SU842111A1 - Solution for chemical polishing of copper and its alloys - Google Patents

Description

 . The invention relates to the chemical treatment of the surface of metals, in particular, to the polishing of articles made of copper and its alloys. Of the existing mechanical, electrochemical and chemical methods of polishing parts, chemical polishing is the most promising. A known solution for chemical polishing of copper and its alloys 1, which contains sulfuric acid, hydrogen peroxide with ethylene glycol monoethyl ether, non-ionic sulfate and azo derivatives with the following ratio of components, g / l: Sulfuric or nitric acid 10-150 Hydrogen peroxide 50-200 Glycol monoethyl ether 10-20 Triazoles 0.01-10 Non-ionic surfactants 0.5-1 Methyl or ethyl ether these glycol glycol 20 ml / l or 50 ml / l methyl alcohol or ethyl alcohol instead. The surface of the metal treated with such a solution is obtained by uniformly uniformly by etching the metal to different depths. The closest to the proposed technical essence is solution 2 containing sulfuric acid, hydrogen chloride and a surfactant. However, the surface gloss is low while metal removal is quite high. The purpose of the invention is to increase the gloss and reduce the etching of the surface of copper and its alloys. To achieve the desired purpose, hexafluoro-silicon 2-alkyl-1 (2-amino-ethyl) -2-imidazoline or 2-alkyl-1 (2) is added as a surfactant to the solution containing sulfuric acid, hydrogen peroxide, surfactant and water. poly (polyethylene polyamine) -2-imidazolines of the general formula. . N-CH, N-CHj 1 -CHa 2 beat I - (((sIG CH CHaNH (iHtCHeNHVCH C faNHt, 20 4. R Go C-goH jn 1-5. 20 41 with the following content of components, g / l: Sulfuric acid (spd. Weight) 50-100 Hydrogen peroxide 100-150 Hexafluoro-silicon 2-alkyl-1 (2 -s1-amino-ethyl) -2-imidazoline salts or 2-alkyl-1 (2-polyethylene-polyamine) -21-3-imidazolines Hexafluorosilicon salts of 2-al-1 (2-amino-ethyl) -2-imidazolines are prepared by reacting 2-alkyl-1 (2-amino-ethyl) -2-imidazolino with hexafluorosilicic acid in acetone at a temperature of 20–40 ° C and molar ratio 1: 1 source components: -cng N-CHz + H2SiFj- -RC I-CHg C NgSCg Ng caijCHj or imidazoline-base 2-alkyl. (2-polyethylenepolyamine) -2-imidazolines) overall formula: ET-Syag tg-cng (cng CHe-NHJ „СНг where R о С С:, оН. Solutions are prepared, Supplied additives are added to the bath to the calculated amount of sulfuric acid and hydrogen peroxide. The contents of the bath are carefully transferred and the temperature of the working solution is adjusted to 30-4BS. Polishing is carried out on plates 75 x 100 mm in size. similar to the sleigh above. The specific polishing conditions for each individual case are reflected in examples 1-18, the test results are shown in the table. Example 1. The composition of the solution is g / l: Sulfuric acid (d 1.84 g / cm) Hydrogen peroxide Hydroxycopyne salt 2-tetradecyl-1- - (2-amine tere) -2-imidazoline Polishing treated sheets from technical copper mark -and M-3 (Cu - 99 ,, Bi - 0.003%, Pb 05%) is carried out in the above mentioned re for 1 min. Example 2. The composition of the solution: Sulfuric acid (d 1.84 g / cm) Hydrogen peroxide Hexafluoro-silicon salt 2-dodecyl-1- (2-amino-ethyl-2-imidazole) The polishing of the brass plate L-68 is carried out at a temperature of solution in the bath for 30 seconds Example 3. Composition of the solution: Sulfuric acid (d 1.84 g / cm) Hydrogen peroxide 2-decyl-1- (2-. -aminoethyl) -imidazoline Hexafluoro-silicon-silicon salt Water Up to Hl. Polishing a plate from technical media Grades M-3 are carried out with the AIA theme for 1 minute. Example 4. Solution composition: Sulfuric acid (d 1.84 g / cm) 100 Hydrogen peroxide 150 Hexafluoro silicon salt of 2-decyl-1- (2-aminoethyl) -2-imidazoline 3 Water up to 1 l L-68 brand brass is polished at C for 30 seconds. Example 5: Solution composition: Sulfuric acid (d 1.84 g / cm) Hydrogen peroxide Hexafluoro-silicon salt 2-octadecyl-1- (2-amino-ethyl) -2-imidazoline 2 Water Up to 1 l Plates of technical copper grade are polished at 35 ° C for 1 minute Example 6. Composition solution,: Sulfuric acid Id 1.84 g / cm) Hydrogen peroxide Hexafluoro-silicon salt 2-octadecyl-1- (2-taminoethyl) -2-imidazoline2 Water. Up to 1 L Brass of the grade L-B8 is polished at C for 1 min. Example 7 (used solution solution) C (. Content of components, g / l: Sulfuric acid40 Hydrogen peroxide 50

Azoic acid20

1-amino-1,2,3-triaol 5 Methanol 50 ml / l

Nonionic surfactant 2 ml / l Vodo Do 1 L

Polishing of copper plates M-3 was carried out in solution for 1 min.

PRI lle R 8. Composition of the solution is the same as in example 7.

Polishing of L-68 brass plates is carried out by immersing them in a solution at 45 ° C for 30 seconds.

Example 9. The composition of the solution g / l:

Sulfuric acid

N 1.84 g / cm) 50

Hydrogen peroxide 100 Water Up to 1 l

Plates of copper grade M-3 polished ri for 1 min.

Example 10. The solution was prepared according to the formula shown in Example 9. Polishing the plate and brass of the grade L-68 was carried out for 1 minute at a solution temperature - 30%.

Example 11. The composition of the solution g / l:

Sulfuric acid

(d 1.84 g / cm) 60

Hydrogen peroxide 90

2-tetradecyl-1 (2-diaminodiethyl) -2-imidazoline2

Water up to 1 l

Polishing a plate of copper poppies M-3 was carried out for 1 min.

Example 12. The composition of the solution g / l:

Sulfuric acid

(d 1.84 g / cm)

60 90

Hydrogen peroxide

2-tetradecyl-1 (2-diaminodiethyl) -22 1 l

-imidazolium

Water

Polishing a plate of brass L-68 was carried out at 40 s for 1 min.

Example 13. The composition of the solution. g / l:

Sulfuric Acid50

Hydrogen peroxide 100

2-decyl-1 (2-hexa. Amino-ethyl) -2-imidazoline. one

Water up to 1 l

The polishing of the α-3 copper plates M-3 is carried out for 1 min.

Example 14. The composition of the solution g / l:

Sulfuric acid

(d 1.84 g / cm) 100

Hydrogen peroxide . 150

2-decyl-1 (2-hexaaminoethyl) -2-imidazoline. 2.

Water up to 1 l

Polishing a plate made of brass of the grade L-68 was carried out at 45 s for 30 seconds.

Example 15. The composition of the solution, g / l:

Sulfuric acid

(d 1.84 g / cm) 50

Hydrogen peroxide 100 2-octadecyl-1 (2-diaminodiethyl) -2-imi0 dazolin1

Water Up to 1 l

Polishing a plate of copper grade M-3 was carried out at 30 ° C for 1 min.

five

Example 16. The composition of the solution, g / l:

Sulfuric acid

(d 1, S4 g / cm) 50

Hydrogen peroxide 150 2-octadecyl-1 (2-di 0-aminodiethyl) -2-imidazoline 2

Water up to 1 l

Polishing a plate made of brass of the grade L-68 is carried out at 45 seconds. For 5 seconds.

Example 17 (known solution 2 is used).

The composition of the solution, aves .: hydrogen peroxide 15

0 Sulfuric acid (d 1.84 g / cm) 9.95 Ethanol5

Nonionic surfactant. 0.1 Water Else

five

Polishing the plate is carried out at

45C for 30 sec for copper grade M-3.

Example 18 (solution as in example 17).

0

The composition of the solution, wt.%: Hydrogen peroxide 15 Sulfuric acid

(d 1.84 g / cm) 9.95

Ethanol 5

Nonionic surfactant 0,1

five

WaterEverything

The polishing of a plate made of brass of the grade L-68 was carried out at 45 ° C for 30 sec.

The solution according to the invention

0 for the chemical polishing of copper and its alloys contains 2-alkyl- (2-amino-ethyl) -2-imidazolines hexafluoro-silicon salts. These are cationic organic substances or imidazo5 lin bases of 2-alkyl- (2-polyethylene polyamine) -2-imidazolines, which form sulfuric acid salts in sulfuric acid solutions (for solutions of other acids, for example, in nitric acid, respectively, nitric acid salts, etc.).

0 The main role, as can be seen from the table, belongs to the organic cation, which is confirmed by the coulostatic and impedance measurement, rhenium.

five

In the known solution 2 alcohols (methanol, ethanol) are composed of substances of the molecular type, as well as non-ionic surfactants, acting, like alcohols, by a molecular mechanism.

Consequently, the mechanism of action of cationic substances and substances of molecular type is different, which is observed from the experimental results. An important factor is the reduction in metal removal (e 0.350, 37 µm / min in Pure solution to 0.16-0.20 µm / min in the presence of additives).

The optimal additive is in the range of 1-3 g / l. The increase in the concentration. Traction almost does not affect the quality of the treated surface.

Claims (2)

As follows from the table, the proposed solution, in comparison with the well-known one, allows to obtain a surface with a high coefficient of light reflection with a slight metal removal, to use for processing the workpiece with a roughness 1 grade lower, which ultimately reduces the cost of parts. Claims A solution for the chemical polishing of copper and its alloys, containing sulfuric acid, hydrogen peroxide, water, and a surfactant, characterized in that, in order to increase the gloss and remove. : lf If-C3l2 -HzSiFe SNgSNgMNg T 2 .. p 1-5 with the following ratio of components, g / l: Sulfuric acid (d 1.84-G / cm) 50-100 Hydrogen peroxide 100-150 Hexafluoro-silicon-silicon salts 2- alkyl-1- (2-aminoethyl) -2-imidazolines or for the purpose of surface etching, it contains 2-alkyl-1- (2-amino-ethyl) -2-imidazolines or 2-alkyl 1- (2-polyethylene polyamine) -2-imidazolines of the general formula Tf-CK, tl-CKz (SNHSS: r11) n Oi CHzHHz 1 2-alkyl-1 (2-polyethylene polyamine) -2-imidazolines 1-3 Sources of information taken in attention when exp version 1, US Patent number 3, 156-20, published. 1976 2. The UK patent 1,164.347, cl. From 7 V, pub. 17.09.69.