TW200401798A - Liquid duroplastics - Google Patents
Liquid duroplastics Download PDFInfo
- Publication number
- TW200401798A TW200401798A TW092117450A TW92117450A TW200401798A TW 200401798 A TW200401798 A TW 200401798A TW 092117450 A TW092117450 A TW 092117450A TW 92117450 A TW92117450 A TW 92117450A TW 200401798 A TW200401798 A TW 200401798A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- weight
- acid
- silica
- resins
- Prior art date
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- 239000007788 liquid Substances 0.000 title claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 64
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 29
- 229920005989 resin Polymers 0.000 claims description 55
- 239000011347 resin Substances 0.000 claims description 55
- 239000000203 mixture Substances 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 21
- 229920003023 plastic Polymers 0.000 claims description 20
- 239000004033 plastic Substances 0.000 claims description 19
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 7
- 238000000197 pyrolysis Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 238000005728 strengthening Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 claims 1
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical group CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 claims 1
- 125000005395 methacrylic acid group Chemical group 0.000 abstract description 11
- 150000004756 silanes Chemical group 0.000 abstract description 6
- 230000000052 comparative effect Effects 0.000 description 23
- 229920001567 vinyl ester resin Polymers 0.000 description 18
- -1 methacrylic silanes Chemical class 0.000 description 15
- 239000000178 monomer Substances 0.000 description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 13
- 229920000642 polymer Polymers 0.000 description 13
- 238000006460 hydrolysis reaction Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 230000007062 hydrolysis Effects 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 9
- 239000005977 Ethylene Substances 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000000654 additive Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 229920006305 unsaturated polyester Polymers 0.000 description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- 239000002253 acid Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000004925 Acrylic resin Substances 0.000 description 6
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 238000009472 formulation Methods 0.000 description 6
- 150000002978 peroxides Chemical class 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 229920000178 Acrylic resin Polymers 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000004641 Diallyl-phthalate Substances 0.000 description 5
- 150000001298 alcohols Chemical class 0.000 description 5
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 239000004615 ingredient Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Chemical class 0.000 description 5
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 230000006399 behavior Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 150000001735 carboxylic acids Chemical class 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 150000003440 styrenes Chemical class 0.000 description 4
- 239000002562 thickening agent Substances 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000001530 fumaric acid Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000006072 paste Substances 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 229940035437 1,3-propanediol Drugs 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- SGWZVZZVXOJRAQ-UHFFFAOYSA-N 2,6-Dimethyl-1,4-benzenediol Chemical compound CC1=CC(O)=CC(C)=C1O SGWZVZZVXOJRAQ-UHFFFAOYSA-N 0.000 description 2
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 2
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- XJMMNTGIMDZPMU-UHFFFAOYSA-N 3-methylglutaric acid Chemical compound OC(=O)CC(C)CC(O)=O XJMMNTGIMDZPMU-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- RDHPKYGYEGBMSE-UHFFFAOYSA-N bromoethane Chemical compound CCBr RDHPKYGYEGBMSE-UHFFFAOYSA-N 0.000 description 2
- 238000005537 brownian motion Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 125000002993 cycloalkylene group Chemical group 0.000 description 2
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 2
- PFURGBBHAOXLIO-UHFFFAOYSA-N cyclohexane-1,2-diol Chemical compound OC1CCCCC1O PFURGBBHAOXLIO-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- 125000005702 oxyalkylene group Chemical group 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 239000000088 plastic resin Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 2
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000012783 reinforcing fiber Substances 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 2
- 230000009974 thixotropic effect Effects 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- ZQHJVIHCDHJVII-OWOJBTEDSA-N (e)-2-chlorobut-2-enedioic acid Chemical compound OC(=O)\C=C(\Cl)C(O)=O ZQHJVIHCDHJVII-OWOJBTEDSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- WDCYWAQPCXBPJA-UHFFFAOYSA-N 1,3-dinitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC([N+]([O-])=O)=C1 WDCYWAQPCXBPJA-UHFFFAOYSA-N 0.000 description 1
- OBTNQJQVKQVMSI-UHFFFAOYSA-N 1-[2-(1-hydroxycyclohexyl)propan-2-yl]cyclohexan-1-ol Chemical compound C1CCCCC1(O)C(C)(C)C1(O)CCCCC1 OBTNQJQVKQVMSI-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- SENUUPBBLQWHMF-UHFFFAOYSA-N 2,6-dimethylcyclohexa-2,5-diene-1,4-dione Chemical compound CC1=CC(=O)C=C(C)C1=O SENUUPBBLQWHMF-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- WOGWYSWDBYCVDY-UHFFFAOYSA-N 2-chlorocyclohexa-2,5-diene-1,4-dione Chemical compound ClC1=CC(=O)C=CC1=O WOGWYSWDBYCVDY-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- CWNNYYIZGGDCHS-UHFFFAOYSA-N 2-methylideneglutaric acid Chemical compound OC(=O)CCC(=C)C(O)=O CWNNYYIZGGDCHS-UHFFFAOYSA-N 0.000 description 1
- WZHHYIOUKQNLQM-UHFFFAOYSA-N 3,4,5,6-tetrachlorophthalic acid Chemical compound OC(=O)C1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1C(O)=O WZHHYIOUKQNLQM-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 230000005653 Brownian motion process Effects 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910003910 SiCl4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- FHKPLLOSJHHKNU-INIZCTEOSA-N [(3S)-3-[8-(1-ethyl-5-methylpyrazol-4-yl)-9-methylpurin-6-yl]oxypyrrolidin-1-yl]-(oxan-4-yl)methanone Chemical compound C(C)N1N=CC(=C1C)C=1N(C2=NC=NC(=C2N=1)O[C@@H]1CN(CC1)C(=O)C1CCOCC1)C FHKPLLOSJHHKNU-INIZCTEOSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002015 acyclic group Chemical group 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005336 allyloxy group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical class CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical group OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 150000001869 cobalt compounds Chemical class 0.000 description 1
- NRLCNVYHWRDHTJ-UHFFFAOYSA-L cobalt(2+);naphthalene-1-carboxylate Chemical compound [Co+2].C1=CC=C2C(C(=O)[O-])=CC=CC2=C1.C1=CC=C2C(C(=O)[O-])=CC=CC2=C1 NRLCNVYHWRDHTJ-UHFFFAOYSA-L 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- ILUAAIDVFMVTAU-UHFFFAOYSA-N cyclohex-4-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CC=CCC1C(O)=O ILUAAIDVFMVTAU-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- GGSUCNLOZRCGPQ-UHFFFAOYSA-N diethylaniline Chemical compound CCN(CC)C1=CC=CC=C1 GGSUCNLOZRCGPQ-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- HANKSFAYJLDDKP-UHFFFAOYSA-N dihydrodicyclopentadiene Chemical compound C12CC=CC2C2CCC1C2 HANKSFAYJLDDKP-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 1
- 229960001826 dimethylphthalate Drugs 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- YCUBDDIKWLELPD-UHFFFAOYSA-N ethenyl 2,2-dimethylpropanoate Chemical compound CC(C)(C)C(=O)OC=C YCUBDDIKWLELPD-UHFFFAOYSA-N 0.000 description 1
- IGBZOHMCHDADGY-UHFFFAOYSA-N ethenyl 2-ethylhexanoate Chemical compound CCCCC(CC)C(=O)OC=C IGBZOHMCHDADGY-UHFFFAOYSA-N 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 150000002191 fatty alcohols Chemical class 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 238000009730 filament winding Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- CGXBXJAUUWZZOP-UHFFFAOYSA-N formaldehyde;phenol;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.OC1=CC=CC=C1.NC1=NC(N)=NC(N)=N1 CGXBXJAUUWZZOP-UHFFFAOYSA-N 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- GVLGAFRNYJVHBC-UHFFFAOYSA-N hydrate;hydrobromide Chemical compound O.Br GVLGAFRNYJVHBC-UHFFFAOYSA-N 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- LXCJGJYAOVCKLO-UHFFFAOYSA-N n-cyclohexyl-n-hydroxynitrous amide Chemical compound O=NN(O)C1CCCCC1 LXCJGJYAOVCKLO-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001281 polyalkylene Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005646 polycarboxylate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- WEHMXWJFCCNXHJ-UHFFFAOYSA-N propa-1,2-dienylbenzene Chemical compound C=C=CC1=CC=CC=C1 WEHMXWJFCCNXHJ-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920013730 reactive polymer Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000002444 silanisation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- BWSZXUOMATYHHI-UHFFFAOYSA-N tert-butyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(C)(C)C BWSZXUOMATYHHI-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
200401798 (1) 玖、發明說明 【發明所屬之技術領域】 本發明係關於一種強化液態硬塑膠的方法,且關 得之硬塑膠。 【先前技術】 硬塑膠是指由可熟化之樹脂產製之所有塑膠。依 D IN 7 7 2 4,到達分解溫度時,它們是經交聯,密閉篩 高度聚合的材料,這些材料在較低溫度下是鋼一彈性 在5 0 °C或更高之溫度至分解溫度下有極受限制之變 彈性行爲。切變模數在任何溫度下不落在102kp/cm2 〇 硬塑膠通常是不定形的。因硬塑膠之交聯,它們 子不能進行任何微布朗運動。另一方面,聚合物分子 一布朗運動在玻璃轉換溫度(其高於5 〇 t )下是可 〇 硬塑膠一詞同於名稱硬性體(d u r 0 m e Γ ),後者 是較佳的,因它在形式上更密切地與彈性體和塑料( 性塑膠)有關,當對此二種其它類之塑膠命名時。 硬塑膠廣泛地作爲模製用組成物,澆鑄樹脂,樹 著劑及漆樹脂。硬塑膠特別包括酞酸二烯丙酯樹脂( )、環氧基一三聚氰醯胺一甲醛樹脂(M F )、三聚 胺—酚一甲醛樹脂(Μ Ρ )、酚一甲醛樹脂樹脂(P F 不飽和聚酯樹脂(UP )之商業上重要材料群(依 於所200401798 (1) 发明. Description of the invention [Technical field to which the invention belongs] The present invention relates to a method for strengthening liquid hard plastic, and related hard plastic. [Previous technology] Hard plastic refers to all plastics made from curable resins. According to D IN 7 7 2 4, when the decomposition temperature is reached, they are highly cross-linked, closed sieve highly polymerized materials. These materials are steel at a lower temperature and elastic at a temperature of 50 ° C or higher to the decomposition temperature. There are extremely restricted and flexible behaviors. Shear modulus does not fall at 102kp / cm2 at any temperature. Hard plastics are usually amorphous. Due to the cross-linking of hard plastic, they cannot perform any micro-Brownian motion. On the other hand, the Brownian motion of polymer molecules at the glass transition temperature (which is higher than 5 0 t) is 0. The term hard plastic is the same as the name hard body (dur 0 me Γ), which is better because it Formally more closely related to elastomers and plastics (sex plastics), when these two other types of plastics are named. Hard plastics are widely used as molding compositions, casting resins, resins, and lacquer resins. Hard plastics especially include diallyl phthalate resin (), epoxy-melamine-formaldehyde resin (MF), melamine-phenol-formaldehyde resin (MP), phenol-formaldehyde resin (PF Commercially important material group of unsaturated polyester resin (UP)
眼之 的且 形的 之下 的分 之巨 能的 有時 熱塑 脂接 DAP 氰醯 )及 DIN (2) (2)200401798 7 7 2 8 5 P 1 ; 1 9 8 8,1月1日,其簡稱是在括弧中)。 已知使用粉狀矽石作爲聚合物用之塡料。 通常’以硬相形式被較軟之聚合物所環繞以細緻分佈 的塡料改良/很多商業上可得到之有價値的機械性。這些 包括硬度,抗張強度,應力値和其它可測量之性質。 原則上,熱塑性塑膠和可交聯之聚合物間必須有區別 。石夕石在此一類材料中可作爲塡料。然而,添加量和效果 因聚合物而可能極不同。 亦已知在液態硬塑膠中作爲增稠劑。然而那並非本發 明主題;反之,砂石之增稠作用應盡可能地少。 本發明描述在低分子量,通常爲液態之反應性聚合物 中以不飽和有機基修飾之矽石的使用。已知:可能達成流 變性和機械性之有利結合,亦即,一方面在未交聯態中低 的粘度和低的流動限度,且另一方面,在經交聯態中高的 硬度和高的模數。 已知:用乙烯基矽烷或甲基丙烯矽烷類處理聚合物中 所用之塡料以在經交聯之產物中得到有利的性質。這是依 先前技藝,在塡料混入聚合物期間實施此種處理。 那程序之缺點是供矽烷對固體之所要的粘合所需之化 學反應順序發生在難以控制的環境中,且其再現性仍待改 進。再者,會形成醇類以作爲無可避免之廢棄產物;醇類 通常是聚合物材料之不想要的構成成伤且必須在複雜的操 作中除去。 矽烷本身及由彼所形成之裂解產物在可燃性和毒性方 (3) 200401798 面是危險來源且通常需另外的安全性測量和調查。因此想 要使用一種塡料,其已含有想要之反應性基因且不釋出任 何不想要之物質之聚合物或入環境中。 【發明內容] 本發明提供一種強化液態硬塑膠之方法,此方法特徵 在於製備未交聯之樹脂和已用含甲基丙烯酸系基團之矽烷 類來表面修飾的熱解製備的矽石的混合物。Eyes and shapes of the sub-permanently powerful thermoplastic resin sometimes connected to DAP (cyanocyanine) and DIN (2) (2) 200401798 7 7 2 8 5 P 1; 1 9 8 8 January 1 , Which is abbreviated in parentheses). It is known to use powdered silica as a filler for polymers. Usually ' is surrounded by a softer polymer in the form of a hard phase to provide a finer distribution of the modified material / many of the commercially available valuable mechanical properties. These include hardness, tensile strength, stress and other measurable properties. In principle, there must be a distinction between thermoplastics and crosslinkable polymers. Shi Xishi can be used as a material in this kind of materials. However, the amount and effect of addition may vary greatly depending on the polymer. It is also known as a thickener in liquid hard plastics. However, that is not the subject of the invention; instead, the thickening effect of sand and gravel should be as small as possible. This invention describes the use of silica modified with unsaturated organic groups in reactive polymers of low molecular weight, usually liquid. It is known that it is possible to achieve an advantageous combination of rheology and mechanical properties, that is, on the one hand, low viscosity and low flow limit in the uncrosslinked state, and, on the other hand, high hardness and high in the crosslinked state Modulus. It is known that the polymers used in polymers are treated with vinyl silanes or methacrylic silanes to obtain advantageous properties in the crosslinked products. This is done in the prior art during the mixing of the aggregate into the polymer. The disadvantage of that procedure is that the sequence of chemical reactions required for the desired bonding of the silane to the solid occurs in an uncontrollable environment, and its reproducibility needs to be improved. Furthermore, alcohols are formed as an unavoidable waste product; alcohols are often unwanted constituents of polymer materials that cause injuries and must be removed in complex operations. Silanes themselves and the cracked products formed by them are hazardous sources in terms of flammability and toxicity (3) 200401798 and often require additional safety measurements and investigations. It is therefore desirable to use a polymer which already contains the desired reactive gene and which does not release any undesired polymers or into the environment. [Summary of the Invention] The present invention provides a method for strengthening a liquid hard plastic. The method is characterized by preparing a mixture of uncrosslinked resin and silica prepared by pyrolysis that has been surface-modified with methacrylic group-containing silanes. .
本發明也提供液態硬塑膠,其特徵在於它們含有已用 含甲基丙烯酸系基團之矽烷類來表面修飾的熱解製備的矽 石。 在本發明之特別實體中,熱解製備的矽石可結構性地 被修飾。 依本發明,特別有效的塡料是一種矽石,其含有甲基 丙:¾酸系基團且已藉火焰水解來製備且其結構已藉機械後 處理而改變。 可依本發明來使用之熱解 BET表面積,米~克 粒子尺寸,奈米 塡充密度,克/升 pH値 碳含量,。4 D B P 數,〇/0 匕可以耠以下方式製備: 備的矽石特徵在於: 20 至 380 6 至 1 1 〇 5 0 至 6 0 0 3至1 0 〇. 1 至 1 5 <200 先在合適混合裝置中激烈The present invention also provides liquid hard plastics, which are characterized in that they contain fumed silicas which have been surface-modified with methacrylic group-containing silanes. In a particular entity of the invention, the silica prepared by pyrolysis can be modified structurally. According to the present invention, a particularly effective material is a kind of silica, which contains methyl propionate: ¾ acid-based groups and has been prepared by flame hydrolysis and its structure has been changed by mechanical post-treatment. Pyrolytic BET surface area that can be used in accordance with the present invention, particle size in meters to grams, nanometer 塡 filling density, gram / liter pH 値 carbon content ,. 4 DBP number, 0/0 can be prepared in the following way: The prepared silica is characterized by: 20 to 380 6 to 1 1 〇5 0 to 6 0 0 3 to 1 0 〇 1 to 1 5 < 200 first Intense in a suitable mixing device
(4) (4)200401798 地混合矽石與水或稀釋酸,而後混合表面修飾劑;或藉噴 霧應用不同之表面修飾劑的混合物。各成份進一步混合 15至30分鐘,而後在〗〇〇至400 °C下熱處理1至6小 時。 在本發明之較佳實體中,可以使用熱解製備之矽石作 爲矽石。 熱解的矽石藉揮發性矽化合物如SiCl4,甲基三氯矽 院或類似者來製備。它們由 U 11 m a η η ' s Ε η z y k 1 0 p a d i e d e r t e c h n i s c h e n C h e m i e 4 版,2 1 冊,4 6 4 頁(1 9 8 2 )中獲知 ο 在本發明之較佳實體中,可以使用具有約2 0 0米2/克 之BET表面積的熱解矽石。 至於表面修飾劑,可以使用單體物質,如甲基丙烯氧 丙基三烷氧基矽烷類,其中烷氧基可意指甲氧基,乙氧基 及/或丙氧基。 本發明之必要特徵是塡料與漆之反應性單體及寡聚體 錯光聚合之連結。 令人驚訝地,已發現:利用特別的液態樹脂系統,即 使光不存在,含有甲基丙烯酸系基團且已藉火焰水解製備 且其結構已藉機構後處理來改變之矽石會不成比例地產生 硬聚合物,其因有利的性質而顯出特色。 此種樹脂系統的實例是: •不同組成物之不飽和聚酯樹脂: A .乙烯不飽和聚酯, -8 - (5) (5)200401798 B .與A共聚合之乙烯不飽和單體, C ·基於A + B,5至3 0重量%之纖維性強化劑, D .可選擇地,粉狀塡料, E. 可選擇地,基於A + B,0.5至5重量%增稠劑, F. 基於A + B,0.5至5重量%有機過氧化物, G. 芳族胺,有機酸之金屬鹽,如鈷化合物, Η .可選擇地,進一步之慣用添加劑。 A .至於不飽和聚酯,適合者是以下物質之一般聚縮 合產物:多價,特別是二價羧酸及其可酯化之衍生物,特 別是酸酐,其以酯之方式連結至多元,特別是二元醇,且 可選擇地另含有單元醇及/或羥基羧酸基團,其中至少某 些基團必須具有乙烯不飽和之可共聚基。 至於多元,特別是二元之可選擇不飽和的醇,適合者 是具有非環或環基之一般烷二醇及氧雜烷二醇,例如,乙 二醇、1,2 -丙二醇、1,3 —丙二醇、1,3 —丁 二醇、1 ,4 — 丁 二醇、1,6 —己二醇、2,2 —二伸甲基—I,3 — 丙二醇、二乙二醇、三乙二醇、聚乙二醇、二丙二醇、1 ,2 —環己二醇、2,2 一雙(羥基環己基)丙烷、三甲基 醇丙烷單烯丙基醚或1,4 一丁二醇。 也可能使用共存附屬量之單-、三-或更多元之醇, 如亞乙基己醇、脂肪醇、苄基醇、1,2 -二一(烯丙氧基 )丙醇一 (3)、甘油、季戊四醇或三甲基醇丙烷。多元 ’特別是二元醇通常以化學計量與多元,特別是二元羧酸 或其可縮合之衍生物反應。 (6) (6)200401798 合適的羧酸及其衍生物是二元、烯烴不飽和的,較佳 地々一烯烴不飽和的羧酸,如馬來酸、富馬酸、氯馬來酸 '衣康酸、亞甲基戊二酸及中康酸及其酯或較佳地,它們 的酸酐、此外也可能有其它具有修飾作用的二元不飽和及 /或飽和的以及芳族殘酸被縮合入聚酯中,例如,丁二酸 、戊二酸、甲基戊二酸、己二酸、癸二酸、庚二酸、酞酸 酐、鄰酞酸、異酞酸、對酞酸、二氫酞酸、四氫酞酸、四 氯酞酸、3,5—橋甲撐基、1,2,3,6 —四氫酞酸、橋甲 撐四氯酞酸或六氯橋甲撐基四氫酞酸、還有單-、三-及 更多元羧酸、如乙基己酸、脂肪酸、甲基丙烯酸、丙烯酸 、丙酸1,2,4,5 —苯甲羧酸。馬來酸及其酸酐及富馬 酸較佳被使用。 已使用二環戊二烯製備之不飽和的聚酯也可有利地被 使用。 也可能使用不飽和聚酯之混合物,包括那些在單體B 中僅具有限溶解度且易於結晶者。此種易於結晶之不飽和 聚酯可以包括例如富馬酸、己二酸、對酞酸、乙二醇、1 ,4 一丁二醇、1,6 一己二醇及新戊二醇。 不飽和之聚酯具有5至2 0 0,較佳地2 0至8 5之酸値 ,及約800至6〇〇〇,較佳地約]〇〇〇至400〇之平均分子 〇 不定形且可選擇之可結晶的不飽和聚酯通常藉著在共 沸條件下彳衣連續或不連續方法熔融縮合而自其起始成份來 製備。 -10- (7) (7)200401798 B ·合適的可共聚之乙烯不飽和單體化合物是烯丙基 及較佳地一般在不飽和聚酯模製組成物中使用之乙烯基化 合物,例如乙烯基芳烯化合物如苯乙烯、亞甲基苯乙烯、 對氯苯乙烯或乙烯基甲苯;丙烯酸及甲基丙烯酸與具有1 至1 8碳原子之醇的酯,如甲基丙烯酸甲酯、丙烯酸丁酯 、丙烯酸乙基己酯、丙烯酸羥丙酯、丙烯酸二氫二環戊二 烯酯、二丙烯酸丁二醇酯及(甲基)丙烯酸醯胺;烯丙酯 、如酞酸二烯丙酯、及乙烯基酯如乙基己酸乙烯酯、乙酸 乙烯酯、丙烯乙烯酯、特戊酸乙烯酯及其它。也合適者是 所述之乙烯不飽和單體的混合物。較佳地,適合作爲成份 B者是苯乙烯、乙烯苯及酞酸二烯丙酯。基於成份A和B 之總重,單體B通常以1 0至8 0重量%,較佳地2 0至7 0 重量%之量含於聚酯模製組成物中。 C ·作爲強化纖維,有適合的粗紗形無機或有機纖維 ,或可選擇之由彼所編織之平坦結構如墊子,例如玻璃、 碳纖維、石棉、纖維素及合成有機纖維,如聚羧酸酯;聚 碳酸酯和聚醯胺者。強化纖維維基於成份 A + B,以5至 3 0 〇重量%,較佳地1 〇至1 5 0重量%之量來使用。 D .合適的塡料是例如一般之細粉狀或顆粒狀之無機 塡料如亞堊、高嶺土、石英粉末、白雲石、重石、金屬粉 末、鋁水合物、水泥、滑石、矽藻土、木塵、木屑、顏料 及類似者。基於A + B,它們茳SMC模製組成物中之用量 是0至200重量%,在BMC模製組成物中之用量是1〇〇 至4 0 0重量%。 -11 - (8) (8)200401798 E ·作爲增稠劑,可以提及例如鹼土氧化物或氫氧化 物如氧化錦、氫氧化錦、氫氧化鏡及較佳地氧化鎂以及其 氧化物或氫氧化物之混合物。它們也可部分地被氧化鋅代 替。聚異氰酸酯或金屬醇酸鹽在某些情況中也合適。基於 A + B增稱劑以0.5至5重量%之量添加至模製組成物中。 F·作爲聚合起始劑,使用在高溫下生成自由基之一 般有機過氧化物,基於A和B之總重,其量是0.0 5至5 重量%,較佳地0 . 1至3重量。/〇。合適的起始劑是例如苯 醯過氧化物,過辛酸特丁酯、過苯酸特丁酯、二枯基過氧 化物、二特丁基過氧化物及過縮醛如三甲基環己基單過縮 醛以及過碳酸。 G ·進一步之一般的添加劑是例如抑制劑如氫醌、2 ,6 —二甲基氫醌、特丁基苯並兒茶酸、對苯醌、氯醌、2 ,6 —二甲基醌、硝基苯、如間一二硝基苯、硫代二苯胺 、或N -亞硝基一 N -環己基羥基胺、及其混合物。基於 成份 A + B,抑制劑通常以 0.0 0 5至 0.2重量%,較佳地 0 · 0 1至0 · 1重量%之量含於模製組成物中。 作爲潤滑劑、會考慮例如硬脂酸鋅、鎂及鈣以及聚伸 烷基醚蠟。 •乙烯基酯樹脂(此VE樹脂也稱爲苯丙烯酸酯樹脂 ,簡稱爲Ρ Η A )是基於(伸)苯基衍生物如酚類之芳族縮 水甘油醚菸環氧化淸漆之反應樹脂,其分子已被(,基) 丙烯酸來酯化。 所謂之π乙烯基酯”類之樹脂一些年來已被認爲有用於 -12- 200401798 Ο) 廣泛之樹脂應用’特別是那些需要優越化學品抵抗性者。 樹脂在化學上是環氧樹脂之反應產物和環氧樹脂乙烯不飽 和產物。現在商業上可得之典型的乙烯基樹脂包括 E P 0 C R Y L 樹月曰(由 S h e 11 C h e m i c a ] C 〇 m p a n y 所售), DERKANE 411 (由 Dow Chemicals Company 戶斤售)及 CO —REZYN VE — 8300 (由 Itnerplastic Company 所售)。 在使用乙烯基酯樹脂以製備成形產品時,特別是經玻 璃纖維強化之塑膠(ERP )結構時,應控制樹脂組成物之 粘度以致組成物是流體的而能容易應用且能有塡料和強化 物之良好潤濕,但卻不是太過流體的以致它從垂直表面流 出,引起成形產物中之缺乏樹脂的區域。再者,在很多用 途中’例如成形產物如管,槽,滌氣器或導管使用乙烯基 酯樹脂來製備時,優越體和塔藏特性是極重要的,若非對 程序是必須的,特別是在成形和熟化期間者。在此種應用 中,樹脂典型地溶在乙烯基單體中,如苯乙烯中,在此之 後它被成形熟化以產製成形產品。若在成形及熟化步驟中 ’組成物之體及塔藏特性會使組成物之外流或流動發生, 例如當樹脂組成物應用在供襯裏之垂直表面時,成形產品 之樹脂表面有不均勻厚度且具有經縮小的機械強度。 先前已建議:藉添加某些觸變劑來改良乙烯基酯樹脂 之粘度、體及塔藏特性。已報告:烟砂石在某些乙烯基酯 樹脂組成物中是”極有效的”觸變淛(參見 Paul F· Gruins 編之 M U n s a t u r a t e d Polyester Technology",Gordon and Breach Science Publishers )。 -13 - (10) (10)200401798 本發明之組成物可以包括共單體以利於處理,熟化且 提供所要之機械性質。合適的相容共單體包括反應性乙烯 不飽和共單體如苯乙烯、氯苯乙烯、乙烯基甲苯、甲基苯 乙烯、酞酸二烯丙酯、氰尿酸三烯丙酯、丙烯酸酯、甲基 丙烯酸酯及二乙烯基苯。苯乙烯是較佳的相容輔劑。此組 成物也可包括非反應性稀釋劑如丙酮,其中僅用淨樹脂可 得之性質是想要。 在本發明中所用之乙烯基酯樹脂可以是在此技藝中任 何已知者且可以藉環氧樹脂和乙烯不飽和單羧酸間之加成 反應來製備。供製備合適之乙烯基酯樹脂的方法揭示於美 國專利申請案 3,2 5 6 5 2 2 6 ; 3 5 3 1 7,4 6 5 ; 3,3 4 5,4 0 1 ; 3,3 7 3,22 1 ; 3,3 7 7,4 06 ; 3,43 2,47 8 ; 3,54 8,03 0 ; 3 5 5 6 4 5 0 7 4 ;3,634,542 及 35637,518 中。 通常,用以製備在本發明中所用之乙烯基酯樹脂的反 應是直接的。它可被合適的觸媒如三級胺、膦、鹼或錫鹽 來催化。反應通式可如下所示: 〇 〇 〇、(4) (4) 200401798 Mix silica with water or dilute acid, and then mix the surface modifier; or apply a mixture of different surface modifiers by spraying. The ingredients are further mixed for 15 to 30 minutes, and then heat-treated at 100 to 400 ° C for 1 to 6 hours. In the preferred entity of the present invention, silica prepared by pyrolysis can be used as the silica. Pyrolyzed silica is prepared from volatile silicon compounds such as SiCl4, methyltrichlorosilicon or the like. They are known from U 11 ma η η s Ε η zyk 1 0 padiedertechnischen C hemie 4th edition, 21st volume, 46.4 pages (1 982). In a preferred entity of the present invention, it is possible to use Fumed silica with a BET surface area of 200 m2 / g. As for the surface modifying agent, a monomer substance such as methacryloxypropyltrialkoxysilane can be used, in which the alkoxy group means nailoxy, ethoxy and / or propoxy. An essential feature of the present invention is the linkage of the photopolymer to the reactive monomers and oligomers of the lacquer for photopolymerization. Surprisingly, it has been found that, using a special liquid resin system, even if light is not present, silica containing methacrylic groups that has been prepared by flame hydrolysis and whose structure has been changed by institutional post-treatment will be disproportionate. Rigid polymers, which are distinguished by advantageous properties. Examples of such resin systems are: • Unsaturated polyester resins of different compositions: A. Ethylene unsaturated polyester, -8-(5) (5) 200401798 B. Ethylene unsaturated monomer copolymerized with A, C. 5 to 30% by weight of fibrous reinforcing agent based on A + B, D. Optionally, powdery concrete, E. Optionally, 0.5 to 5% by weight of thickener based on A + B, F. Based on A + B, 0.5 to 5% by weight of organic peroxides, G. Aromatic amines, metal salts of organic acids, such as cobalt compounds, Η. Optionally, further customary additives. A. As for unsaturated polyesters, suitable are the general polycondensation products of the following: polyvalent, especially divalent carboxylic acids and their esterifiable derivatives, especially acid anhydrides, which are linked to the polybasic by way of esters, In particular, diols, and optionally additional unit alcohol and / or hydroxycarboxylic acid groups, at least some of which must have copolymerizable groups that are unsaturated in ethylene. As for the multi-element, especially di-valent, optionally unsaturated alcohols, suitable are general alkanediols and oxaalkanediols having acyclic or cyclic groups, such as ethylene glycol, 1,2-propanediol, 1, 3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,6-hexanediol, 2,2-dimethylene-1,3-propanediol, diethylene glycol, triethylene glycol Glycol, polyethylene glycol, dipropylene glycol, 1,2-cyclohexanediol, 2,2-bis (hydroxycyclohexyl) propane, trimethyl alcohol propane monoallyl ether, or 1,4-butanediol . It is also possible to use co-existing auxiliary amounts of mono-, tri-, or polyhydric alcohols, such as ethylenehexanol, fatty alcohols, benzyl alcohol, 1,2-bis (allyloxy) propanol- (3 ), Glycerol, pentaerythritol, or trimethylol propane. Polyol's, especially diols, are usually reacted stoichiometrically with polyvalents, especially dicarboxylic acids or their condensable derivatives. (6) (6) 200401798 Suitable carboxylic acids and their derivatives are binary, olefinically unsaturated, preferably mono-olefinically unsaturated carboxylic acids such as maleic acid, fumaric acid, chloromaleic acid ' Itaconic acid, methylene glutaric acid and mesaconic acid and their esters or, preferably, their anhydrides, in addition, may have other binary unsaturated and / or saturated and aromatic residual acids having a modification effect. Condensation into polyesters, for example, succinic acid, glutaric acid, methylglutaric acid, adipic acid, sebacic acid, pimelic acid, phthalic anhydride, phthalic acid, isophthalic acid, terephthalic acid, dicarboxylic acid Hydrophthalic acid, Tetrahydrophthalic acid, Tetrachlorophthalic acid, 3,5-Pyridynyl, 1,2,3,6-tetrahydrophthalic acid, Pyridyl tetrachlorophthalic acid or Hexachloroprylidene Tetrahydrophthalic acid, as well as mono-, tri-, and more carboxylic acids such as ethylhexanoic acid, fatty acids, methacrylic acid, acrylic acid, and propionic acid 1,2,4,5-benzoic acid. Maleic acid and its anhydride and fumaric acid are preferably used. Unsaturated polyesters which have been prepared using dicyclopentadiene can also be used to advantage. It is also possible to use mixtures of unsaturated polyesters, including those which have only limited solubility in monomer B and are easy to crystallize. Such easily crystallizable unsaturated polyesters may include, for example, fumaric acid, adipic acid, terephthalic acid, ethylene glycol, 1,4-monobutylene glycol, 1,6-monohexanediol, and neopentyl glycol. Unsaturated polyesters have a pH of 5 to 200, preferably 20 to 85, and an average molecular weight of about 800 to 600, preferably about 400 to 400. And selectable crystallizable unsaturated polyesters are usually prepared from their starting ingredients by continuous condensation or continuous discontinuous process melt condensation under azeotropic conditions. -10- (7) (7) 200401798 B. Suitable copolymerizable ethylene unsaturated monomer compounds are allyl and preferably vinyl compounds, such as ethylene, generally used in unsaturated polyester molding compositions. Alkylene compounds such as styrene, methylene styrene, p-chlorostyrene or vinyl toluene; esters of acrylic acid and methacrylic acid with alcohols having 1 to 18 carbon atoms, such as methyl methacrylate, butyl acrylate Esters, ethylhexyl acrylate, hydroxypropyl acrylate, dihydrodicyclopentadiene acrylate, butanediol diacrylate, and ammonium (meth) acrylate; allyl esters, such as diallyl phthalate, And vinyl esters such as vinyl ethylhexanoate, vinyl acetate, propylene vinyl ester, vinyl pivalate and others. Also suitable are mixtures of said ethylenically unsaturated monomers. Preferably, those suitable as component B are styrene, vinylbenzene and diallyl phthalate. The monomer B is usually contained in the polyester molding composition in an amount of 10 to 80% by weight, preferably 20 to 70% by weight based on the total weight of the components A and B. C. As a reinforcing fiber, there are suitable roving-shaped inorganic or organic fibers, or a flat structure such as mats, such as glass, carbon fiber, asbestos, cellulose, and synthetic organic fibers, such as polycarboxylate; Polycarbonate and polyamide. The reinforcing fiber dimension is used in an amount of 5 to 300% by weight, preferably 10 to 150% by weight, based on the component A + B. D. Suitable concrete materials are, for example, general fine powdered or granular inorganic materials such as chalk, kaolin, quartz powder, dolomite, heavy stone, metal powder, aluminum hydrate, cement, talc, diatomaceous earth, wood Dust, sawdust, pigments and the like. Based on A + B, they are used in the SMC molding composition in an amount of 0 to 200% by weight and in the BMC molding composition in an amount of 100 to 400% by weight. -11-(8) (8) 200401798 E · As a thickener, mention may be made of, for example, alkaline earth oxides or hydroxides such as oxide bromide, bromide hydroxide, mirrors and preferably magnesium oxide and its oxides or Mixture of hydroxides. They can also be partially replaced by zinc oxide. Polyisocyanates or metal alcoholates are also suitable in some cases. The weighting agent is added to the molding composition in an amount of 0.5 to 5% by weight based on A + B. F. As the polymerization initiator, a general organic peroxide that generates radicals at high temperature is used, and its amount is 0.05 to 5% by weight, preferably 0.1 to 3% by weight based on the total weight of A and B. / 〇. Suitable starters are, for example, phenylhydrazone peroxide, tert-butyl peroctoate, tert-butyl perbenzoate, dicumyl peroxide, ditert-butyl peroxide and peracetals such as trimethylcyclohexyl Monoperacetals and percarbonates. G. Further general additives are, for example, inhibitors such as hydroquinone, 2,6-dimethylhydroquinone, t-butylbenzocatechin, p-benzoquinone, chloroquinone, 2,6-dimethylquinone, Nitrobenzene, such as m-dinitrobenzene, thiodiphenylamine, or N-nitroso-N-cyclohexylhydroxylamine, and mixtures thereof. Based on the ingredients A + B, the inhibitor is usually contained in the molding composition in an amount of from 0.05 to 0.2% by weight, preferably from 0.1 to 0.1% by weight. As lubricants, for example, zinc stearate, magnesium and calcium, and polyalkylene ether waxes are considered. • Vinyl ester resin (this VE resin is also called phenyl acrylate resin, abbreviated as P Η A) is a reaction resin based on (extended) phenyl derivatives such as phenols, aromatic glycidyl ether smoke epoxidized varnish Its molecules have been esterified with (,) acrylic acid. So-called π vinyl ester resins have been considered for some years to be used in -12-200401798 〇) a wide range of resin applications' especially those requiring superior chemical resistance. The resin is chemically an epoxy resin reaction Products and epoxy unsaturated products of epoxy resins. Typical vinyl resins currently commercially available include EP 0 CRYL, sold by She 11 C hemica] Comany, DERKANE 411 (available from Dow Chemicals Company Household sales) and CO —REZYN VE — 8300 (sold by Itnerplastic Company). When using vinyl ester resins to prepare shaped products, especially glass fiber reinforced plastic (ERP) structures, the resin composition should be controlled Viscosity so that the composition is fluid and can be easily applied and has good wetting of materials and reinforcements, but it is not so fluid that it flows out from the vertical surface, causing areas of resin deficiency in the formed product. In many applications, for example, when molded products such as tubes, tanks, scrubbers, or ducts are prepared using vinyl ester resins, superior bodies and towers Characteristics are extremely important, if not necessary for the procedure, especially during forming and curing. In this application, the resin is typically dissolved in a vinyl monomer, such as styrene, after which it is shaped Curing to produce shaped products. If the physical and tower properties of the composition during the forming and curing steps will cause the composition to flow out or flow, for example, when the resin composition is applied to the vertical surface of the lining, The resin surface has a non-uniform thickness and has reduced mechanical strength. It has previously been suggested that the viscosity, bulk, and tower storage properties of vinyl ester resins be improved by adding certain thixotropic agents. It has been reported that cinnamonite is used in some ethylene Base resin resin composition is "very effective" thixotropy (see MU nsaturated Polyester Technology " edited by Paul F. Gruins, Gordon and Breach Science Publishers). -13-(10) (10) 200401798 Composition of the invention Substances may include comonomers to facilitate handling, curing, and provide the desired mechanical properties. Suitable compatible comonomers include reactive ethylene unsaturated comonomers such as Ethylene, chlorostyrene, vinyltoluene, methylstyrene, diallyl phthalate, triallyl cyanurate, acrylates, methacrylates, and divinylbenzene. Styrene is better compatible Adjuvants. This composition may also include non-reactive diluents such as acetone, in which the properties available only with neat resins are desired. The vinyl ester resin used in the present invention may be any known in the art And it can be prepared by the addition reaction between epoxy resin and ethylene unsaturated monocarboxylic acid. Methods for preparing suitable vinyl ester resins are disclosed in U.S. patent applications 3, 2 5 6 5 2 2 6; 3 5 3 1 7, 4 6 5; 3, 3 4 5, 4 0 1; 3, 3 7 3,22 1; 3,3 7 7,4 06; 3,43 2,47 8; 3,54 8,03 0; 3 5 5 6 4 5 0 7 4; 3,634,542 and 35637,518. In general, the reaction used to prepare the vinyl ester resin used in the present invention is straightforward. It can be catalyzed by suitable catalysts such as tertiary amines, phosphines, bases or tin salts. The reaction formula can be shown as follows: 〇 〇 〇 、
I \ / \ WI \ / \ W
C-C-C-R-C-C-C +2 / C-C=CC-C-C-R-C-C-C +2 / C-C = C
HOHO
/? I/? I
C=C-C-0^C-C-C-R-C-C-C-0-C-C=C OH OH 其中R是例如伸烷基、環伸烷基、伸芳基、芳基伸烷 基、氧伸芳基Έ氧芳基伸院基或環伸院基醋。 β 合適的酸是丙烯酸、甲基丙烯酸;巴豆酸及肉桂酸。 合適的環氧樹脂是如下: -14- (11) 200401798 環氧化物C = CC-0 ^ CCCRCCC-0-CC = C OH OH where R is, for example, alkylene, cycloalkylene, alkylene, arylalkylene, oxyalkylene, oxyalkylene, or cycloalkylene Home base vinegar. β Suitable acids are acrylic acid, methacrylic acid; crotonic acid and cinnamic acid. Suitable epoxy resins are as follows: -14- (11) 200401798 Epoxide
環脂族環氧化物Cycloaliphatic epoxide
D 結合不同特性之實質數目的不同乙烯基酯可以藉結合 不同環氧樹脂與各種不同之不飽和酸而製備。多種不同 的產物當然甚至可以進一步地延伸,依可與乙烯基酯樹脂 結合及共聚合之不飽和單體的選擇而定。迄今已達最大利 用性且因此較佳被用於本發明中之乙烯基酯樹脂是以雙酚 一 A ( B P A ) —環氧爲底之乙烯基酯樹脂。這些樹脂可與 或不與共反應性單體如苯乙烯一同用喑本發明之組成物中 除了乙烯基酯樹脂’觸變添加劑及若想要,反應性或 非反應性稀釋劑之外,本發明之樹脂組成物也可包括觸媒 -15- (12) (12)200401798 、抑制劑、塡料、顏料及/或其它已知之一般添加劑。 本發明之組成物可以使用在此技藝中已知之自由基生 成起始劑來聚合及交聯。樹脂之聚合是藉真實之加成反應 且典型地不形成副產物。合適的起始劑包括過氧化物,較 佳地有機過氧化物如苯醯過氧化或甲基乙基酮過氧化物, 以及自由基之其它來源。例如,生成自由基之光起始劑也 可用來使本發明之組成物開始聚合。起始劑可與一般之加 速劑或促進劑如三級胺如二甲基或二乙基苯胺,及金屬皂 如辛酸-或萘酸鈷或錳。 可以使用不同的成形方法以使樹組成物成形。合適的 方法包括手工鋪疊法、冷壓製法、袋法、配合模法、纖絲 纏繞法及連續模製法。 •丙烯酸樹脂可以是冷或熱熟化之合成樹脂,其可藉 (甲基)丙烯酸酯(所謂之純- A )之均聚合而得、或其 與例如苯乙烯或乙烯酯之共聚合而得。熱可熟化之丙烯酸 樹脂另含有官能基(羥基、羥甲基、羧基),經由彼可以 實施交聯反應,它們可以自身交聯或(例如右添加胺基塑 膠或環氧樹脂後)藉外來方法而交聯。丙烯酸樹脂之溶解 度及機械性經由單體的選擇可以廣泛地變化。經熟化之丙 録酸樹脂通常是抗紫外光且不墟色之透明產品。 冷熟化之塗覆用樹脂可以有以下組成,例如: A )(甲基)丙'稀酸酯5 0至1 0 0重量% (甲基)丙烯酸甲酯0至5重量% (甲基)丙烯酸乙酯0至5重量% -16- (13) (13)200401798 c3 — C6 (甲基)丙烯酸酯0至97重量% >C7 (甲基)丙烯酸酯0至50重量% 多價(甲基)丙烯酸酯3至1 0重量% 共單體〇至5 0重量% 乙烯基芳族化合物〇至3 0重量% 乙烯基酯〇至3 0重量。/。 成份A之構成成份和是1 〇 〇重量%, B )每1重量份之A,0至2重量份之溶解或溶脹於 A )中之(預)聚合物,基於B,(甲基)丙烯酸酯或( 甲基)丙烯酸乙酯之量是大於5重量%, C)每100重量份(A + B) ,2至5重量份之至少一 石鱲及/或鱲, D ) —種氧化還原系統,其至少關於氧化還原之一成 分要保持分離直至此系統之可聚合之構成成份聚合爲止, 此氧化還原系統含有加速劑及過氧化物觸媒或起始劑,其 量足以使成份A )冷熟化,及 E ) —般之添加劑。 •經混合之樹脂可以是聚酯樹脂和乙烯基樹脂及/或 丙細酸樹脂之混合物以達到各性質之結合,此從商業來看 特別有利。 樹脂小心地與砂石混合且熟化劑及可選擇地加速劑被 添加至此。依熟化劑而定,熟化發生在顯著低於室溫之溫 度下,在室溫區中或在顯著高於室溫下溫度區中。溫度上 限通常由樹脂之物代資料例如單體之蒸汽壓來決定。 -17- (14) (14)200401798 依本發明之液態硬塑膠(其含有經結構性修飾之含丙 烯基的矽石)可以是液態,膏狀或固態。 它們可以含有另外的粉狀或纖維狀塡充材料,如: 石英粉, 玻璃纖維, 顏料, 防火劑, 金屬氧化物, 金屬粉, 石墨, 碳黑或 溶劑型之液態添加劑, 增塑劑, 非反應性增充劑樹脂,如烴樹脂, 賦與可撓性之樹脂,酚樹脂, 鱲, 聚合助劑和粘合促進劑。 進一步之添加劑可以是: 增稠劑, 起泡劑, 脫模劑, 增加使用期間之安定劑。 含有甲基丙烯酸系基團且已藉火焰水解來製備且其結 構已藉機械後處理來改變之依本發明所用之矽石使依本發 -18- (15) (15)200401798 明之樹脂及由彼所製之製備有很多技術優點。 與已知之細分矽石相反地,觸變行爲極低。對應用及 塗層和接著劑製劑之損失行爲有很大的好處。 堅固地結合至固體表面之丙烯官能基在反應性樹脂之 聚合期間會反應以形成交聯位址,此賦與終產物高度的硬 度,強度和彈性。此外,交聯反應的速度可增加,以致塗 層更快速地塵乾(d u s t - d r y )且層合物可較早地自模除去 〇 同樣地’模製組成物之加工被改良,特別是在高度塡 充系統之情況中,依本發明之矽石的反應性在短時間內實 施模製之均勻完全熟化。 當使用含有甲基丙烯酸系基團且藉火焰水解製備之矽 石時’特別的優點也是在製劑中不形成游離醇,如當使用 依先前技藝之液態矽烷時會無可避免地。 藉水解反應在原位上釋出之醇可以在樹脂製劑之進一 步加工期間引起很多缺點,如交聯方法之加速或阻滯。此 外’矽烷化反應需要可測量之時間及/或觸媒及/或熱之使 用以及可選擇地除去所形成之醇及過多之矽烷的方法。 依本發明之含有甲基丙烯酸系基團且藉火焰水解所製 備之矽石在液態或膏狀樹脂的使用對於其它塡料(主要是 那些具有較粗之粒子尺寸者)之沈積行爲有利的效果,即 使此效果並非在顯著地位上。 【實施方式】 -19- (16) (16)200401798 實例 比較性實例] 1 0 0重里份之不飽和之含苯乙烯的異酞酸聚酯樹脂及 1重量份之3 3 %甲基乙基酮過氧化物於酞酸二甲酯中所成 的溶液在溶解器之助下混合。粘度藉助於電流計來決定。 (在此實例及以下實例中所決定之粘度資料摘錄於表1中 )。液體而後倒入襯有分離箔之四方形鋼模中且在8 〇 ’在1 0 0巴之密閉壓力下加熱1 5分鐘。在那期間,組成 物完全熟化且形成爲透明片。 比較性實例2 來自比較性實例1之1 〇〇重量份之樹脂藉助於溶解器 以與1 5重量份之矽石混合,該矽石覆以三甲基甲砂院基 且藉火焰水解來製備且具有173米2之比表面積及藉分析 測定之3 · 4重量%之碳含量且其結構已藉機械後處理來改 變。粘度在2 3 °C下藉著在低壓櫥中簡單的脫氣作用而測 定。所得之膏狀組成物具有顯著低的流動限制,但可擴散 。1重量%之Μ Ε κ過氧化物溶液被添加至此,且在四方形 模中在8 0 °C下進行加熱1 5分鐘。在那時間,製劑完全 熟化且以半透明片形式自模除去。 比較性實例3 (先前技藝) 如實例1 一般,]重量°/。之3 3 % Μ Ε K過氧化物溶液被 添加至1 〇〇重量份之不飽和之含苯乙丨希之溴化乙丨希醋樹脂 -20- (17) 200401798 中;此混合物被成形以形成片且熟化。 比較性實例4 (先前技藝) 如實例1 一般,]0 0重量份之不飽和之含苯乙烯的溴 化乙烯基酯樹脂與1 5重量份矽石混合,此矽石覆以三甲 基甲矽基且已藉火焰水解來製備且具有1 7 3米2之比表面 積且其結構已藉機械後處理來改變。此組成物易於流動。D. A substantial number of different vinyl esters combining different characteristics can be prepared by combining different epoxy resins with various unsaturated acids. Many different products can of course be extended even further, depending on the choice of unsaturated monomers that can be combined and copolymerized with the vinyl ester resin. The vinyl ester resin which has hitherto reached the maximum usability and is therefore preferably used in the present invention is a bisphenol-A (BPA) -epoxy-based vinyl ester resin. These resins can be used with or without co-reactive monomers such as styrene. In addition to vinyl ester resins' thixotropic additives and, if desired, reactive or non-reactive diluents, The resin composition of the invention may also include catalyst-15- (12) (12) 200401798, inhibitors, additives, pigments and / or other known general additives. The composition of the present invention can be polymerized and crosslinked using a radical generation initiator known in the art. Polymerization of the resin is by a true addition reaction and typically does not form by-products. Suitable starters include peroxides, preferably organic peroxides such as phenylhydrazone peroxide or methyl ethyl ketone peroxide, and other sources of free radicals. For example, free radical-generating photoinitiators can also be used to initiate polymerization of the composition of the present invention. The initiator can be used with general accelerators or accelerators such as tertiary amines such as dimethyl or diethylaniline, and metal soaps such as caprylic acid- or cobalt naphthalate or manganese. Different forming methods can be used to shape the tree composition. Suitable methods include a manual lay-up method, a cold pressing method, a bag method, a mating mold method, a filament winding method, and a continuous molding method. • The acrylic resin may be a cold or heat cured synthetic resin, which may be obtained by homopolymerization of a (meth) acrylate (so-called pure-A), or by copolymerization with, for example, styrene or vinyl ester. Thermally-curable acrylic resins also contain functional groups (hydroxyl, methylol, carboxyl), through which they can perform cross-linking reactions. They can be cross-linked by themselves or (for example, by adding amine plastic or epoxy resin on the right) by external methods. And cross-linking. The solubility and mechanical properties of acrylic resins can be widely changed through the selection of monomers. The cured acrylic resin is usually a transparent product that is resistant to ultraviolet light and does not appear bleached. The cold-curing coating resin may have the following composition, for example: A) (meth) acrylic acid dilute acid ester 50 to 100% by weight (meth) acrylate 0 to 5% by weight (meth) acrylic acid 0 to 5% by weight -16- (13) (13) 200401798 c3 — C6 (meth) acrylate 0 to 97% by weight > C7 (meth) acrylate 0 to 50% by weight polyvalent (methyl ) Acrylate 3 to 10% by weight of comonomer 0 to 50% by weight of vinyl aromatic compound 0 to 30% by weight of vinyl ester 0 to 30% by weight. /. The composition of ingredient A is 100% by weight, B) per 1 part by weight of A, 0 to 2 parts by weight of (pre) polymer dissolved or swelled in A), based on B, (meth) acrylic acid The amount of ester or ethyl (meth) acrylate is greater than 5% by weight, C) per 100 parts by weight (A + B), 2 to 5 parts by weight of at least one stone and / or osmium, D)-a redox system At least one component of the redox must be kept separated until the polymerizable constituents of this system are polymerized. This redox system contains accelerators and peroxide catalysts or initiators in an amount sufficient to cool component A). Maturation, and E) -like additives. • The mixed resin can be a mixture of polyester resin and vinyl resin and / or acrylic resin to achieve a combination of properties, which is particularly advantageous from a commercial point of view. The resin is carefully mixed with the gravel and a curing agent and optionally an accelerator are added thereto. Depending on the curing agent, curing occurs at temperatures significantly below room temperature, in the room temperature region or in the temperature region significantly above room temperature. The upper temperature limit is usually determined by the material information of the resin such as the vapor pressure of the monomer. -17- (14) (14) 200401798 The liquid hard plastic according to the present invention (which contains structurally modified acryl-containing silica) may be liquid, paste or solid. They can contain additional powdery or fibrous filler materials such as: quartz powder, glass fiber, pigments, flame retardants, metal oxides, metal powders, graphite, carbon black or solvent-based liquid additives, plasticizers, non- Reactive extender resins, such as hydrocarbon resins, resins imparting flexibility, phenol resins, resins, polymerization aids and adhesion promoters. Further additives can be: thickener, foaming agent, release agent, stabilizer to increase the use period. The silica used in accordance with the present invention containing methacrylic groups and which has been prepared by flame hydrolysis and whose structure has been changed by mechanical post-treatment makes the resin according to the present invention -18- (15) (15) 200401798 and The preparation made by him has many technical advantages. In contrast to known finely divided silicas, thixotropic behavior is extremely low. There are great benefits for applications and loss behavior of coatings and adhesive formulations. The propylene functional group firmly bonded to the solid surface reacts during the polymerization of the reactive resin to form a crosslinking site, which imparts a high degree of rigidity, strength and elasticity to the final product. In addition, the speed of the cross-linking reaction can be increased so that the coating is dust-dry more quickly and the laminate can be removed from the mold earlier. Similarly, the processing of the molding composition is improved, especially in In the case of highly charged systems, the reactivity of the silica according to the invention is uniformly and completely cured in a short time. When using silica containing methacrylic groups and prepared by flame hydrolysis, a particular advantage is that no free alcohol is formed in the formulation, such as when using liquid silanes according to the prior art. The alcohol released in situ by the hydrolysis reaction can cause many disadvantages during the further processing of the resin formulation, such as the acceleration or retardation of the crosslinking method. In addition, the ' silanization reaction requires a measurable time and / or use of catalyst and / or heat and a method of selectively removing formed alcohols and excess silanes. The use of the silica containing methacrylic acid groups and prepared by flame hydrolysis according to the present invention in liquid or paste resins has a beneficial effect on the deposition behavior of other materials (mainly those with larger particle sizes). , Even if the effect is not prominent. [Embodiment] -19- (16) (16) 200401798 Examples Comparative Examples] 100 parts by weight of unsaturated styrene-containing isophthalic acid polyester resin and 1 part by weight of 3% methyl ethyl A solution of ketone peroxide in dimethyl phthalate is mixed with the help of a dissolver. The viscosity is determined by means of an ammeter. (The viscosity data determined in this example and the following examples are extracted in Table 1). The liquid was then poured into a square steel mold lined with a separation foil and heated at 800 'for 15 minutes under a closed pressure of 100 bar. During that time, the composition was fully cured and formed into a transparent sheet. Comparative Example 2 100 parts by weight of resin from Comparative Example 1 were mixed with 15 parts by weight of silica by means of a dissolver, the silica was coated with trimethylmethanthine base and prepared by flame hydrolysis It has a specific surface area of 173 m 2 and a carbon content of 3.4% by weight measured by analysis and its structure has been changed by mechanical post-treatment. Viscosity is measured at 23 ° C by simple degassing in a low pressure cabinet. The resulting paste composition has significantly lower flow restrictions but is diffusible. A 1% by weight solution of M E kappa peroxide was added thereto, and heating was performed at 80 ° C for 15 minutes in a square mold. At that time, the formulation was fully cured and removed from the mold in the form of a translucent tablet. Comparative Example 3 (previous technique) As in Example 1, weight ° /. The 33% ΜΕΚ peroxide solution was added to 1,000 parts by weight of unsaturated styrene-containing ethyl bromide, ethyl bromide, and Greek resin-20- (17) 200401798; the mixture was shaped to Form flakes and mature. Comparative Example 4 (previous technique) As in Example 1, 0 parts by weight of unsaturated styrene-containing brominated vinyl ester resin was mixed with 15 parts by weight of silica, and the silica was coated with trimethylformyl Silicon-based and has been prepared by flame hydrolysis and has a specific surface area of 173 m 2 and its structure has been changed by mechanical post-treatment. This composition is easy to flow.
實例2 (依本發明)Example 2 (according to the present invention)
1 5重量份之矽石與1 〇 〇重量份不飽和之含苯乙烯的 溴化乙烯基樹脂混合,該矽石含有甲基丙烯酸系基團且已 藉火焰水解來製備且具有1 60米2/克之比表面積,1 5奈 米之平均粒子尺寸及5 %之碳含量,且其結構已藉機械後 處理來改變。沒有可注意到之流動限制,此組成物極易於 倒出。它混以1重量%之3 3 % Μ E K過氧化物溶液,脫氣且 成形以形成片且如實例1中熟化。 比較性實例5 (先前技藝) 1〇〇重量份之ΡΜΜΑ樹脂於單體的甲基丙烯酸甲酯中 之溶液在室溫下熟化,其具有以下組成: a ) 2 0至9 5重量%單體的成份,其由以下組成 a】)60至1〇〇重量份(甲基)丙烯之化合牧;, a2 ) 0至4 0重量份之多官能性(甲基)丙烯酸酯 -21 - (18)20040179815 parts by weight of silica is mixed with 1,000 parts by weight of unsaturated styrene-containing brominated vinyl resin. The silica contains methacrylic groups and has been prepared by flame hydrolysis and has a length of 160 m 2. The specific surface area per gram, the average particle size of 15 nanometers and the carbon content of 5%, and its structure has been changed by mechanical post-treatment. With no noticeable flow restrictions, this composition is extremely easy to pour. It was mixed with a 1% by weight solution of 33% MEK peroxide, degassed and shaped to form a sheet and cured as in Example 1. Comparative Example 5 (previous technique) A solution of 100 parts by weight of a PMMA resin in methyl methacrylate of a monomer was cured at room temperature and had the following composition: a) 20 to 95% by weight of monomer Ingredients, which consist of the following: a]) 60 to 100 parts by weight of (meth) propylene compound ;, a2) 0 to 40 parts by weight of polyfunctional (meth) acrylates 21-(18 200401798
重量份之接板交聯劑, b ) 5 至 8〇 c ) 0 · 1 至 s羹%之溶於成份A )中之聚合物, ]5重量份之自由基生成劑,其已具有低的 流動限制,被混以 在室溫下熟化。^ 5 膠粘性。 !重量%之熟化劑,倒出以形成薄片且 小時後,此片完全熟化。表面有殘餘 比較性實例6 (依本發明): 1 S "s* /λ 7Γ/ — ΙΖΓ妙石與1 00重量份來自比較性實例5之 PMMA樹脂混会 〆 ㈡’該矽石含有三甲基甲矽基且已藉三甲基 甲矽基之火焰水解而製備且具有173 * 2/克之比表面積, 1 2 奈米之2(1 j:白& > 拉子尺寸及3 ·4%碳含量。與比較性實例5 相比此▲ ^具有顯著經增加之流動限制。它與3重量% 熟化劑混合’倒出以形成比且在室溫下熟化。表面稍有殘 餘膠粘膠性。 實例3 (依本發明) 1 0 0重量份來自比較性實例5之Ρ Μ Μ Α樹脂藉實驗級 溶解器與1 5重量份砂石緊密結合,此较石含有甲基丙烯 酸系基團且已藉火焰水解來製備且具有〗60米2/克之比表 面積。與未經塡充之樹脂(比較性實例5 )相比,流動限 制僅稍微增加。此混合物而後與3重量份熟化劑混合,倒 出以形成薄片且在室溫下熟化。1 6小畤後,此片完全熟 化。此表面非膠粘性。 -22- (19) 200401798 測試結果摘要 表1 : 未熟化之製劑的性質 粘度, Pas, at 5/s 流變 指數2.5/5 向上 流動限度,P a s 比較性實例1 1.34 1 0.2 比較性實例2 101.7 1.68 2 18 實例1 12.9 1.42 7.6 比較性實例3 0.573 1 0.002 比較性實例4 95.7 1.77 258 實例2 2.62 1.13 0.1 比較性實例5 8.24 1 40 比較性實例6 69 1.65 26 1 實例3 23 1.26 65Parts by weight of the cross-linking agent, b) 5 to 80c) 0.1 to 1% by weight of a polymer dissolved in component A), 5 parts by weight of a free radical generator, which already has a low Flow limited and mixed to mature at room temperature. ^ 5 Adhesive. ! Wt% of curing agent, pour out to form flakes and after hours, the sheet is fully cured. Comparative Example 6 with residual surface (according to the present invention): 1 S " s * / λ 7Γ / — IZΓ Miao stone mixed with 100 parts by weight of PMMA resin from Comparative Example 5 'The silica contains three Methylsilyl and has been prepared by flame hydrolysis of trimethylsilyl and has a specific surface area of 173 * 2 / g, 1 2 nm 2 (1 j: white & > puller size and 3 · 4% carbon content. Compared to Comparative Example 5, this has a significantly increased flow limit. It is mixed with 3% by weight of the curing agent to pour out to form a ratio and mature at room temperature. The surface has a slight residual stickiness Example 3 (according to the present invention) 100 parts by weight of the P Μ Μ Α resin from Comparative Example 5 is closely combined with 15 parts by weight of sand and gravel by means of an experimental dissolver, which contains methacrylic groups It has been prepared by flame hydrolysis and has a specific surface area of 60 m 2 / g. Compared to the resin without filling (Comparative Example 5), the flow restriction is only slightly increased. This mixture is then mixed with 3 parts by weight of a curing agent Mix, pour out to form flakes and ripen at room temperature. After 16 hours, this piece is fully ripened This surface is non-tacky. -22- (19) 200401798 Summary of test results Table 1: Intrinsic viscosity of uncured formulation, Pas, at 5 / s Rheological index 2.5 / 5 Upward flow limit, P as Comparative Example 1 1.34 1 0.2 Comparative Example 2 101.7 1.68 2 18 Example 1 12.9 1.42 7.6 Comparative Example 3 0.573 1 0.002 Comparative Example 4 95.7 1.77 258 Example 2 2.62 1.13 0.1 Comparative Example 5 8.24 1 40 Comparative Example 6 69 1.65 26 1 Example 3 23 1.26 65
表1之分析 即使在所選之高劑量下,含甲基丙烯酸系基團且藉火 焰水解製備之矽石使塑膠樹脂組成物粘度有相當小的增加 以及低的流動限制。那性質對於進一步之加工極有利。 -23 - (20) 200401798 表2 : 蕭耳D 1 〇 s / 6 0 s 壓痕 硬度 拉伸強 度MP a 拉伸模 量Μ P a 彎曲 模量 比較性 實例1 7 8/76 87 47 2 3 6 7 1 3 8 5 3 PE 比較性 實例2 84/83 1 06 48 3 5 0 7 1 8 8 93 R82 00 實例1 84/83 118 5 5 4 103 2 3 764 R7200 比較性 實例3 86/85 73 70 42 18 23 764 VE 比較性 實例4 85/84 119 50 4960 252 1 3 R8200 實例2 8 5/84 1 2 1 43 6 0 5 1 23 5 40 R7200 比較性 實例5 82/80 10 1 n . m . η . m . η . m . MM A 比較性 實例6 83/8 1 110 η . m . η . m . η . m . R82 00 實例3 85/83 129 η . m . η . m . η . m . R7200 經熟化之製劑的"生κ 表2之分析: 如預期的,二種矽石使經交聯樹脂製劑中硬度和模數 有增加。雖有較低之BET表面積,用甲基丙烯酸系基團 修飾之矽石因實質更顯著作用而顯其特色,此在實例2中 -24 - (21) 200401798 導致樹脂之可注意到之易脆性。精於此技藝之人會了解在 此處所顯示之節省成本潛力且降低更可撓之基礎樹脂之劑 量或使用。 -25-Analysis of Table 1 Even at the selected high doses, silica containing methacrylic groups and prepared by flame hydrolysis gives a relatively small increase in viscosity and low flow restriction of the plastic resin composition. That property is extremely beneficial for further processing. -23-(20) 200401798 Table 2: Shaw D 1 〇s / 60 s Indentation Hardness Tensile Strength MP a Tensile Modulus M P a Flexural Modulus Comparative Example 1 7 8/76 87 47 2 3 6 7 1 3 8 5 3 PE Comparative Example 2 84/83 1 06 48 3 5 0 7 1 8 8 93 R82 00 Example 1 84/83 118 5 5 4 103 2 3 764 R7200 Comparative Example 3 86/85 73 70 42 18 23 764 VE Comparative Example 4 85/84 119 50 4960 252 1 3 R8200 Example 2 8 5/84 1 2 1 43 6 0 5 1 23 5 40 R7200 Comparative Example 5 82/80 10 1 n.m Comparative example 6 83/8 1 110 η. m. η. m. η. m. R82 00 Example 3 85/83 129 η. m. η. m. R7200 Analysis of cured raw materials " Raw kappa " Table 2: As expected, the two silicas increased the hardness and modulus in the crosslinked resin formulation. Although it has a lower BET surface area, silica modified with methacrylic groups is more distinguished due to its more substantial function. This is shown in Example 2 -24-(21) 200401798, which results in noticeable brittleness of the resin. . Those skilled in the art will understand the cost savings potential shown here and reduce the dosage or use of more flexible base resins. -25-
Claims (1)
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| Application Number | Priority Date | Filing Date | Title |
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| PCT/EP2002/007276 WO2004005393A1 (en) | 2002-07-02 | 2002-07-02 | Liquid duroplastics |
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| EP (1) | EP1517949A1 (en) |
| JP (1) | JP2005531672A (en) |
| CN (1) | CN100575403C (en) |
| AU (1) | AU2002321158A1 (en) |
| TW (1) | TW200401798A (en) |
| WO (1) | WO2004005393A1 (en) |
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| US7701550B2 (en) | 2004-08-19 | 2010-04-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| RU2358908C2 (en) * | 2004-11-18 | 2009-06-20 | Дегусса Гмбх | Hydrophobic silicon dioxide and its application in silicon rubber |
| DE102007024099A1 (en) | 2007-05-22 | 2008-11-27 | Evonik Degussa Gmbh | adhesives |
| WO2013156337A1 (en) | 2012-04-20 | 2013-10-24 | Evonik Degussa Gmbh | Reinforced epoxy resin adhesive |
| EP3954743A1 (en) | 2020-08-12 | 2022-02-16 | Evonik Operations GmbH | Use of silicon dioxide to improve the conductivity of coatings |
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| US3328339A (en) * | 1963-08-28 | 1967-06-27 | Monsanto Co | Reinforced plastics containing base treated, calcined particulate fillers and organosilane coupling agents |
| DE50016050D1 (en) * | 2000-10-21 | 2011-02-03 | Evonik Degussa Gmbh | Functionalized silicic acids |
| ES2359228T3 (en) * | 2000-10-21 | 2011-05-19 | Evonik Degussa Gmbh | SYSTEMS OF CURABLE VARNISHES BY RADIATION. |
| EP1199336B1 (en) * | 2000-10-21 | 2014-01-15 | Evonik Degussa GmbH | Functionalized, structure modified silicic acids |
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| AU2002321158A1 (en) | 2004-01-23 |
| CN100575403C (en) | 2009-12-30 |
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