SU51795A1 - Composition for local limitation of solder solids when soldering - Google Patents
Composition for local limitation of solder solids when solderingInfo
- Publication number
- SU51795A1 SU51795A1 SU195922A SU195922A SU51795A1 SU 51795 A1 SU51795 A1 SU 51795A1 SU 195922 A SU195922 A SU 195922A SU 195922 A SU195922 A SU 195922A SU 51795 A1 SU51795 A1 SU 51795A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- soldering
- composition
- local limitation
- solder
- solder solids
- Prior art date
Links
Landscapes
- Detergent Compositions (AREA)
Description
Уже известны составы дл ограничени сферы /действи припо при пайке в форме водных растворов, в которые в качестве наполнител входит, например, асбест.Compositions are already known for limiting the sphere / action of solder in brazing in the form of aqueous solutions, which include, for example, asbestos as a filler.
Отличие изобретенного состава заключаетс в применении в качестве жидкой основы водного раствора жидкого стекла.The difference of the invented composition lies in the use of an aqueous solution of liquid glass as a liquid base.
В зависимости от требований, предъ вл емых к изделию и пайке, концентраци раствора жидкого стекла может колебатьс в пределах от 40 до 50%, наполнител из порошкообразного мела или асбеста около . остальное-вода.Depending on the requirements for the product and soldering, the concentration of the liquid glass solution can vary from 40 to 50%, a filler made of powdered chalk or asbestos about. the rest is water.
Указанный состав наноситс кисточкой тонким слоем на те части подготовленной к пайке детали, которые требуетс оградить от затекани припо . Затем деталь просушивают и па ют обычным способом.Said composition is applied with a brush in a thin layer on those parts of the part prepared for soldering that must be protected from flowing solder. Then the part is dried and burned in the usual way.
После пайки предохранительна пленка легко удал етс щеткой-или промыванием (гор чей водой или слабой кислотой).After soldering, the safety film is easily removed by brushing or rinsing (with hot water or a weak acid).
Предмет изобретени .The subject matter of the invention.
Состав дл местного ограничени сферы действи припо при пайке с применением в качестве наполнител мела или асбеста, отличающийс тем, что в качестве жидкой основы вз т водный раствор жидкого стекла.A composition for local limitation of the solder's sphere of action when soldering using chalk or asbestos as a filler, characterized in that a water solution of liquid glass is taken as the liquid base.
Тиг.,Печатный Труд . Зах. 5326-700Tig., Printed Labor. Zach. 5326-700
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU195922A SU51795A1 (en) | 1936-07-11 | 1936-07-11 | Composition for local limitation of solder solids when soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU195922A SU51795A1 (en) | 1936-07-11 | 1936-07-11 | Composition for local limitation of solder solids when soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU51795A1 true SU51795A1 (en) | 1936-11-30 |
Family
ID=48364218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU195922A SU51795A1 (en) | 1936-07-11 | 1936-07-11 | Composition for local limitation of solder solids when soldering |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU51795A1 (en) |
-
1936
- 1936-07-11 SU SU195922A patent/SU51795A1/en active
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