SU217185A1 - - Google Patents
Info
- Publication number
- SU217185A1 SU217185A1 SU1124066A SU1124066A SU217185A1 SU 217185 A1 SU217185 A1 SU 217185A1 SU 1124066 A SU1124066 A SU 1124066A SU 1124066 A SU1124066 A SU 1124066A SU 217185 A1 SU217185 A1 SU 217185A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- solder
- bismuth
- lead
- copper
- cadmium
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 description 7
- 229910052797 bismuth Inorganic materials 0.000 description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 6
- 229910052793 cadmium Inorganic materials 0.000 description 4
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Description
ПРИПОЙ ДЛЯ ПАЙКИ МЕДИ И МЕДНЫХ СПЛАВОВSolder for soldering copper and copper alloys
Известен припой дл пайки изделий из меди и медных сплавов (в о/о): свинца 42; висмута 42; кадми 16.Known solder for soldering products from copper and copper alloys (in o / o): lead 42; bismuth 42; cadmium 16.
Дл повышени прочности и коррозионной стойкости во влажной среде па ного соединени его состав вз т в следующем процентном соотношении: кадми 16-18; висмута 12-14, свинца 69-71.To increase the strength and corrosion resistance in a humid environment of a soldering compound, its composition is taken in the following percentage ratio: cadmium 16-18; bismuth 12-14, lead 69-71.
Температура плавлени припо 218° С.Melting point solder 218 ° C.
Предложенный припой состоит из двух фаз: эвтектики Pb + Cd и сс-твердого раствора висмута в свинце. Уменьшение содержани висмута в припое позвол ет повысить его прочность.The proposed solder consists of two phases: the eutectic of Pb + Cd and the cc-solid solution of bismuth in lead. Reducing the bismuth content of the solder increases its strength.
Деталь, па ную предложенным припоем, можно покрывать гальваническим покрытием, например серебром.The part soldered by the proposed solder can be coated with an electroplated coating, for example, silver.
Предмет изобретени Subject invention
Припой дл пайки меди и медных сплавов , содержащий свинец, висмут, кадмий, огличающийс тем, что, с целью повышени прочности и коррозионной стойкости во влажной среде па ного соединени , его состав вз т в следующем соотношении (в о/о): кадми 16-18; висмута 12-14; свинца 69-71.Solder for brazing of copper and copper alloys, containing lead, bismuth, cadmium, because in order to increase the strength and corrosion resistance in a humid medium of a brazing compound, its composition is taken in the following ratio (in o / o): cadmium 16 -18; bismuth 12-14; lead 69-71.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1124066A SU217185A1 (en) | 1967-01-05 | 1967-01-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU1124066A SU217185A1 (en) | 1967-01-05 | 1967-01-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU217185A1 true SU217185A1 (en) | 1968-04-26 |
Family
ID=39968116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU1124066A SU217185A1 (en) | 1967-01-05 | 1967-01-05 |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU217185A1 (en) |
-
1967
- 1967-01-05 SU SU1124066A patent/SU217185A1/ru active
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