exchangers 200, 2 0 ′, it is obvious that the detector 1 1 8 can be combined with only one heat exchanger. The present invention has been described using specific embodiments, in which details are incorporated to facilitate understanding of the structure and operating principle of the present invention. References and details of special embodiments are not intended to limit the scope of patent application. It will be apparent to those skilled in the art that modifications can be made in the embodiments for illustration without departing from the spirit and scope of the invention.

Page 55 200419128 Brief Description of Drawings Figure 1 A illustrates a side view of a conventional heat exchanger. Figure 1B illustrates a top view of a conventional heat exchanger. Fig. 2A illustrates a schematic diagram of a closed loop cooling system according to another embodiment of the flexible liquid transport microchannel heat exchanger including the present invention. Fig. 2B illustrates a schematic diagram of a closed loop cooling system of another embodiment incorporating a soft liquid transfer microchannel heat exchanger of the present invention. Figure 3A illustrates a top view of another tube layer of the heat exchanger of the present invention. Figure 3B illustrates a schematic view of another heat exchanger having another tube layer in accordance with the present invention. Figure 4 illustrates a perspective view of an interlaced branch pipe layer of the present invention.

Fig. 5 illustrates a top view of an interlaced branch tube layer having an interface layer according to the present invention. Fig. 6A illustrates a cross-sectional view of an interfacial layer interlaced branch pipe layer along the A-A line. Fig. 6B illustrates a cross-sectional view of the interlayer branch pipe layer along the interface layer B-B. Fig. 6C illustrates a cross-sectional view of an interfacial layer interlaced branch pipe layer along the C-C line. FIG. 7A illustrates a perspective view of an interlaced branch pipe layer with an interface layer according to the present invention. FIG. 7B illustrates a perspective view of another embodiment of the interface layer of the present invention. Fig. 8A illustrates a top view of another branch layer of the present invention. Figure 8B illustrates a top view of the interface layer of the present invention. Figure 8C illustrates a top view of the interface layer of the present invention. Figure 9A illustrates a side view of another embodiment of the three-layer heat exchanger of the present invention.

Figure 9B illustrates a side view of another embodiment of the two-layer heat exchanger of the present invention. 10A-10E illustrate perspective views of different micropin array interface layers of the present invention. Figure 11 illustrates a perspective view of another heat exchanger according to the present invention. Figure 1 2 A illustrates a perspective view of a preferred heat exchanger of the present invention. Figure 1 2B illustrates a perspective view of another heat exchanger according to the present invention.

Page 56 200419128 Brief Description of Drawings Figure 1 2C illustrates a perspective view of another circulation level of the present invention. Figure 12D illustrates a perspective view of the lower side of the preferred entry level of the present invention. Figure 1 2E illustrates a perspective view of the lower side of another entry level of the present invention. Figure 1 2F illustrates a perspective view of the lower side of the preferred exit level of the present invention. Figure 12G illustrates a perspective view of the lower side of another exit level of the present invention. Fig. 12 (a) illustrates a sectional view of a preferred heat exchanger of the present invention. Fig. 12 illustrates a cross-sectional view of another heat exchanger according to the present invention. Figure 13 illustrates a top view of the flow level of a preferred embodiment of the present invention having a preferred arrangement of inlet and outlet apertures for single-phase liquid flow. Figure 14 illustrates a top view of the flow level of a preferred embodiment of the present invention having a preferred arrangement of inlet and outlet apertures for two-phase liquid flow. Figure 15 illustrates a side view of a heat exchanger interface layer having a coating material applied thereto according to the present invention. Figure 16 illustrates a flow chart of another method of manufacturing the heat exchanger of the present invention. Figure 17 illustrates a schematic view of another embodiment of the present invention having two heat exchangers coupled to a heat source.

Description of component symbols: 1 0, 2 0 heat exchanger 1 1 bottom 1 4 parallel channels 16 out 24 outlets 26 middle 2 7 bottom surface 3 0 closed 3 2 pump 3 4 moving 3 8 liquid line 96 electrical surface 1 2 inlet Port port 2 2 inter-layer 2 2 multi-nozzle combined circuit sealed cooling system state detection and control module circuit board 9 8 thermal interface material

Page 57 200419128

Schematic illustration on page 58 9 9, 9 9 'Heat source 10 0 Heat exchanger 104, 2 0 4 Intermediate layer 102, 202, 2 0 2A, 3 0 2, 302', 402, 402 'Interface layer 103, 132 3 0 4B, 3 0 8B, 3 0 8B ', 312B' bottom surface 105, 105A, 105B, 105C, 105D, 205A, 205B conduit 106, 206, 3 0 6, 3 0 6, 4 0 6 1 2 4 Detector 10 7 Zone 1 0 8, 1 0 9 Liquid port 110, 111, 210 A0410, 4 1 0 'Microchannel 112, 116, 414, 414, 418, 418' Channel 108, 116, 118 , 118A, 118B, 118C, 118D, 118E j 118F, 120, 1 20 A, 120F, 1 2 2 finger part 1 19, 121 finger hole 130 '3 0 4A', 3 0 8A, 3 0 8A 'top surface 2 0 0, 2 0 0 ,, 3 0 0, 3 0 0 ,, 4 0 0 heat exchanger 208, 208A, 2 0 8B inlet 2 0 9, 2 0 9A, 2 0 9B outlet 2 1 0 microchannel Wall 2 1 4 Vapor-permeable membrane 3 0 1 Microporous structure 3 0 3 Columns 3 0 3 B Square 3 0 3C Rhombic, oval 3 0 3D hexagonal 3 0 3 E distance wing 3 04 ,, 3 0 8 3 0 8, 312, 3 1 2 'levels 314, 314 ,, 315, 315 ,, 316, 316,, 345, 408, 4 0 9 port 3 2 0, 3 2 0 ,, 3 2 6,, 3 28, 3 2 8 'Slim channel 3 2 2 Transmission channels 321 ,, 322, 32 2,, 324, 3 2 4', 3 3 0 'Pore 411, 41 1 ,, 412, 4 1 2' Parallel liquid conduit 416, 416A, 416B groove 4 2 0 curved surface

Claims (1)

200419128 VI. Scope of patent application1. A heat exchanger includes: cold :: f: contact with f source and the configuration is to allow liquid to be consumed to the interface screen through its branch pipe layer, Ms. Shi & The path is used to transfer liquid to the "layer" section of the "layer"; the configuration of a group of body paths can be repeated in the heat exchanger; the individual liquids in the group are: The surface layer still contains a plurality of pillars, which are configured along the interface layer, wherein the plurality of pillars include a coating thereon, and the coating has a proper thermal conductivity of up to +10 W / mk. Xi 2 · —A heat exchanger for cooling a heat source, including: a · —the interface layer is in contact with the heat source and is configured so that liquid can be coupled to the interface layer through the b.—the branch layer, which contains : 牙 'i · the first level, has a plurality of. In fact, a vertical inlet path for the transmission of liquid to the interface layer, wherein the inlet path arranges the optimal liquid transmission distance between each other; and ii · a The second level has at least one exit path for removing liquid from the interface I layer; Λ; | wherein the interface layer still contains a plurality of pillars arranged thereon in an appropriate pattern · | the plurality of pillars include a A coating is applied thereon, wherein the coating has a suitable thermal conductivity of at least 10 W / mk. 3. If the heat exchanger according to item 2 of the patent application scope, it further comprises a porous micro-junction structure arranged along the interface layer. Λσ 4 · The heat exchanger according to item 3 of the patent application, wherein the porous microstructure Page 59 200419128 6. Scope of patent application Including at least one micro hole, which has a variable size along a predetermined direction. 5. The heat exchanger according to item 3 of the patent application range, wherein the average pore size of the porous microstructure is in the range of and including 30 microns and 300 microns. 6. The heat exchanger as claimed in claim 3, wherein at least a region of the porous microstructure has a porosity in and including one of a range of 0.3 and 0.8. Page 60