SU1163126A1 - Semiconductor device cooling fin - Google Patents
Semiconductor device cooling fin Download PDFInfo
- Publication number
- SU1163126A1 SU1163126A1 SU833605917A SU3605917A SU1163126A1 SU 1163126 A1 SU1163126 A1 SU 1163126A1 SU 833605917 A SU833605917 A SU 833605917A SU 3605917 A SU3605917 A SU 3605917A SU 1163126 A1 SU1163126 A1 SU 1163126A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- sleeves
- spikes
- plate
- heat
- coefficient
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
РАДИАТОР ДЛЯ ОХЛАЖДЕНИЯ ПОЛУПРОВОДНЖОВЫХ nPHBOiOB, содержащий укрепленную на охлаждаемом приборе пластину с оребрением в виде шипов, отличающийс тем, что, с целью интенсификации теплообмена, шипы .выполнены из проволоки и собраны в пучки, установленные в гильзах, заполненных теплопроводным материалом и размещенных в соответствующих гнездах , выполненных под эти гильзы, причем гильзы вьшолнены из материала с коэффициентом теплового расти-. рени , превышающим коэффициент теплового расширени пластины. (Л с:RADIATOR FOR COOLING OF SEMI-WATER nPHBOiOB, containing a plate with spikes in the form of spikes, fixed on a cooled instrument, characterized in that, in order to intensify heat exchange, spikes are made of wire and assembled into bundles installed in sleeve cases filled with a heat-conducting material. , made under these sleeves, and sleeves are made of a material with a coefficient of heat plant -. reni exceeding the coefficient of thermal expansion of the plate. (L with:
Description
1 one
Изобретение относитс к радиаторам дл охлаждени полупроводниковых приборов и может быть использовано в электротехнике.The invention relates to radiators for cooling semiconductor devices and can be used in electrical engineering.
Цель изобретени - интенсификаци теплообмена.The purpose of the invention is to intensify heat transfer.
На фиг. 1 изображен радиатор, поперечный разрез; на фиг. 2 - вид А на фиг. 1: на фиг. 3 - узел на фиг, 1.FIG. 1 shows a radiator, cross section; in fig. 2 is a view A of FIG. 1: in FIG. 3 - the node in FIG. 1.
Радиатор содержит укрепленную на охлаждаемом приборе 1 пластину 2 с оребрением в виде шипов, которые вьшолнены из проволоки и собраны в пучки 3, установленные в гильзах 4, заполненных теплопроводньм материалом 5 и размещенных в соответствующих гнездах, выполненных под эти гильзы 4, причем гильзы 4 выполненыThe radiator contains a plate 2 fixed on the cooled device 1 with finning in the form of spikes, which are made of wire and assembled in bundles 3 installed in sleeves 4 filled with heat-conducting material 5 and placed in corresponding slots made under these sleeves 4, with sleeves 4 made
12621262
из материала с коэффициентом теплового расширени , превьшающим коэффициент теплового расширени пластины 2,from a material with a coefficient of thermal expansion that exceeds the coefficient of thermal expansion of plate 2,
При нагреве радиатора от работающего прибора 1 последний отводит тепло в окружающую среду через поверхности пластины 2 и шипов, наход щихс с пластиной 2 в плотном тепловом контакте за счет разных коэффициентов теплового расширени гильзы 4 и пластины 2, а также за счет заполнени гильзы 4 теплопроводным материалом Ь. Теплообмен радиатора с окружающей средой интенсифицируетс за счет развитой поверхности .оребрени и турбулизации на нем охлаждающей рабочей среды.When the radiator heats up from the working device 1, the latter removes heat into the environment through the surfaces of the plate 2 and studs that are in close thermal contact with the plate 2 due to different coefficients of thermal expansion of the sleeve 4 and plate 2, as well as by filling the sleeve 4 with a heat-conducting material B. Heat transfer from the radiator to the environment is intensified due to the developed surface of the ribs and the turbulization of the cooling working medium on it.
Фиг. 2FIG. 2
Ф(4г.ЗF (4g.Z
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU833605917A SU1163126A1 (en) | 1983-06-15 | 1983-06-15 | Semiconductor device cooling fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU833605917A SU1163126A1 (en) | 1983-06-15 | 1983-06-15 | Semiconductor device cooling fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU1163126A1 true SU1163126A1 (en) | 1985-06-23 |
Family
ID=21068662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU833605917A SU1163126A1 (en) | 1983-06-15 | 1983-06-15 | Semiconductor device cooling fin |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU1163126A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5180001A (en) * | 1989-08-18 | 1993-01-19 | Hitachi, Ltd. | Heat transfer member |
| US5201866A (en) * | 1992-02-03 | 1993-04-13 | International Business Machines Corporation | Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface |
| US5299090A (en) * | 1993-06-29 | 1994-03-29 | At&T Bell Laboratories | Pin-fin heat sink |
| US5390734A (en) * | 1993-05-28 | 1995-02-21 | Lytron Incorporated | Heat sink |
| SE1730353A1 (en) * | 2017-12-28 | 2019-06-29 | Andersson Inge | Cooling installation |
-
1983
- 1983-06-15 SU SU833605917A patent/SU1163126A1/en active
Non-Patent Citations (1)
| Title |
|---|
| Патент US № 2765152, кл. 165-181, опублик. 1953. Авторское свидетельство СССР 661230, кл. F 28 F 3/04, 1972. * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5180001A (en) * | 1989-08-18 | 1993-01-19 | Hitachi, Ltd. | Heat transfer member |
| US5201866A (en) * | 1992-02-03 | 1993-04-13 | International Business Machines Corporation | Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface |
| US5390734A (en) * | 1993-05-28 | 1995-02-21 | Lytron Incorporated | Heat sink |
| US5299090A (en) * | 1993-06-29 | 1994-03-29 | At&T Bell Laboratories | Pin-fin heat sink |
| SE1730353A1 (en) * | 2017-12-28 | 2019-06-29 | Andersson Inge | Cooling installation |
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