SG94734A1 - Packaging of a microchip device - Google Patents

Packaging of a microchip device

Info

Publication number: SG94734A1
Authority: SG; Singapore
Prior art keywords: packaging; microchip device; microchip
Prior art date: 2001-01-15

Application number

SG200100220A

Inventor

Chuen Khiang Wang

Original Assignee

Chuen Khiang Wang

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-01-15

Filing date

2001-01-15

Publication date

2003-03-18

2001-01-15 Application filed by Chuen Khiang Wang filed Critical Chuen Khiang Wang

2001-01-15 Priority to SG200100220A priority Critical patent/SG94734A1/en

2002-04-09 Priority to TW091107069A priority patent/TW567594B/en

2002-04-09 Priority to TW091107070A priority patent/TW567562B/en

2002-06-19 Priority to PCT/SG2002/000125 priority patent/WO2004002003A1/en

2002-06-19 Priority to US10/312,589 priority patent/US7443041B2/en

2003-03-18 Publication of SG94734A1 publication Critical patent/SG94734A1/en

Classifications

- H10W74/117—
- H10W70/635—
- H10W70/68—
- H10W74/016—
- H10W74/129—
- H10W90/701—
- H10W72/0198—
- H10W72/075—
- H10W72/551—
- H10W72/865—
- H10W72/932—
- H10W72/951—
- H10W74/00—
- H10W90/734—
- H10W90/754—

SG200100220A 2001-01-15 2001-01-15 Packaging of a microchip device SG94734A1 (en)

Priority Applications (5)

Application Number	Priority Date	Filing Date	Title
SG200100220A SG94734A1 (en)	2001-01-15	2001-01-15	Packaging of a microchip device
TW091107069A TW567594B (en)	2001-01-15	2002-04-09	Method of packaging microchip devices, the interposer used therefor and the microchip device packaged thereby
TW091107070A TW567562B (en)	2001-01-15	2002-04-09	Method of packaging microchip devices, the interposer used therefor and the microchip device packaged thereby
PCT/SG2002/000125 WO2004002003A1 (en)	2001-01-15	2002-06-19	Packaging of a microchip device
US10/312,589 US7443041B2 (en)	2001-01-15	2002-06-19	Packaging of a microchip device

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
SG200100220A SG94734A1 (en)	2001-01-15	2001-01-15	Packaging of a microchip device
PCT/SG2002/000125 WO2004002003A1 (en)	2001-01-15	2002-06-19	Packaging of a microchip device

Publications (1)

Publication Number	Publication Date
SG94734A1 true SG94734A1 (en)	2003-03-18

Family

ID=32301958

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SG200100220A SG94734A1 (en)	2001-01-15	2001-01-15	Packaging of a microchip device

Country Status (2)

Country	Link
SG (1)	SG94734A1 (en)
WO (1)	WO2004002003A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI374525B (en) *	2004-05-11	2012-10-11	Taiwan Semiconductor Mfg	Cut-out heat slug for integrated circuit device packaging

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2000208540A (en) *	1998-08-25	2000-07-28	Texas Instr Inc <Ti>	Method of sealing thin semiconductor chip scale package
JP2000260791A (en) *	1999-03-08	2000-09-22	Fuji Xerox Co Ltd	Semiconductor device and manufacturing method thereof
US6133627A (en) *	1990-09-24	2000-10-17	Tessera, Inc.	Semiconductor chip package with center contacts

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2000312102A (en) *	1999-04-27	2000-11-07	Kyocera Corp	Junction structure of dielectric line and non-radiative dielectric line
DE10120248A1 (en) *	2000-04-26	2002-03-28	Kyocera Corp	Structure for connecting a non-radiating dielectric waveguide and a metal waveguide, transmitter / receiver module for millimeter waves and transmitter / receiver for millimeter waves
KR100358983B1 (en) *	2001-02-20	2002-11-01	엔알디테크 주식회사	NRD Guide FM Transmitter with FM Modulator in rear of Gunn Oscillator

2001
- 2001-01-15 SG SG200100220A patent/SG94734A1/en unknown
2002
- 2002-06-19 WO PCT/SG2002/000125 patent/WO2004002003A1/en not_active Ceased

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6133627A (en) *	1990-09-24	2000-10-17	Tessera, Inc.	Semiconductor chip package with center contacts
JP2000208540A (en) *	1998-08-25	2000-07-28	Texas Instr Inc <Ti>	Method of sealing thin semiconductor chip scale package
JP2000260791A (en) *	1999-03-08	2000-09-22	Fuji Xerox Co Ltd	Semiconductor device and manufacturing method thereof

Also Published As

Publication number	Publication date
WO2004002003A1 (en)	2003-12-31

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