SU246622A1 - HEAD FOR SIDES - Google Patents

Description

The known soldering head, for example, the conclusions of the casing of integrated solid circuits, is made in the form of a spring-loaded cage with heating elements fixed in it, equipped with a channel system that serves to supply the protective gas directly to the soldering zone and the power busbars.

The purpose of the invention is to improve the performance of the soldering process, increase the accuracy of the dosage of the prio and prevent the formation of solder bridges between adjacent terminals of the solid integrated circuit.

This is achieved in the described head using the section of the section with a tape of solder knives located in a spring-loaded cage between the heating elements.

FIG. 1 shows the design of the described head in two projections; in fig. 2 - axonometric projection of the head in the process of soldering.

The head contains a ball bearing 1, which serves to fasten it to the feed mechanism (not shown) and install it in the required plane during the soldering process; the current-carrying tires 2 and which are mounted on the insulator 4. On the tires 2 and 5 there are clamps 5 for fastening the heating elements 6 of the W-shape, made of a material having a high ohmic

resistance and non-wettable solder. The number of working blades 7 of the heating elements 6 is selected according to the number of terminals 8 of the flat body 9. This allows soldering all the leads 8 simultaneously to the printed conductors 10 of the board 11. Such a constructive design of the heating elements 6 ensures the temperature of the working blades 7 regardless of the soldering conditions. The heating elements 6 are separated into two V-shaped halves. This makes it easier during assembly orientation and fixation of the halves of the heating elements 5.

Between the blades 7 of the heating elements 6, there are dispensing strips 12 of solder dosing knives 13 made of a material that is not wettable by solder. The knives 13 are secured in a spring-loaded cage.

14 of an insulating material that moves between the winches 2 and 5 under the action of the springs 15.

The pressure of the knives 13 on the tape 12 solder is regulated with screws 16. Wires

power supplies (not shown) are soldered to the contact lobes 17 of tires 2 and 5.

The feeder belt solder (not shown) puts the tape 12 on the pins 8 of the housing 9 integrated solid circuit. The head, lowering, presses the separating knives 13 with the tape 12 and cuts or cuts it, depending on the compressing force of the adjusting springs 15 due to the fact that the knives protrude over the tip 7 of the heating elements 6 by 0.5-1.0 mm.

Thus, the tape 12 is divided into equal parts, which are pressed by the tips 7 of the heating elements 6 to the terminals 8 of the housing 9. The protective gas supply system is turned on to the soldering zone.

A current pulse with a given amplitude and duration is transmitted through the heating elements 6. In the process of melting iripo, at the time of its softening, the knives 13 finally separate the tape 12 of solder. This prevents the formation of jumpers between the terminals 8 of the housing 9 of the integrated solid circuit.

Under the action of surface tension forces, the solder is forced into the iaike zone. The soldering process is monitored visually through a binocular microscope. After curing, the solder head rises to its original position, and the shielding gas supply system is turned off.

Subject invention

The soldering head, for example, the casing terminals of integral solid circuits, is made in the form of a spring-loaded cage with heating elements fixed in it, equipped with a duct system for supplying protective gas directly to the soldering zone, and current-conducting buses, characterized in that in order to improve the performance of the soldering process, increase the accuracy of the dosage of solder and prevent the formation of solder bridges between adjacent terminals of the housing and integral solid circuit, said spring-loaded sleep sleeve wife yuschimi tape section solder bars located between the heating elements.