SU102481A1 - The method of processing quartz by etching - Google Patents
The method of processing quartz by etchingInfo
- Publication number
- SU102481A1 SU102481A1 SU451594A SU451594A SU102481A1 SU 102481 A1 SU102481 A1 SU 102481A1 SU 451594 A SU451594 A SU 451594A SU 451594 A SU451594 A SU 451594A SU 102481 A1 SU102481 A1 SU 102481A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- etching
- quartz
- processing quartz
- processing
- aqueous
- Prior art date
Links
- 239000010453 quartz Substances 0.000 title description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title description 6
- 238000005530 etching Methods 0.000 title description 5
- 238000000034 method Methods 0.000 title description 3
- 239000013078 crystal Substances 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- JMRISUQLKBSNOR-UHFFFAOYSA-N potassium;dihydrofluoride Chemical compound F.F.[K] JMRISUQLKBSNOR-UHFFFAOYSA-N 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000563 toxic property Toxicity 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Description
При 131()товлен11и иьезоквардсвыл Uoделий I помощью травлени можно BI.IKвить неоднородность кварцевых кристаллов (двойники, свили и проч. дефекты), повысить нрочность сцеплени с нанесенным металлическим слоем, повысить стабильность частоты иластип во времени и производить предварительную подтонку частоты кварцевых пластин.At 131 (), it was possible to use BI.IK to identify the heterogeneity of quartz crystals (twins, stitches and other defects), increase the adhesion strength with the applied metal layer, improve the stability of the frequency of the elastic in time and produce a preliminary tone of the frequency of the quartz plates.
Обычно травление кристаллов jiBii;iii,v к ква| цпвых пластин производ т в ттлпвиковой кислоте, котора обладает весьма си; ьными токсическими свойствами. (1оэт1.чу применение ее в кварцевом производстве к)айне нежелательно.Usually etching of crystals jiBii; iii, v kkva | ppc plates are made in tlpvic acid, which possesses quite b; tny toxic properties. (1oet1.ch its application in quartz production to) Aine is undesirable.
В предлагаемом способе в качестве тра:;лтс .; кварца используют водный 30- -Ю.о-иый раствор двухфторпстого кали , нагретого до температуры СО-90°.In the proposed method as tra:; lts.; quartz using an aqueous 30-U.-oh solution of bifluorine potassium heated to a temperature of CO-90 °.
Предлагаемый травптель вл етс менее опасным по своей токсичности и в то ;ке врем обеспечивает лорои ее качество травлени .The proposed traptel is less dangerous in terms of its toxicity and at that time, it provides the quality of etching.
Предмет изобретени Subject invention
Способ обработки кварца травлением, п т л и ч а 10 щ и и с тем, что. с, целью уменьшени вредных выделеЕшй ирп травлении., в качестве травител приме} ют водный 30-40%-ный раствор двухфтористого кали , нагретый jo температуры 60-00°.The method of treatment of quartz by etching, ptl and h and 10 u and so that. c, in order to reduce the harmful release of irradiation by etching, an aqueous 30–40% solution of potassium dihydrofluoride, heated at a temperature of 60–00 ° C, is used as an etchant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU451594A SU102481A1 (en) | 1954-04-19 | 1954-04-19 | The method of processing quartz by etching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU451594A SU102481A1 (en) | 1954-04-19 | 1954-04-19 | The method of processing quartz by etching |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU102481A1 true SU102481A1 (en) | 1955-11-30 |
Family
ID=48376193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU451594A SU102481A1 (en) | 1954-04-19 | 1954-04-19 | The method of processing quartz by etching |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU102481A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5948202A (en) * | 1994-02-03 | 1999-09-07 | Corning Incorporated | Method for removing a protective coating from optical fibers and making a photonic device |
-
1954
- 1954-04-19 SU SU451594A patent/SU102481A1/en active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5948202A (en) * | 1994-02-03 | 1999-09-07 | Corning Incorporated | Method for removing a protective coating from optical fibers and making a photonic device |
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