[go: up one dir, main page]

SU51795A1 - Composition for local limitation of solder solids when soldering - Google Patents

Composition for local limitation of solder solids when soldering

Info

Publication number
SU51795A1
SU51795A1 SU195922A SU195922A SU51795A1 SU 51795 A1 SU51795 A1 SU 51795A1 SU 195922 A SU195922 A SU 195922A SU 195922 A SU195922 A SU 195922A SU 51795 A1 SU51795 A1 SU 51795A1
Authority
SU
USSR - Soviet Union
Prior art keywords
soldering
composition
local limitation
solder
solder solids
Prior art date
Application number
SU195922A
Other languages
Russian (ru)
Inventor
Г.Н. Муравьев
А.Ф. Никонов
Original Assignee
Г.Н. Муравьев
А.Ф. Никонов
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Г.Н. Муравьев, А.Ф. Никонов filed Critical Г.Н. Муравьев
Priority to SU195922A priority Critical patent/SU51795A1/en
Application granted granted Critical
Publication of SU51795A1 publication Critical patent/SU51795A1/en

Links

Landscapes

  • Detergent Compositions (AREA)

Description

Уже известны составы дл  ограничени  сферы /действи  припо  при пайке в форме водных растворов, в которые в качестве наполнител  входит, например, асбест.Compositions are already known for limiting the sphere / action of solder in brazing in the form of aqueous solutions, which include, for example, asbestos as a filler.

Отличие изобретенного состава заключаетс  в применении в качестве жидкой основы водного раствора жидкого стекла.The difference of the invented composition lies in the use of an aqueous solution of liquid glass as a liquid base.

В зависимости от требований, предъ вл емых к изделию и пайке, концентраци  раствора жидкого стекла может колебатьс  в пределах от 40 до 50%, наполнител  из порошкообразного мела или асбеста около . остальное-вода.Depending on the requirements for the product and soldering, the concentration of the liquid glass solution can vary from 40 to 50%, a filler made of powdered chalk or asbestos about. the rest is water.

Указанный состав наноситс  кисточкой тонким слоем на те части подготовленной к пайке детали, которые требуетс  оградить от затекани  припо . Затем деталь просушивают и па ют обычным способом.Said composition is applied with a brush in a thin layer on those parts of the part prepared for soldering that must be protected from flowing solder. Then the part is dried and burned in the usual way.

После пайки предохранительна  пленка легко удал етс  щеткой-или промыванием (гор чей водой или слабой кислотой).After soldering, the safety film is easily removed by brushing or rinsing (with hot water or a weak acid).

Предмет изобретени .The subject matter of the invention.

Состав дл  местного ограничени  сферы действи  припо  при пайке с применением в качестве наполнител  мела или асбеста, отличающийс  тем, что в качестве жидкой основы вз т водный раствор жидкого стекла.A composition for local limitation of the solder's sphere of action when soldering using chalk or asbestos as a filler, characterized in that a water solution of liquid glass is taken as the liquid base.

Тиг.,Печатный Труд . Зах. 5326-700Tig., Printed Labor. Zach. 5326-700

SU195922A 1936-07-11 1936-07-11 Composition for local limitation of solder solids when soldering SU51795A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU195922A SU51795A1 (en) 1936-07-11 1936-07-11 Composition for local limitation of solder solids when soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU195922A SU51795A1 (en) 1936-07-11 1936-07-11 Composition for local limitation of solder solids when soldering

Publications (1)

Publication Number Publication Date
SU51795A1 true SU51795A1 (en) 1936-11-30

Family

ID=48364218

Family Applications (1)

Application Number Title Priority Date Filing Date
SU195922A SU51795A1 (en) 1936-07-11 1936-07-11 Composition for local limitation of solder solids when soldering

Country Status (1)

Country Link
SU (1) SU51795A1 (en)

Similar Documents

Publication Publication Date Title
SU51795A1 (en) Composition for local limitation of solder solids when soldering
US1556714A (en) Composition for preventing accumulation of moisture
US1553485A (en) Liquid preparation for removing paint
US803802A (en) Brazing compound.
US1467654A (en) Composition for removing paint
SU105863A1 (en) Paste for soldering and tinning
US1347454A (en) Writing and engrossing ink
US1550987A (en) Process of soldering and composition therefor
US1632555A (en) Composition of matter
US1775197A (en) Soldering solution
Holmes et al. Anti-Dimming Preparations for Gas Masks
US444084A (en) Process of enameling photographs and other prints
DE623043C (en) Luestersud
US1034819A (en) Paint and varnish remover.
SU50410A1 (en) The method of preparation of resin composition (alloy) for galosh varnishes
SU396455A1 (en) PASTE FOR CLEANING THE METAL SURFACE
Jay A method for improving flux used in soldering nonprecious alloys
GB454283A (en) Improvements in or relating to aluminium planographic printing plates
GB404874A (en) An improved washable protective coating for oil tanks
GB492589A (en) Method of avoiding the formation of zinc stains on laundry boiled in zinc-lined vessels
GB470482A (en) Improvements in or relating to gelatine and glue compositions
Phin The Workshop Companion: A Collection of Useful and Reliable Recipes, Rules, Processes, Methods, Wrinkles, and Practical Hints for the Household and the Shop
CH175569A (en) Process for the preparation of the 3.6-diamino-10-methylacridinium salt of 3-acetyl-amino-4-oxy-5-chlorophenyl-1-arsic acid.
GB280115A (en) Improved composition for polishing furniture enamelled surfaces and the like
GB169258A (en) A new or improved paint or composition impervious to oils, spirits and other liquids